PL3160219T3 - Sposób i urządzenie do umieszczania elektronicznych komponentów - Google Patents

Sposób i urządzenie do umieszczania elektronicznych komponentów

Info

Publication number
PL3160219T3
PL3160219T3 PL16180010T PL16180010T PL3160219T3 PL 3160219 T3 PL3160219 T3 PL 3160219T3 PL 16180010 T PL16180010 T PL 16180010T PL 16180010 T PL16180010 T PL 16180010T PL 3160219 T3 PL3160219 T3 PL 3160219T3
Authority
PL
Poland
Prior art keywords
electronic components
placing electronic
placing
components
electronic
Prior art date
Application number
PL16180010T
Other languages
English (en)
Inventor
Udo Hofmann
Wolfram Sinn
Sergei Richter
Original Assignee
Ersa Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ersa Gmbh filed Critical Ersa Gmbh
Publication of PL3160219T3 publication Critical patent/PL3160219T3/pl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0053—Arrangements for assisting the manual mounting of components, e.g. special tables or light spots indicating the place for mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0818—Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0853—Determination of transport trajectories inside mounting machines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Supply And Installment Of Electrical Components (AREA)
PL16180010T 2015-10-23 2016-07-18 Sposób i urządzenie do umieszczania elektronicznych komponentów PL3160219T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015220746.3A DE102015220746A1 (de) 2015-10-23 2015-10-23 Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile
EP16180010.7A EP3160219B1 (de) 2015-10-23 2016-07-18 Verfahren und vorrichtung zur platzierung elektronischer bauteile

Publications (1)

Publication Number Publication Date
PL3160219T3 true PL3160219T3 (pl) 2019-02-28

Family

ID=56684448

Family Applications (1)

Application Number Title Priority Date Filing Date
PL16180010T PL3160219T3 (pl) 2015-10-23 2016-07-18 Sposób i urządzenie do umieszczania elektronicznych komponentów

Country Status (5)

Country Link
US (1) US10217211B2 (pl)
EP (1) EP3160219B1 (pl)
CN (1) CN106879185B (pl)
DE (1) DE102015220746A1 (pl)
PL (1) PL3160219T3 (pl)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3220730B1 (en) * 2014-11-11 2020-12-23 FUJI Corporation Control device for electronic component attaching device
US10338006B2 (en) * 2017-06-15 2019-07-02 Asm Technology Singapore Pte Ltd Method and apparatus for aligning and inspecting electronic components
JP7148108B2 (ja) * 2017-07-06 2022-10-05 メイショウ株式会社 部品実装装置及び部品実装用プログラム
WO2019009095A1 (ja) * 2017-07-06 2019-01-10 メイショウ株式会社 部品実装装置及び部品実装用プログラム
US11878432B2 (en) * 2019-10-21 2024-01-23 Silicon Laboratories Inc. Low-cost robotics for placement of integrated circuit and method therefor
US11529742B2 (en) 2019-10-21 2022-12-20 Silicon Laboratories Inc. Control of low-cost robotics and method therefor
CN114927001B (zh) * 2022-04-19 2023-09-26 天津二建建筑工程有限公司 一种视频监控方法、系统、智能终端及存储介质

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DE19857263A1 (de) * 1998-12-11 2000-03-16 Peter Gammelin Verfahren und Vorrichtung zum Positionieren von Bauelementen auf Trägern
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JP5018812B2 (ja) * 2009-03-16 2012-09-05 パナソニック株式会社 スクリーン印刷機及びスクリーン印刷方法
JP5246064B2 (ja) * 2009-06-29 2013-07-24 パナソニック株式会社 電子部品実装方法
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JP5408153B2 (ja) * 2011-02-21 2014-02-05 パナソニック株式会社 電子部品実装装置および電子部品実装装置における画像読取り方法
CH705802B1 (de) * 2011-11-25 2016-04-15 Esec Ag Einrichtung für die Montage von Halbleiterchips.
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DE102013207598A1 (de) * 2013-04-25 2014-10-30 Finetech Gmbh & Co.Kg Platziervorrichtung und Platzierverfahren
JP6285275B2 (ja) * 2014-04-30 2018-02-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6426984B2 (ja) * 2014-11-18 2018-11-21 キヤノン株式会社 リソグラフィ装置および物品製造方法
US10743447B2 (en) * 2015-02-26 2020-08-11 Fuji Corporation Component mounting machine

Also Published As

Publication number Publication date
US10217211B2 (en) 2019-02-26
CN106879185B (zh) 2020-05-19
US20170116720A1 (en) 2017-04-27
DE102015220746A1 (de) 2017-04-27
CN106879185A (zh) 2017-06-20
EP3160219B1 (de) 2018-09-12
EP3160219A1 (de) 2017-04-26

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