WO2009011201A1 - 検査用構造体 - Google Patents

検査用構造体 Download PDF

Info

Publication number
WO2009011201A1
WO2009011201A1 PCT/JP2008/061328 JP2008061328W WO2009011201A1 WO 2009011201 A1 WO2009011201 A1 WO 2009011201A1 JP 2008061328 W JP2008061328 W JP 2008061328W WO 2009011201 A1 WO2009011201 A1 WO 2009011201A1
Authority
WO
WIPO (PCT)
Prior art keywords
section
base section
layer
inspecting
circuit board
Prior art date
Application number
PCT/JP2008/061328
Other languages
English (en)
French (fr)
Inventor
Jun Mochizuki
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to JP2009523580A priority Critical patent/JP5079806B2/ja
Publication of WO2009011201A1 publication Critical patent/WO2009011201A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

　プローブカードにおける回路基板の下面側に、検査用構造体が取付けられる。検査用構造体は、台座部と、当該台座部の下面に取り付けられた基板状のコンタクト部と、台座部を保持する保持部を有している。コンタクト部は、配線層、絶縁層及び弾性層が下からこの順に積層されて形成され、各プローブピンは、コンタクト部の面内の一部が下方に屈曲して形成され、前記配線層、絶縁層及び弾性層を有する積層構造を有している。台座部の導体部内に、導電線と誘電体部が同軸状に配置されている。導電線は、プローブピンと回路基板に電気的に接続されている。
PCT/JP2008/061328 2007-07-13 2008-06-20 検査用構造体 WO2009011201A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009523580A JP5079806B2 (ja) 2007-07-13 2008-06-20 検査用構造体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-183949 2007-07-13
JP2007183949 2007-07-13

Publications (1)

Publication Number Publication Date
WO2009011201A1 true WO2009011201A1 (ja) 2009-01-22

Family

ID=40259541

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061328 WO2009011201A1 (ja) 2007-07-13 2008-06-20 検査用構造体

Country Status (3)

Country Link
JP (1) JP5079806B2 (ja)
TW (1) TWI391671B (ja)
WO (1) WO2009011201A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018135674A1 (ko) * 2017-01-17 2018-07-26 주식회사 이노글로벌 양방향 도전성 패턴 모듈
JP2019211459A (ja) * 2018-06-06 2019-12-12 中華精測科技股▲ふん▼有限公司Ｃｈｕｎｇｈｗａ Ｐｒｅｃｉｓｉｏｎｔｅｓｔ Ｔｅｃｈ．Ｃｏ．，Ｌｔｄ プローブカード装置及びその３次元信号授受構造
CN111751578A (zh) * 2019-03-29 2020-10-09 矽品精密工业股份有限公司 检测装置及其制法
CN114088997A (zh) * 2020-08-24 2022-02-25 日本麦可罗尼克斯股份有限公司 电触头的电接触构造以及电连接装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9774121B2 (en) * 2012-12-04 2017-09-26 Japan Electronics Material Corporation Contact probe
JP7198127B2 (ja) * 2019-03-20 2022-12-28 株式会社アドバンテスト インタポーザ、ソケット、ソケット組立体、及び、配線板組立体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63206671A (ja) * 1987-02-24 1988-08-25 Tokyo Electron Ltd 検査装置
JPH0750324A (ja) * 1993-08-03 1995-02-21 Tokyo Electron Ltd プローブ装置
JP2005061844A (ja) * 2003-08-12 2005-03-10 Japan Electronic Materials Corp プローブカード
JP2006507479A (ja) * 2002-06-24 2006-03-02 ナノネクサス インク ウエハレベルのスプリングを有するプローブカードアセンブリおよびパッケージの構造および製造工程
JP2006275543A (ja) * 2005-03-28 2006-10-12 Kurio:Kk プローブ装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3878449B2 (ja) * 2001-10-17 2007-02-07 株式会社ルネサステクノロジ 半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63206671A (ja) * 1987-02-24 1988-08-25 Tokyo Electron Ltd 検査装置
JPH0750324A (ja) * 1993-08-03 1995-02-21 Tokyo Electron Ltd プローブ装置
JP2006507479A (ja) * 2002-06-24 2006-03-02 ナノネクサス インク ウエハレベルのスプリングを有するプローブカードアセンブリおよびパッケージの構造および製造工程
JP2005061844A (ja) * 2003-08-12 2005-03-10 Japan Electronic Materials Corp プローブカード
JP2006275543A (ja) * 2005-03-28 2006-10-12 Kurio:Kk プローブ装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018135674A1 (ko) * 2017-01-17 2018-07-26 주식회사 이노글로벌 양방향 도전성 패턴 모듈
JP2019211459A (ja) * 2018-06-06 2019-12-12 中華精測科技股▲ふん▼有限公司Ｃｈｕｎｇｈｗａ Ｐｒｅｃｉｓｉｏｎｔｅｓｔ Ｔｅｃｈ．Ｃｏ．，Ｌｔｄ プローブカード装置及びその３次元信号授受構造
CN111751578A (zh) * 2019-03-29 2020-10-09 矽品精密工业股份有限公司 检测装置及其制法
CN114088997A (zh) * 2020-08-24 2022-02-25 日本麦可罗尼克斯股份有限公司 电触头的电接触构造以及电连接装置

Also Published As

Publication number Publication date
JP5079806B2 (ja) 2012-11-21
JPWO2009011201A1 (ja) 2010-09-16
TWI391671B (zh) 2013-04-01
TW200921111A (en) 2009-05-16

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