AU2001250876A1 - Method and apparatus for planarizing a semiconductor contactor - Google Patents

Method and apparatus for planarizing a semiconductor contactor

Info

Publication number
AU2001250876A1
AU2001250876A1 AU2001250876A AU5087601A AU2001250876A1 AU 2001250876 A1 AU2001250876 A1 AU 2001250876A1 AU 2001250876 A AU2001250876 A AU 2001250876A AU 5087601 A AU5087601 A AU 5087601A AU 2001250876 A1 AU2001250876 A1 AU 2001250876A1
Authority
AU
Australia
Prior art keywords
planarizing
semiconductor contactor
contactor
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001250876A
Inventor
Benjamin N Eldridge
Gary W Grube
Gaetan L Mathieu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27062552&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU2001250876(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US09/528,064 external-priority patent/US6509751B1/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of AU2001250876A1 publication Critical patent/AU2001250876A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AU2001250876A 2000-03-17 2001-03-16 Method and apparatus for planarizing a semiconductor contactor Abandoned AU2001250876A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US52793100A 2000-03-17 2000-03-17
US09/528,064 US6509751B1 (en) 2000-03-17 2000-03-17 Planarizer for a semiconductor contactor
US09528064 2000-03-17
US09527931 2000-03-17
PCT/US2001/008746 WO2001071779A2 (en) 2000-03-17 2001-03-16 Method and apparatus for planarizing a semiconductor contactor

Publications (1)

Publication Number Publication Date
AU2001250876A1 true AU2001250876A1 (en) 2001-10-03

Family

ID=27062552

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001250876A Abandoned AU2001250876A1 (en) 2000-03-17 2001-03-16 Method and apparatus for planarizing a semiconductor contactor

Country Status (7)

Country Link
EP (1) EP1266230B1 (en)
JP (4) JP2003528459A (en)
KR (1) KR100459050B1 (en)
AU (1) AU2001250876A1 (en)
DE (1) DE60142030D1 (en)
TW (2) TW588400B (en)
WO (1) WO2001071779A2 (en)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003528459A (en) * 2000-03-17 2003-09-24 フォームファクター，インコーポレイテッド Method and apparatus for planarizing semiconductor contactors
US6965244B2 (en) 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
US6911835B2 (en) * 2002-05-08 2005-06-28 Formfactor, Inc. High performance probe system
JP3621938B2 (en) 2002-08-09 2005-02-23 日本電子材料株式会社 Probe card
US7071715B2 (en) 2004-01-16 2006-07-04 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates
JPWO2005083773A1 (en) * 2004-02-27 2007-08-30 株式会社アドバンテスト Probe card and manufacturing method thereof
DE102004027887B4 (en) * 2004-05-28 2010-07-29 Feinmetall Gmbh Testing device for electrical testing of a test object
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
WO2006126279A1 (en) 2005-05-23 2006-11-30 Kabushiki Kaisha Nihon Micronics Probe assembly, method of producing the probe assembly, and electrical connection device
JP4634867B2 (en) 2005-06-03 2011-02-16 株式会社ミツトヨ Image measuring system and method
US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
JP4791473B2 (en) 2005-08-02 2011-10-12 株式会社日本マイクロニクス Electrical connection device
JP4642603B2 (en) * 2005-08-25 2011-03-02 東京エレクトロン株式会社 Probe card
DE112005003731B4 (en) 2005-10-24 2013-04-18 Kabushiki Kaisha Nihon Micronics Method for mounting an electrical connection device
US7671614B2 (en) * 2005-12-02 2010-03-02 Formfactor, Inc. Apparatus and method for adjusting an orientation of probes
JP5289771B2 (en) 2005-12-05 2013-09-11 日本発條株式会社 Probe card
JP4823667B2 (en) 2005-12-05 2011-11-24 日本発條株式会社 Probe card
US7365553B2 (en) * 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
KR101025895B1 (en) 2006-06-08 2011-03-30 니혼 하츠쵸 가부시키가이샤 Probe card
KR100821996B1 (en) * 2006-09-08 2008-04-15 윌테크놀러지(주) Probe unit capable of adjusting flatness
JP2008134170A (en) * 2006-11-29 2008-06-12 Micronics Japan Co Ltd Electrically connecting device
JP5190195B2 (en) * 2006-11-29 2013-04-24 株式会社日本マイクロニクス Electrical connection device
JP2008216060A (en) 2007-03-05 2008-09-18 Micronics Japan Co Ltd Electrical connecting device
EP2128630A4 (en) 2007-03-14 2014-05-14 Nhk Spring Co Ltd Probe card
KR101242004B1 (en) 2007-03-19 2013-03-11 (주) 미코티엔 Probe card
KR101029697B1 (en) 2007-03-20 2011-04-18 가부시키가이샤 니혼 마이크로닉스 Electrical Connection Device
KR100806736B1 (en) * 2007-05-11 2008-02-27 주식회사 에이엠에스티 Probe card and method for fabricating the same
KR100911661B1 (en) * 2007-07-11 2009-08-10 (주)엠투엔 Probe card having planarization means
CN101755216B (en) 2007-07-19 2012-10-10 日本发条株式会社 Probe card
JP4941169B2 (en) * 2007-08-15 2012-05-30 横河電機株式会社 Probe card mechanism
JP5326240B2 (en) * 2007-08-24 2013-10-30 富士通株式会社 Inspection method of probe board and electronic device
US8378705B2 (en) 2008-02-29 2013-02-19 Nhk Spring Co., Ltd. Wiring substrate and probe card
US7923290B2 (en) * 2009-03-27 2011-04-12 Stats Chippac Ltd. Integrated circuit packaging system having dual sided connection and method of manufacture thereof
KR100954451B1 (en) * 2009-06-19 2010-04-27 박영주 Insert layer-built method to evenness regulation-body of evenness equipment and evenness equipment to probe-card test for semiconductor wafer
DE202009014987U1 (en) * 2009-10-28 2010-02-18 Feinmetall Gmbh Test device for electrical testing of electrical devices
KR101108726B1 (en) * 2010-01-26 2012-02-29 삼성전기주식회사 Member for adjusting horizontality
KR101148635B1 (en) * 2011-07-25 2012-05-25 삼성전기주식회사 Probe card
JPWO2013108759A1 (en) 2012-01-18 2015-05-11 日本発條株式会社 Space transformer and probe card
JP5991823B2 (en) * 2012-02-14 2016-09-14 株式会社日本マイクロニクス Electrical connection device and method of assembling the same
CN117043921A (en) 2021-02-24 2023-11-10 株式会社爱德万测试 Semiconductor wafer test apparatus, semiconductor wafer test system, flatness measuring apparatus, and method for adjusting flatness of wiring board
JP2024017497A (en) * 2022-07-28 2024-02-08 株式会社日本マイクロニクス Electric connection device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07109471B2 (en) * 1986-12-23 1995-11-22 株式会社コパル Strobe emission control method
JPH0680716B2 (en) * 1990-10-11 1994-10-12 日本電子材料株式会社 Positioning mechanism for probe card
US5094536A (en) * 1990-11-05 1992-03-10 Litel Instruments Deformable wafer chuck
JP2802849B2 (en) * 1992-03-16 1998-09-24 日立電子エンジニアリング株式会社 Probe card warpage correction mechanism
WO1996016440A1 (en) * 1994-11-15 1996-05-30 Formfactor, Inc. Interconnection elements for microelectronic components
JP2900240B2 (en) * 1995-10-09 1999-06-02 日本電子材料株式会社 Method for producing anisotropic conductive sheet
JP2737774B2 (en) * 1996-03-15 1998-04-08 日本電気株式会社 Wafer tester
JPH1031034A (en) * 1996-07-17 1998-02-03 Denki Kagaku Kogyo Kk Probe card with parallelism regulator
JPH11163059A (en) * 1997-11-25 1999-06-18 Yamamoto Isamu Apparatus and method of inspecting semiconductor wafer for integrated circuit
JP2003528459A (en) * 2000-03-17 2003-09-24 フォームファクター，インコーポレイテッド Method and apparatus for planarizing semiconductor contactors

Also Published As

Publication number Publication date
KR20020095151A (en) 2002-12-20
JP2006343350A (en) 2006-12-21
DE60142030D1 (en) 2010-06-17
EP1266230B1 (en) 2010-05-05
WO2001071779A2 (en) 2001-09-27
KR100459050B1 (en) 2004-12-03
JP2005164601A (en) 2005-06-23
WO2001071779A3 (en) 2002-03-14
JP2003528459A (en) 2003-09-24
EP1266230A2 (en) 2002-12-18
TW588404B (en) 2004-05-21
JP2005164600A (en) 2005-06-23
TW588400B (en) 2004-05-21

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