SG11201510024VA - A probe card assembly for testing electronic devices - Google Patents

A probe card assembly for testing electronic devices

Info

Publication number
SG11201510024VA
SG11201510024VA SG11201510024VA SG11201510024VA SG11201510024VA SG 11201510024V A SG11201510024V A SG 11201510024VA SG 11201510024V A SG11201510024V A SG 11201510024VA SG 11201510024V A SG11201510024V A SG 11201510024VA SG 11201510024V A SG11201510024V A SG 11201510024VA
Authority
SG
Singapore
Prior art keywords
electronic devices
probe card
card assembly
testing electronic
testing
Prior art date
Application number
SG11201510024VA
Inventor
Li Fan
Darcy Kelley-Greene
Edward Milovic
Mukesh Selvaraj
Jim Zhang
Gensaku Nagai
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc filed Critical Formfactor Inc
Publication of SG11201510024VA publication Critical patent/SG11201510024VA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/36—Overload-protection arrangements or circuits for electric measuring instruments

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
SG11201510024VA 2013-05-06 2014-05-05 A probe card assembly for testing electronic devices SG11201510024VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361820080P 2013-05-06 2013-05-06
PCT/US2014/036859 WO2014182633A1 (en) 2013-05-06 2014-05-05 A probe card assembly for testing electronic devices

Publications (1)

Publication Number Publication Date
SG11201510024VA true SG11201510024VA (en) 2016-01-28

Family

ID=51841133

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201510024VA SG11201510024VA (en) 2013-05-06 2014-05-05 A probe card assembly for testing electronic devices

Country Status (7)

Country Link
US (1) US9588139B2 (en)
JP (1) JP6513639B2 (en)
KR (1) KR102213726B1 (en)
CN (1) CN105531593B (en)
SG (1) SG11201510024VA (en)
TW (1) TWI641837B (en)
WO (1) WO2014182633A1 (en)

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US10151774B2 (en) * 2015-06-10 2018-12-11 Asm Technology Singapore Pte Ltd Electrical contact having electrical isolated members for contacting an electrical component
US9702906B2 (en) 2015-06-26 2017-07-11 International Business Machines Corporation Non-permanent termination structure for microprobe measurements
US10114042B2 (en) 2016-02-05 2018-10-30 Texas Instruments Incorporated Vertical probe card
TWI564570B (en) * 2016-03-15 2017-01-01 創意電子股份有限公司 Probe card inspection device
US10180486B2 (en) * 2016-03-16 2019-01-15 Formfactor Beaverton, Inc. Test standards and methods for impedance calibration of a probe system, and probe systems that include the test standards or utilize the methods
DE102016004520A1 (en) 2016-04-13 2017-10-19 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Contact pin and test socket with contact pins
TWI632376B (en) * 2016-05-31 2018-08-11 巨擘科技股份有限公司 Probe card device
PH12017000234A1 (en) * 2016-09-02 2018-07-23 Knight Auto Prec Engineering Pte Ltd Handling assembly of semiconductor test equipment
WO2018112166A1 (en) * 2016-12-16 2018-06-21 Xcerra Corporation Spring-loaded probe having folded portions and probe assembly
IT201700017037A1 (en) * 2017-02-15 2018-08-15 Technoprobe Spa Measurement board for high frequency applications
TWI641839B (en) * 2017-08-18 2018-11-21 中華精測科技股份有限公司 Detection device
US11156640B2 (en) 2017-10-31 2021-10-26 Formfactor, Inc. MEMS probe card assembly having decoupled electrical and mechanical probe connections
KR102581387B1 (en) * 2018-09-11 2023-09-21 삼성전자주식회사 Alignment key and probe card including the same
US11293947B2 (en) 2019-04-26 2022-04-05 Formfactor, Inc. Probe on carrier architecture for vertical probe arrays
WO2021182083A1 (en) * 2020-03-13 2021-09-16 日本電産リード株式会社 Inspection jig and substrate inspection device comprising same
CN111537858A (en) * 2020-04-22 2020-08-14 深圳市华星光电半导体显示技术有限公司 Detection device and detection method
CN111796231A (en) * 2020-06-23 2020-10-20 中南华兴科技有限公司 Portable high-voltage electrified display testing device
CN115436675A (en) * 2021-06-04 2022-12-06 迪科特测试科技(苏州)有限公司 Testing device and probe assembly thereof
JP2023076046A (en) * 2021-11-22 2023-06-01 株式会社日本マイクロニクス Probe storage jig, probe storage system, and probe storage method

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US7952373B2 (en) * 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
JP2002365308A (en) * 2001-06-08 2002-12-18 Japan Electronic Materials Corp Vertical blade type probe, vertical blade type probe unit and vertical blade type probe card using the same
JP2004028885A (en) * 2002-06-27 2004-01-29 Fujitsu Ltd Semiconductor device, semiconductor package, and method of testing semiconductor device
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US7084650B2 (en) * 2002-12-16 2006-08-01 Formfactor, Inc. Apparatus and method for limiting over travel in a probe card assembly
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US20100207652A1 (en) 2007-10-08 2010-08-19 Amst Co., Ltd. Method for wafer test and probe card for the same
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JP5021519B2 (en) * 2008-02-22 2012-09-12 日本電子材料株式会社 Probe card
US7960989B2 (en) 2008-12-03 2011-06-14 Formfactor, Inc. Mechanical decoupling of a probe card assembly to improve thermal response
US7772863B2 (en) 2008-12-03 2010-08-10 Formfactor, Inc. Mechanical decoupling of a probe card assembly to improve thermal response
US8760187B2 (en) * 2008-12-03 2014-06-24 L-3 Communications Corp. Thermocentric alignment of elements on parts of an apparatus
JP2011075342A (en) * 2009-09-29 2011-04-14 Formfactor Inc Probe head control mechanism for probe card assembly
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KR102066155B1 (en) * 2013-03-08 2020-01-14 삼성전자주식회사 Probing method, probe card for performing the method, and probing apparatus including the probe card

Also Published As

Publication number Publication date
CN105531593B (en) 2019-05-03
US9588139B2 (en) 2017-03-07
KR102213726B1 (en) 2021-02-08
TW201504632A (en) 2015-02-01
US20140327461A1 (en) 2014-11-06
CN105531593A (en) 2016-04-27
JP6513639B2 (en) 2019-05-15
WO2014182633A1 (en) 2014-11-13
JP2016524137A (en) 2016-08-12
TWI641837B (en) 2018-11-21
KR20160031453A (en) 2016-03-22

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