KR100251431B1 - 웨이퍼링의 공급·반송장치 - Google Patents

웨이퍼링의 공급·반송장치 Download PDF

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Publication number
KR100251431B1
KR100251431B1 KR1019960034161A KR19960034161A KR100251431B1 KR 100251431 B1 KR100251431 B1 KR 100251431B1 KR 1019960034161 A KR1019960034161 A KR 1019960034161A KR 19960034161 A KR19960034161 A KR 19960034161A KR 100251431 B1 KR100251431 B1 KR 100251431B1
Authority
KR
South Korea
Prior art keywords
wafer ring
wafer
cassette
wafering
conveying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019960034161A
Other languages
English (en)
Korean (ko)
Other versions
KR970013178A (ko
Inventor
오사무 나카무라
시게루 이치카와
츠네하루 아라이
Original Assignee
후지야마 겐지
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지야마 겐지, 가부시키가이샤 신가와 filed Critical 후지야마 겐지
Publication of KR970013178A publication Critical patent/KR970013178A/ko
Application granted granted Critical
Publication of KR100251431B1 publication Critical patent/KR100251431B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Specific Conveyance Elements (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
KR1019960034161A 1995-08-18 1996-08-19 웨이퍼링의 공급·반송장치 Expired - Fee Related KR100251431B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP23210895A JP3198401B2 (ja) 1995-08-18 1995-08-18 ウェーハリングの供給・返送装置
JP95-232108 1995-08-18

Publications (2)

Publication Number Publication Date
KR970013178A KR970013178A (ko) 1997-03-29
KR100251431B1 true KR100251431B1 (ko) 2000-04-15

Family

ID=16934138

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960034161A Expired - Fee Related KR100251431B1 (ko) 1995-08-18 1996-08-19 웨이퍼링의 공급·반송장치

Country Status (4)

Country Link
US (1) US5853532A (https=)
JP (1) JP3198401B2 (https=)
KR (1) KR100251431B1 (https=)
TW (1) TW297144B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180021492A (ko) 2016-08-22 2018-03-05 세메스 주식회사 웨이퍼링 이송 장치

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107128A (ja) * 1996-10-01 1998-04-24 Shinkawa Ltd ウェーハリングの供給装置
JP3662404B2 (ja) * 1997-11-19 2005-06-22 芝浦メカトロニクス株式会社 ウエハシート引伸ばし装置およびそれを用いたペレットボンディング装置
JP3888754B2 (ja) * 1997-12-08 2007-03-07 日東電工株式会社 半導体ウエハの自動貼付け装置
JPH11307553A (ja) * 1998-04-21 1999-11-05 Shinkawa Ltd 半導体ペレットの位置決め方法及びその装置
JP2001176892A (ja) 1999-12-15 2001-06-29 Shinkawa Ltd ダイボンディング方法及びその装置
US7011484B2 (en) * 2002-01-11 2006-03-14 Taiwan Semiconductor Manufacturing Co., Ltd. End effector with tapered fingertips
US20040071534A1 (en) * 2002-07-18 2004-04-15 August Technology Corp. Adjustable wafer alignment arm
DE112004001695T5 (de) 2003-09-11 2006-07-06 Advantest Corp. Vorrichtung zur Erzeugung eines Fehlerkorrektursignals und ein Quadraturmodulator, der mit der Vorrichtung zur Erzeugung eines Fehlerkorrektursignals ausgerüstet ist
US20080003091A1 (en) * 2006-06-22 2008-01-03 Bonora Anthony C Method and apparatus for transporting, queuing, and loading of large area substrates in multi-tool processing operations
KR100986281B1 (ko) * 2010-01-21 2010-10-07 주식회사 이노비즈 엘이디 검사장비의 웨이퍼 로딩유닛
TWI566317B (zh) * 2015-03-13 2017-01-11 均華精密工業股份有限公司 晶圓環快速換料裝置及其方法
JP6493339B2 (ja) * 2016-08-26 2019-04-03 村田機械株式会社 搬送容器、及び収容物の移載方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584045A (en) * 1984-02-21 1986-04-22 Plasma-Therm, Inc. Apparatus for conveying a semiconductor wafer
US4638601A (en) * 1985-11-04 1987-01-27 Silicon Technology Corporation Automatic edge grinder
JPS62106642A (ja) * 1985-11-05 1987-05-18 Toshiba Seiki Kk ウェハリングの供給・返送方法
US5478428A (en) * 1994-08-01 1995-12-26 Grand Rapids Label Company Label separator and method for separating a label from a backing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180021492A (ko) 2016-08-22 2018-03-05 세메스 주식회사 웨이퍼링 이송 장치

Also Published As

Publication number Publication date
TW297144B (https=) 1997-02-01
JPH0964147A (ja) 1997-03-07
US5853532A (en) 1998-12-29
KR970013178A (ko) 1997-03-29
JP3198401B2 (ja) 2001-08-13

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