TW297144B - - Google Patents

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Publication number
TW297144B
TW297144B TW085103472A TW85103472A TW297144B TW 297144 B TW297144 B TW 297144B TW 085103472 A TW085103472 A TW 085103472A TW 85103472 A TW85103472 A TW 85103472A TW 297144 B TW297144 B TW 297144B
Authority
TW
Taiwan
Prior art keywords
wafer
ring
cassette
guide
transported
Prior art date
Application number
TW085103472A
Other languages
English (en)
Chinese (zh)
Original Assignee
Arakawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arakawa Kk filed Critical Arakawa Kk
Application granted granted Critical
Publication of TW297144B publication Critical patent/TW297144B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Specific Conveyance Elements (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
TW085103472A 1995-08-18 1996-03-22 TW297144B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23210895A JP3198401B2 (ja) 1995-08-18 1995-08-18 ウェーハリングの供給・返送装置

Publications (1)

Publication Number Publication Date
TW297144B true TW297144B (https=) 1997-02-01

Family

ID=16934138

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085103472A TW297144B (https=) 1995-08-18 1996-03-22

Country Status (4)

Country Link
US (1) US5853532A (https=)
JP (1) JP3198401B2 (https=)
KR (1) KR100251431B1 (https=)
TW (1) TW297144B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI566317B (zh) * 2015-03-13 2017-01-11 均華精密工業股份有限公司 晶圓環快速換料裝置及其方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107128A (ja) * 1996-10-01 1998-04-24 Shinkawa Ltd ウェーハリングの供給装置
JP3662404B2 (ja) * 1997-11-19 2005-06-22 芝浦メカトロニクス株式会社 ウエハシート引伸ばし装置およびそれを用いたペレットボンディング装置
JP3888754B2 (ja) * 1997-12-08 2007-03-07 日東電工株式会社 半導体ウエハの自動貼付け装置
JPH11307553A (ja) * 1998-04-21 1999-11-05 Shinkawa Ltd 半導体ペレットの位置決め方法及びその装置
JP2001176892A (ja) 1999-12-15 2001-06-29 Shinkawa Ltd ダイボンディング方法及びその装置
US7011484B2 (en) * 2002-01-11 2006-03-14 Taiwan Semiconductor Manufacturing Co., Ltd. End effector with tapered fingertips
US20040071534A1 (en) * 2002-07-18 2004-04-15 August Technology Corp. Adjustable wafer alignment arm
DE112004001695T5 (de) 2003-09-11 2006-07-06 Advantest Corp. Vorrichtung zur Erzeugung eines Fehlerkorrektursignals und ein Quadraturmodulator, der mit der Vorrichtung zur Erzeugung eines Fehlerkorrektursignals ausgerüstet ist
US20080003091A1 (en) * 2006-06-22 2008-01-03 Bonora Anthony C Method and apparatus for transporting, queuing, and loading of large area substrates in multi-tool processing operations
KR100986281B1 (ko) * 2010-01-21 2010-10-07 주식회사 이노비즈 엘이디 검사장비의 웨이퍼 로딩유닛
KR102490593B1 (ko) 2016-08-22 2023-01-20 세메스 주식회사 웨이퍼링 이송 장치
JP6493339B2 (ja) * 2016-08-26 2019-04-03 村田機械株式会社 搬送容器、及び収容物の移載方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584045A (en) * 1984-02-21 1986-04-22 Plasma-Therm, Inc. Apparatus for conveying a semiconductor wafer
US4638601A (en) * 1985-11-04 1987-01-27 Silicon Technology Corporation Automatic edge grinder
JPS62106642A (ja) * 1985-11-05 1987-05-18 Toshiba Seiki Kk ウェハリングの供給・返送方法
US5478428A (en) * 1994-08-01 1995-12-26 Grand Rapids Label Company Label separator and method for separating a label from a backing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI566317B (zh) * 2015-03-13 2017-01-11 均華精密工業股份有限公司 晶圓環快速換料裝置及其方法

Also Published As

Publication number Publication date
JPH0964147A (ja) 1997-03-07
US5853532A (en) 1998-12-29
KR970013178A (ko) 1997-03-29
JP3198401B2 (ja) 2001-08-13
KR100251431B1 (ko) 2000-04-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees