HK1248820A1 - 用於測試印刷電路板的平行測試器的定位裝置及用於測試印刷電路板的平行測試器 - Google Patents

用於測試印刷電路板的平行測試器的定位裝置及用於測試印刷電路板的平行測試器

Info

Publication number
HK1248820A1
HK1248820A1 HK18108182.1A HK18108182A HK1248820A1 HK 1248820 A1 HK1248820 A1 HK 1248820A1 HK 18108182 A HK18108182 A HK 18108182A HK 1248820 A1 HK1248820 A1 HK 1248820A1
Authority
HK
Hong Kong
Prior art keywords
printed circuit
circuit boards
testing printed
parallel tester
positioning device
Prior art date
Application number
HK18108182.1A
Other languages
English (en)
Inventor
Rüdiger Dehmel
Torsten Kassbaum
Original Assignee
Xcerra Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xcerra Corp filed Critical Xcerra Corp
Publication of HK1248820A1 publication Critical patent/HK1248820A1/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2815—Functional tests, e.g. boundary scans, using the normal I/O contacts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
HK18108182.1A 2015-08-07 2018-06-26 用於測試印刷電路板的平行測試器的定位裝置及用於測試印刷電路板的平行測試器 HK1248820A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015113046.7A DE102015113046A1 (de) 2015-08-07 2015-08-07 Positioniereinrichtung für einen Paralleltester zum Testen von Leiterplatten und Paralleltester zum Testen von Leiterplatten
PCT/EP2016/063989 WO2017025230A1 (de) 2015-08-07 2016-06-17 Positioniereinrichtung für einen paralleltester zum testen von leiterplatten und paralleltester zum testen von leiterplatten

Publications (1)

Publication Number Publication Date
HK1248820A1 true HK1248820A1 (zh) 2018-10-19

Family

ID=56194469

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18108182.1A HK1248820A1 (zh) 2015-08-07 2018-06-26 用於測試印刷電路板的平行測試器的定位裝置及用於測試印刷電路板的平行測試器

Country Status (9)

Country Link
US (1) US20180217200A1 (zh)
EP (1) EP3332261A1 (zh)
JP (1) JP2018523825A (zh)
KR (1) KR102026610B1 (zh)
CN (1) CN107923938B (zh)
DE (1) DE102015113046A1 (zh)
HK (1) HK1248820A1 (zh)
TW (2) TWI674414B (zh)
WO (1) WO2017025230A1 (zh)

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CN107656517B (zh) * 2017-09-15 2024-05-17 郑州众智科技股份有限公司 控制器自动化检测装置
WO2019130952A1 (ja) * 2017-12-28 2019-07-04 日本電産リード株式会社 検査装置及び検査方法
TWI662873B (zh) * 2018-08-09 2019-06-11 揚博科技股份有限公司 噴射驅動型電路板旋轉載具
TWI676031B (zh) * 2018-09-06 2019-11-01 致茂電子股份有限公司 滑移式電子元件測試裝置
CN109188178A (zh) * 2018-10-18 2019-01-11 昆山佰奥智能装备股份有限公司 极性检测机构
TWI827809B (zh) * 2019-04-04 2024-01-01 丹麥商卡普雷斯股份有限公司 測量測試樣本之電性的方法，以及多層測試樣本
TWI692644B (zh) * 2019-06-18 2020-05-01 旺矽科技股份有限公司 電子元件針測裝置
KR102270760B1 (ko) * 2019-11-29 2021-06-30 에이엠티 주식회사 미세 피치를 갖는 디바이스의 테스트장치
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CN112578265B (zh) * 2020-11-25 2022-03-15 苏州市高威电子有限公司 一种中继测试治具
TWI759159B (zh) * 2021-03-26 2022-03-21 經登企業股份有限公司 磁性感測器及限位裝置
CN113466659B (zh) * 2021-06-28 2022-05-31 昆山兢美电子科技有限公司 一种印刷电路板检测用飞针测试装置
CN113532316B (zh) * 2021-07-05 2023-01-20 深圳市先地图像科技有限公司 一种能同时检测多块pcb板形位偏差的装置及检测方法
CN113655364B (zh) * 2021-07-06 2024-03-19 合肥宇隆光电科技有限公司 一种接触型pcba开路短路测试装置及其测试方法
CN113866587B (zh) * 2021-08-20 2024-05-24 苏州国科测试科技有限公司 一种飞针测试设备
TWI811770B (zh) * 2021-08-23 2023-08-11 鴻勁精密股份有限公司 輸送機構、測試裝置、檢知方法及其應用之作業機
CN115078974A (zh) * 2022-07-23 2022-09-20 隋大明 一种线路板测试平台
CN115826630B (zh) * 2023-02-20 2023-05-12 中国机械总院集团江苏分院有限公司 物料盒队列位置交换的控制方法和装置

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Also Published As

Publication number Publication date
TW201712346A (zh) 2017-04-01
US20180217200A1 (en) 2018-08-02
CN107923938A (zh) 2018-04-17
WO2017025230A1 (de) 2017-02-16
JP2018523825A (ja) 2018-08-23
TWI674414B (zh) 2019-10-11
DE102015113046A1 (de) 2017-02-09
TW201835579A (zh) 2018-10-01
CN107923938B (zh) 2021-04-30
KR102026610B1 (ko) 2019-09-30
EP3332261A1 (de) 2018-06-13
TWI631345B (zh) 2018-08-01
KR20180034582A (ko) 2018-04-04

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