SG11201405703RA - Probe card for an apparatus for testing electronic devices - Google Patents

Probe card for an apparatus for testing electronic devices

Info

Publication number
SG11201405703RA
SG11201405703RA SG11201405703RA SG11201405703RA SG11201405703RA SG 11201405703R A SG11201405703R A SG 11201405703RA SG 11201405703R A SG11201405703R A SG 11201405703RA SG 11201405703R A SG11201405703R A SG 11201405703RA SG 11201405703R A SG11201405703R A SG 11201405703RA
Authority
SG
Singapore
Prior art keywords
electronic devices
probe card
testing electronic
testing
probe
Prior art date
Application number
SG11201405703RA
Inventor
Riccardo Vettori
Ricardo Liberini
Original Assignee
Technoprobe Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe Spa filed Critical Technoprobe Spa
Publication of SG11201405703RA publication Critical patent/SG11201405703RA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
SG11201405703RA 2012-06-08 2013-06-07 Probe card for an apparatus for testing electronic devices SG11201405703RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT000996A ITMI20120996A1 (en) 2012-06-08 2012-06-08 MEASUREMENT CARD FOR A TEST DEVICE OF ELECTRONIC DEVICES
PCT/EP2013/001675 WO2013182317A1 (en) 2012-06-08 2013-06-07 Probe card for an apparatus for testing electronic devices

Publications (1)

Publication Number Publication Date
SG11201405703RA true SG11201405703RA (en) 2014-11-27

Family

ID=46397449

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201405703RA SG11201405703RA (en) 2012-06-08 2013-06-07 Probe card for an apparatus for testing electronic devices

Country Status (7)

Country Link
US (1) US9880202B2 (en)
EP (1) EP2859361B1 (en)
KR (1) KR102050987B1 (en)
IT (1) ITMI20120996A1 (en)
SG (1) SG11201405703RA (en)
TW (1) TWI636258B (en)
WO (1) WO2013182317A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580970B (en) * 2015-07-06 2017-05-01 Mpi Corp Probe module (1)
JP6855185B2 (en) * 2016-07-27 2021-04-07 株式会社日本マイクロニクス Electrical connection device
IT201600079679A1 (en) * 2016-07-28 2018-01-28 Technoprobe Spa Measurement board for electronic devices
IT201700017061A1 (en) * 2017-02-15 2018-08-15 Technoprobe Spa Improved measurement card for high frequency applications
IT201700046645A1 (en) 2017-04-28 2018-10-28 Technoprobe Spa Measurement board for a test device of electronic devices
CN113140477B (en) * 2020-01-20 2022-09-16 创意电子股份有限公司 Probe card module
KR20230152314A (en) * 2022-04-27 2023-11-03 (주)티에스이 Probe head with adjustable protrusion length of probe

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8575954B2 (en) * 2002-06-24 2013-11-05 Advantest (Singapore) Pte Ltd Structures and processes for fabrication of probe card assemblies with multi-layer interconnect
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
US7622935B2 (en) * 2005-12-02 2009-11-24 Formfactor, Inc. Probe card assembly with a mechanically decoupled wiring substrate
MY147876A (en) * 2005-12-05 2013-01-31 Nhk Spring Co Ltd Probe card
US7692433B2 (en) * 2006-06-16 2010-04-06 Formfactor, Inc. Sawing tile corners on probe card substrates
US7471078B2 (en) * 2006-12-29 2008-12-30 Formfactor, Inc. Stiffener assembly for use with testing devices
CN101663591A (en) * 2007-03-26 2010-03-03 株式会社爱德万测试 Connecting board, probe card and electronic component testing apparatus provided with the probe card
US7791361B2 (en) * 2007-12-10 2010-09-07 Touchdown Technologies, Inc. Planarizing probe card
US7733104B2 (en) * 2008-04-21 2010-06-08 Sv Probe Pte. Ltd. Low force interconnects for probe cards
US7772863B2 (en) * 2008-12-03 2010-08-10 Formfactor, Inc. Mechanical decoupling of a probe card assembly to improve thermal response

Also Published As

Publication number Publication date
TWI636258B (en) 2018-09-21
EP2859361B1 (en) 2019-07-31
WO2013182317A1 (en) 2013-12-12
TW201350866A (en) 2013-12-16
EP2859361A1 (en) 2015-04-15
ITMI20120996A1 (en) 2013-12-09
KR102050987B1 (en) 2019-12-02
US20150048856A1 (en) 2015-02-19
US9880202B2 (en) 2018-01-30
KR20150016931A (en) 2015-02-13
WO2013182317A8 (en) 2014-10-30

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