PL3160219T3 - Sposób i urządzenie do umieszczania elektronicznych komponentów - Google Patents
Sposób i urządzenie do umieszczania elektronicznych komponentówInfo
- Publication number
- PL3160219T3 PL3160219T3 PL16180010T PL16180010T PL3160219T3 PL 3160219 T3 PL3160219 T3 PL 3160219T3 PL 16180010 T PL16180010 T PL 16180010T PL 16180010 T PL16180010 T PL 16180010T PL 3160219 T3 PL3160219 T3 PL 3160219T3
- Authority
- PL
- Poland
- Prior art keywords
- electronic components
- placing electronic
- placing
- components
- electronic
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
- G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
- G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0053—Arrangements for assisting the manual mounting of components, e.g. special tables or light spots indicating the place for mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0818—Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
- H05K13/0853—Determination of transport trajectories inside mounting machines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015220746.3A DE102015220746A1 (de) | 2015-10-23 | 2015-10-23 | Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile |
EP16180010.7A EP3160219B1 (de) | 2015-10-23 | 2016-07-18 | Verfahren und vorrichtung zur platzierung elektronischer bauteile |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3160219T3 true PL3160219T3 (pl) | 2019-02-28 |
Family
ID=56684448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL16180010T PL3160219T3 (pl) | 2015-10-23 | 2016-07-18 | Sposób i urządzenie do umieszczania elektronicznych komponentów |
Country Status (5)
Country | Link |
---|---|
US (1) | US10217211B2 (pl) |
EP (1) | EP3160219B1 (pl) |
CN (1) | CN106879185B (pl) |
DE (1) | DE102015220746A1 (pl) |
PL (1) | PL3160219T3 (pl) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3220730B1 (en) * | 2014-11-11 | 2020-12-23 | FUJI Corporation | Control device for electronic component attaching device |
US10338006B2 (en) * | 2017-06-15 | 2019-07-02 | Asm Technology Singapore Pte Ltd | Method and apparatus for aligning and inspecting electronic components |
JP7148108B2 (ja) * | 2017-07-06 | 2022-10-05 | メイショウ株式会社 | 部品実装装置及び部品実装用プログラム |
WO2019009095A1 (ja) * | 2017-07-06 | 2019-01-10 | メイショウ株式会社 | 部品実装装置及び部品実装用プログラム |
US11878432B2 (en) * | 2019-10-21 | 2024-01-23 | Silicon Laboratories Inc. | Low-cost robotics for placement of integrated circuit and method therefor |
US11529742B2 (en) | 2019-10-21 | 2022-12-20 | Silicon Laboratories Inc. | Control of low-cost robotics and method therefor |
CN114927001B (zh) * | 2022-04-19 | 2023-09-26 | 天津二建建筑工程有限公司 | 一种视频监控方法、系统、智能终端及存储介质 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0152879B1 (ko) * | 1995-10-10 | 1998-12-15 | 이희종 | 표면실장기의 부품인식방법 및 장치 |
DE19857263A1 (de) * | 1998-12-11 | 2000-03-16 | Peter Gammelin | Verfahren und Vorrichtung zum Positionieren von Bauelementen auf Trägern |
US6634091B1 (en) * | 2000-02-15 | 2003-10-21 | Samsung Techwin Co., Ltd. | Part mounter |
ATE423392T1 (de) * | 2000-03-10 | 2009-03-15 | Infotech Ag | Verfahren und vorrichtung zum justieren eines bauelementes auf einem substrat unter verwendung von digitaler merkmaltrennung |
JP4045838B2 (ja) * | 2002-04-12 | 2008-02-13 | 松下電器産業株式会社 | 部品装着管理方法 |
DE112004000479T5 (de) * | 2003-03-28 | 2006-02-16 | Assembléon N.V. | Verfahren zum Anordnen von wenigstens einem Bauelement auf wenigstens einem Substrat sowie System dafür |
DE10325179A1 (de) * | 2003-06-04 | 2004-12-23 | Marconi Communications Gmbh | Verfahren zum Montieren einer Schaltung |
US7706595B2 (en) * | 2003-11-07 | 2010-04-27 | Cyberoptics Corporation | Pick and place machine with workpiece motion inspection |
JP4165538B2 (ja) * | 2004-07-21 | 2008-10-15 | オムロン株式会社 | 部品実装検査方法および部品実装検査装置 |
US8233724B2 (en) * | 2005-06-02 | 2012-07-31 | Panasonic Corporation | Automatic component teaching device |
JP2007173801A (ja) * | 2005-12-22 | 2007-07-05 | Unaxis Internatl Trading Ltd | フリップチップを基板に取り付ける方法 |
JP4367524B2 (ja) * | 2007-05-22 | 2009-11-18 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
DE102008033903A1 (de) * | 2008-07-18 | 2010-01-21 | Suss Microtec Test Systems Gmbh | Vorrichtung und Verfahren zur Montage mehrerer Halbleiterbauelemente auf einem Zielsubstrat |
JP5018812B2 (ja) * | 2009-03-16 | 2012-09-05 | パナソニック株式会社 | スクリーン印刷機及びスクリーン印刷方法 |
JP5246064B2 (ja) * | 2009-06-29 | 2013-07-24 | パナソニック株式会社 | 電子部品実装方法 |
CN102960084B (zh) * | 2010-06-30 | 2015-09-16 | 克拉-坦科股份有限公司 | 用于将电子器件放到输入介质和输出介质的隔室中的方法和排布系统 |
JP5408153B2 (ja) * | 2011-02-21 | 2014-02-05 | パナソニック株式会社 | 電子部品実装装置および電子部品実装装置における画像読取り方法 |
CH705802B1 (de) * | 2011-11-25 | 2016-04-15 | Esec Ag | Einrichtung für die Montage von Halbleiterchips. |
JP5830644B2 (ja) * | 2011-12-06 | 2015-12-09 | パナソニックIpマネジメント株式会社 | 下受けピン配置判定装置および下受けピン配置判定方法 |
TWI421972B (zh) * | 2011-12-08 | 2014-01-01 | Metal Ind Res & Dev Ct | 無標記異空間基板組裝對位方法及系統 |
JP5781975B2 (ja) * | 2012-03-30 | 2015-09-24 | ヤマハ発動機株式会社 | 電子部品の装着方法及び電子部品の装着装置 |
US9780514B2 (en) * | 2012-08-22 | 2017-10-03 | Panasonic Intellectual Property Management Co., Ltd. | Component mounting method |
US9162880B2 (en) * | 2012-09-07 | 2015-10-20 | LuxVue Technology Corporation | Mass transfer tool |
WO2014041665A1 (ja) * | 2012-09-13 | 2014-03-20 | 株式会社日立製作所 | プリント基板設計検証システム、プリント基板設計検証方法及び記録媒体 |
JP5884015B2 (ja) * | 2012-11-19 | 2016-03-15 | パナソニックIpマネジメント株式会社 | 電子部品装着システム |
WO2014076969A1 (ja) * | 2012-11-19 | 2014-05-22 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
KR101686032B1 (ko) * | 2013-03-28 | 2016-12-13 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리 장치, 반도체 장치의 제조 방법 및 기록 매체 |
DE102013207598A1 (de) * | 2013-04-25 | 2014-10-30 | Finetech Gmbh & Co.Kg | Platziervorrichtung und Platzierverfahren |
JP6285275B2 (ja) * | 2014-04-30 | 2018-02-28 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6426984B2 (ja) * | 2014-11-18 | 2018-11-21 | キヤノン株式会社 | リソグラフィ装置および物品製造方法 |
US10743447B2 (en) * | 2015-02-26 | 2020-08-11 | Fuji Corporation | Component mounting machine |
-
2015
- 2015-10-23 DE DE102015220746.3A patent/DE102015220746A1/de not_active Withdrawn
-
2016
- 2016-07-18 PL PL16180010T patent/PL3160219T3/pl unknown
- 2016-07-18 EP EP16180010.7A patent/EP3160219B1/de active Active
- 2016-09-19 CN CN201610833444.2A patent/CN106879185B/zh active Active
- 2016-10-19 US US15/297,419 patent/US10217211B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10217211B2 (en) | 2019-02-26 |
CN106879185B (zh) | 2020-05-19 |
US20170116720A1 (en) | 2017-04-27 |
DE102015220746A1 (de) | 2017-04-27 |
CN106879185A (zh) | 2017-06-20 |
EP3160219B1 (de) | 2018-09-12 |
EP3160219A1 (de) | 2017-04-26 |
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