JP7101528B2 - Board processing equipment - Google Patents

Description

The present disclosure relates to a substrate processing apparatus .

Conventionally, there is known a substrate processing apparatus that performs substrate processing such as cleaning processing by pressing a brush against a rotating substrate while rotating the substrate.

Japanese Unexamined Patent Publication No. 2005-228961

The present disclosure provides techniques for facilitating brush management.

The substrate processing apparatus according to one aspect of the present disclosure includes a processing unit, an information holding unit, and an information acquisition unit. The processing unit processes the substrate using a brush. The information holding unit is provided in the processing unit and holds information about the brush. The information acquisition unit acquires the information read from the information holding unit.

According to the present disclosure, it is possible to provide a technique for facilitating the management of brushes.

FIG. 1 is a diagram showing a configuration of a substrate processing apparatus according to the first embodiment. FIG. 2 is a diagram showing a configuration of a processing unit according to the first embodiment. FIG. 3 is a diagram showing a configuration of a processing unit according to the first embodiment. FIG. 4 is a diagram showing a configuration of an access unit according to the first embodiment. FIG. 5 is a block diagram showing a configuration of the control device according to the first embodiment. FIG. 6 is a diagram showing an example of brush information. FIG. 7 is a flowchart showing an example of the parameter setting process. FIG. 8 is a diagram showing an arrangement of a reader / writer according to the first modification in the first embodiment. FIG. 9 is a diagram showing the arrangement of the reader / writer according to the second modification in the first embodiment. FIG. 10 is a diagram showing an example of the configuration of the cleaning unit and the access unit according to the second embodiment. FIG. 11 is a diagram showing another example of the configuration of the cleaning unit and the access unit according to the second embodiment. FIG. 12 is a diagram showing an example of the configuration of the cleaning unit and the access unit according to the second embodiment. FIG. 13 is a diagram showing another example of the configuration of the cleaning unit according to the second embodiment. FIG. 14 is a diagram showing the configuration of the cleaning unit according to the third embodiment. FIG. 15 is a diagram showing an example of the configuration of the rotating plate. FIG. 16 is a diagram showing an example of the duty ratio of the pulse detected by the rotary encoder.

Hereinafter, a substrate processing apparatus according to the present disclosure, a substrate processing method, and an embodiment for carrying out a brush (hereinafter, referred to as “embodiment”) will be described in detail with reference to the drawings. It should be noted that this embodiment does not limit the substrate processing apparatus, substrate processing method and brush according to the present disclosure. In addition, each embodiment can be appropriately combined as long as the processing contents do not contradict each other. Further, in each of the following embodiments, the same parts are designated by the same reference numerals, and duplicate explanations are omitted.

Brushes used for substrate processing have multiple parameters such as withstand voltage, recommended working pressure range, and life, and the values of these parameters vary from brush to brush. Conventionally, the user manually inputs the brush parameter values for the substrate processing device. However, in manual input by the user, for example, if an input error occurs, an erroneous parameter value may be set. It is also troublesome for the user to manually input the parameter value.

Further, in recent years, with the spread of 3D printers and the like, there is an increasing risk that imitation brushes are attached to the substrate processing apparatus. However, in the conventional substrate processing apparatus, it is difficult to distinguish between a genuine brush and a counterfeit brush.

Therefore, a technique capable of easily performing brush parameter control, quality control, and the like is expected.

First, the configuration of the substrate processing apparatus according to the first embodiment will be described with reference to FIG. FIG. 1 is a diagram showing a configuration of a substrate processing apparatus according to the first embodiment.

In each drawing referred to below, in order to make the explanation easy to understand, an orthogonal coordinate system in which the X-axis direction, the Y-axis direction, and the Z-axis direction that are orthogonal to each other are defined and the Z-axis positive direction is the vertical upward direction is shown. In some cases. Further, the rotation direction centered on the vertical axis may be referred to as the θ direction.

As shown in FIG. 1, the substrate processing device 1 includes a loading / unloading block 2, a delivery block 3, and a processing block 4. These are arranged side by side in the order of the carry-in / out block 2, the delivery block 3 and the processing block 4.

The substrate processing apparatus 1 conveys a substrate such as a semiconductor wafer (hereinafter referred to as “wafer W”) carried in from the carry-in / out block 2 to the processing block 4 via the delivery block 3 and processes it in the processing block 4. Further, the substrate processing apparatus 1 returns the processed wafer W from the processing block 4 to the loading / unloading block 2 via the delivery block 3, and discharges the processed wafer W from the loading / unloading block 2 to the outside. Hereinafter, the configurations of the blocks 2 to 4 will be described.

The loading / unloading block 2 includes a mounting section 11 and a transport section 12. A plurality of cassettes C for accommodating a plurality of wafers W in a horizontal state are mounted on the mounting section 11. The transport unit 12 is arranged adjacent to the mounting unit 11 and includes a transport device 13 inside. The transfer device 13 transfers the wafer W between the mounting unit 11 and the delivery block 3.

The delivery block 3 includes a delivery unit 22. The delivery unit 22 can accommodate a plurality of wafers W in multiple stages.

The processing block 4 includes a transport unit 16, a transport device 17, and a plurality of processing units 18. The transport device 17 is arranged inside the transport unit 16, and the plurality of processing units 18 are arranged outside the transport unit 16. Further, the plurality of processing units 18 are arranged adjacent to the transport unit 16.

The transfer device 17 transfers the wafer W between the delivery section 22 and the processing section 18 of the delivery block 3. Specifically, the transfer device 17 takes out the wafer W from the delivery unit 22 and transfers it to the processing unit 18. Further, the transfer device 17 takes out the wafer W processed by the processing unit 18 from the processing unit 18 and conveys it to the delivery unit 22.

The processing unit 18 performs substrate processing using a brush on the wafer W carried in by the transfer device 17. Here, an example in which the processing unit 18 performs a cleaning process for removing particles and the like adhering to the surface of the wafer W will be described, but the substrate processing performed by the processing unit 18 is not limited to the cleaning process. For example, the substrate processing performed by the processing unit 18 may be a processing for removing the convex portion from the surface of the wafer W or a processing for polishing the surface of the wafer W.

Here, the configuration of the processing unit 18 will be described with reference to FIGS. 2 and 3. 2 and 3 are views showing the configuration of the processing unit 18 according to the first embodiment. Note that FIG. 2 is a schematic view of the inside of the processing unit 18 as viewed from above, and FIG. 3 is a schematic view of the inside of the processing unit 18 as viewed from the side. Further, in FIG. 3, the liquid supply unit 105 is omitted.

As shown in FIGS. 2 and 3, the processing unit 18 includes a chamber 101, a substrate holding unit 102, a cup unit 103, a cleaning unit 104, a liquid supply unit 105, and an access unit 106.

The chamber 101 accommodates a substrate holding unit 102, a cup unit 103, a cleaning unit 104, a liquid supply unit 105, and an access unit 106. An FFU (Fun Filter Unit) 111 that forms a downflow in the chamber 101 is provided on the ceiling of the chamber 101 (see FIG. 3).

The substrate holding portion 102 rotates a main body portion 121 having a diameter larger than that of the wafer W, a plurality of grip portions 122 provided on the upper surface of the main body portion 121, a strut member 123 for supporting the main body portion 121, and a strut member 123. A drive unit 124 for driving is provided. The number of grip portions 122 is not limited to that shown in the figure.

The substrate holding portion 102 holds the wafer W by gripping the peripheral edge portion of the wafer W using a plurality of gripping portions 122. As a result, the wafer W is held horizontally in a state slightly separated from the upper surface of the main body 121.

The cup portion 103 is arranged so as to surround the substrate holding portion 102. At the bottom of the cup portion 103, a drainage port 131 for discharging the processing liquid supplied to the wafer W to the outside of the chamber 101 and an exhaust port 132 for exhausting the atmosphere inside the chamber 101 are formed. ..

The cleaning unit 104 includes a brush 141 and a spindle 142 (an example of a rotating shaft) extending in the vertical direction and rotatably supporting the brush 141. The spindle 142 is connected to a rotation mechanism (not shown), which rotates the brush 141 around a vertical axis by rotating the spindle 142.

The brush 141 has, for example, a resin brush body having a cylindrical shape, and a cleaning body provided at the lower part of the brush body and pressed against the wafer W. The wash body is composed of, for example, a large number of hair bundles. Further, the cleaning body may be composed of a sponge or the like.

Further, the cleaning unit 104 includes an arm 143 that extends in the horizontal direction and supports the brush 141 from above via the spindle 142, and a swivel elevating mechanism 144 that swivels and raises and lowers the arm 143. The swivel elevating mechanism 144 allows the arm 143 to move the brush 141 between a processing position above the wafer W and a standby position outside the wafer W.

Further, the cleaning unit 104 is connected to the first treatment liquid supply source 148 via a valve 146, a flow rate regulator (not shown), or the like. The cleaning unit 104 discharges the first treatment liquid supplied from the first treatment liquid supply source 148 toward the wafer W from the hollow portion that vertically penetrates the brush 141. The first treatment liquid is, for example, DHF (dilute hydrofluoric acid). The first treatment liquid is not limited to DHF, and may be another treatment liquid such as SC1 or pure water (Deionized Water).

The liquid supply unit 105 includes a nozzle 151, a nozzle arm 152 extending in the horizontal direction and supporting the nozzle 151 from above, and a swivel elevating mechanism 153 that swivels and raises and lowers the nozzle arm 152.

The nozzle 151 is connected to the second processing liquid supply source 158 via a valve 156, a flow rate regulator (not shown), or the like. The liquid supply unit 105 discharges the second treatment liquid supplied from the second treatment liquid supply source 158 toward the wafer W. The second treatment liquid is a rinse liquid such as pure water. The second treatment liquid is not limited to the rinsing liquid, and may be another treatment liquid.

The processing unit 18 is provided with an RFID tag 145 (an example of an information holding unit) that holds information about the brush 141. In the first embodiment, the RFID tag 145 is embedded in the brush 141. The brush 141 is removable from the processing unit 18. Therefore, the RFID tag 145 is also removable with respect to the processing unit 18.

The RFID tag 145 contains information such as "brush type", "serial number", "part number", "pressure resistance", "working pressure range", "lifetime", and "authentication code" as information regarding the brush 141. It is held in advance.

The "brush type" is information indicating the type of the brush 141. By storing the "brush type" in the RFID tag 145, the substrate processing device 1 can recognize the type of the brush 141. As a result, for example, when the brush 141 of a certain type (referred to as type A) is attached to the arm 143, the substrate processing apparatus 1 has a value stored in advance as a parameter value of the brush 141 of type A. It can be automatically reflected in the recipe information of the processing unit 18.

The "serial number" is a unique identification number assigned to the brush 141. By storing the "serial number" in the RFID tag 145, for example, when a problem occurs in the brush 141, it becomes easy to trace the manufacturing time, manufacturing location, etc., and it is possible to facilitate quality control. can.

The "part number" is, for example, the part number of the brush 141. By storing the "part number" in the RFID tag 145, it is possible to facilitate the arrangement of new products, for example, when the brush 141 is replaced with a new product of the same type.

The "pressure resistance" is information indicating the pressure resistance of the brush 141. Further, the "working pressure range" is information indicating a range of working pressure recommended for the brush 141. By storing the "pressure resistance" and "working pressure range" in the RFID tag 145, for example, even if a new brush not registered in the substrate processing device 1 is attached to the arm 143, the recipe information of the processing unit 18 Information such as the working pressure range can be automatically reflected in. Therefore, it is not necessary to upgrade the software for registering a new brush in the substrate processing device 1.

"Life" is information about the life of the brush 141. The life of the brush 141 is represented by, for example, the integrated value of the working pressure and the working time of the brush 141. By storing the "life" in the RFID tag 145, for example, the working pressure and the working time of the brush 141 are measured in the substrate processing device 1, and the replacement time of the brush 141 is determined based on the difference between the measurement result and the life. Can be predicted. Further, it is possible to determine the allocation of the substrate processing to the plurality of processing units 18 so that the replacement times of the brush 141 are aligned among the plurality of processing units 18. For example, by allocating more substrate processing to the processing unit 18 having a long remaining life than the processing unit 18 having a short remaining life, it is possible to align the replacement time of these processing units 18. This makes it possible to efficiently replace the processing unit 18. It also facilitates regular maintenance planning.

The "authentication code" is information for authenticating the genuine brush 141. By storing the "authentication code" in the RFID tag 145, it is possible to prevent the counterfeit brush from being attached to the arm 143 and used.

The RFID tag 145 can be embedded in the brush 141 by, for example, making a hole in the brush 141, inserting the RFID tag 145 into the hole, and then molding the RFID tag 145 with a resin material. When the RFID tag 145 is embedded in the brush 141, it is preferable to use the RFID tag 145 as small as possible. For example, as the RFID tag 145, a cylindrical type, a coin type, or a label type RFID tag is suitable.

Further, for the RFID tag 145, it is preferable to use an electromagnetic induction type RFID that does not easily affect the surrounding water or metal when performing data communication with the access unit 106 described later.

The access unit 106 performs data communication with the RFID tag 145 embedded in the brush 141. The configuration of the access unit 106 will be described with reference to FIG. FIG. 4 is a diagram showing the configuration of the access unit 106 according to the first embodiment.

As shown in FIG. 4, the access unit 106 includes a housing 161, a reader / writer 162 arranged inside the housing 161 and a communication cable 163 for connecting the reader / writer 162 and the control device 5 described later. ..

The reader / writer 162 reads information about the brush 141 from the RFID tag 145 and transmits the information to the control device 5 via the communication cable 163. Further, the reader / writer 162 writes the information transmitted from the control device 5 via the communication cable 163 to the RFID tag 145.

Here, as the information written to the RFID tag 145, for example, "use pressure", "use time", "integrated value of use pressure and use time", "use device", "use module", "used flag". "And so on.

The "working pressure" is information indicating the working pressure of the brush 141. The "use time" is information indicating the use time of the brush 141. The "integrated value of working pressure and working time" is a value obtained by multiplying the above "working pressure" by the above "using time". For example, when the brush 141 is replaced, by writing this information on the RFID tag 145, the usage status of the brush 141 up to the replacement can be easily grasped, which is useful for the development of a new brush and quality control.

The “device used” is information for identifying the substrate processing device 1 in which the brush 141 is used. Further, the "use module" is information for identifying the processing unit 18 in which the brush 141 is used. For example, when the brush 141 is replaced, by writing this information on the RFID tag 145, it is possible to easily grasp which processing unit 18 of which substrate processing device 1 is the brush 141 used.

The "used flag" is information indicating that the brush 141 has been used. For example, when the brush 141 is replaced, the "used flag" can be written on the RFID tag 145 to prevent the used brush 141 from being reused, for example. Further, for example, even when the RFID tag 145 is taken out from the used brush 141 and the taken out RFID tag 145 is attached to the brush of the counterfeit product, the use of the counterfeit product can be prevented.

As described above, the reader / writer 162 of the access unit 106 is an example of an information reading unit that reads information about the brush 141 from the RFID tag 145. Further, the reader / writer 162 is also an example of an information writing unit for writing information indicating that the brush 141 has been used for the RFID tag 145.

If information is read or written to the RFID tag 145 in the vicinity of the wafer W, the wafer W may be affected by electromagnetic waves. Further, it is preferable to install the access unit 106 at a position where the treatment liquid does not directly come into contact with the access unit 106. Therefore, as shown in FIG. 3, the access unit 106 is arranged at the standby position of the brush 141. Specifically, the access unit 106 is arranged at a position that includes the standby position in the communicable range with the RFID tag 145 and does not include the wafer W held by the substrate holding unit 102 in the communicable range. Will be done.

As shown in FIG. 2, the substrate processing device 1 further includes a control device 5. The control device 5 controls the operation of the substrate processing device 1. Specifically, the transfer device 13 takes out a plurality of unprocessed wafers W from the cassette C together and accommodates them in the delivery unit 22 under the control of the control device 5. Subsequently, the transfer device 17 takes out the wafer W from the delivery unit 22 and transfers it to the processing unit 18 under the control of the control device 5.

Subsequently, the processing unit 18 performs a cleaning process using the brush 141 on the wafer W under the control of the control device 5. Here, an example of the procedure of the cleaning process will be described.

First, the processing unit 18 holds the peripheral edge portion of the wafer W carried in by the transport device 17 by the substrate holding unit 102. Further, the processing unit 18 drives the drive unit 124 to rotate the wafer W at a predetermined rotation speed.

Subsequently, the processing unit 18 moves the brush 141 from the standby position to the processing position by driving the swivel elevating mechanism 144. Further, the processing unit 18 rotates the brush 141 by driving the swivel elevating mechanism 144 and the rotation mechanism (not shown), and presses the rotating brush 141 against the wafer W with a predetermined pressing force. Then, the processing unit 18 drives the swivel elevating mechanism 144 to move the brush 141 from the center of the wafer W toward the outer circumference. At that time, the processing unit 18 supplies the processing liquid from the hollow portion of the brush 141 toward the wafer W by opening the valve 146. As a result, the particles and the like adhering to the wafer W are removed by the brush 141. After that, the processing unit 18 closes the valve 146, stops the rotation mechanism (not shown), and then drives the swivel elevating mechanism 144 to move the brush 141 to the standby position.

Subsequently, the processing unit 18 controls the swivel elevating mechanism 153 to move the nozzle 151 from the standby position to the processing position, and then opens the valve 156 to supply the rinse liquid from the nozzle 151 to the wafer W. As a result, the processing liquid, particles, and the like remaining on the wafer W are discharged from the wafer W together with the rinsing liquid. After that, the processing unit 18 closes the valve 156 and drives the swivel elevating mechanism 153 to move the nozzle 151 to the standby position.

Subsequently, the processing unit 18 accelerates the rotation of the wafer W by the drive unit 124 to dry the wafer W and then stops the drive unit 124. As a result, the cleaning process by the processing unit 18 is completed.

When the cleaning process is completed, the transfer device 17 takes out the processed wafer W from the processing unit 18 and accommodates it in the delivery unit 22 under the control of the control device 5. Then, according to the control of the control device 5, the transfer device 13 takes out a plurality of processed wafers W from the delivery unit 22 and stores them in the cassette C. As a result, a series of substrate processing by the substrate processing apparatus 1 is completed.

Next, a specific configuration example of the control device 5 will be described with reference to FIG. FIG. 5 is a block diagram showing a configuration of the control device 5 according to the first embodiment.

The control device 5 includes a control unit 51 and a storage unit 52. Further, the control unit 51 includes an information acquisition unit 511, a parameter setting unit 512, an authentication processing unit 513, a recipe execution unit 514, a usage status acquisition unit 515, a remaining life calculation unit 516, and a write control unit 517. And prepare. The storage unit 52 stores brush information 521, recipe information 522, and usage status information 523. Here, the control device 5 includes, for example, a computer having a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), an HDD (Hard Disk Drive), an input / output port, and various circuits. include.

The CPU of the computer reads, for example, a program stored in the ROM and executes it. As a result, the CPU of the computer can be used as an information acquisition unit 511, a parameter setting unit 512, an authentication processing unit 513, a recipe execution unit 514, a usage status acquisition unit 515, a remaining life calculation unit 516, and a write control unit 517 of the control unit 51. Function. At least one or all of the information acquisition unit 511, the parameter setting unit 512, the authentication processing unit 513, the recipe execution unit 514, the usage status acquisition unit 515, the remaining life calculation unit 516, and the write control unit 517 are composed of hardware. You may. The hard wafer is, for example, an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or the like.

Further, the storage unit 52 corresponds to, for example, a RAM or an HDD. The RAM or HDD can store brush information 521, recipe information 522, and usage status information 523. The control device 5 may acquire the above-mentioned programs and various information via another computer or a portable storage medium connected by a wired or wireless network. Examples of the storage medium readable by a computer include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

The information acquisition unit 511 acquires the information read from the RFID tag 145 by the access unit 106 via the communication cable 163. Further, the information acquisition unit 511 stores the acquired information as brush information 521 in the storage unit 52.

For example, when the information acquisition unit 511 detects that the brush 141 is attached to the arm 143 by a sensor (not shown), the information acquisition unit 106 may cause the access unit 106 to read information from the RFID tag 145. This makes it possible to obtain information about the newly attached brush 141. The information acquisition unit 511 may detect that the brush 141 is attached to the arm 143 by an input operation to the input unit 108 by the user.

Here, the contents of the brush information 521 will be described with reference to FIG. FIG. 6 is a diagram showing an example of brush information 521.

As shown in FIG. 6, the brush information 521 is associated with a "brush type", a "serial number", a "part number", a "pressure resistance", a "working pressure range", a "lifetime", an "authentication code", and the like. It will be remembered.

For example, the information acquisition unit 511 uses the brush type "D", the serial number "a4", the part number "b4", the withstand voltage "c4", the working pressure range "d4 to e4", and the life "f4" as the information of the brush 141. And it is assumed that the authentication code "g5" is acquired. When this information is new, that is, when it is not stored in the storage unit 52 as brush information 521, the information acquisition unit 511 stores the acquired information in the storage unit 52.

As a result, even when a new brush not registered in the substrate processing apparatus 1 is attached to the arm 143, information on the pressure resistance and the working pressure range can be automatically reflected in the recipe information of the processing unit 18. Therefore, it is not necessary to upgrade the software for registering a new brush in the substrate processing device 1.

The control unit 51 may perform a process of displaying the information acquired by the information acquisition unit 511 on the display unit 107 of the board processing apparatus 1.

The parameter setting unit 512 sets the parameters of the board processing using the information acquired by the information acquisition unit 511. Specifically, the parameter setting unit 512 reflects the information about the brush 141 acquired by the information acquisition unit 511 in the recipe information 522 stored in the storage unit 52.

The recipe information 522 is information indicating the content of the processing to be executed by the processing unit 18, in other words, information defining the processing conditions of the wafer W. The recipe information 522 includes parameters such as the time required for each process step in substrate processing, the rotation speed of the wafer W, the position (start point and end point) of the brush 141, the working pressure range, and the moving speed. The parameter setting unit 512 reflects, for example, the value of the working pressure range among the information acquired by the information acquisition unit 511 as the parameter value of the working pressure range of the recipe information 522. Further, the parameter setting unit 512 may reflect information other than the working pressure range, for example, pressure resistance information, etc. in the recipe information 522.

As described above, by automatically reflecting the information about the brush 141 read from the RFID tag 145 in the recipe information 522, it is not necessary to manually input the parameters by the user. Therefore, it is possible to prevent an input error of a parameter value or the like. In addition, the user can save the trouble of manually inputting the parameter value.

In addition, the parameter setting unit 512 prohibits the input of the parameter value exceeding the withstand voltage when the user manually changes the parameter value in the working pressure range, or displays that the input parameter value is inappropriate. It may be displayed on the unit 107.

The authentication processing unit 513 permits the execution of the board processing when the code input to the input unit 108 by the user matches the authentication code acquired by the information acquisition unit 511.

For example, when the authentication processing unit 513 detects that the brush 141 is attached to the arm 143, the authentication processing unit 513 causes the display unit 107 to display an authentication screen asking the user to input an authentication code. When the code is input by the user, the authentication processing unit 513 determines whether or not the input code matches the authentication code included in the information acquired by the information acquisition unit 511. Then, when the two match, the authentication processing unit 513 permits the execution of the board processing by, for example, storing the permission flag in the storage unit 52.

By performing the authentication process of the brush 141 in this way, it is possible to prevent the counterfeit brush from being attached to the arm 143 and used.

The recipe execution unit 514 controls each unit of the processing unit 18 based on the recipe information 522 to cause the processing unit 18 to execute the substrate processing.

The recipe execution unit 514 does not execute the board processing even if the user instructs the execution of the board processing when the authentication processing unit 513 does not permit the execution of the board processing. This makes it possible to prevent the use of counterfeit brushes.

The usage status acquisition unit 515 acquires the usage status including the usage pressure and the usage time of the brush 141. For example, the cleaning unit 104 is provided with a pressure sensor 109 that detects the working pressure (pressing pressure on the wafer W) of the brush 141. The usage status acquisition unit 515 acquires the usage pressure of the brush 141 from the pressure sensor 109, and stores the acquired usage pressure change with time in the storage unit 52 as usage status information 523. The usage status acquisition unit 515 may acquire the usage pressure and the usage time of the brush 141 based on the recipe information 522, the number of times the substrate processing is executed, and the like.

Further, for example, when the life of the brush 141 is represented by the integrated value of the working pressure and the usage time, the usage status acquisition unit 515 obtains the integrated value of the usage pressure and the usage time and stores the usage status information 523 in the storage unit 52. You may memorize it.

Further, the usage status acquisition unit 515 may store the above-mentioned information of the "used device", "used module", and "used flag" as the usage status information 523 in the storage unit 52 as other usage status. The usage status acquisition unit 515 stores this information in the storage unit 52, for example, when the first substrate processing using the brush 141 is executed.

The remaining life calculation unit 516 calculates the remaining life of the brush 141 based on the usage status of the brush 141 acquired by the usage status acquisition unit 515 and the information regarding the life of the brush 141 acquired by the information acquisition unit 511.

For example, the remaining life calculation unit 516 retrieves the information of the "integrated value of the working pressure and the usage time" stored as the usage status information 523 from the storage unit 52, and is based on the difference from the life acquired by the information acquisition unit 511. The remaining life of the brush 141 is calculated. The larger the difference, the longer the remaining life of the brush 141, and the smaller the difference, the shorter the remaining life of the brush 141.

The remaining life calculation unit 516 constantly calculates the remaining life, and when the calculated remaining life falls below the threshold value, displays information prompting the replacement of the brush 141 on the display unit 107 or transmits it to a higher-level device (not shown). Can be done.

The control unit 51 allocates substrate processing to the plurality of processing units 18 based on the remaining life of each brush 141 used in the plurality of processing units 18 so that the replacement times of the brush 141 are aligned among the plurality of processing units 18. May be decided. For example, the control unit 51 can arrange the replacement time of these processing units 18 by allocating more substrate processing to the processing unit 18 having a long remaining life than the processing unit 18 having a short remaining life. This makes it possible to efficiently replace the processing unit 18. It also facilitates regular maintenance planning.

The write control unit 517 controls the access unit 106 to write various information stored in the storage unit 52 as the usage status information 523 to the RFID tag 145. For example, the write control unit 517 may have the access unit 106 write the usage status information 523 to the RFID tag 145 each time the brush 141 moves to the standby position. Further, the write control unit 517 may have the access unit 106 write the usage status information 523 on the RFID tag 145 when the brush 141 is replaced.

Next, an example of the parameter setting process will be described with reference to FIG. 7. FIG. 7 is a flowchart showing an example of the parameter setting process. The parameter setting process is executed, for example, when it is detected that the brush 141 is attached to the arm 143.

As shown in FIG. 7, the control unit 51 first determines whether or not the information regarding the brush 141 has been read by the access unit 106 (step S101).

Subsequently, when it is determined in step S101 that the information regarding the brush 141 has been read (steps S101, Yes), the control unit 51 determines whether or not the attached brush 141 is unused (step S102). For example, if the information about the brush 141 does not include the "used flag", the control unit 51 determines that the attached brush 141 is unused.

When it is determined in step S102 that the brush 141 is unused (steps S102, Yes), the control unit 51 determines whether or not the brush 141 can be authenticated (step S103).

For example, the control unit 51 displays information such as the brush type read from the RFID tag 145 on the display unit 107, and displays a screen on the display unit 107 prompting to confirm whether or not the brush 141 replacement work has been completed. Let me. Further, the control unit 51 causes the display unit 107 to display a screen prompting the user to input the authentication code when the user performs an input operation to the input unit 108 indicating that the brush 141 replacement work is completed. Then, the control unit 51 determines that the brush 141 can be authenticated when the code input to the input unit 108 by the user matches the authentication code acquired by the information acquisition unit 511.

When it is determined in step S103 that the brush 141 can be authenticated (steps S103, Yes), the control unit 51 permits the execution of the substrate processing by, for example, storing the permission flag in the storage unit 52 (step S104).

Then, the control unit 51 sets the parameters (step S105). That is, the information about the brush 141 acquired by the information acquisition unit 511 is reflected in the recipe information 522.

On the other hand, when the information about the brush 141 cannot be read in step S101 (step S101, No), the control unit 51 prohibits the execution of the substrate processing by, for example, storing the prohibition flag in the storage unit 52 (step S106). ). When the prohibition flag is stored, the control unit 51 does not execute the board processing even when the user instructs the board processing to be executed. This makes it possible to prevent the use of counterfeit brushes.

Further, in step S102, even when the brush 141 is not unused (step S102, No), that is, when the used flag is written in the RFID tag 145, the control unit 51 executes the board processing. Prohibit (step S106). This makes it possible to prevent the used brush 141 from being reused. Further, for example, even when the RFID tag 145 is taken out from the used brush 141 and the taken out RFID tag 145 is attached to the brush of the counterfeit product, the use of the counterfeit product can be prevented.

Further, even when the brush 141 cannot be authenticated in step S103 (steps S103, No), the control unit 51 prohibits the execution of the substrate processing (step S106). This makes it possible to prevent unauthorized use of the brush 141.

When the process of step S105 or step S106 is completed, the control unit 51 ends the parameter setting process.

By the way, in the above-mentioned example, the reader / writer 162 of the access unit 106 is arranged at the standby position, but the arrangement of the reader / writer 162 is not limited to this example. A modified example of the arrangement of the reader / writer 162 will be described with reference to FIGS. 8 and 9. FIG. 8 is a diagram showing the arrangement of the reader / writer 162 according to the first modification in the first embodiment. Further, FIG. 9 is a diagram showing the arrangement of the reader / writer 162 according to the second modification in the first embodiment.

As shown in FIG. 8, the reader / writer 162 may be arranged inside the arm 143 in the cleaning unit 104. When the communication method of the RFID tag 145 is the electromagnetic induction method, it is preferable to arrange the reader / writer 162 in the arm 143 at a position as close as possible to the brush 141 because the communication distance is relatively short.

Further, as shown in FIG. 9, the reader / writer 162 may be arranged in the housing 161A of the handy type access unit 106A. In this case, since the access unit 106A can be arranged outside the chamber 101, it is possible to prevent the access unit 106A from being soiled or the like. As described above, the reader / writer 162 does not necessarily have to be provided in the processing unit 18.

Further, in the above example, the RFID tag 145 is embedded in the brush 141, but the RFID tag 145 does not necessarily have to be embedded in the brush 141. For example, the RFID tag 145 may be attached to the peripheral surface of the brush 141 and molded with a resin member.

In the first embodiment described above, the RFID tag 145 has been described as an example of the information holding unit that holds information about the brush 141, but the information holding unit is not limited to the RFID tag 145, and is, for example, a barcode. There may be. Barcodes do not use radio waves when reading information, so they have the advantage of having little effect on other devices.

Therefore, in the second embodiment, an example in which the information holding unit is a barcode will be described. Here, a one-dimensional bar code will be described as an example, but the bar code is not limited to the one-dimensional bar code and may be a two-dimensional bar code.

FIG. 10 is a diagram showing an example of the configuration of the cleaning unit and the access unit according to the second embodiment. 11 and 12 are views showing another example of the configuration of the cleaning unit and the access unit according to the second embodiment, and FIG. 13 is a diagram showing another configuration of the access unit according to the second embodiment. It is a figure which shows an example.

As shown in FIG. 10, in the cleaning unit 104B according to the second embodiment, the brush 141 is provided with the barcode 145B. The barcode 145B may be printed on the peripheral surface of the brush 141. In this case, it is preferable to protect the peripheral surface of the brush 141 on which the barcode 145B is printed with a transparent and chemical resistant protective member. As a result, it is possible to suppress contamination and deterioration of the barcode 145B, and it is preferable to use a fluororesin such as FEP as the protective member.

The barcode 145B is provided on the brush 141, and the brush 141 is removable from the processing unit 18. Therefore, the barcode 145B is also detachable from the processing unit 18.

The access unit 106B includes a housing 161B, a barcode reader 162B (an example of an information reading unit) arranged inside the housing 161B, and a communication cable 163B for connecting the barcode reader 162B and the control device 5. .. The access unit 106B is arranged at, for example, a standby position.

Further, as shown in FIG. 11, the access unit 106C may be attached to the arm 143 of the cleaning unit 104B and may be configured to be integrally movable with the arm 143.

In this case, the housing 161C has, for example, a horizontal portion extending horizontally along the arm 143 and a vertical portion extending downward from the tip of the horizontal portion to the height position of the brush 141. May be good. The barcode reader 162B may be arranged at a position facing the barcode 145B at the lower portion of the vertical portion of the housing 161C. Further, the communication cable 163B may be inserted inside the arm 143.

Further, as shown in FIG. 12, the barcode reader 162B may be arranged in the housing 161D of the handy type access unit 106D. In this case, since the access unit 106D can be arranged outside the chamber 101, it is possible to prevent the access unit 106D from being soiled or the like.

Further, the barcode 145B may be provided at a position other than the brush 141 as long as it can be read by the access units 106B to 106D. For example, as shown in FIG. 13, the barcode 145B may be provided on the arm 143 of the cleaning unit 104B. In this case, for example, a sticker on which the barcode 145B is printed and a brush 141 are set as a set, the brush 141 is attached to the arm 143, and the barcode 145B sticker is attached to a position readable by the access units 106B to 106D. Can be considered. The position where the barcode 145B is provided is preferably a place where the correspondence with the brush 141 can be understood. From such a viewpoint, the position where the barcode 145B is provided is preferably at least one of the processing units 18 and is a position that can be read by the access units 106B to 106D, and more preferably the brush 141. Is in the vicinity of.

In the second embodiment, when the information acquisition unit 511 detects that the brush 141 is attached to the arm 143 by a sensor (not shown) due to replacement work or the like, the information acquisition unit 511 uses the barcode 145B for the access units 106B to 106D. Have the information read out. Then, the parameter setting unit 512 sets the parameters of the substrate processing using the information acquired by the information acquisition unit 511. As a result, information on the pressure resistance and the working pressure range can be automatically reflected in the recipe information of the processing unit 18.

The information holding unit is not limited to the RFID tag 145 and the barcode 145B. For example, the information holding unit may be a rotary plate of a rotary encoder.

Therefore, in the third embodiment, an example in which the information holding unit is a rotary plate of the rotary encoder will be described with reference to FIGS. 14 to 16. FIG. 14 is a diagram showing the configuration of the cleaning unit according to the third embodiment. Further, FIG. 15 is a diagram showing an example of the configuration of the rotating plate. Further, FIG. 16 is a diagram showing an example of the duty ratio of the pulse detected by the rotary encoder.

As shown in FIG. 14, the cleaning unit 104E includes a rotary encoder 106E for detecting the rotation speed of the brush 141. The rotary encoder 106E includes a rotary plate 145E and a sensor unit 162E (an example of an information reading unit). The rotary plate 145E is detachably attached to the spindle 142 and rotates integrally with the spindle 142.

A plurality of slits 145E1 are arranged on the rotating plate 145E at a constant pitch along the circumferential direction (see FIG. 15). The sensor unit 162E has a light emitting unit and a light receiving unit, and the light emitting unit and the light receiving unit are arranged so as to face each other with the rotating plate 145E interposed therebetween. Further, although not shown here, a fixed slit plate having slits having the same pitch as the rotating plate 145E is arranged between the light emitting portion and the rotating plate 145E.

Further, the cleaning unit 104E includes a drive unit 110 such as a motor that rotates the spindle 142. The drive unit 110 and the spindle 142 are connected by, for example, pulleys 111 and 112 and a transmission belt 113. The rotary encoder 106E, the drive unit 110, the pulleys 111, 112, and the transmission belt 113 are housed in the arm 143 (not shown here).

The rotary encoder 106E irradiates light from the light emitting unit of the sensor unit 162E toward the light receiving unit. At this time, when the rotating plate 145E rotates with the rotation of the spindle 142, one waveform (pulse) is detected by the light receiving unit for each rotation of one pitch. The control unit 51 counts the number of pulses detected by the light receiving unit, and detects the rotation speed of the brush 141 from the number of pulse counts per unit time.

In the third embodiment, the plurality of slits 145E1 formed in the rotating plate 145E are formed in a pattern peculiar to each brush 141. Specifically, the widths of the plurality of slits 145E1 are formed so as to be different among the plurality of brushes 141. On the other hand, the pitches of the plurality of slits 145E1 are formed to be the same among the plurality of brushes 141. In other words, the number of the plurality of slits 145E1, that is, the number of pulses detected until the rotating plate 145E makes one rotation is formed to be the same among the plurality of brushes 141.

As described above, the widths of the plurality of slits 145E1 are formed to be different among the plurality of brushes 141. Therefore, as shown in FIG. 16, the duty ratio (τ / T) of the pulse output from the sensor unit 162E is a value peculiar to each brush 141 (here, brushes A to C).

In the third embodiment, in the storage unit 52, for example, in addition to each item of the brush information 521 shown in FIG. 6, brush information including a duty ratio item is stored. Further, in the third embodiment, the information acquisition unit 511 of the control unit 51 calculates the duty ratio of the pulse output from the sensor unit 162E. Then, the information acquisition unit 511 can acquire information such as the brush type and the withstand voltage associated with the calculated duty ratio from the storage unit 52 as information regarding the brush 141.

As described above, the substrate processing apparatus 1 according to the embodiment includes a processing unit 18, an information holding unit (for example, an RFID tag 145, a barcode 145B, and a rotary plate 145E), and an information acquisition unit 511. The processing unit 18 performs substrate processing using the brush 141. The information holding unit is provided in the processing unit 18 and holds information about the brush 141. The information acquisition unit 511 acquires the information read from the information holding unit.

As described above, the substrate processing apparatus 1 according to the embodiment facilitates the management of the brush 141 such as parameter management and quality control by acquiring the information read from the information holding unit that holds the information about the brush 141. be able to.

Further, in the substrate processing apparatus 1 according to the embodiment, the information holding unit may be an RFID tag 145. By using the RFID tag 145 as the information holding unit, it is possible not only to read the information from the RFID tag 145 but also to write the information to the RFID tag 145. Further, since the RFID tag 145 can read information even when it is embedded inside the component, it is easy to make it less susceptible to the influence of the processing liquid.

Further, in the substrate processing apparatus 1 according to the embodiment, the information holding unit may be a barcode 145B. Since the barcode 145B does not use radio waves when reading information, it has an advantage that it has little influence on other devices.

Further, the substrate processing device 1 according to the embodiment may include an information reading unit (for example, a reader / writer 162, a barcode reader 162B, and a sensor unit 162E) that reads information about the brush 141 from the information holding unit. Further, even if the processing unit 18 is provided with an arm 143 that supports the brush 141 and moves the brush 141 between the processing position above the substrate (for example, the wafer W) and the standby position outside the substrate. good. Further, the information holding unit may be provided on the brush 141 or the arm 143, and the information reading unit may be arranged at the standby position.

Thereby, for example, when the information holding unit is the RFID tag 145, it is possible to suppress the influence of the electromagnetic wave on the wafer W when reading the information from the RFID tag 145. Further, by arranging the information reading unit at the standby position, it is possible to prevent the processing liquid from being applied to the information reading unit.

Further, in the substrate processing apparatus 1 according to the embodiment, the information holding unit may be the rotary plate 145E of the rotary encoder 106E attached to the rotary shaft (for example, the spindle 142) of the brush 141. In this case, the rotating plate 145E may have a plurality of slits 145E1 arranged in the circumferential direction in a pattern corresponding to the brush 141.

By providing the rotating plate 145E with a plurality of slits 145E1 arranged in the circumferential direction in a pattern corresponding to the brush 141 in this way, for example, the brush 141 can be identified by the duty ratio of the pulse detected by the rotary encoder 106E. Can be done.

Further, the substrate processing apparatus 1 according to the embodiment may include a parameter setting unit 512 that sets parameters for substrate processing using the information acquired by the information acquisition unit 511. This eliminates the need for parameter setting by manual input by the user, so that it is possible to prevent an input error of a parameter value or the like. In addition, the user can save the trouble of manually inputting the parameter value.

Further, in the substrate processing apparatus 1 according to the embodiment, the information regarding the brush 141 may include information regarding the life of the brush 141. In this case, the substrate processing apparatus 1 according to the embodiment may include a usage status acquisition unit 515 and a remaining life calculation unit 516. The usage status acquisition unit 515 acquires the usage status including the usage pressure and the usage time of the brush 141. The remaining life calculation unit 516 calculates the remaining life of the brush 141 based on the usage status acquired by the usage status acquisition unit and the information regarding the brush life acquired by the information acquisition unit 511.

Thereby, for example, the replacement time of the brush 141 can be predicted. Further, it is possible to determine the allocation of the substrate processing to the plurality of processing units 18 so that the replacement times of the brush 141 are aligned among the plurality of processing units 18.

Further, in the substrate processing apparatus 1 according to the embodiment, the information regarding the brush 141 may include an authentication code. In this case, the board processing device 1 according to the embodiment includes an authentication processing unit 513 that permits execution of board processing when the code input by the user matches the authentication code acquired by the information acquisition unit 511. You may.

This makes it possible to prevent, for example, a counterfeit brush from being attached to the arm 143 and used.

Further, the substrate processing device 1 and the information holding unit according to the embodiment may be provided with an information writing unit (as an example, a reader / writer 162) for writing information indicating that the brush 141 has been used.

This makes it possible, for example, to prevent the used brush 141 from being reused. Further, for example, even when the RFID tag 145 is taken out from the used brush 141 and the taken out RFID tag 145 is attached to the brush of the counterfeit product, the use of the counterfeit product can be prevented.

It should be considered that the embodiments disclosed this time are exemplary in all respects and not restrictive. Indeed, the above embodiments can be embodied in a variety of forms. Further, the above-described embodiment may be omitted, replaced or changed in various forms without departing from the scope of the attached claims and the purpose thereof.

W Wafer 1 Substrate processing device 5 Control device 51 Control unit 52 Storage unit 18 Processing unit 104 Cleaning unit 106 Access unit 141 Brush 143 Arm 145 RFID tag (example of information holding unit)
162 Reader / Writer 511 Information acquisition unit 512 Parameter setting unit

Claims (8)

A processing unit that processes the substrate using a brush,
An information holding unit provided in the processing unit and holding information about the brush,
An information reading unit that reads the information from the information holding unit, and an information reading unit.
An information acquisition unit that acquires the information read from the information holding unit by the information reading unit, and an information acquisition unit .
Equipped with
The processing unit
An arm that supports the brush and moves the brush between a processing position above the substrate and a standby position outside the substrate.
Equipped with
The information holding unit is
Provided on the brush or the arm
The information reading unit is
A substrate processing device arranged at the standby position . A processing unit that processes the substrate using a brush,
An information holding unit provided in the processing unit and holding information about the brush,
It is provided with an information acquisition unit that acquires the information read from the information holding unit .
The information holding unit is
A substrate processing apparatus which is a rotary plate of a rotary encoder attached to a rotary shaft of the brush and has a plurality of slits arranged in the circumferential direction in a pattern corresponding to the brush . The information holding unit is
The substrate processing apparatus according to claim 1, which is an RFID tag. The information holding unit is
The substrate processing apparatus according to claim 1, which is a barcode. The substrate processing apparatus according to any one of claims 1 to 4 , further comprising a parameter setting unit for setting parameters for the substrate processing using the information acquired by the information acquisition unit. The information includes information regarding the life of the brush.
The usage status acquisition unit that acquires the usage status including the usage pressure and usage time of the brush, and
The claim includes a remaining life calculation unit for calculating the remaining life of the brush based on the usage status acquired by the usage status acquisition unit and the information regarding the life of the brush acquired by the information acquisition unit. The substrate processing apparatus according to any one of 1 to 5 . The information includes an authorization code and
The invention according to any one of claims 1 to 6 , further comprising an authentication processing unit that permits execution of the board processing when the code input by the user matches the authentication code acquired by the information acquisition unit. Board processing equipment. The substrate processing apparatus according to claim 3 , further comprising an information writing unit for writing information indicating that the brush has been used to the information holding unit.

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