TW280937B - - Google Patents
Info
- Publication number
- TW280937B TW280937B TW084104495A TW84104495A TW280937B TW 280937 B TW280937 B TW 280937B TW 084104495 A TW084104495 A TW 084104495A TW 84104495 A TW84104495 A TW 84104495A TW 280937 B TW280937 B TW 280937B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6110421A JPH07297258A (ja) | 1994-04-26 | 1994-04-26 | 板状体の搬送装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW280937B true TW280937B (US20110009641A1-20110113-C00116.png) | 1996-07-11 |
Family
ID=14535342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084104495A TW280937B (US20110009641A1-20110113-C00116.png) | 1994-04-26 | 1995-05-05 |
Country Status (4)
Families Citing this family (90)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6091498A (en) * | 1996-07-15 | 2000-07-18 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| US6645355B2 (en) | 1996-07-15 | 2003-11-11 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| JP3774283B2 (ja) | 1996-11-19 | 2006-05-10 | 東京エレクトロン株式会社 | 処理システム |
| JP3370537B2 (ja) * | 1997-01-07 | 2003-01-27 | 東京エレクトロン株式会社 | 制御装置及び処理装置 |
| JPH10326729A (ja) * | 1997-05-26 | 1998-12-08 | Toshiba Corp | 製造システム |
| JPH118170A (ja) * | 1997-06-13 | 1999-01-12 | Canon Inc | 半導体処理システムおよびデバイス製造方法 |
| JP3340945B2 (ja) * | 1997-08-06 | 2002-11-05 | 東京エレクトロン株式会社 | 塗布現像処理装置 |
| JP3774836B2 (ja) * | 1997-10-03 | 2006-05-17 | 沖電気工業株式会社 | ロットの搬送システム及びロットの搬送方法 |
| JPH11126743A (ja) * | 1997-10-24 | 1999-05-11 | Tokyo Electron Ltd | 処理装置 |
| KR19980042582A (ko) * | 1997-11-19 | 1998-08-17 | 히가시데쓰로 | 처리시스템 |
| DE19910478C2 (de) * | 1998-03-12 | 2002-02-28 | Tokyo Electron Ltd | Substrattransportverfahren und Substratbearbeitungssystem |
| US6035245A (en) * | 1998-03-24 | 2000-03-07 | Advanced Micro Devices, Inc. | Automated material handling system method and arrangement |
| US6203617B1 (en) * | 1998-03-26 | 2001-03-20 | Tokyo Electron Limited | Conveying unit and substrate processing unit |
| JP3661138B2 (ja) * | 1998-04-04 | 2005-06-15 | 東京エレクトロン株式会社 | アライメント高速処理機構 |
| US6336204B1 (en) * | 1998-05-07 | 2002-01-01 | Applied Materials, Inc. | Method and apparatus for handling deadlocks in multiple chamber cluster tools |
| TW410415B (en) * | 1998-05-15 | 2000-11-01 | Tokyo Electron Ltd | Substrate carrying equipment and substrate processing equipment |
| TW484184B (en) * | 1998-11-06 | 2002-04-21 | Canon Kk | Sample separating apparatus and method, and substrate manufacturing method |
| US6672358B2 (en) * | 1998-11-06 | 2004-01-06 | Canon Kabushiki Kaisha | Sample processing system |
| JP2000150611A (ja) * | 1998-11-06 | 2000-05-30 | Canon Inc | 試料の処理システム |
| JP4365914B2 (ja) * | 1998-11-25 | 2009-11-18 | キヤノン株式会社 | 半導体製造装置およびデバイス製造方法 |
| KR100309919B1 (ko) * | 1998-11-26 | 2002-10-25 | 삼성전자 주식회사 | 작업대상물의절단및분류자동화시스템과그제어방법 |
| US6616394B1 (en) | 1998-12-30 | 2003-09-09 | Silicon Valley Group | Apparatus for processing wafers |
| US6418356B1 (en) | 1998-12-31 | 2002-07-09 | Silicon Valley Group, Inc. | Method and apparatus for resolving conflicts in a substrate processing system |
| US6768930B2 (en) | 1998-12-31 | 2004-07-27 | Asml Holding N.V. | Method and apparatus for resolving conflicts in a substrate processing system |
| US6865437B1 (en) * | 1998-12-31 | 2005-03-08 | Asml Holdings N.V. | Robot pre-positioning in a wafer processing system |
| US6678572B1 (en) * | 1998-12-31 | 2004-01-13 | Asml Holdings, N.V. | Recipe cascading in a wafer processing system |
| JP2000223386A (ja) * | 1999-02-02 | 2000-08-11 | Mitsubishi Electric Corp | 半導体製造システムおよび当該システムで用いられる半導体製造システム制御装置 |
| JP2000252178A (ja) * | 1999-03-02 | 2000-09-14 | Nec Corp | 半導体装置製造ラインの生産制御方法及び装置 |
| JP3851751B2 (ja) | 1999-03-24 | 2006-11-29 | 東京エレクトロン株式会社 | 処理システム |
| US6317643B1 (en) * | 1999-03-31 | 2001-11-13 | Agere Systems Guardian Corp. | Manufacturing and engineering data base |
| JP4021118B2 (ja) * | 1999-04-28 | 2007-12-12 | 東京エレクトロン株式会社 | 基板処理装置 |
| DE19921246C2 (de) * | 1999-05-07 | 2003-06-12 | Infineon Technologies Ag | Anlage zur Fertigung von Halbleiterprodukten |
| DE19921245C2 (de) | 1999-05-07 | 2003-04-30 | Infineon Technologies Ag | Anlage zur Bearbeitung von Wafern |
| JP4302817B2 (ja) * | 1999-05-13 | 2009-07-29 | 東京エレクトロン株式会社 | 真空処理システム |
| DE19922936B4 (de) | 1999-05-19 | 2004-04-29 | Infineon Technologies Ag | Anlage zur Bearbeitung von Wafern |
| KR100557027B1 (ko) | 1999-06-30 | 2006-03-03 | 동경 엘렉트론 주식회사 | 기판전달장치 및 도포현상 처리시스템 |
| DE19935320A1 (de) * | 1999-07-28 | 2001-02-08 | Schneider Automation Gmbh | Verfahren zur Überwachung eines Werkstückes während eines Transport- und/oder Fertigungsprozesses |
| TW511169B (en) * | 2000-02-01 | 2002-11-21 | Tokyo Electron Ltd | Substrate processing apparatus and substrate processing method |
| KR100500230B1 (ko) * | 2000-07-26 | 2005-07-11 | 삼성전자주식회사 | 무인운반 시스템 및 그 제어방법 |
| JP3825232B2 (ja) * | 2000-07-28 | 2006-09-27 | 株式会社 Ｓｅｎ−Ｓｈｉ・アクセリス カンパニー | ウエハ搬送システム及びその搬送方法 |
| JP4180787B2 (ja) * | 2000-12-27 | 2008-11-12 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| TW533460B (en) * | 2001-03-09 | 2003-05-21 | Tokyo Electron Ltd | Processing apparatus |
| JP2003031639A (ja) * | 2001-07-17 | 2003-01-31 | Canon Inc | 基板処理装置、基板の搬送方法及び露光装置 |
| JP2003045947A (ja) * | 2001-07-27 | 2003-02-14 | Canon Inc | 基板処理装置及び露光装置 |
| US6768538B2 (en) * | 2001-11-02 | 2004-07-27 | Taiwan Semiconductor Manufacturing Co., Ltd | Photolithography system to increase overlay accuracy |
| JP3911624B2 (ja) * | 2001-11-30 | 2007-05-09 | 東京エレクトロン株式会社 | 処理システム |
| JP3916473B2 (ja) * | 2002-01-31 | 2007-05-16 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| KR100974141B1 (ko) * | 2002-11-28 | 2010-08-04 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 |
| JP4170864B2 (ja) * | 2003-02-03 | 2008-10-22 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理装置における基板搬送方法および基板処理方法 |
| JP4449319B2 (ja) * | 2003-03-25 | 2010-04-14 | 株式会社デンソー | 製造管理方法 |
| JP4378114B2 (ja) * | 2003-06-18 | 2009-12-02 | 東京エレクトロン株式会社 | 処理システム |
| JP4215677B2 (ja) * | 2003-08-25 | 2009-01-28 | 日立ビアメカニクス株式会社 | レーザ加工機及びレーザ加工方法 |
| JP4080405B2 (ja) * | 2003-09-22 | 2008-04-23 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP4719435B2 (ja) * | 2004-07-26 | 2011-07-06 | 株式会社日立国際電気 | 半導体製造装置、半導体基板の移載方法及び半導体製造方法 |
| US7451011B2 (en) * | 2004-08-27 | 2008-11-11 | Tokyo Electron Limited | Process control using physical modules and virtual modules |
| US7212878B2 (en) * | 2004-08-27 | 2007-05-01 | Tokyo Electron Limited | Wafer-to-wafer control using virtual modules |
| US7699021B2 (en) | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
| US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
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| US7255747B2 (en) | 2004-12-22 | 2007-08-14 | Sokudo Co., Ltd. | Coat/develop module with independent stations |
| US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
| JP4444154B2 (ja) * | 2005-05-02 | 2010-03-31 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| US7571019B2 (en) * | 2005-12-30 | 2009-08-04 | Intel Corporation | Integrated configuration, flow and execution system for semiconductor device experimental flows and production flows |
| US7633601B2 (en) * | 2006-03-14 | 2009-12-15 | United Microelectronics Corp. | Method and related operation system for immersion lithography |
| JP4969138B2 (ja) * | 2006-04-17 | 2012-07-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| US7679714B2 (en) * | 2006-10-12 | 2010-03-16 | Asml Netherlands B.V. | Lithographic apparatus, combination of lithographic apparatus and processing module, and device manufacturing method |
| US7694688B2 (en) | 2007-01-05 | 2010-04-13 | Applied Materials, Inc. | Wet clean system design |
| US7950407B2 (en) * | 2007-02-07 | 2011-05-31 | Applied Materials, Inc. | Apparatus for rapid filling of a processing volume |
| DE602007008197D1 (de) * | 2007-03-02 | 2010-09-16 | Singulus Mastering B V | Steuerungsverfahren für ein integrales Mastering-System |
| WO2008120307A1 (ja) * | 2007-03-28 | 2008-10-09 | Showa Shell Sekiyu K.K. | Ｃｉｓ系薄膜太陽電池サブモジュールの製造システム |
| JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP5148944B2 (ja) * | 2007-08-14 | 2013-02-20 | 大日本スクリーン製造株式会社 | 基板処理システム |
| JP2009087138A (ja) * | 2007-10-01 | 2009-04-23 | Elpida Memory Inc | 搬送システム、搬送車管理装置、および搬送制御方法 |
| JP4828503B2 (ja) * | 2007-10-16 | 2011-11-30 | 東京エレクトロン株式会社 | 基板処理装置、基板搬送方法、コンピュータプログラムおよび記憶媒体 |
| JP5318403B2 (ja) | 2007-11-30 | 2013-10-16 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP5128918B2 (ja) | 2007-11-30 | 2013-01-23 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| KR100892756B1 (ko) * | 2007-12-27 | 2009-04-15 | 세메스 주식회사 | 기판 처리 장치 및 이를 이용한 기판 이송 방법 |
| JP5179170B2 (ja) * | 2007-12-28 | 2013-04-10 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP5001828B2 (ja) * | 2007-12-28 | 2012-08-15 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| ES2498742T3 (es) * | 2008-10-07 | 2014-09-25 | Kawasaki Jukogyo Kabushiki Kaisha | Robot y sistema de transferencia de sustrato |
| JP5309324B2 (ja) * | 2008-10-07 | 2013-10-09 | 川崎重工業株式会社 | 基板搬送システム |
| WO2010103958A1 (ja) * | 2009-03-09 | 2010-09-16 | シャープ株式会社 | 基板搬送方法 |
| JP5392190B2 (ja) * | 2010-06-01 | 2014-01-22 | 東京エレクトロン株式会社 | 基板処理システム及び基板処理方法 |
| KR101923531B1 (ko) | 2011-12-23 | 2018-11-30 | 삼성전자주식회사 | 반도체 칩 본딩 장치 |
| JP6003859B2 (ja) * | 2013-09-18 | 2016-10-05 | 東京エレクトロン株式会社 | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
| JP2015076433A (ja) * | 2013-10-07 | 2015-04-20 | 東京エレクトロン株式会社 | 基板搬送方法 |
| US9595343B1 (en) | 2016-06-05 | 2017-03-14 | Apple Inc. | Early prediction of failure in programming a nonvolatile memory |
| JP7050735B2 (ja) * | 2019-10-02 | 2022-04-08 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布、現像方法 |
| JP7378318B2 (ja) * | 2020-02-28 | 2023-11-13 | 東京エレクトロン株式会社 | 部品交換方法 |
| JP2022040720A (ja) * | 2020-08-31 | 2022-03-11 | 株式会社ディスコ | 加工装置 |
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| JPS59219925A (ja) * | 1983-05-30 | 1984-12-11 | Nec Corp | Ｐｒインライン装置 |
| US5166884A (en) * | 1984-12-24 | 1992-11-24 | Asyst Technologies, Inc. | Intelligent system for processing and storing articles |
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| JPS63157870A (ja) * | 1986-12-19 | 1988-06-30 | Anelva Corp | 基板処理装置 |
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| JP2519096B2 (ja) * | 1988-02-12 | 1996-07-31 | 東京エレクトロン株式会社 | 処理装置及びレジスト処理装置及び処理方法及びレジスト処理方法 |
| KR970003907B1 (ko) * | 1988-02-12 | 1997-03-22 | 도오교오 에레구토론 가부시끼 가이샤 | 기판처리 장치 및 기판처리 방법 |
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| JPH0590387A (ja) * | 1991-10-21 | 1993-04-09 | Tokyo Electron Ltd | 処理装置 |
| JPH0529437A (ja) * | 1991-10-21 | 1993-02-05 | Tokyo Electron Ltd | 処理装置 |
| JP2931820B2 (ja) * | 1991-11-05 | 1999-08-09 | 東京エレクトロン株式会社 | 板状体の処理装置及び搬送装置 |
| US5442561A (en) * | 1992-05-12 | 1995-08-15 | Nippon Telegraph And Telephone Corporation | Production management system and its application method |
| KR100242530B1 (ko) * | 1993-05-18 | 2000-02-01 | 히가시 데쓰로 | 필터장치 |
| US5565034A (en) * | 1993-10-29 | 1996-10-15 | Tokyo Electron Limited | Apparatus for processing substrates having a film formed on a surface of the substrate |
-
1994
- 1994-04-26 JP JP6110421A patent/JPH07297258A/ja active Pending
-
1995
- 1995-04-26 KR KR1019950009914A patent/KR100300614B1/ko not_active IP Right Cessation
- 1995-04-26 US US08/427,871 patent/US5803932A/en not_active Expired - Lifetime
- 1995-05-05 TW TW084104495A patent/TW280937B/zh not_active IP Right Cessation
-
1997
- 1997-08-22 US US08/916,441 patent/US5980591A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US5803932A (en) | 1998-09-08 |
| KR100300614B1 (ko) | 2001-11-30 |
| US5980591A (en) | 1999-11-09 |
| JPH07297258A (ja) | 1995-11-10 |
| KR950034476A (ko) | 1995-12-28 |
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| MK4A | Expiration of patent term of an invention patent |