JP6785605B2 - Substrate processing method, substrate processing equipment, and recording medium - Google Patents

Description

The present invention relates to a substrate processing method for processing a substrate, a substrate processing apparatus, and a computer-readable recording medium in which a computer provided in the substrate processing apparatus records a program for executing the substrate processing method.
The substrates to be processed include, for example, semiconductor wafers, liquid crystal display device substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, optomagnetic disk substrates, and photomasks. Substrates such as substrates, ceramic substrates, and solar cell substrates are included.

In the substrate processing by the single-wafer type substrate processing apparatus that processes the substrates one by one, in order to physically clean the upper surface of the substrate, the upper surface of the substrate held by the spin chuck may be cleaned with a brush. In the substrate processing method described in Patent Document 1 below, the entire upper surface of the substrate is cleaned by bringing the brush into contact with the upper surface of the rotating substrate and scanning the brush in the horizontal direction.

2016-149470

In the substrate processing method described in Patent Document 1, when the upper surface of the substrate is unevenly soiled, there is a possibility that the stains cannot be sufficiently removed. On the other hand, in order to sufficiently clean the entire upper surface of the substrate, it is conceivable to lengthen the time for the brush to contact the upper surface of the substrate, but this increases the time required for cleaning the substrate, and the throughput ( The number of substrates processed per unit time) may decrease.

Therefore, one object of the present invention is to provide a substrate processing method, a substrate processing apparatus, and a computer provided in the substrate processing apparatus, which can suppress a decrease in throughput and can evenly clean the upper surface of the substrate. It is to provide a computer-readable recording medium on which a program for executing a substrate processing method is recorded.

One embodiment of the present invention includes a substrate holding step of holding the substrate horizontally, a substrate rotating step of rotating the horizontally held substrate around a rotation axis along a vertical direction, and the horizontally held substrate. A brush contact step of bringing a brush for cleaning the upper surface of the substrate into contact with the upper surface of the substrate in a rotating state, and a position of contacting the center of the upper surface of the horizontally held substrate in parallel with the brush contact step. The brush moving step of moving the brush between the position where the brush is in contact with the outer periphery of the upper surface of the substrate, and the upper surface of the substrate are divided into a plurality of regions by circular virtual lines concentric with the substrate, and each of the regions Provided is a substrate processing method including a speed setting step of setting a priority and setting a moving speed of the brush in the brush moving step so that the moving speed of the brush becomes lower in the region having a higher priority. To do.

According to this method, the upper surface of the substrate is divided into a plurality of regions by a circular virtual line concentric with the rotating substrate, and priority is set for each region. Since the moving speed of the brush in the brush moving step executed in parallel with the brush contact step is set to be lower as the priority is higher, the higher priority area is, the longer the cleaning is performed. Therefore, by setting the priority of each area so that the area where dirt adhering to the substrate is difficult to be removed has a higher priority, it is possible to sufficiently clean the area on the upper surface of the board where dirt is difficult to be removed. On the other hand, it is possible to shorten the cleaning time of the region on the upper surface of the substrate where dirt is easily removed. Therefore, it is possible to suppress a decrease in throughput and evenly clean the upper surface of the substrate.

In one embodiment of the present invention, the moving speed of the brush in the brush moving step is determined based on the priority set so that the higher the degree of contamination of the upper surface of the substrate is, the higher the speed setting step is. Includes a process to set for each area.
According to this method, the higher the degree of contamination of the substrate, the higher the priority. Therefore, it is possible to sufficiently clean the region having a relatively high degree of contamination on the upper surface of the substrate, while it is possible to shorten the cleaning time of the region having a relatively low degree of contamination on the upper surface of the substrate. Therefore, it is possible to suppress a decrease in throughput and evenly clean the upper surface of the substrate.

In one embodiment of the present invention, in the speed setting step, the total time during which the brush moving step is executed is T, the number of the regions is i, and the i-th priority of the region counted from the rotation axis. The degree is wi, the moving distance of the brush in the i-th region counting from the rotation axis is ri, the moving time of the brush in the i-th region counting from the rotation axis is ti, and the rotation axis is ti. The step of setting the moving speed of the brush in each of the regions is included based on the following equations (1) and (2), where the moving speed of the brush in the i-th region counting from is set as vi.

According to this method, the total time T in which the brush moving step is executed, the number i of the regions, the priority wi of the i-th region, and the moving distance ri of the brush in the i-th region are specified, and the equation (1) is specified. ) Is used to calculate the brush movement time ti in the i-th region. Then, by substituting the movement time ti calculated from the equation (1) and the movement distance ri of the brush in the designated i-th region into the equation (2), the movement speed vi of the brush in the i-th region Is calculated. Therefore, the brush moving speed vi in each region is set so that the brush moving step ends after a lapse of time T from the start of the brush moving step (at a predetermined time). Therefore, the decrease in throughput can be reliably suppressed.

In one embodiment of the present invention, the brush contact step includes a brush pressing step of pressing the brush against the upper surface of the rotating substrate. Further, the substrate processing method sets a second priority for each of the regions, and the pressing amount or pressing pressure of the brush against the rotating substrate is increased in the region having a higher second priority. The pressing state setting step of setting each of the above areas is further included. The pressing amount of the brush means the amount of movement of the brush toward the upper surface of the substrate after the brush comes into contact with the upper surface of the substrate.

According to this method, the pressing amount or pressing pressure of the brush against the rotating substrate is higher in the second higher priority region set in each region. Here, the higher the pressing amount or pressing pressure of the brush, the easier it is to remove the dirt adhering to the upper surface of the substrate. Therefore, it is possible to shorten the cleaning time of the region having a relatively high second priority on the upper surface of the substrate. On the other hand, as compared with the substrate processing in which the brush is always pressed against the substrate with a constant pressing amount (pressing pressure), the consumption of the brush can be suppressed and the life of the brush can be extended. Therefore, it is possible to suppress a decrease in throughput and evenly clean the upper surface of the substrate.

In one embodiment of the present invention, the pressing amount or the pressing pressure is set based on the second priority set so that the degree of contamination of the upper surface of the substrate becomes higher in the pressing state setting step. Includes setting process.
According to this method, the higher the degree of contamination on the upper surface of the substrate, the higher the second priority. Further, as described above, the higher the second priority region, the higher the pressing amount or pressing pressure. Therefore, it is possible to shorten the cleaning time of the upper surface of the substrate in a region where the degree of contamination is relatively high. On the other hand, as compared with the substrate processing in which the brush is always pressed against the substrate with a constant pressing amount (pressing pressure), the consumption of the brush can be suppressed and the life of the brush can be extended. Therefore, it is possible to suppress a decrease in throughput and evenly clean the upper surface of the substrate.

In one embodiment of the present invention, the brush contact step includes a brush pressing step of pressing the brush against the upper surface of the rotating substrate. In addition, the substrate processing method includes a pressing state setting step of setting the pressing amount or pressing pressure of the brush against the rotating substrate so that the brush processing method changes in inverse proportion to the moving speed of the brush.
According to this method, the pressing amount or pressing pressure of the brush against the rotating substrate is set so as to change in inverse proportion to the moving speed of the brush. That is, the amount or pressure of the brush pressed against the rotating substrate in the brush pressing step increases as the moving speed of the brush decreases. Therefore, the higher the priority region, the higher the pressing amount or the pressing pressure, and the cleaning time of the upper surface of the substrate in the relatively high priority region can be shortened. Therefore, it is possible to suppress a decrease in throughput and evenly clean the upper surface of the substrate.

In one embodiment of the present invention, the substrate processing method includes a brush elevating step of raising and lowering the brush in parallel with the brush moving step, and a brush moving step with the brush along the upper surface of the substrate. Further includes a vertical position setting step of setting the vertical position of the brush in the brush raising / lowering step for each of the regions so that
According to this method, the brush raising / lowering step is executed in parallel with the brush moving step. The vertical position of the brush in the brush raising / lowering process is set for each region so that the brush moving process is executed with the brush along the upper surface of the substrate. Therefore, even if the substrate is warped, the state in which the brush is in contact with the upper surface of the substrate can be maintained, so that uneven cleaning of the upper surface of the substrate can be suppressed. Therefore, the upper surface of the substrate can be cleaned even more evenly.

In another embodiment of the present invention, the substrate processing apparatus includes a substrate holding means for horizontally holding the substrate and a substrate rotating means for rotating the substrate held by the substrate holding means around a rotation axis along a vertical direction. , A brush for cleaning the upper surface of the substrate held by the substrate holding means, a brush contact means for bringing the brush into contact with the upper surface of the substrate held by the substrate holding means, and a brush moving for moving the brush in the horizontal direction. The means includes a substrate rotating means, a brush contacting means, and a controlling means for controlling the brush moving means.

Further, in parallel with the substrate rotation step in which the control means rotates the horizontally held substrate, the brush contact step in which the brush is brought into contact with the horizontally held substrate, and the brush contact step, the horizontal A brush moving step of moving the brush between a position in contact with the center of the upper surface of the substrate held by the substrate and a position in contact with the outer periphery of the upper surface of the substrate, and a circular shape in which the upper surface of the substrate is concentric with the substrate. The area is divided into a plurality of areas by the virtual line of the above, a priority is set for each of the areas, and the moving speed of the brush in the brush moving step is set so that the moving speed of the brush becomes lower as the priority is higher. Execute the speed setting process to be set.

According to this configuration, the upper surface of the substrate is divided into a plurality of regions by a circular virtual line concentric with the rotating substrate, and priority is set for each region. Since the moving speed of the brush in the brush moving step executed in parallel with the brush contact step is set to be lower as the priority is higher, the higher priority area is, the longer the cleaning is performed. Therefore, by setting the priority of each area so that the area where dirt adhering to the substrate is difficult to be removed has a higher priority, it is possible to sufficiently clean the area on the upper surface of the board where dirt is difficult to be removed. On the other hand, it is possible to shorten the cleaning time of the region on the upper surface of the substrate where dirt is easily removed. Therefore, it is possible to suppress a decrease in throughput and evenly clean the upper surface of the substrate.

In another embodiment of the present invention, the priority is set so that the higher the degree of contamination on the upper surface of the substrate, the higher the priority.
According to this configuration, the higher the degree of contamination of the substrate, the higher the priority. Therefore, it is possible to sufficiently clean the region having a relatively high degree of contamination on the upper surface of the substrate, while it is possible to shorten the cleaning time of the region having a relatively low degree of contamination on the upper surface of the substrate. Therefore, it is possible to suppress a decrease in throughput and evenly clean the upper surface of the substrate.

In another embodiment of the present invention, the control means has T as the total time during which the brush moving step is executed, i as the number of regions, and the priority of the i-th region counted from the rotation axis. The degree is wi, the moving distance of the brush in the i-th region counted from the rotation axis is ri, the moving time of the brush in the i-th region counting from the rotation axis is ti, and the rotation axis is ti. The step of setting the moving speed of the brush in each of the regions is executed based on the following equations (1) and (2), where the moving speed of the brush in the i-th region counting from is set to vi.

According to this configuration, the total time T in which the brush moving process is executed, the number i of the regions, the priority wi of the i-th region, and the moving distance ri of the brush in the i-th region are specified, and the equation (1) is specified. ) Is used to calculate the brush movement time ti in the i-th region. Then, by substituting the movement time ti calculated from the equation (1) and the movement distance ri of the brush in the designated i-th region into the equation (2), the movement speed vi of the brush in the i-th region can be obtained. It is calculated. Therefore, the brush movement speed vi in each region is set so that the brush movement process ends after a lapse of time T from the start of the brush movement process (at a time specified in advance), so that a decrease in throughput is surely suppressed. can do.

In another embodiment of the invention, the substrate processing apparatus further includes a brush pressing means that presses the brush against the upper surface of the horizontally held substrate. In addition, the control means sets a brush pressing step of pressing the brush against the upper surface of the rotating substrate and a second priority in each of the regions, and the amount of pressing the brush against the rotating substrate. Alternatively, the pressing state setting step of setting the pressing pressure in each of the regions so that the region having the higher second priority becomes higher is executed.

According to this configuration, the pressing amount or pressing pressure of the brush against the rotating substrate is higher in the second higher priority region set in each region. Here, the higher the pressing amount or pressing pressure of the brush, the easier it is to remove the dirt adhering to the upper surface of the substrate. Therefore, it is possible to shorten the cleaning time of the region having a relatively high second priority. Compared with the substrate processing in which the brush is always pressed against the substrate with a constant pressing amount (pressing pressure), the consumption of the brush can be suppressed and the life of the brush can be extended. Therefore, it is possible to suppress a decrease in throughput and evenly clean the upper surface of the substrate.

In another embodiment of the present invention, the control means sets the pressing amount or the pressing pressure based on the second priority set so that the higher the degree of contamination of the upper surface of the substrate is, the higher the degree of contamination is. Perform the process.
According to this configuration, the higher the degree of contamination on the upper surface of the substrate, the higher the second priority. Further, as described above, the higher the second priority region, the higher the pressing amount or pressing pressure. Therefore, it is possible to shorten the cleaning time of the upper surface of the substrate in a region where the degree of contamination is relatively high. On the other hand, as compared with the substrate processing in which the brush is always pressed against the substrate with a constant pressing amount (pressing pressure), the consumption of the brush can be suppressed and the life of the brush can be extended. Therefore, it is possible to suppress a decrease in throughput and evenly clean the upper surface of the substrate.

In another embodiment of the invention, the substrate processing apparatus further includes a brush pressing means that presses the brush against the upper surface of the horizontally held substrate. Further, the brush pressing step in which the control means presses the brush against the upper surface of the rotating substrate and the pressing of the brush against the rotating substrate so as to change in inverse proportion to the moving speed of the brush. Execute the pressing state setting step of setting the amount or pressing pressure.

According to this configuration, the pressing amount or pressing pressure of the brush against the rotating substrate is set so as to change in inverse proportion to the moving speed of the brush. That is, the pressing amount or pressing pressure of the brush against the rotating substrate increases as the moving speed of the brush decreases. Therefore, the higher the priority region, the higher the pressing amount or the pressing pressure, and the cleaning time of the upper surface of the substrate in the relatively high priority region can be shortened. Therefore, it is possible to suppress a decrease in throughput and evenly clean the upper surface of the substrate.

In another embodiment of the present invention, the substrate processing apparatus further includes a brush elevating means for elevating the brush. Further, the control means executes the brush raising / lowering step of raising and lowering the brush and the brush moving step in a state where the brush is placed along the upper surface of the substrate in parallel with the brush contacting step. The vertical position setting step of setting the vertical position of the brush in the brush raising / lowering step for each region is executed.

According to this configuration, the brush raising / lowering step is executed in parallel with the brush moving step. The vertical position of the brush in the brush raising / lowering process is set for each region so that the brush moving process is executed with the brush along the upper surface of the substrate. Therefore, even if the substrate is warped, the state in which the brush is in contact with the upper surface of the substrate can be maintained, so that uneven cleaning of the upper surface of the substrate can be suppressed. Therefore, the upper surface of the substrate can be cleaned even more evenly.

Yet another embodiment of the present invention provides a computer-readable recording medium on which a program for causing a computer provided in a substrate processing apparatus to execute the substrate processing method is recorded. According to this configuration, the same effect as described above can be obtained.

FIG. 1 is a schematic plan view for explaining the internal layout of the substrate processing apparatus according to the embodiment of the present invention. FIG. 2 is a schematic vertical sectional view for explaining a configuration example of a processing unit provided in the substrate processing apparatus. FIG. 3 is a block diagram for explaining the electrical configuration of the main part of the substrate processing apparatus. FIG. 4 is a flow chart for explaining an example of substrate processing by the substrate processing apparatus. FIG. 5A is a schematic front view of the substrate in the brush moving step of the substrate processing (S6 of FIG. 4). FIG. 5B is a schematic plan view of the substrate in the brush moving step of the substrate processing (S6 of FIG. 4). FIG. 6 is a flow chart for explaining an example of a method of setting the moving speed of the brush in each region by the control means provided in the substrate processing apparatus. FIG. 7A is an example of a graph diagram created based on the moving speed of the brush set by the method shown in FIG. FIG. 7B is an example of a graph diagram created based on the moving speed of the brush set by the method shown in FIG. FIG. 8A is a table showing an example of the relationship between the second priority in each region and the pressing force of the brush. FIG. 8B is an example of a graph showing the pressing pressure set for each region. FIG. 9A is a schematic front view of the board in which the warp is generated. FIG. 9B is a schematic front view of the board in which the warp is generated. FIG. 10 is a table showing an example of information acquired by the control means in the method shown in FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic plan view for explaining the internal layout of the substrate processing apparatus 1 according to the embodiment of the present invention. The substrate processing device 1 is a single-wafer type device that processes substrates W such as silicon wafers one by one. In this embodiment, the substrate W is a circular substrate.
The substrate processing apparatus 1 includes a plurality of processing units 2 for processing the substrate W, a plurality of load port LPs each holding a carrier C accommodating a plurality of substrates W processed by the processing unit 2, and a load port LP. It includes transfer robots IR and CR that transfer the substrate W to and from the processing unit 2, and a control unit 3 that controls the substrate processing device 1.

The substrate processing device 1 includes a measurement unit 4 for measuring the state of the substrate W carried out from the plurality of load port LPs, and an operation unit 6 for operating the substrate processing device 1. The operation unit 6 has a display unit (not shown) for displaying information on the substrate processing, and an input unit (not shown) for the operator to input information on the substrate processing.
The transfer robot IR transfers the substrate W between the carrier C and the transfer robot CR. The transfer robot CR transfers the substrate W between the transfer robot IR and the processing unit 2. The plurality of processing units 2 have, for example, a similar configuration.

FIG. 2 is a schematic vertical sectional view for explaining a configuration example of the processing unit 2.
The processing unit 2 has a spin chuck 5 that rotates the substrate W around a vertical rotation axis a1 passing through the center of the substrate W while holding one substrate W in a horizontal posture, and deionization on the upper surface of the substrate W. It includes a treatment liquid nozzle 10 for supplying a treatment liquid such as water (DIW: Deionized Water). The processing unit 2 further includes a chamber 13 (see FIG. 1) that houses the spin chuck 5. Although not shown, the chamber 13 is formed with a carry-in / carry-out port for carrying in / out the substrate W, and is provided with a shutter unit for opening and closing the carry-in / carry-out port.

The spin chuck 5 may be a vacuum type chuck that holds the substrate W horizontally by adsorbing the back surface (lower surface) of the substrate W, which is a non-device forming surface, or by sandwiching the substrate W in the horizontal direction. It may be a holding type chuck that holds the substrate W horizontally. In this embodiment, an example in which the spin chuck 5 is a vacuum type chuck is shown.
The spin chuck 5 includes a spin base 21, a rotating shaft 22 coupled to the center of the lower surface of the spin base 21, and an electric motor 23 that applies a rotational force to the rotating shaft 22. The rotating shaft 22 extends in the vertical direction along the rotating axis a1. A spin base 21 is coupled to the upper end of the rotating shaft 22. The spin base 21 has a disk shape along the horizontal direction.

On the upper surface of the spin base 21, a plurality of suction ports 24 for sucking the substrate W arranged on the upper surface of the spin base 21 and holding the substrate W on the spin base 21 are formed. The suction port 24 is connected to the suction pipe 50 via a suction path 25 formed inside the spin base 21 and the rotating shaft 22. The suction pipe 50 is connected to a suction mechanism 27 such as a vacuum pump. The suction pipe 50 is provided with a suction valve 40 for opening and closing the path. The spin base 21 and the suction mechanism 27 are examples of substrate holding means for holding the substrate W horizontally.

Unlike this embodiment, the suction pipe 50 extends to the inside of the spin base 21 and the rotating shaft 22, and the portion of the suction pipe 50 extending to the inside of the spin base 21 and the rotating shaft 22 constitutes the suction path 25. You may be.
When the rotating shaft 22 is rotated by the electric motor 23, the substrate W is rotated around the rotating axis a1. Hereinafter, the radial direction centered on the rotation axis a1 is referred to as the rotation radius direction. The radius of gyration direction is also the radial direction of the substrate W. Further, the inside in the radial direction of rotation is simply referred to as "inward in the radial direction", and the outside in the radial direction of rotation is simply referred to as "outward in the radial direction". The rotating shaft 22 and the electric motor 23 are examples of substrate rotating means for rotating the substrate W around the rotating axis a1.

In this embodiment, the treatment liquid nozzle 10 is a fixed nozzle arranged so as to discharge the treatment liquid toward the rotation center of the upper surface of the substrate W. A treatment liquid such as DIW is supplied to the treatment liquid nozzle 10 from the treatment liquid supply source via the treatment liquid supply pipe 51. The treatment liquid supply pipe 51 is interposed with a treatment liquid valve 41 for opening and closing the flow path thereof and a treatment liquid flow rate adjusting valve 42 for adjusting the flow rate of the treatment liquid in the treatment liquid supply pipe 51. .. The treatment liquid nozzle 10 does not have to be a fixed nozzle, and may be at least a moving nozzle that moves in the horizontal direction.

The treatment liquid nozzle 10 may be a rinse liquid nozzle for supplying a rinse liquid other than DIW. Examples of the rinse solution include carbonated water, electrolytic ionized water, ozone water, hydrochloric acid water having a dilution concentration (for example, about 10 to 100 ppm), reduced water (hydrogen water), and the like, in addition to DIW. Further, the treatment liquid supplied from the treatment liquid nozzle 10 to the substrate W may be a liquid other than the rinsing liquid, for example, a chemical liquid, or a liquid organic solvent such as IPA. .. A plurality of types of treatment liquids may be sequentially supplied to the substrate W from one or more nozzles.

The processing unit 2 includes a brush 31 for cleaning the upper surface of the substrate W, a brush arm 35 for supporting the brush 31, a brush moving mechanism 36 for moving the brush 31 by moving the brush arm 35, and a substrate W. It includes a pressing state changing mechanism 39 for changing the pressing amount or pressing force of the brush 31 against the upper surface. The pressing amount of the brush 31 means the amount of movement of the brush 31 toward the upper surface of the substrate W after the brush 31 comes into contact with the upper surface of the substrate W.

The brush 31 is held by a brush holder 32 arranged above the brush 31. The brush holder 32 is attached to a holder mounting portion 33 arranged above the brush holder 32. The holder mounting portion 33 is supported by a support shaft 34 extending upward from the holder mounting portion 33. The support shaft 34 projects downward from the brush arm 35.
The brush 31 is an elastically deformable sponge brush made of a synthetic resin such as PVA (polyvinyl alcohol). The brush 31 projects downward from the brush holder 32. The brush 31 includes a cleaning surface 31a arranged below the brush holder 32. The cleaning surface 31a faces the upper surface of the substrate W in the vertical direction. The cleaning surface 31a is smaller than the substrate W in a plan view. The cleaning surface 31a may be a flat surface parallel to the upper surface of the substrate W or a hemispherical surface convex downward in a free state in which the brush 31 is not pressed against the substrate W. When the cleaning surface 31a is circular, the diameter of the cleaning surface 31a is, for example, 20 mm. However, the size of the cleaning surface 31a is not limited to this. Further, the brush 31 is not limited to the sponge brush, and may be a brush having hair bundles formed by a plurality of resin fibers.

The pressing state changing mechanism 39 is an actuator such as an air cylinder that moves the brush 31 up and down in the vertical direction. The pressing state changing mechanism 39 is arranged in the brush arm 35. The processing unit 2 may include a brush rotation mechanism in the brush arm 35 that rotates the brush 31 around the rotation axis a1 that is vertical to the brush arm 35. When the brush rotation mechanism is provided on the brush arm 35, the brush rotation mechanism rotates the brush 31 by rotating the support shaft 34 around its center line.

The brush moving mechanism 36 includes a brush horizontal drive mechanism 37 that moves the brush arm 35 horizontally, and a brush vertical drive mechanism 38 that moves the brush arm 35 vertically. FIG. 2 shows an example in which the brush horizontal drive mechanism 37 is a brush turning mechanism that rotates the brush arm 35 around the vertical brush rotation axis a2 located around the spin chuck 5. The brush horizontal drive mechanism 37 may be a brush slide mechanism that linearly moves the brush arm 35 in the horizontal direction. The brush horizontal drive mechanism 37 is an example of a brush moving means for moving the brush 31 in the horizontal direction. The brush vertical drive mechanism 38 is an example of a brush raising / lowering means for raising and lowering the brush 31.

The brush 31 has a standby position where the brush 31 is located around the spin chuck 5 in a plan view and a center where the brush 31 contacts the center of the upper surface of the substrate W when the brush horizontal drive mechanism 37 moves the brush arm 35. It is movable to and from the position. The position between the standby position and the center position includes an outer peripheral position where the brush 31 contacts the outer periphery of the upper surface of the substrate W. The center of the upper surface of the substrate W is a portion where the upper surface of the substrate W and the rotation axis a1 intersect. The outer circumference of the upper surface of the substrate W is a portion of the upper surface of the substrate W that is slightly inside (center side) of the substrate W with respect to the peripheral edge of the substrate W.

FIG. 3 is a block diagram for explaining the electrical configuration of the main part of the substrate processing apparatus 1. The control unit 3 includes a computer main body 67 and a peripheral device 68 connected to the computer main body 67. The computer body 67 includes a CPU 69 (central processing unit) that executes various instructions and a main storage device 70 that stores information. The peripheral device 68 includes an auxiliary storage device 71 that stores information such as a program, a reading device 72 that reads information from the removable media M, and a communication device 73 that communicates with an external device such as a host computer HC.

The computer body 67 is connected to each of the auxiliary storage device 71, the reading device 72, and the communication device 73. The computer main body 67 is further connected to each device such as the transfer robot IR and the processing unit 2. The computer body 67 exchanges information with each of the auxiliary storage devices 71 and the like.
The CPU 69 executes the program P stored in the auxiliary storage device 71 and the program P read from the removable media M by the reading device 72. The program P in the auxiliary storage device 71 may be pre-installed in the control unit 3, or may be sent from the removable media M to the auxiliary storage device 71 through the reading device 72. It may be sent from an external device to the auxiliary storage device 71 through the communication device 73.

The auxiliary storage device 71 is a non-volatile memory that retains storage even when power is not supplied. The auxiliary storage device 71 is, for example, a magnetic storage device such as a hard disk drive. The auxiliary storage device 71 may be a non-volatile memory other than the magnetic storage device.
The removable media M is a non-volatile memory that holds a memory even when power is not supplied. The removable media M is, for example, an optical disk such as a compact disk or a semiconductor memory such as a memory card. The removable media M may be a non-volatile memory other than the optical disk and the semiconductor memory. The removable medium M is an example of a computer-readable recording medium on which the program P is recorded.

The host computer HC communicates with the control unit 3. The host computer HC designates the identification information of the recipe 74 indicating a series of steps performed on the substrate W to the control unit 3 for each substrate W.
A plurality of types of recipes 74 are stored in the auxiliary storage device 71. Recipe 74 includes recipe identification information, substrate processing conditions, and substrate processing procedures. The computer main body 67 reads the recipe 74 designated by the host computer HC from the auxiliary storage device 71. Then, the computer main body 67 creates a processing schedule for processing the substrate W by the processing unit 2 according to the designated recipe 74. After that, the control unit 3 is a substrate processing device such as a transfer robot IR, CR, a measurement unit 4, an operation unit 6, an electric motor 23, a suction mechanism 27, a brush moving mechanism 36, a pressing state changing mechanism 39, and valves 40 to 42. Make the control target (resource) of 1 execute the processing schedule.

FIG. 4 is a flow chart for explaining an example of substrate processing by the substrate processing apparatus 1. In the substrate processing by the substrate processing apparatus 1, steps S1 to S12 are executed in this order, for example, as shown in FIG. 4, based on the processing schedule created by the control unit 3.
First, the unprocessed substrate W is carried into the processing unit 2 from the carrier C by the transfer robots IR and CR, and is passed to the spin chuck 5 (S1). Then, the control unit 3 drives the suction mechanism 27 and opens the suction valve 40 to cause the suction mechanism 27 to suck the substrate W. As a result, the substrate holding step of holding the substrate W horizontally by the spin chuck 5 in contact with the upper surface of the spin base 21 is started (S2). After that, the substrate W is maintained in a horizontally held state until it is carried out by the transfer robot CR.

Then, the control unit 3 drives the electric motor 23 to start the substrate rotation step of rotating the substrate W held by the spin chuck 5 (S3). The substrate rotation step may be continued until the start of spin dry (S12) described later.
Then, the control unit 3 opens the processing liquid valve 41 and supplies the processing liquid such as DIW from the processing liquid nozzle 10 toward the upper surface of the rotating substrate W. As a result, the processing liquid supply process is started (S4). The processing liquid supplied to the upper surface of the rotating substrate W flows radially outward along the upper surface of the substrate W by centrifugal force. As a result, the processing liquid spreads over the entire upper surface of the substrate W.

Next, the control unit 3 controls the brush horizontal drive mechanism 37 to move the brush 31 from the standby position to the center position. Then, the control unit 3 controls the brush vertical drive mechanism 38 to execute the brush contact step of bringing the cleaning surface 31a of the brush 31 into contact with the center of the upper surface of the rotating substrate W (S5). In this way, the brush vertical drive mechanism 38 functions as a brush contact means for bringing the brush 31 into contact with the upper surface of the substrate W held by the spin base 21.

In the brush contact step, the control unit 3 may control the pressing state changing mechanism 39 to press the brush 31 against the upper surface of the substrate W (brush pressing step). When the brush 31 is pressed against the substrate W, the cleaning surface 31a is further brought into close contact with the substrate W due to the elastic deformation of the brush 31. In this way, the pressing state changing mechanism 39 functions as a brush pressing means that presses the upper surface of the substrate W against the upper surface of the substrate W.

After that, the control unit 3 controls the brush horizontal drive mechanism 37 to start a brush moving step of moving the brush 31 in contact with the upper surface of the substrate W from the central position to the outer peripheral position (S6). That is, the brush moving process is executed in parallel with the brush contact process. As a result, the brush 31 is rubbed against the entire upper surface of the substrate W, and the entire upper surface of the substrate W is scrubbed.

Then, the control unit 3 controls the brush vertical drive mechanism 38 to retract the brush 31 located at the outer peripheral position upward (S7). As a result, the brush 31 is separated from the upper surface of the substrate W. After that, the brush 31 is moved to the standby position. The treatment liquid valve 41 is closed after the brush 31 is separated from the substrate W. As a result, the supply of DIW to the substrate W is stopped (S8). After that, the rotation of the substrate W is accelerated to a drying speed (for example, several thousand rpm). As a result, the pure water adhering to the substrate W is shaken off around the substrate W, and the substrate W dries (S9). The control unit 3 controls the electric motor 23 to stop the rotation of the substrate W after the substrate W has dried (S10). Then, the control unit 3 closes the suction valve 40, and then stops the suction by the suction mechanism 27. As a result, the holding of the substrate W by the spin base 21 is released (S11).

After that, the transfer robot CR enters the processing unit 2, scoops the processed substrate W from the spin chuck 5, and carries it out of the processing unit 2 (S12). The substrate W is passed from the transfer robot CR to the transfer robot IR, and is housed in the carrier C by the transfer robot IR.
In this way, the plurality of substrate processing steps (brush moving step and brush contacting step) are executed under the substrate processing conditions specified in Recipe 74 and in the substrate processing procedure specified in Recipe 74.

5A and 5B are schematic views of the substrate W in the brush moving step (S6 of FIG. 4). 5A is a front view and FIG. 5B is a plan view.
Here, before the substrate processing shown in FIG. 4 is executed, the control unit 3 sets the moving speed v of the brush 31 in the brush moving step (S6 in FIG. 4) which is a part of the recipe 74 (S6 in FIG. 4). Speed setting process).

Specifically, the control unit 3 divides the upper surface of the substrate W along the radial direction of rotation by a circular virtual line L concentric with the rotating substrate W. Then, the control unit 3 sets the priority w in each of the plurality of areas A. The center of the virtual line L coincides with the rotation axis a1 in a plan view. The moving speed v is a radial component of the moving speed of the brush 31 located at a position facing the region A. The radial component of the distance that the brush 31 at the position facing the region A moves is called the movement distance r.

The n (n: natural number of 2 or more) th region A counted from the rotation axis a1 is also referred to as a region An. Further, the priority w in the area An is also referred to as a priority wn, the virtual line L that is the boundary between the area A (n-1) and the area An is also referred to as a virtual line Ln, and the moving distance r in the area An is the moving distance rn. Also called. The moving speed v of the brush 31 in the nth region An counting from the rotation axis a1 is also referred to as a moving speed vn. 5A and 5B show a state in which the brush 31 is in a position facing the region A1. The position where the brush 31 faces the region An is a position where the center of the brush 31 in a plan view faces the region An.

The priority w is set so that the region A in which dirt such as particles adhering to the upper surface of the substrate is difficult to be removed becomes higher. Specifically, the priority w is set so that the higher the degree of contamination on the upper surface of the substrate W, the higher the priority w. A high degree of contamination on the upper surface of the substrate W means a large amount of dirt (for example, the number of particles) adhering to the upper surface of the substrate W. The higher the degree of contamination on the upper surface of the substrate W, the more difficult it is for dirt to be removed from the upper surface of the substrate W.

The number of particles adhering to the upper surface of the substrate W is measured while the substrate W is conveyed from the load port LP to the processing unit 2 by, for example, a particle counter provided in the measuring unit 4. The number of particles adhering to the upper surface of the substrate W may be measured in advance by a particle counter provided outside the substrate processing apparatus 1. Further, instead of measuring the number of particles on the substrate W to be subjected to the substrate treatment, the contamination state of the substrate W before being processed by the substrate processing apparatus 1 is predicted, and this prediction is based on the degree of contamination of the upper surface of the substrate W. It may be used as an index.

The area A where dirt is hard to be removed requires a longer time to clean the substrate W. Therefore, the moving speed v of the brush 31 in the brush moving step (S6 in FIG. 4) is set so as to be lower in the region A having a higher priority w. On the upper surface of the substrate W, the amount of dirt adhering to the vicinity of the outer periphery is particularly large, and the degree of contamination in the region A near the outer periphery is higher than that in the region A near the center.
Further, it is not always necessary to set the priority w so that the higher the degree of contamination, the higher the priority w. For example, the priority w may be set so that the region A having a higher degree of adsorption of dirt (for example, particles) to the upper surface of the substrate W has a higher priority w. The higher the degree of adsorption of dirt (for example, particles) to the upper surface of the substrate W, the more difficult it is to remove the dirt from the upper surface of the substrate W.

Next, a method of setting the moving speed v of the brush 31 in each region A will be described in detail. FIG. 6 is a flow chart for explaining an example of a method of setting the moving speed v of the brush 31 in each region A by the control unit 3. FIG. 6 shows an example in the case of n ≧ 3.
First, the control unit 3 acquires recipe information (step T1). The recipe information is the value of various parameters, and examples thereof include the total time during which the brush moving process is executed (total time T), the radius R of the substrate W to be processed on the substrate, and the like. The total time T is, for example, a time of about 5 seconds to 20 seconds. The radius R is, for example, 150 mm. The control unit 3 may acquire these recipe information from the information stored in the auxiliary storage device 71 of the control unit 3, or the information input by the operator to the input unit of the operation unit 6 (see FIG. 2). You may get it from.

Then, the control unit 3 acquires the moving distances r1, ..., R (n-1) of the brush 31 input by the operator to the input unit of the operation unit 6 (step T2). Then, it is determined whether or not the sum [r1 + ... + r (n-1)] of the moving distances r1, ..., R (n-1) is smaller than the radius R of the substrate W (step T3). When the sum [r1 + ... + r (n-1)] of the moving distances r1, ..., R (n-1) is not smaller than the radius R of the substrate W (No in step T3), an alarm is issued to the operator. (Step T4), and step T2 until it is determined in step T3 that the sum [r1 + ... + r (n-1)] of the moving distances r1, ..., R (n-1) is smaller than the radius R of the substrate W. The process from is repeated.

When the sum [r1 + ... + r (n-1)] of the moving distances r1, ..., R (n-1) is smaller than the radius R of the substrate W (Yes in step T3), the operator operates the control unit 3. The priorities w1, ..., Wn input to the input unit of the unit 6 are acquired (step T5).
Then, the control unit 3 calculates the movement speeds v1, ..., Vn in each region A by using the total time T, the movement distance r, and the priority w acquired from step T1 to step T5 (step T6). Specifically, the moving speeds v1, ..., Vn in each region A are calculated based on the following equations (1) and (2).

In the formulas (1) and (2), the number of regions A is i (i: natural number), the priority of the brush 31 in the i-th region Ai counted from the rotation axis a1 is wi, and the number is counted from the rotation axis a1. Let ri be the moving distance r of the brush 31 in the i-th region Ai. Further, in the equations (1) and (2), the movement time of the brush 31 in the i-th region Ai counting from the rotation axis a1 is set to ti, and the movement of the brush 31 in the i-th region Ai counting from the rotation axis a1 is set. Let the velocity v be vi. As mentioned above, T indicates the total time that the brush moving process is performed.

The travel time ti is calculated from the equation (1). As shown in the equation (1), the travel time ti becomes longer as the priority wi is higher. Then, the moving speed vi is calculated based on the moving time ti calculated by the formula (1) and the moving speed vi calculated by the formula (2). By calculating the moving speed vi for all the regions A, the moving speeds v1, ..., Vn can be obtained.
Then, the control unit 3 determines whether or not the calculated moving speeds v1, ..., Vn are within the mechanical performance (spec) of the brush horizontal drive mechanism 37 (step T7). When the calculated moving speeds v1, ..., Vn are out of the mechanical performance range of the brush horizontal drive mechanism 37 (No in step T7), an alarm is issued to the operator (step T8), and step T7. The process from step T5 is repeated until it is determined that the moving speeds v1, ..., Vn calculated in step 2 are within the range of the mechanical performance of the brush horizontal drive mechanism 37.

When the calculated moving speeds v1, ..., Vn are within the mechanical performance range of the brush horizontal drive mechanism 37 (Yes in step T7), the calculated moving speeds v1, ..., Vn are the stored data. As 75 (see FIG. 3), it is stored and stored in the auxiliary storage device 71 or the like (step T9). The stored data 75 may include the movement times t1, ..., Tn together with the calculated movement speeds v1, ..., Vn. Then, the control unit 3 sets the moving speed v of the brush 31 in the recipe 74 based on the stored data 75 stored in the auxiliary storage device 71 (speed setting step).

The moving speed v of the brush 31 in each region A does not have to be constant at all times, and may be set so as to decrease near the boundary with the adjacent region A from the outside in the radial direction, for example. Further, the calculated movement speeds v1, ..., Vn may be used as the maximum value (peak value) of the movement speed v of the brush 31 in the corresponding regions A1 ..., An. That is, the moving speed v may be set so that the brush 31 temporarily accelerates in the vicinity of the boundary with the adjacent region A from the inside in the radial direction.

7A and 7B are examples of graphs created based on the moving speed v of the brush 31 set by the method shown in FIG.
The control unit 3 may create a graph as shown in FIGS. 7A and 7B based on the stored data 75 and the recipe information.
The graph shown in FIG. 7A is an example of a graph showing the relationship between the position of the brush 31 and the moving speed v of the brush 31 in the brush moving step (S6). In the graph shown in FIG. 7A, the position of the brush 31 is on the horizontal axis. The position of the brush 31 is the position of the center of the brush 31 in a plan view. The horizontal axis has the position of the rotation axis a1 as the origin. In the graph shown in FIG. 7A, the moving speed v of the brush 31 is on the vertical axis. In this graph, an example of n = 3 is shown. In this graph, the moving speeds v1, v2, v3 stored as the stored data 75 are used as the maximum value of the moving speed v in each region A1, A2, A3.

In the graph shown in FIG. 7B, the position of the brush 31 is used as the vertical axis, and the position of the rotation axis a1 is used as the reference (origin). Further, in the graph shown in FIG. 7B, the elapsed time is the vertical axis. The elapsed time is the time elapsed since the brush moving process was started. The moment when the brush movement process is started is used as the reference (origin).
The control unit 3 can display these graphs on the display unit of the operation unit 6 (see FIG. 1). As a result, the operator of the substrate processing apparatus 1 can visually confirm the moving speed v of the brush 31 in each region A.

According to this embodiment, the substrate W is divided into a plurality of regions A by a circular virtual line L concentric with the rotating substrate W, and a priority w is set in each region A. Since the moving speed v of the brush 31 in the brush moving step executed in parallel with the brush contact step is set to be lower as the priority w is higher, the region A having a higher priority w is washed for a longer time. Is done. Therefore, by setting the priority w of each region A so that the region A in which dirt adhering to the substrate W is difficult to be removed has a higher priority w, the region A in which dirt is difficult to be removed on the upper surface of the substrate W. Can be sufficiently cleaned, while the cleaning time of the region A on the upper surface of the substrate W where dirt is easily removed can be shortened. Therefore, it is possible to suppress a decrease in throughput and evenly clean the upper surface of the substrate W.

Further, according to this embodiment, the region A having a higher degree of contamination of the substrate W has a higher priority w. Therefore, it is possible to sufficiently clean the region A having a relatively high degree of contamination on the upper surface of the substrate W, while it is possible to shorten the cleaning time of the region A having a relatively low degree of contamination on the upper surface of the substrate W. Therefore, it is possible to suppress a decrease in throughput and evenly clean the upper surface of the substrate W.

Further, according to this embodiment, the total time T in which the brush moving step is executed, the number i of the area A, the priority wi of the i-th area A, and the moving distance ri of the brush 31 in the i-th area A Is specified, and the movement time ti of the brush 31 in the i-th region A is calculated by using the equation (1). Then, by substituting the movement time ti calculated from the equation (1) and the movement distance ri of the brush 31 in the designated i-th region A into the equation (2), the brush 31 in the i-th region A The moving speed vi of is calculated. Therefore, the brush moving speed vi in each region Ai is set so that the brush moving step ends after a lapse of time T from the start of the brush moving step (at a time specified in advance). Therefore, the decrease in throughput can be reliably suppressed.

In the substrate processing by the substrate processing apparatus 1 in the above-described embodiment, the pressing force or pressing pressure of the brush 31 in the brush moving step (S6 in FIG. 4) is controlled by the control unit before the substrate processing shown in FIG. 4 is executed. It may be set by 3.
Specifically, the control unit 3 sets a second priority y in each area A so that the higher the second priority y, the higher the pressing force or pressing pressure of the brush 31 against the substrate W. The pressing force or pressing pressure is set in (pressing force setting step, pressing pressure setting step).

FIG. 8A is a table showing an example of the relationship between the second priority y in each region A and the pressing force of the brush 31. The second priority y in the nth region An counting from the rotation axis a1 is also referred to as yn (not shown). FIG. 8A shows an example of n = 5. The number of particles is the number of particles per unit area.
The second priority y is set so as to be higher in the region A where the degree of contamination of the substrate W is higher. Specifically, the second priority y is set so that the larger the number of particles adhering to the upper surface of the substrate W, the higher the pressing force. The pressing force may be set to change in proportion to the number of particles.

In the brush pressing step, the pressing force (pressing pressure) of the brush 31 is measured by measuring the pressing force (pressing pressure) of the brush 31 against the upper surface of the substrate W using a pressure sensor (not shown) such as a strain gauge. It is being detected. As a result, it can be confirmed that the pressing force (pressing pressure) of the brush 31 against the upper surface of the substrate W matches the pressing force (pressing pressure) set in the pressing force (pressing pressure) setting step. Further, the control unit 3 can also calculate the pressing pressure from the surface area and the pressing force of the cleaning surface 31a of the brush 31 and set the pressing pressure.

In this substrate processing, the pressing pressure of the brush 31 against the rotating substrate W is higher in the region A having a higher second priority y set in each region A. Therefore, it is possible to shorten the cleaning time of the region A having a relatively high second priority y on the upper surface of the substrate W. On the other hand, as compared with the substrate processing in which the brush 31 is constantly pressed with a constant pressing pressure, the consumption of the brush 31 can be suppressed and the life of the brush 31 can be extended. Therefore, it is possible to suppress a decrease in throughput and evenly clean the upper surface of the substrate W.

Further, according to this substrate treatment, the higher the degree of contamination of the upper surface of the substrate W, the higher the pressing pressure of the brush 31 against the rotating substrate W. Therefore, the cleaning time of the upper surface of the substrate W in the region A having a relatively high degree of contamination can be shortened. On the other hand, as compared with the substrate processing in which the brush 31 is constantly pressed with a constant pressing pressure, the consumption of the brush 31 can be suppressed and the life of the brush 31 can be extended. Therefore, it is possible to suppress a decrease in throughput and evenly clean the upper surface of the substrate W.

Unlike this substrate processing, the second priority y may be set so that the region A having a higher degree of adsorption of dirt (for example, particles) to the upper surface of the substrate W has a higher second priority y. ..
FIG. 8B is a graph showing the pressing pressure of the brush 31 against the substrate W in each region A with the region A as the horizontal axis. The control unit 3 may display a graph showing the pressing pressure of the brush 31 in each area A as shown in FIG. 8B on the display unit of the operation unit 6 (see FIG. 2). As a result, the operator can visually confirm the degree of contamination (number of particles) in each region A.

Further, in the substrate processing by the substrate processing device 1 in the above-described embodiment, the control unit 3 controls the brush vertical drive mechanism 38 in parallel with the brush moving step (S6 in FIG. 4) to raise and lower the brush 31. May (brush raising and lowering process). The control unit 3 may set the vertical position of the brush 31 in the brush raising / lowering process for each region A before the substrate processing shown in FIG. 4 is executed (vertical position setting process). In the vertical position setting step, the vertical position of the brush 31 is set so that the brush moving step is executed with the brush 31 along the upper surface of the substrate W.

As shown in FIG. 9A, the substrate W may be warped downward from the rotation axis a1 in the radial direction, that is, it may be warped upward. In this case, the position of the upper surface of the substrate W in the vertical direction is lower in the position near the outer periphery of the substrate W than in the vicinity of the center of the substrate W. On the contrary, as shown in FIG. 9B, the substrate W may be warped, that is, warped downward so as to go upward in the radial direction from the rotation axis a1. In this case, the position of the upper surface of the substrate W in the vertical direction is higher in the position near the outer periphery of the substrate W than in the vicinity of the center of the substrate W.

In this substrate processing, the brush raising / lowering step is executed in parallel with the brush moving step. The vertical position of the brush 31 in the brush raising / lowering step is set for each region A so that the brush moving step is executed with the brush 31 along the upper surface of the substrate W. Therefore, even if the substrate W is warped as shown in FIG. 9A or 9B, the brush 31 can be maintained in contact with the upper surface of the substrate W, so that the upper surface of the substrate W is unevenly cleaned. Can be suppressed. Therefore, the upper surface of the substrate W can be cleaned even more evenly.

The present invention is not limited to the embodiments described above, and can be implemented in other embodiments.
For example, when the control unit 3 sets the moving speed of the brush 31 in each area A, the table 76 (see FIG. 3) stored in the auxiliary storage device 71 may be used. As shown in FIG. 10, the table 76 shows a pattern of combinations of the moving distances r1, ..., R (n-1) of the brush 31 in each region A and the priorities w1, ..., Wn in each region A. Multiple entries have been made. In step T2 of FIG. 6, the control unit 3 acquires the moving distances r1, ..., R (n-1) of the brush 31 in each region A from the table 76, and in step T4 of FIG. 6, the control unit 3 , Priority w1, ..., Wn in each area A may be obtained from the table 76.

Further, unlike the example shown in FIG. 6, in the method of setting the moving speed v of the brush 31 when n = 2, the control unit 3 acquires the moving distance r1 in step T2, and the moving distance r1 is set in step T3. It is determined whether or not it is smaller than the radius R of the substrate W.
Further, unlike the above-described embodiment, the priority w set in the speed setting step may be used as the second priority y. Further, in the pressing force (pressing pressure) setting step, the pressing force (pressing pressure) of the brush 31 against the rotating substrate W may be set so as to change in inverse proportion to the moving speed v of the brush 31. According to this substrate processing, the pressing pressure of the brush 31 against the rotating substrate W in the brush pressing step increases as the moving speed of the brush 31 decreases. Therefore, the higher the priority w, the higher the pressing force (pressing pressure). The cleaning time of the upper surface of the substrate W in the region A having a relatively high priority w can be shortened. Therefore, it is possible to suppress a decrease in throughput and evenly clean the upper surface of the substrate W.

Further, unlike the above-described embodiment, the control unit 3 may set the pressing amount so as to change in inverse proportion to the moving speed v of the brush 31. Further, the control unit 3 may execute a pressing amount setting step in which the pressing amount of the brush 31 against the rotating substrate W is set to be higher in the region A having a higher second priority y. In short, the control unit 3 may execute a pressing state setting step of setting the pressing force (pressing pressure) or pressing amount of the brush 31 against the rotating substrate W, that is, the pressing state.

Further, in the above-described embodiment, in the brush moving step (S6 in FIG. 4), the brush 31 is moved from the central position to the outer peripheral position. However, unlike the above-described embodiment, in the brush moving step, the brush 31 may be moved from the outer peripheral position to the central position, or after being moved from the outer peripheral position to the central position, it is returned to the outer peripheral position. You may move it toward.
In addition, various changes can be made within the scope of the claims.

1: Board processing device 3: Control unit (control means, computer)
21: Spin base (board holding means)
22: Rotation axis (board rotation means)
23: Electric motor (board rotating means)
37: Brush horizontal drive mechanism (brush moving means)
38: Brush vertical drive mechanism (brush contact means, brush lifting means)
39: Pressing state changing mechanism (brush pressing means)
A: Area L: Virtual line M: Removable media (recording medium)
P: Program 27: Suction mechanism (board holding means)
T: Total time W: Substrate a1: Rotation axis r: Movement distance v: Movement speed w: Priority y: Second priority

Claims (15)

The board holding process that holds the board horizontally,
A substrate rotation step of rotating the horizontally held substrate around a rotation axis along the vertical direction,
A brush contact step of bringing a brush for cleaning the upper surface of the horizontally held substrate into contact with the upper surface of the rotating substrate.
In parallel with the brush contact step, a brush moving step of moving the brush between a position of contacting the center of the upper surface of the horizontally held substrate and a position of contacting the outer periphery of the upper surface of the substrate.
The upper surface of the substrate is divided into a plurality of regions by circular virtual lines concentric with the substrate, priority is set for each region, and the higher the priority, the lower the moving speed of the brush. Including a speed setting step of setting the moving speed of the brush in the brush moving step.
The movement time calculated by calculating the movement time of the brush in each of the regions so that the speed setting step ends the brush movement step when a predetermined time elapses from the start of the brush movement step. including the step of setting the moving speed of the brush in the said region on the basis of time, the substrate processing method. The speed setting step includes a step of setting the moving speed of the brush in the brush moving step for each region based on the priority set so that the degree of contamination of the upper surface of the substrate increases. , The substrate processing method according to claim 1. In the speed setting step, the total time during which the brush moving step is executed is T, the number of the regions is i, the priority of the i-th region counted from the rotation axis is wi, and the rotation axis is The moving distance of the brush in the i-th region counted from the rotation axis is ri, the moving time of the brush in the i-th region counting from the rotation axis is ti, and the i-th movement time in the rotation axis is ti. The substrate processing method according to claim 1 or 2, wherein the moving speed of the brush in the above is set to vi, and the moving speed of the brush in each of the regions is set based on the following formulas (1) and (2). ..

The brush contact step includes a brush pressing step of pressing the brush against the upper surface of the rotating substrate.
A second priority is set for each of the regions, and the pressing amount or pressing pressure of the brush against the rotating substrate is set for each of the regions so that the region having the higher second priority is higher. The substrate processing method according to any one of claims 1 to 3, further comprising a pressing state setting step. The claim includes a step of setting the pressing amount or the pressing pressure based on the second priority set so that the degree of contamination of the upper surface of the substrate becomes higher in the pressing state setting step. The substrate processing method according to 4. The brush contact step includes a brush pressing step of pressing the brush against the upper surface of the rotating substrate.
The invention according to any one of claims 1 to 3, further comprising a pressing state setting step of setting the pressing amount or pressing pressure of the brush against the rotating substrate so as to change in inverse proportion to the moving speed of the brush. Substrate processing method. In parallel with the brush moving step, a brush raising and lowering step of raising and lowering the brush,
Further including a vertical position setting step of setting the vertical position of the brush for each region in the brush raising / lowering step so that the brush moving step is executed with the brush along the upper surface of the substrate. , The substrate processing method according to any one of claims 1 to 6. A board holding means for holding the board horizontally and
A substrate rotating means for rotating the substrate held by the substrate holding means around a rotation axis along the vertical direction,
A brush for cleaning the upper surface of the substrate held by the substrate holding means,
A brush contact means that brings the brush into contact with the upper surface of the substrate held by the substrate holding means,
A brush moving means for moving the brush in the horizontal direction and
The substrate rotating means, the brush contacting means, and the controlling means for controlling the brush moving means are included.
In parallel with the substrate rotation step of rotating the horizontally held substrate, the brush contact step of bringing the brush into contact with the horizontally held substrate, and the brush contact step, the control means horizontally A brush moving step of moving the brush between a position in contact with the center of the upper surface of the held substrate and a position in contact with the outer periphery of the upper surface of the substrate, and a circular shape in which the upper surface of the substrate is concentric with the substrate. divided into a plurality of regions by virtual lines, the priority is set to each of said region, the movement speed of the brushes in the brush moving step as the movement speed speed of the brush as the high priority the region is lower To set the speed setting process and execute ,
In the speed setting step, the control means calculates the moving time of the brush in each of the regions so that the brush moving step ends when a predetermined time elapses from the start of the brush moving step. A substrate processing apparatus that sets the moving speed of the brush in each of the regions based on the calculated movement time . The substrate processing apparatus according to claim 8, wherein the priority is set so as to increase the degree of contamination of the upper surface of the substrate. In the speed setting step, the total time during which the brush moving step is executed by the control means is T, the number of the regions is i, and the priority of the i-th region counted from the rotation axis is wi. Let ri be the moving distance of the brush in the i-th region counting from the rotation axis, and ti be the moving time of the brush in the i-th region counting from the rotation axis, and count from the rotation axis. The substrate according to claim 8 or 9, wherein the moving speed of the brush in the i-th region is set to vi, and the moving speed of the brush in each of the regions is set based on the following equations (1) and (2). Processing equipment.

Further including a brush pressing means for pressing the brush against the upper surface of the horizontally held substrate.
A brush pressing step in which the control means presses the brush against the upper surface of the rotating substrate, and a second priority is set for each of the regions, and the pressing amount or pressing of the brush against the rotating substrate. The substrate processing apparatus according to any one of claims 8 to 10, which executes a pressing state setting step of setting the pressure in each of the regions so that the region has a higher second priority. 11. The step of setting the pressing amount or the pressing pressure based on the second priority set so that the degree of contamination of the upper surface of the substrate becomes higher by the control means. The substrate processing apparatus according to. Further including a brush pressing means for pressing the brush against the upper surface of the horizontally held substrate.
The brush pressing step in which the control means presses the brush against the upper surface of the rotating substrate, and the amount of pressing of the brush against the rotating substrate or so as to change in inverse proportion to the moving speed of the brush. The substrate processing apparatus according to any one of claims 8 to 10, which executes the pressing state setting step of setting the pressing pressure. Further including a brush lifting means for raising and lowering the brush,
The brush so that the control means executes the brush raising / lowering step of raising and lowering the brush and the brush moving step with the brush along the upper surface of the substrate in parallel with the brush contact step. The substrate processing apparatus according to any one of claims 8 to 13, which executes a vertical position setting step of setting the vertical position of the brush in the elevating step for each region. A computer-readable recording medium on which a program for causing a computer provided in a substrate processing apparatus to execute the substrate processing method according to any one of claims 1 to 7 is recorded.

Images