TWI327986B - Substrate absorption device - Google Patents

Substrate absorption device Download PDF

Info

Publication number
TWI327986B
TWI327986B TW093111648A TW93111648A TWI327986B TW I327986 B TWI327986 B TW I327986B TW 093111648 A TW093111648 A TW 093111648A TW 93111648 A TW93111648 A TW 93111648A TW I327986 B TWI327986 B TW I327986B
Authority
TW
Taiwan
Prior art keywords
adsorption
substrate
pad
suction
contact
Prior art date
Application number
TW093111648A
Other languages
English (en)
Chinese (zh)
Other versions
TW200508125A (en
Inventor
Hayashi Takato
Hirado Koji
Kinoshita Hitoshi
Jogasaki Shuya
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW200508125A publication Critical patent/TW200508125A/zh
Application granted granted Critical
Publication of TWI327986B publication Critical patent/TWI327986B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
TW093111648A 2003-05-06 2004-04-26 Substrate absorption device TWI327986B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003128054 2003-05-06
JP2003192188 2003-07-04
JP2003192141 2003-07-04

Publications (2)

Publication Number Publication Date
TW200508125A TW200508125A (en) 2005-03-01
TWI327986B true TWI327986B (en) 2010-08-01

Family

ID=33436989

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111648A TWI327986B (en) 2003-05-06 2004-04-26 Substrate absorption device

Country Status (4)

Country Link
JP (1) JP4553841B2 (ja)
KR (1) KR101055911B1 (ja)
TW (1) TWI327986B (ja)
WO (1) WO2004100254A1 (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI380944B (zh) * 2004-11-24 2013-01-01 Ckd Corp A floating unit having a tilting function, and a floating device
JP4895518B2 (ja) * 2005-03-22 2012-03-14 オリンパス株式会社 基板保持装置及び基板の保持方法
JP4899357B2 (ja) * 2005-07-01 2012-03-21 株式会社Ｉｈｉ 基板吸着装置
JP4920209B2 (ja) * 2005-07-15 2012-04-18 シーケーディ株式会社 板状ワークの移載装置
JP2007048828A (ja) * 2005-08-08 2007-02-22 Murata Mfg Co Ltd 板状体の変形処理装置及び該板状体の変形処理方法
JP4655272B2 (ja) * 2005-08-19 2011-03-23 株式会社安川電機 基板吸着装置とそれを用いた基板搬送装置
JP4790395B2 (ja) * 2005-12-02 2011-10-12 オリンパス株式会社 基板吸着機構及び基板検査装置
JP2008302487A (ja) * 2007-06-11 2008-12-18 Olympus Corp 基板吸着装置及び基板搬送装置並びに外観検査装置
JP4787872B2 (ja) * 2008-10-16 2011-10-05 東京エレクトロン株式会社 基板搬送処理装置
JP5815959B2 (ja) * 2011-02-08 2015-11-17 近藤工業株式会社 Ｎ２ガスパージ装置におけるノズルユニット
KR101841534B1 (ko) 2011-11-21 2018-03-23 한화테크윈 주식회사 패널 이송 장치
CN104245547B (zh) * 2012-04-26 2016-07-27 株式会社Ihi 输送装置
JP6135066B2 (ja) * 2012-08-10 2017-05-31 シンフォニアテクノロジー株式会社 パージノズルユニット、パージ装置、ロードポート
JP6218395B2 (ja) * 2013-03-05 2017-10-25 日置電機株式会社 吸着機構および吸着装置
CN103646905A (zh) * 2013-12-11 2014-03-19 中国电子科技集团公司第二研究所 晶圆片识别旋转定位吸附台
JP2015153970A (ja) * 2014-02-18 2015-08-24 キヤノン株式会社 基板保持機構、基板搬送装置および基板搬送方法
JP6316181B2 (ja) * 2014-12-18 2018-04-25 東京エレクトロン株式会社 基板保持ステージ
CN104708461B (zh) * 2015-03-03 2017-07-07 西北工业大学 一种大型壁板的简易固持装置
TWI630059B (zh) * 2015-12-25 2018-07-21 日商三星鑽石工業股份有限公司 Substrate adsorption device and workbench
JP6655514B2 (ja) 2016-09-21 2020-02-26 東京エレクトロン株式会社 基板検査方法及び基板検査装置
JP6327374B2 (ja) * 2017-02-21 2018-05-23 シンフォニアテクノロジー株式会社 パージノズルユニット、ロードポート
JP6804155B2 (ja) * 2017-03-13 2020-12-23 東レエンジニアリング株式会社 基板浮上搬送装置
JP6519897B2 (ja) * 2018-04-10 2019-05-29 シンフォニアテクノロジー株式会社 パージノズルユニット、ロードポート
JP7210896B2 (ja) * 2018-04-23 2023-01-24 東京エレクトロン株式会社 基板載置装置及び基板載置方法
JP6882698B2 (ja) * 2019-04-24 2021-06-02 シンフォニアテクノロジー株式会社 パージノズルユニット、ロードポート
KR102416681B1 (ko) * 2021-04-20 2022-07-05 주식회사 윈텍오토메이션 Cvd 코팅 트레이로부터 초경인서트 제품을 분리하기 위한 배큠 그립퍼 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6094487U (ja) * 1983-11-30 1985-06-27 東芝機械株式会社 ウエハ吸着装置
JPS63136636U (ja) * 1987-02-27 1988-09-08
JPH05318368A (ja) * 1992-05-18 1993-12-03 Tokyo Electron Yamanashi Kk 吸着搬送装置
JP3122590B2 (ja) * 1994-12-28 2001-01-09 株式会社三協精機製作所 吸着パッド
JPH08236597A (ja) * 1995-02-27 1996-09-13 Hitachi Ltd 移載装置
JP4106450B2 (ja) * 2001-02-07 2008-06-25 日産自動車株式会社 吸着保持装置

Also Published As

Publication number Publication date
WO2004100254A1 (ja) 2004-11-18
JPWO2004100254A1 (ja) 2006-07-13
KR20060008319A (ko) 2006-01-26
TW200508125A (en) 2005-03-01
KR101055911B1 (ko) 2011-08-10
JP4553841B2 (ja) 2010-09-29

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