TW280937B - - Google Patents

Info

Publication number
TW280937B
TW280937B TW084104495A TW84104495A TW280937B TW 280937 B TW280937 B TW 280937B TW 084104495 A TW084104495 A TW 084104495A TW 84104495 A TW84104495 A TW 84104495A TW 280937 B TW280937 B TW 280937B
Authority
TW
Taiwan
Application number
TW084104495A
Other languages
Chinese (zh)
Original Assignee
Tokyo Electron Co Ltd
Tel Kyushu Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd, Tel Kyushu Kk filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW280937B publication Critical patent/TW280937B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW084104495A 1994-04-26 1995-05-05 TW280937B (oth)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6110421A JPH07297258A (ja) 1994-04-26 1994-04-26 板状体の搬送装置

Publications (1)

Publication Number Publication Date
TW280937B true TW280937B (oth) 1996-07-11

Family

ID=14535342

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084104495A TW280937B (oth) 1994-04-26 1995-05-05

Country Status (4)

Country Link
US (2) US5803932A (oth)
JP (1) JPH07297258A (oth)
KR (1) KR100300614B1 (oth)
TW (1) TW280937B (oth)

Families Citing this family (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6091498A (en) * 1996-07-15 2000-07-18 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6645355B2 (en) 1996-07-15 2003-11-11 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
JP3774283B2 (ja) * 1996-11-19 2006-05-10 東京エレクトロン株式会社 処理システム
JP3370537B2 (ja) * 1997-01-07 2003-01-27 東京エレクトロン株式会社 制御装置及び処理装置
JPH10326729A (ja) * 1997-05-26 1998-12-08 Toshiba Corp 製造システム
JPH118170A (ja) * 1997-06-13 1999-01-12 Canon Inc 半導体処理システムおよびデバイス製造方法
JP3340945B2 (ja) 1997-08-06 2002-11-05 東京エレクトロン株式会社 塗布現像処理装置
JP3774836B2 (ja) * 1997-10-03 2006-05-17 沖電気工業株式会社 ロットの搬送システム及びロットの搬送方法
JPH11126743A (ja) * 1997-10-24 1999-05-11 Tokyo Electron Ltd 処理装置
KR19980042582A (ko) * 1997-11-19 1998-08-17 히가시데쓰로 처리시스템
DE19910478C2 (de) 1998-03-12 2002-02-28 Tokyo Electron Ltd Substrattransportverfahren und Substratbearbeitungssystem
US6035245A (en) * 1998-03-24 2000-03-07 Advanced Micro Devices, Inc. Automated material handling system method and arrangement
US6203617B1 (en) * 1998-03-26 2001-03-20 Tokyo Electron Limited Conveying unit and substrate processing unit
JP3661138B2 (ja) * 1998-04-04 2005-06-15 東京エレクトロン株式会社 アライメント高速処理機構
US6336204B1 (en) * 1998-05-07 2002-01-01 Applied Materials, Inc. Method and apparatus for handling deadlocks in multiple chamber cluster tools
TW410415B (en) * 1998-05-15 2000-11-01 Tokyo Electron Ltd Substrate carrying equipment and substrate processing equipment
TW484184B (en) * 1998-11-06 2002-04-21 Canon Kk Sample separating apparatus and method, and substrate manufacturing method
US6672358B2 (en) * 1998-11-06 2004-01-06 Canon Kabushiki Kaisha Sample processing system
JP2000150611A (ja) * 1998-11-06 2000-05-30 Canon Inc 試料の処理システム
JP4365914B2 (ja) * 1998-11-25 2009-11-18 キヤノン株式会社 半導体製造装置およびデバイス製造方法
KR100309919B1 (ko) * 1998-11-26 2002-10-25 삼성전자 주식회사 작업대상물의절단및분류자동화시스템과그제어방법
US6616394B1 (en) 1998-12-30 2003-09-09 Silicon Valley Group Apparatus for processing wafers
US6418356B1 (en) 1998-12-31 2002-07-09 Silicon Valley Group, Inc. Method and apparatus for resolving conflicts in a substrate processing system
US6768930B2 (en) 1998-12-31 2004-07-27 Asml Holding N.V. Method and apparatus for resolving conflicts in a substrate processing system
US6678572B1 (en) * 1998-12-31 2004-01-13 Asml Holdings, N.V. Recipe cascading in a wafer processing system
US6865437B1 (en) * 1998-12-31 2005-03-08 Asml Holdings N.V. Robot pre-positioning in a wafer processing system
JP2000223386A (ja) * 1999-02-02 2000-08-11 Mitsubishi Electric Corp 半導体製造システムおよび当該システムで用いられる半導体製造システム制御装置
JP2000252178A (ja) * 1999-03-02 2000-09-14 Nec Corp 半導体装置製造ラインの生産制御方法及び装置
JP3851751B2 (ja) 1999-03-24 2006-11-29 東京エレクトロン株式会社 処理システム
US6317643B1 (en) * 1999-03-31 2001-11-13 Agere Systems Guardian Corp. Manufacturing and engineering data base
JP4021118B2 (ja) * 1999-04-28 2007-12-12 東京エレクトロン株式会社 基板処理装置
DE19921246C2 (de) * 1999-05-07 2003-06-12 Infineon Technologies Ag Anlage zur Fertigung von Halbleiterprodukten
DE19921245C2 (de) 1999-05-07 2003-04-30 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
JP4302817B2 (ja) * 1999-05-13 2009-07-29 東京エレクトロン株式会社 真空処理システム
DE19922936B4 (de) 1999-05-19 2004-04-29 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
US6338582B1 (en) 1999-06-30 2002-01-15 Tokyo Electron Limited Substrate delivery apparatus and coating and developing processing system
DE19935320A1 (de) * 1999-07-28 2001-02-08 Schneider Automation Gmbh Verfahren zur Überwachung eines Werkstückes während eines Transport- und/oder Fertigungsprozesses
US6632281B2 (en) * 2000-02-01 2003-10-14 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
KR100500230B1 (ko) * 2000-07-26 2005-07-11 삼성전자주식회사 무인운반 시스템 및 그 제어방법
JP3825232B2 (ja) * 2000-07-28 2006-09-27 株式会社 Ｓｅｎ−Ｓｈｉ・アクセリス カンパニー ウエハ搬送システム及びその搬送方法
JP4180787B2 (ja) * 2000-12-27 2008-11-12 東京エレクトロン株式会社 基板処理装置および基板処理方法
TW533460B (en) * 2001-03-09 2003-05-21 Tokyo Electron Ltd Processing apparatus
JP2003031639A (ja) * 2001-07-17 2003-01-31 Canon Inc 基板処理装置、基板の搬送方法及び露光装置
JP2003045947A (ja) * 2001-07-27 2003-02-14 Canon Inc 基板処理装置及び露光装置
US6768538B2 (en) * 2001-11-02 2004-07-27 Taiwan Semiconductor Manufacturing Co., Ltd Photolithography system to increase overlay accuracy
JP3911624B2 (ja) * 2001-11-30 2007-05-09 東京エレクトロン株式会社 処理システム
JP3916473B2 (ja) * 2002-01-31 2007-05-16 東京エレクトロン株式会社 基板処理装置および基板処理方法
KR100974141B1 (ko) * 2002-11-28 2010-08-04 도쿄엘렉트론가부시키가이샤 기판 처리 장치
JP4170864B2 (ja) * 2003-02-03 2008-10-22 大日本スクリーン製造株式会社 基板処理装置および基板処理装置における基板搬送方法および基板処理方法
JP4449319B2 (ja) * 2003-03-25 2010-04-14 株式会社デンソー 製造管理方法
JP4378114B2 (ja) * 2003-06-18 2009-12-02 東京エレクトロン株式会社 処理システム
JP4215677B2 (ja) * 2003-08-25 2009-01-28 日立ビアメカニクス株式会社 レーザ加工機及びレーザ加工方法
JP4080405B2 (ja) * 2003-09-22 2008-04-23 大日本スクリーン製造株式会社 基板処理装置
JP4719435B2 (ja) * 2004-07-26 2011-07-06 株式会社日立国際電気 半導体製造装置、半導体基板の移載方法及び半導体製造方法
US7212878B2 (en) * 2004-08-27 2007-05-01 Tokyo Electron Limited Wafer-to-wafer control using virtual modules
US7451011B2 (en) * 2004-08-27 2008-11-11 Tokyo Electron Limited Process control using physical modules and virtual modules
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7371022B2 (en) 2004-12-22 2008-05-13 Sokudo Co., Ltd. Developer endpoint detection in a track lithography system
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
JP4444154B2 (ja) * 2005-05-02 2010-03-31 大日本スクリーン製造株式会社 基板処理装置
US7571019B2 (en) * 2005-12-30 2009-08-04 Intel Corporation Integrated configuration, flow and execution system for semiconductor device experimental flows and production flows
US7633601B2 (en) * 2006-03-14 2009-12-15 United Microelectronics Corp. Method and related operation system for immersion lithography
JP4969138B2 (ja) * 2006-04-17 2012-07-04 大日本スクリーン製造株式会社 基板処理装置
US7679714B2 (en) * 2006-10-12 2010-03-16 Asml Netherlands B.V. Lithographic apparatus, combination of lithographic apparatus and processing module, and device manufacturing method
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
EP1965381B1 (en) * 2007-03-02 2010-08-04 Singulus Mastering B.V. Control Method for Integrated Mastering System
WO2008120307A1 (ja) * 2007-03-28 2008-10-09 Showa Shell Sekiyu K.K. Ｃｉｓ系薄膜太陽電池サブモジュールの製造システム
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5148944B2 (ja) * 2007-08-14 2013-02-20 大日本スクリーン製造株式会社 基板処理システム
JP2009087138A (ja) * 2007-10-01 2009-04-23 Elpida Memory Inc 搬送システム、搬送車管理装置、および搬送制御方法
JP4828503B2 (ja) * 2007-10-16 2011-11-30 東京エレクトロン株式会社 基板処理装置、基板搬送方法、コンピュータプログラムおよび記憶媒体
JP5318403B2 (ja) 2007-11-30 2013-10-16 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) * 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
KR100892756B1 (ko) * 2007-12-27 2009-04-15 세메스 주식회사 기판 처리 장치 및 이를 이용한 기판 이송 방법
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) * 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
KR101488649B1 (ko) * 2008-10-07 2015-02-04 가와사키 쥬코교 가부시키가이샤 기판 반송 로봇 및 시스템
JP5309324B2 (ja) * 2008-10-07 2013-10-09 川崎重工業株式会社 基板搬送システム
US8313974B2 (en) 2009-03-09 2012-11-20 Sharp Kabushiki Kaisha Substrate transport method
JP5392190B2 (ja) * 2010-06-01 2014-01-22 東京エレクトロン株式会社 基板処理システム及び基板処理方法
KR101923531B1 (ko) * 2011-12-23 2018-11-30 삼성전자주식회사 반도체 칩 본딩 장치
JP6003859B2 (ja) * 2013-09-18 2016-10-05 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP2015076433A (ja) * 2013-10-07 2015-04-20 東京エレクトロン株式会社 基板搬送方法
US9595343B1 (en) 2016-06-05 2017-03-14 Apple Inc. Early prediction of failure in programming a nonvolatile memory
JP7050735B2 (ja) * 2019-10-02 2022-04-08 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法
JP7378318B2 (ja) * 2020-02-28 2023-11-13 東京エレクトロン株式会社 部品交換方法
JP2022040720A (ja) * 2020-08-31 2022-03-11 株式会社ディスコ 加工装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219925A (ja) * 1983-05-30 1984-12-11 Nec Corp Ｐｒインライン装置
US5166884A (en) * 1984-12-24 1992-11-24 Asyst Technologies, Inc. Intelligent system for processing and storing articles
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
JPS63157870A (ja) * 1986-12-19 1988-06-30 Anelva Corp 基板処理装置
US4974166A (en) * 1987-05-18 1990-11-27 Asyst Technologies, Inc. Processing systems with intelligent article tracking
JP2519096B2 (ja) * 1988-02-12 1996-07-31 東京エレクトロン株式会社 処理装置及びレジスト処理装置及び処理方法及びレジスト処理方法
KR970003907B1 (ko) * 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 기판처리 장치 및 기판처리 방법
JPH0628278B2 (ja) * 1988-06-17 1994-04-13 大日本スクリーン製造株式会社 基板搬送用エレベータ
US4923584A (en) * 1988-10-31 1990-05-08 Eaton Corporation Sealing apparatus for a vacuum processing system
EP0408216A3 (en) * 1989-07-11 1991-09-18 Hitachi, Ltd. Method for processing wafers and producing semiconductor devices and apparatus for producing the same
US5310410A (en) * 1990-04-06 1994-05-10 Sputtered Films, Inc. Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus
US5067218A (en) * 1990-05-21 1991-11-26 Motorola, Inc. Vacuum wafer transport and processing system and method using a plurality of wafer transport arms
US5297910A (en) * 1991-02-15 1994-03-29 Tokyo Electron Limited Transportation-transfer device for an object of treatment
JPH0529438A (ja) * 1991-10-21 1993-02-05 Tokyo Electron Ltd 処理装置
JPH0529437A (ja) * 1991-10-21 1993-02-05 Tokyo Electron Ltd 処理装置
JPH0529436A (ja) * 1991-10-21 1993-02-05 Tokyo Electron Ltd 処理方法及び処理装置
JPH0590387A (ja) * 1991-10-21 1993-04-09 Tokyo Electron Ltd 処理装置
JP2931820B2 (ja) * 1991-11-05 1999-08-09 東京エレクトロン株式会社 板状体の処理装置及び搬送装置
US5442561A (en) * 1992-05-12 1995-08-15 Nippon Telegraph And Telephone Corporation Production management system and its application method
KR100242530B1 (ko) * 1993-05-18 2000-02-01 히가시 데쓰로 필터장치
US5565034A (en) * 1993-10-29 1996-10-15 Tokyo Electron Limited Apparatus for processing substrates having a film formed on a surface of the substrate

Also Published As

Publication number Publication date
US5803932A (en) 1998-09-08
KR950034476A (ko) 1995-12-28
JPH07297258A (ja) 1995-11-10
KR100300614B1 (ko) 2001-11-30
US5980591A (en) 1999-11-09

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