HK1244057A1 - 用於檢查電子器件的方法 - Google Patents

用於檢查電子器件的方法

Info

Publication number
HK1244057A1
HK1244057A1 HK18103413.3A HK18103413A HK1244057A1 HK 1244057 A1 HK1244057 A1 HK 1244057A1 HK 18103413 A HK18103413 A HK 18103413A HK 1244057 A1 HK1244057 A1 HK 1244057A1
Authority
HK
Hong Kong
Prior art keywords
checking
electronic component
electronic
component
Prior art date
Application number
HK18103413.3A
Other languages
English (en)
Inventor
布莱恩特 K
摩肯斯 B
温特艾伯 M
Original Assignee
依科視朗國際有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102015005641.7A external-priority patent/DE102015005641A1/de
Application filed by 依科視朗國際有限公司 filed Critical 依科視朗國際有限公司
Publication of HK1244057A1 publication Critical patent/HK1244057A1/zh

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/18Investigating the presence of flaws defects or foreign matter
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/083Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/14Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
    • G06K7/1404Methods for optical code recognition
    • G06K7/1408Methods for optical code recognition the method being specifically adapted for the type of code
    • G06K7/14131D bar codes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/001Industrial image inspection using an image reference approach
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00Investigating materials by wave or particle radiation
    • G01N2223/60Specific applications or type of materials
    • G01N2223/611Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6113Specific applications or type of materials patterned objects; electronic devices printed circuit board [PCB]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00Investigating materials by wave or particle radiation
    • G01N2223/60Specific applications or type of materials
    • G01N2223/66Specific applications or type of materials multiple steps inspection, e.g. coarse/fine
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/10Image acquisition modality
    • G06T2207/10116X-ray image
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30141Printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Artificial Intelligence (AREA)
  • Signal Processing (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
HK18103413.3A 2015-04-15 2018-03-12 用於檢查電子器件的方法 HK1244057A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015004650 2015-04-15
DE102015005641.7A DE102015005641A1 (de) 2015-05-05 2015-05-05 Verfahren zum Prüfen eines elektronischen Bauteils
PCT/EP2016/000612 WO2016165828A1 (de) 2015-04-15 2016-04-14 Verfahren zum prüfen eines elektronischen bauteils

Publications (1)

Publication Number Publication Date
HK1244057A1 true HK1244057A1 (zh) 2018-07-27

Family

ID=55808541

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18103413.3A HK1244057A1 (zh) 2015-04-15 2018-03-12 用於檢查電子器件的方法

Country Status (7)

Country Link
US (1) US10571413B2 (zh)
JP (1) JP6535755B2 (zh)
KR (1) KR102121521B1 (zh)
CN (1) CN107592910B (zh)
HK (1) HK1244057A1 (zh)
TW (1) TW201643411A (zh)
WO (1) WO2016165828A1 (zh)

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GB2574188B (en) * 2018-04-11 2022-03-09 E M & I Maritime Ltd Inspection of hazardous area equipment
US11188792B2 (en) 2020-01-07 2021-11-30 International Business Machines Corporation Defect detection using multiple models
KR20220133575A (ko) 2021-03-25 2022-10-05 스템코 주식회사 광학 검사 장치
CN113252686B (zh) * 2021-05-13 2021-12-17 中科长光精拓智能装备(苏州)有限公司 一种电子元件邦定方法

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Also Published As

Publication number Publication date
KR20170136634A (ko) 2017-12-11
WO2016165828A1 (de) 2016-10-20
TW201643411A (zh) 2016-12-16
US20180136145A1 (en) 2018-05-17
JP2018514760A (ja) 2018-06-07
US10571413B2 (en) 2020-02-25
CN107592910B (zh) 2021-08-13
KR102121521B1 (ko) 2020-06-29
JP6535755B2 (ja) 2019-06-26
CN107592910A (zh) 2018-01-16

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