TW455974B - Probe card transfer mechanism - Google Patents

Probe card transfer mechanism Download PDF

Info

Publication number
TW455974B
TW455974B TW089113408A TW89113408A TW455974B TW 455974 B TW455974 B TW 455974B TW 089113408 A TW089113408 A TW 089113408A TW 89113408 A TW89113408 A TW 89113408A TW 455974 B TW455974 B TW 455974B
Authority
TW
Taiwan
Prior art keywords
probe card
probe
adapter
card
patent application
Prior art date
Application number
TW089113408A
Other languages
English (en)
Chinese (zh)
Inventor
Masaru Suzuki
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TW455974B publication Critical patent/TW455974B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66B—ELEVATORS; ESCALATORS OR MOVING WALKWAYS
    • B66B1/00—Control systems of elevators in general
    • B66B1/34—Details, e.g. call counting devices, data transmission from car to control system, devices giving information to the control system
    • B66B1/3415—Control system configuration and the data transmission or communication within the control system
    • B66B1/3446—Data transmission or communication within the control system
    • B66B1/3453—Procedure or protocol for the data transmission or communication
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66B—ELEVATORS; ESCALATORS OR MOVING WALKWAYS
    • B66B1/00—Control systems of elevators in general
    • B66B1/02—Control systems without regulation, i.e. without retroactive action
    • B66B1/06—Control systems without regulation, i.e. without retroactive action electric
    • B66B1/14—Control systems without regulation, i.e. without retroactive action electric with devices, e.g. push-buttons, for indirect control of movements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66B—ELEVATORS; ESCALATORS OR MOVING WALKWAYS
    • B66B2201/00—Aspects of control systems of elevators
    • B66B2201/20—Details of the evaluation method for the allocation of a call to an elevator car
    • B66B2201/211—Waiting time, i.e. response time
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW089113408A 1999-07-09 2000-07-06 Probe card transfer mechanism TW455974B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19524599A JP4104099B2 (ja) 1999-07-09 1999-07-09 プローブカード搬送機構

Publications (1)

Publication Number Publication Date
TW455974B true TW455974B (en) 2001-09-21

Family

ID=16337921

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089113408A TW455974B (en) 1999-07-09 2000-07-06 Probe card transfer mechanism

Country Status (4)

Country Link
US (1) US6414478B1 (https=)
JP (1) JP4104099B2 (https=)
KR (2) KR100503516B1 (https=)
TW (1) TW455974B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103308839A (zh) * 2012-03-14 2013-09-18 东京毅力科创株式会社 晶片检查装置
CN103308734A (zh) * 2012-03-14 2013-09-18 东京毅力科创株式会社 探针装置和探针装置的探针卡安装方法
TWI638172B (zh) * 2013-08-01 2018-10-11 日商東京威力科創股份有限公司 Probe instrument

Families Citing this family (68)

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US6380751B2 (en) 1992-06-11 2002-04-30 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
US5345170A (en) 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US5561377A (en) 1995-04-14 1996-10-01 Cascade Microtech, Inc. System for evaluating probing networks
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6002263A (en) 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
US6034533A (en) 1997-06-10 2000-03-07 Tervo; Paul A. Low-current pogo probe card
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
JP4798595B2 (ja) * 2001-08-07 2011-10-19 東京エレクトロン株式会社 プローブカード搬送装置及びプローブカード搬送方法
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
JP3783075B2 (ja) * 2001-12-13 2006-06-07 東京エレクトロン株式会社 プローブ装置及びローダ装置
US6777964B2 (en) 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
EP1509776A4 (en) 2002-05-23 2010-08-18 Cascade Microtech Inc PROBE TO TEST ANY TESTING EQUIPMENT
JP4134289B2 (ja) 2002-05-29 2008-08-20 東京エレクトロン株式会社 プローブカード搬送装置及びアダプタ
US6847219B1 (en) 2002-11-08 2005-01-25 Cascade Microtech, Inc. Probe station with low noise characteristics
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7250779B2 (en) 2002-11-25 2007-07-31 Cascade Microtech, Inc. Probe station with low inductance path
US6861856B2 (en) 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
DE10260766A1 (de) * 2002-12-23 2004-04-01 Infineon Technologies Ag Kontaktiereinrichtung zum Kontaktieren von integrierten Schaltungen und Kontaktierverfahren
JP4391744B2 (ja) * 2002-12-27 2009-12-24 東京エレクトロン株式会社 移動式プローブカード搬送装置、プローブ装置及びプローブ装置へのプローブカードの搬送方法
US7221172B2 (en) 2003-05-06 2007-05-22 Cascade Microtech, Inc. Switched suspended conductor and connection
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
WO2005065258A2 (en) 2003-12-24 2005-07-21 Cascade Microtech, Inc. Active wafer probe
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
DE202005021434U1 (de) 2004-06-07 2008-03-20 Cascade Microtech, Inc., Beaverton Thermooptische Einspannvorrichtung
US7330041B2 (en) 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
KR101157449B1 (ko) 2004-07-07 2012-06-22 캐스케이드 마이크로테크 인코포레이티드 멤브레인 서스펜디드 프로브를 구비한 프로브 헤드
KR20070058522A (ko) 2004-09-13 2007-06-08 캐스케이드 마이크로테크 인코포레이티드 양측 프루빙 구조
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
EP1932003A2 (en) 2005-06-13 2008-06-18 Cascade Microtech, Inc. Wideband active-passive differential signal probe
JP4875332B2 (ja) * 2005-09-21 2012-02-15 東京エレクトロン株式会社 プローブカード移載補助装置及び検査設備
US7609077B2 (en) 2006-06-09 2009-10-27 Cascade Microtech, Inc. Differential signal probe with integral balun
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
JP2008016676A (ja) * 2006-07-06 2008-01-24 Micronics Japan Co Ltd プローブカード自動交換機構及び検査装置
KR100847577B1 (ko) * 2006-12-27 2008-07-21 세크론 주식회사 프로빙 검사장치
US7764079B1 (en) * 2007-01-31 2010-07-27 SemiProbe LLC Modular probe system
KR101335916B1 (ko) * 2007-07-11 2013-12-03 삼성전자주식회사 테스트 장치
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
JP5517344B2 (ja) * 2010-02-12 2014-06-11 東京エレクトロン株式会社 プローブカードの搬送機構、プローブカードの搬送方法及びプローブ装置
KR101503143B1 (ko) * 2013-01-31 2015-03-18 세메스 주식회사 프로브 카드의 반송 방법
JP6271257B2 (ja) * 2014-01-08 2018-01-31 東京エレクトロン株式会社 基板検査装置及びプローブカード搬送方法
JP6410626B2 (ja) * 2015-02-06 2018-10-24 株式会社ディスコ 切削装置
JP6523838B2 (ja) 2015-07-15 2019-06-05 東京エレクトロン株式会社 プローブカード搬送装置、プローブカード搬送方法及びプローブ装置
CN106896289A (zh) * 2015-12-17 2017-06-27 台北歆科科技有限公司 分离式探针模块及具备分离式探针模块的电子元件检测设备
JP6801166B2 (ja) * 2016-10-18 2020-12-16 株式会社東京精密 プローバ及びプローブ検査方法
KR102023154B1 (ko) * 2017-09-15 2019-09-19 디알 주식회사 척 어셈블리 및 이를 포함하는 기판 검사 카트리지
KR102095388B1 (ko) 2018-11-13 2020-03-31 주식회사 쎄믹스 웨이퍼 검사 장치의 프로브 카드 교환 장치
JP7217636B2 (ja) * 2019-01-16 2023-02-03 東京エレクトロン株式会社 チャックトップ、検査装置、およびチャックトップの回収方法
JP7186647B2 (ja) * 2019-03-22 2022-12-09 東京エレクトロン株式会社 搬送装置
CN110850123A (zh) * 2019-11-26 2020-02-28 深圳市矽电半导体设备有限公司 一种针卡运输装置及探针台
CN112864069B (zh) * 2021-03-10 2024-08-16 新阳硅密（上海）半导体技术有限公司 晶圆片预处理装置
KR102867964B1 (ko) * 2022-11-14 2025-10-14 주식회사 쎄믹스 프로버의 카드 승강 장치

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103308839A (zh) * 2012-03-14 2013-09-18 东京毅力科创株式会社 晶片检查装置
CN103308734A (zh) * 2012-03-14 2013-09-18 东京毅力科创株式会社 探针装置和探针装置的探针卡安装方法
TWI638172B (zh) * 2013-08-01 2018-10-11 日商東京威力科創股份有限公司 Probe instrument

Also Published As

Publication number Publication date
JP4104099B2 (ja) 2008-06-18
US6414478B1 (en) 2002-07-02
KR20050047060A (ko) 2005-05-19
KR100503516B1 (ko) 2005-07-25
KR20010015223A (ko) 2001-02-26
KR100564475B1 (ko) 2006-03-29
JP2001024039A (ja) 2001-01-26

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