SG10201600301SA - CMP Pad Conditioner, Pad Conditioning System And Method - Google Patents

CMP Pad Conditioner, Pad Conditioning System And Method

Info

Publication number
SG10201600301SA
SG10201600301SA SG10201600301SA SG10201600301SA SG10201600301SA SG 10201600301S A SG10201600301S A SG 10201600301SA SG 10201600301S A SG10201600301S A SG 10201600301SA SG 10201600301S A SG10201600301S A SG 10201600301SA SG 10201600301S A SG10201600301S A SG 10201600301SA
Authority
SG
Singapore
Prior art keywords
pad
conditioning system
cmp
conditioner
pad conditioner
Prior art date
Application number
SG10201600301SA
Inventor
Kelvin Sze Wei Ang
Kok Chian Loh
Saujit Bandhu
Yun Long Qiao
Roy Chin Hua Lim
Johnathan Kar Yam Tay
Maria Celina Tiongco Miranda
Yang Lu
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to SG10201600301SA priority Critical patent/SG10201600301SA/en
Priority to PCT/US2017/013289 priority patent/WO2017123834A1/en
Priority to TW106101263A priority patent/TW201738034A/en
Publication of SG10201600301SA publication Critical patent/SG10201600301SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
SG10201600301SA 2016-01-14 2016-01-14 CMP Pad Conditioner, Pad Conditioning System And Method SG10201600301SA (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG10201600301SA SG10201600301SA (en) 2016-01-14 2016-01-14 CMP Pad Conditioner, Pad Conditioning System And Method
PCT/US2017/013289 WO2017123834A1 (en) 2016-01-14 2017-01-13 Cmp pad conditioner, pad conditioning system and method
TW106101263A TW201738034A (en) 2016-01-14 2017-01-13 CMP pad conditioner, pad conditioning system and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201600301SA SG10201600301SA (en) 2016-01-14 2016-01-14 CMP Pad Conditioner, Pad Conditioning System And Method

Publications (1)

Publication Number Publication Date
SG10201600301SA true SG10201600301SA (en) 2017-08-30

Family

ID=57966106

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201600301SA SG10201600301SA (en) 2016-01-14 2016-01-14 CMP Pad Conditioner, Pad Conditioning System And Method

Country Status (3)

Country Link
SG (1) SG10201600301SA (en)
TW (1) TW201738034A (en)
WO (1) WO2017123834A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102393445B1 (en) * 2017-10-04 2022-05-03 생-고뱅 어브레이시브즈, 인코포레이티드 Abrasive articles and methods of forming same
US10857651B2 (en) * 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
JP7210896B2 (en) * 2018-04-23 2023-01-24 東京エレクトロン株式会社 SUBSTRATE PLACEMENT DEVICE AND SUBSTRATE PLACEMENT METHOD
JP7101528B2 (en) * 2018-04-25 2022-07-15 東京エレクトロン株式会社 Board processing equipment
JP2019198901A (en) * 2018-05-14 2019-11-21 株式会社ディスコ Cutting device
EP3597362B1 (en) * 2018-07-16 2023-04-19 Officina Meccanica Domaso SpA Compression spring grinding machine
JP7143027B2 (en) * 2018-09-27 2022-09-28 株式会社ディスコ Grinding wheels and grinding equipment
JP7250637B2 (en) * 2019-07-01 2023-04-03 株式会社ディスコ Processing equipment and chuck table
CN112847141A (en) * 2019-10-31 2021-05-28 邓筑蓉 Semiconductor wafer planarization system and use method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6343974B1 (en) * 2000-06-26 2002-02-05 International Business Machines Corporation Real-time method for profiling and conditioning chemical-mechanical polishing pads
US7160173B2 (en) * 2002-04-03 2007-01-09 3M Innovative Properties Company Abrasive articles and methods for the manufacture and use of same
US6722948B1 (en) * 2003-04-25 2004-04-20 Lsi Logic Corporation Pad conditioning monitor
KR100541821B1 (en) * 2004-09-09 2006-01-11 삼성전자주식회사 Device and method for sensing error operation of pad conditioner in polishing device thereof
US7840305B2 (en) 2006-06-28 2010-11-23 3M Innovative Properties Company Abrasive articles, CMP monitoring system and method
US8758085B2 (en) * 2010-10-21 2014-06-24 Applied Materials, Inc. Method for compensation of variability in chemical mechanical polishing consumables

Also Published As

Publication number Publication date
WO2017123834A1 (en) 2017-07-20
TW201738034A (en) 2017-11-01

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