PH12017000234A1 - Handling assembly of semiconductor test equipment - Google Patents

Handling assembly of semiconductor test equipment

Info

Publication number
PH12017000234A1
PH12017000234A1 PH12017000234A PH12017000234A PH12017000234A1 PH 12017000234 A1 PH12017000234 A1 PH 12017000234A1 PH 12017000234 A PH12017000234 A PH 12017000234A PH 12017000234 A PH12017000234 A PH 12017000234A PH 12017000234 A1 PH12017000234 A1 PH 12017000234A1
Authority
PH
Philippines
Prior art keywords
contact unit
base plate
test equipment
semiconductor test
handling assembly
Prior art date
Application number
PH12017000234A
Inventor
Chyeo Yong Tay
Cheng Kboon Sng
Original Assignee
Knight Auto Prec Engineering Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Knight Auto Prec Engineering Pte Ltd filed Critical Knight Auto Prec Engineering Pte Ltd
Publication of PH12017000234A1 publication Critical patent/PH12017000234A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process

Abstract

A method of replacing a first contact unit by a second contact unit in a semiconductor device test equipment is described. The method includes removing a contact unit holder from as base plate comprising multiple contact unit openings, wherein each opening is configured to hold in place a first contact unit. At least one first contact unit is released from the base plate; At least one first contact unit is removed from an opening in the base plate. At least one second contact unit is inserted into the at least one opening. At least one second contact unit is locked to the base plate. And the contact unit holder is then repositioned back onto the base plate.
PH12017000234A 2016-09-02 2017-08-15 Handling assembly of semiconductor test equipment PH12017000234A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201662383130P 2016-09-02 2016-09-02

Publications (1)

Publication Number Publication Date
PH12017000234A1 true PH12017000234A1 (en) 2018-07-23

Family

ID=61532211

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12017000234A PH12017000234A1 (en) 2016-09-02 2017-08-15 Handling assembly of semiconductor test equipment

Country Status (3)

Country Link
CN (1) CN107799431A (en)
PH (1) PH12017000234A1 (en)
TW (1) TW201825916A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI745775B (en) * 2019-11-01 2021-11-11 美商第一檢測有限公司 Chip testing device and a chip testing system
KR20210063164A (en) * 2019-11-22 2021-06-01 (주)테크윙 Tester coupling portion

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4323055B2 (en) * 2000-03-22 2009-09-02 富士通マイクロエレクトロニクス株式会社 Semiconductor device testing contactor and method of manufacturing the same
KR100791137B1 (en) * 2002-04-16 2008-01-02 닛폰 하츠죠 가부시키가이샤 Holder for conductive contact
US7109732B2 (en) * 2003-07-31 2006-09-19 Endicott Interconnect Technologies, Inc. Electronic component test apparatus
US7282932B2 (en) * 2004-03-02 2007-10-16 Micron Technology, Inc. Compliant contact pin assembly, card system and methods thereof
JP4868413B2 (en) * 2007-12-04 2012-02-01 センサータ テクノロジーズ インコーポレーテッド socket
SG195423A1 (en) * 2012-06-12 2013-12-30 Knight Auto Prec Engineering Pte Ltd Synchronized adjustable docking height method
KR101447363B1 (en) * 2013-04-30 2014-10-07 주식회사 오킨스전자 Burn-in socket using flexible print circuit board
JP6513639B2 (en) * 2013-05-06 2019-05-15 フォームファクター， インコーポレイテッド Probe card assembly for testing electronic devices

Also Published As

Publication number Publication date
TW201825916A (en) 2018-07-16
CN107799431A (en) 2018-03-13

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