TW201639525A - 使用適形電子器件之活體高速、高解析度電生理學 - Google Patents

使用適形電子器件之活體高速、高解析度電生理學 Download PDF

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Publication number
TW201639525A
TW201639525A TW105106567A TW105106567A TW201639525A TW 201639525 A TW201639525 A TW 201639525A TW 105106567 A TW105106567 A TW 105106567A TW 105106567 A TW105106567 A TW 105106567A TW 201639525 A TW201639525 A TW 201639525A
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Taiwan
Prior art keywords
tissue
flexible
stretchable
array
layer
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TW105106567A
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English (en)
Chinese (zh)
Inventor
約翰Ａ 羅傑斯
金大亨
布萊恩 利特
強納森 維凡提
約書亞Ｄ 摩斯
大衛Ｊ 科蘭斯
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美國伊利諾大學理事會
賓夕法尼亞大學董事會
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Publication of TW201639525A publication Critical patent/TW201639525A/zh

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/07—Endoradiosondes
    • A61B5/076—Permanent implantation
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
    • A61B5/28—Bioelectric electrodes therefor specially adapted for particular uses for electrocardiography [ECG]
    • A61B5/283—Invasive
    • A61B5/287—Holders for multiple electrodes, e.g. electrode catheters for electrophysiological study [EPS]
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6846—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive
    • A61B5/6867—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive specially adapted to be attached or implanted in a specific body part
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/02—Details
    • A61N1/04—Electrodes
    • A61N1/0404—Electrodes for external use
    • A61N1/0472—Structure-related aspects
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/02—Details
    • A61N1/04—Electrodes
    • A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00—Radiation therapy
    • A61N5/06—Radiation therapy using light
    • A61N5/0613—Apparatus adapted for a specific treatment
    • A61N5/0622—Optical stimulation for exciting neural tissue
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/147—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being multilayered
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/02—Details of sensors specially adapted for in-vivo measurements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/06—Arrangements of multiple sensors of different types
    • A61B2562/066—Arrangements of multiple sensors of different types in a matrix array
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/16—Details of sensor housings or probes; Details of structural supports for sensors
    • A61B2562/164—Details of sensor housings or probes; Details of structural supports for sensors the sensor is mounted in or on a conformable substrate or carrier
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/02—Details
    • A61N1/04—Electrodes
    • A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
    • A61N1/0587—Epicardial electrode systems; Endocardial electrodes piercing the pericardium
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/36002—Cancer treatment, e.g. tumour
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00—Radiation therapy
    • A61N5/06—Radiation therapy using light
    • A61N2005/065—Light sources therefor
    • A61N2005/0651—Diodes
    • A61N2005/0652—Arrays of diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7426—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/077—Connecting of TAB connectors
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Animal Behavior & Ethology (AREA)
  • Veterinary Medicine (AREA)
  • Public Health (AREA)
  • General Health & Medical Sciences (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Biophysics (AREA)
  • Pathology (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Physics & Mathematics (AREA)
  • Medical Informatics (AREA)
  • Radiology & Medical Imaging (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Cardiology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physiology (AREA)
  • Neurosurgery (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
  • Measuring And Recording Apparatus For Diagnosis (AREA)
  • Electrotherapy Devices (AREA)
  • Surgical Instruments (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Thin Film Transistor (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Medicinal Preparation (AREA)
TW105106567A 2009-12-16 2010-12-16 使用適形電子器件之活體高速、高解析度電生理學 TW201639525A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US28692109P 2009-12-16 2009-12-16
US31339710P 2010-03-12 2010-03-12
US38852910P 2010-09-30 2010-09-30
PCT/US2010/060425 WO2011084450A1 (en) 2009-12-16 2010-12-15 Electrophysiology in-vivo using conformal electronics
US12/968,637 US10918298B2 (en) 2009-12-16 2010-12-15 High-speed, high-resolution electrophysiology in-vivo using conformal electronics

Publications (1)

Publication Number Publication Date
TW201639525A true TW201639525A (zh) 2016-11-16

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ID=44305696

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105106567A TW201639525A (zh) 2009-12-16 2010-12-16 使用適形電子器件之活體高速、高解析度電生理學
TW099144263A TWI535417B (zh) 2009-12-16 2010-12-16 使用適形電子器件之活體高速、高解析度電生理學

Family Applications After (1)

Application Number Title Priority Date Filing Date
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Country Status (5)

Country Link
US (1) US10918298B2 (https=)
EP (1) EP2513953B1 (https=)
JP (3) JP6046491B2 (https=)
TW (2) TW201639525A (https=)
WO (1) WO2011084450A1 (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI644698B (zh) * 2017-03-20 2018-12-21 德瑪凱股份有限公司 Automatic external cardiac shock defibrillator capable of stabilizing output energy and method for stabilizing output energy of automatic external cardiac shock defibrillator
TWI671972B (zh) * 2018-12-26 2019-09-11 National Chiao Tung University 無線充電裝置
CN111001084A (zh) * 2018-10-04 2020-04-14 株式会社村田制作所 可实施半导体器件及用于制造该可实施半导体器件的方法
TWI733304B (zh) * 2019-08-02 2021-07-11 華廣生技股份有限公司 一種用於承載感測器之容器及其容器操作方法
CN115429281A (zh) * 2022-08-25 2022-12-06 中国科学院苏州生物医学工程技术研究所 一种生理化岛连柔性传感器及其制作方法
TWI869673B (zh) * 2021-12-29 2025-01-11 群創光電股份有限公司 電子裝置
US12575761B2 (en) 2019-08-02 2026-03-17 Bionime Corporation Container for carrying sensor and operating method thereof

Families Citing this family (223)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102683391B (zh) 2004-06-04 2015-11-18 伊利诺伊大学评议会 用于制造并组装可印刷半导体元件的方法和设备
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
KR101430587B1 (ko) 2006-09-20 2014-08-14 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들
KR101519038B1 (ko) 2007-01-17 2015-05-11 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 프린팅­기반 어셈블리에 의해 제조되는 광학 시스템
US9521955B2 (en) * 2007-05-03 2016-12-20 Cornell Research Foundtion, Inc. Subdural electro-optical sensor
CN103872002B (zh) 2008-03-05 2017-03-01 伊利诺伊大学评议会 可拉伸和可折叠的电子器件
WO2010036807A1 (en) * 2008-09-24 2010-04-01 The Board Of Trustees Of The University Of Illinois Arrays of ultrathin silicon solar microcells
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
US9119533B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US9289132B2 (en) 2008-10-07 2016-03-22 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
TWI592996B (zh) 2009-05-12 2017-07-21 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
US9723122B2 (en) 2009-10-01 2017-08-01 Mc10, Inc. Protective cases with integrated electronics
US10918298B2 (en) 2009-12-16 2021-02-16 The Board Of Trustees Of The University Of Illinois High-speed, high-resolution electrophysiology in-vivo using conformal electronics
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US8666471B2 (en) 2010-03-17 2014-03-04 The Board Of Trustees Of The University Of Illinois Implantable biomedical devices on bioresorbable substrates
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
US9029168B2 (en) * 2010-06-28 2015-05-12 The Trustees Of Princeton University Use and making of biosensors utilizing antimicrobial peptides for highly sensitive biological monitoring
US9442285B2 (en) 2011-01-14 2016-09-13 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
EP2681538B1 (en) 2011-03-11 2019-03-06 Mc10, Inc. Integrated devices to facilitate quantitative assays and diagnostics
US9180307B2 (en) * 2011-03-15 2015-11-10 St. Jude Medical, Atrial Fibrillation Division, Inc. Method of reducing the occurrence of arrhythmias via photobiomodulation and apparatus for same
US8907560B2 (en) * 2011-05-12 2014-12-09 Universal Display Corporation Dynamic OLED lighting
WO2012158709A1 (en) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Thermally managed led arrays assembled by printing
US9159635B2 (en) 2011-05-27 2015-10-13 Mc10, Inc. Flexible electronic structure
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
US9757050B2 (en) 2011-08-05 2017-09-12 Mc10, Inc. Catheter balloon employing force sensing elements
WO2013022853A1 (en) 2011-08-05 2013-02-14 Mc10, Inc. Catheter balloon methods and apparatus employing sensing elements
EP3470830A1 (en) 2011-09-01 2019-04-17 MC10 Inc. Electronics for detection of a condition of tissue
US9192757B2 (en) 2011-09-14 2015-11-24 Greatbatch Ltd. Methods for forming an electrode device with reduced impedance
WO2013052919A2 (en) 2011-10-05 2013-04-11 Mc10, Inc. Cardiac catheter employing conformal electronics for mapping
FR2982028B1 (fr) * 2011-10-26 2020-02-21 Aryballe Technologies Puce microstructuree comprenant des surfaces convexes pour analyse par resonance des plasmons de surface, dispositif d'analyse contenant ladite puce microstructuree et utilisation dudit dispositif
FR2982027B1 (fr) * 2011-10-26 2014-01-03 Thibaut Mercey Puce microstructuree pour analyse par resonance des plasmons de surface, dispositif d'analyse comprenant ladite puce microstructuree et utilisation dudit dispositif
CN108389893A (zh) 2011-12-01 2018-08-10 伊利诺伊大学评议会 经设计以经历可编程转变的瞬态器件
US9649064B2 (en) 2012-01-26 2017-05-16 Autonomix Medical, Inc. Controlled sympathectomy and micro-ablation systems and methods
CA3151885C (en) 2012-01-26 2024-10-22 Autonomix Medical, Inc. CONTROLLED SYMPATHECTOMY AND MICRO-ABLATION SYSTEMS AND METHODS
EP2830492B1 (en) 2012-03-30 2021-05-19 The Board of Trustees of the University of Illinois Appendage mountable electronic devices conformable to surfaces and method of making the same
EP2852339B1 (en) 2012-05-29 2020-12-23 Autonomix Medical, Inc. Endoscopic sympathectomy systems
US9247637B2 (en) 2012-06-11 2016-01-26 Mc10, Inc. Strain relief structures for stretchable interconnects
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
DE102012105306A1 (de) * 2012-06-19 2013-12-19 Capical Gmbh EKG-Handgerät
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
KR20150031324A (ko) 2012-07-05 2015-03-23 엠씨10, 인크 유동 감지를 포함하는 카테터 장치
US10310294B2 (en) * 2012-07-24 2019-06-04 Johnson & Johnson Vision Care, Inc. Thinned and flexible semiconductor elements on three dimensional surfaces
US11737896B2 (en) 2012-07-31 2023-08-29 Purdue Research Foundation Wirelessly-powered implantable EMG recording system
CN104684469B (zh) * 2012-10-02 2016-12-07 独立行政法人科学技术振兴机构 信号检测装置以及信号检测方法
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
KR20150072415A (ko) 2012-10-09 2015-06-29 엠씨10, 인크 의류에 집적되는 컨포멀 전자기기
WO2014070999A2 (en) 2012-11-05 2014-05-08 Landy Toth Systems, methods, and devices for monitoring and treatment of tissues within and/or through a lumen wall
US10194840B2 (en) 2012-12-06 2019-02-05 Medtronic Minimed, Inc. Microarray electrodes useful with analyte sensors and methods for making and using them
US10674963B2 (en) 2012-12-09 2020-06-09 Autonomix Medical, Inc. Systems and methods for regulating organ and/or tumor growth rates, function, and/or development
US10497633B2 (en) 2013-02-06 2019-12-03 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with fluid containment
US9613911B2 (en) 2013-02-06 2017-04-04 The Board Of Trustees Of The University Of Illinois Self-similar and fractal design for stretchable electronics
US10840536B2 (en) 2013-02-06 2020-11-17 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with containment chambers
CN105340369A (zh) 2013-02-06 2016-02-17 伊利诺伊大学评议会 具有容纳室的可拉伸的电子系统
US10617300B2 (en) 2013-02-13 2020-04-14 The Board Of Trustees Of The University Of Illinois Injectable and implantable cellular-scale electronic devices
WO2014138465A1 (en) 2013-03-08 2014-09-12 The Board Of Trustees Of The University Of Illinois Processing techniques for silicon-based transient devices
US9913371B2 (en) * 2013-03-14 2018-03-06 Nthdegree Technologies Worldwide Inc. Printing complex electronic circuits using a patterned hydrophobic layer
US9572249B2 (en) 2013-03-14 2017-02-14 Nthdegree Technologies Worldwide Inc. Printing complex electronic circuits
WO2014144533A1 (en) * 2013-03-15 2014-09-18 Applied Materials, Inc. Position and temperature monitoring of ald platen susceptor
CA2906787C (en) * 2013-03-15 2020-02-18 Carewear Corp. Light and ultrasonic transducer device
CA3205904A1 (en) 2013-03-27 2014-10-02 Autonomix Medical, Inc. Systems and methods for neurological traffic and/or receptor functional evaluation and/or modification
US9825229B2 (en) 2013-04-04 2017-11-21 The Board Of Trustees Of The University Of Illinois Purification of carbon nanotubes via selective heating
WO2014169170A1 (en) 2013-04-12 2014-10-16 The Board Of Trustees Of The University Of Illinois Inorganic and organic transient electronic devices
US10292263B2 (en) 2013-04-12 2019-05-14 The Board Of Trustees Of The University Of Illinois Biodegradable materials for multilayer transient printed circuit boards
US9706647B2 (en) * 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
JP6212814B2 (ja) 2013-05-21 2017-10-18 国立研究開発法人科学技術振興機構 多点プローブ及びそれを構成する電子接点シート、多点プローブアレイ並びに多点プローブの製造方法
WO2015021039A1 (en) 2013-08-05 2015-02-12 Xia Li Flexible temperature sensor including conformable electronics
GB201315093D0 (en) * 2013-08-23 2013-10-09 Univ St Andrews Muscle contraction sensor
KR20160067152A (ko) 2013-10-02 2016-06-13 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 장기 장착형 전자 장치
CA2925387A1 (en) 2013-10-07 2015-04-16 Mc10, Inc. Conformal sensor systems for sensing and analysis
MX364705B (es) 2013-10-15 2019-05-06 Autonomix Medical Inc Sistemas y metodos para tratar el cancer y/o aumentar la funcion de organos.
US10136944B2 (en) 2013-10-15 2018-11-27 Autonomix Medical, Inc. Systems and methods for treating cancer and/or augmenting organ function
US10682175B2 (en) * 2013-11-06 2020-06-16 Biosense Webster (Israel) Ltd. Using catheter position and temperature measurement to detect movement from ablation point
WO2015077559A1 (en) 2013-11-22 2015-05-28 Mc10, Inc. Conformal sensor systems for sensing and analysis of cardiac activity
US9763586B2 (en) 2013-12-19 2017-09-19 Cardiac Pacemakers, Inc. System and method for locating neural tissue
TWI514938B (zh) 2013-12-26 2015-12-21 Ind Tech Res Inst 撓性電子模組
EP3092661A4 (en) * 2014-01-06 2017-09-27 Mc10, Inc. Encapsulated conformal electronic systems and devices, and methods of making and using the same
US9125575B1 (en) 2014-02-20 2015-09-08 International Business Machines Corporation Flexible active matrix circuits for interfacing with biological tissue
KR20160129007A (ko) 2014-03-04 2016-11-08 엠씨10, 인크 전자 디바이스를 위한 다부분 유연성 봉지 하우징
KR20160131011A (ko) 2014-03-12 2016-11-15 엠씨10, 인크 분석물의 변화의 정량화
US10492703B2 (en) 2014-03-28 2019-12-03 Board Of Regents, The University Of Texas System Epidermal sensor system and process
DE202014103821U1 (de) * 2014-07-09 2014-09-09 Carmen Diegel Flexible elektrische Leiterstruktur
US10279200B2 (en) 2014-07-17 2019-05-07 Elwha Llc Monitoring and treating pain with epidermal electronics
US10390755B2 (en) 2014-07-17 2019-08-27 Elwha Llc Monitoring body movement or condition according to motion regimen with conformal electronics
US10383550B2 (en) 2014-07-17 2019-08-20 Elwha Llc Monitoring body movement or condition according to motion regimen with conformal electronics
US10279201B2 (en) 2014-07-17 2019-05-07 Elwha Llc Monitoring and treating pain with epidermal electronics
US10099053B2 (en) 2014-07-17 2018-10-16 Elwha Llc Epidermal electronics to monitor repetitive stress injuries and arthritis
US10791924B2 (en) 2014-08-10 2020-10-06 Autonomix Medical, Inc. ANS assessment systems, kits, and methods
CA2957932A1 (en) 2014-08-11 2016-02-18 The Board Of Trustees Of The University Of Illinois Devices and related methods for epidermal characterization of biofluids
CN106999060A (zh) * 2014-08-11 2017-08-01 伊利诺伊大学评议会 用于分析温度特性和热传送特性的表皮器件
WO2016025430A1 (en) 2014-08-11 2016-02-18 The Board Of Trustees Of The University Of Illinois Epidermal photonic systems and methods
KR102295529B1 (ko) 2014-08-20 2021-08-31 삼성전자주식회사 인체 삽입용 감지 처리 패키지, 감지 처리기, 및 감지 처리 시스템
CN105448914B (zh) * 2014-08-28 2019-12-03 中芯国际集成电路制造(上海)有限公司 半导体结构及其形成方法
US9899330B2 (en) 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
US10297572B2 (en) 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
US10219718B2 (en) * 2014-10-22 2019-03-05 Medtronic, Inc. Atrial arrhythmia episode detection in a cardiac medical device
CN107148244B (zh) 2014-10-29 2020-11-03 皇家飞利浦有限公司 用于控制温度的系统和方法
KR101741187B1 (ko) * 2014-11-11 2017-05-30 서울대학교산학협력단 심장의 재동기화 치료를 위한 그물망 전극 및 이의 제조 방법
US10538028B2 (en) 2014-11-17 2020-01-21 The Board Of Trustees Of The University Of Illinois Deterministic assembly of complex, three-dimensional architectures by compressive buckling
CN104523227B (zh) * 2014-12-22 2018-03-09 浙江智柔科技有限公司 一种基于生物兼容薄膜的柔性可延展电子器件及制备方法
US20180169403A1 (en) * 2015-01-09 2018-06-21 President And Fellows Of Harvard College Nanowire arrays for neurotechnology and other applications
US20160228640A1 (en) * 2015-02-05 2016-08-11 Mc10, Inc. Method and system for interacting with an environment
US10477354B2 (en) 2015-02-20 2019-11-12 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
KR101781542B1 (ko) * 2015-02-27 2017-09-27 서울대학교산학협력단 피부 보철용 신축성 전자장치
WO2016140961A1 (en) 2015-03-02 2016-09-09 Mc10, Inc. Perspiration sensor
US9633883B2 (en) 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
US9897996B2 (en) 2015-03-23 2018-02-20 Elwha Llc Positional applicator device for use with stretchable electronic devices and related methods
US9897997B2 (en) 2015-03-23 2018-02-20 Elwha Llc Positional applicator device for use with stretchable electronic devices and related methods
US9897995B2 (en) 2015-03-23 2018-02-20 Elwha Llc Positional applicator device for use with stretchable electronic devices and related methods
CN107851208B (zh) 2015-06-01 2021-09-10 伊利诺伊大学评议会 具有无线供电和近场通信能力的小型化电子系统
WO2016196673A1 (en) 2015-06-01 2016-12-08 The Board Of Trustees Of The University Of Illinois Alternative approach to uv sensing
US20180001107A1 (en) 2016-07-01 2018-01-04 Btl Holdings Limited Aesthetic method of biological structure treatment by magnetic field
US10695575B1 (en) 2016-05-10 2020-06-30 Btl Medical Technologies S.R.O. Aesthetic method of biological structure treatment by magnetic field
WO2017004576A1 (en) 2015-07-02 2017-01-05 The Board Of Trustees Of The University Of Illinois Wireless optofluidic systems for programmable in vivo pharmacology and optogenetics
JP2017012674A (ja) * 2015-07-06 2017-01-19 住友ベークライト株式会社 ウェアラブルセンサーデバイス
US20170007141A1 (en) * 2015-07-09 2017-01-12 Peter Andris Raudzens Smart wireless electrode array
US10653332B2 (en) 2015-07-17 2020-05-19 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
CN105161011B (zh) * 2015-08-11 2018-12-04 京东方科技集团股份有限公司 显示面板及其制作方法、显示装置和智能穿戴设备
US10709384B2 (en) 2015-08-19 2020-07-14 Mc10, Inc. Wearable heat flux devices and methods of use
EP3356003A4 (en) 2015-10-01 2019-04-03 Mc10, Inc. METHOD AND SYSTEM FOR INTERACTION WITH A VIRTUAL ENVIRONMENT
WO2017062508A1 (en) 2015-10-05 2017-04-13 Mc10, Inc. Method and System for Neuromodulation and Stimulation
EP4230133B1 (en) 2015-10-21 2025-09-17 Autonomix Medical, Inc. Controlled and precise treatment of cardiac tissues
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
WO2017084014A1 (zh) * 2015-11-16 2017-05-26 深圳市洛书和科技发展有限公司 可挠性导电连接件及模块化电子电路
US11567028B2 (en) * 2015-11-29 2023-01-31 Ramot At Tel-Aviv University Ltd. Sensing electrode and method of fabricating the same
JP6746300B2 (ja) * 2015-11-30 2020-08-26 株式会社リコー 神経刺激装置、生体磁界計測システム
TWI565446B (zh) * 2015-12-14 2017-01-11 準訊生醫股份有限公司 長時間生理訊號量測貼片
WO2017143189A1 (en) * 2016-02-17 2017-08-24 Verily Life Sciences Llc Extraneural cuff with flexible interconnects for stimulaton and recording
EP3829187A1 (en) 2016-02-22 2021-06-02 Medidata Solutions, Inc. System, devices, and method for on-body data and power transmission
CN108781313B (zh) 2016-02-22 2022-04-08 美谛达解决方案公司 用以贴身获取传感器信息的耦接的集线器和传感器节点的系统、装置和方法
WO2017173339A1 (en) 2016-04-01 2017-10-05 The Board Of Trustees Of The University Of Illinois Implantable medical devices for optogenetics
WO2017184705A1 (en) 2016-04-19 2017-10-26 Mc10, Inc. Method and system for measuring perspiration
US11464993B2 (en) 2016-05-03 2022-10-11 Btl Healthcare Technologies A.S. Device including RF source of energy and vacuum system
CA3025009C (en) 2016-05-26 2022-07-26 San Diego State University Research Foundation Photoeradication of microorganisms with pulsed purple or blue light
EP3254636B1 (en) * 2016-06-07 2019-07-24 Braun GmbH Skin treatment device
US10653342B2 (en) 2016-06-17 2020-05-19 The Board Of Trustees Of The University Of Illinois Soft, wearable microfluidic systems capable of capture, storage, and sensing of biofluids
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
JP6972523B2 (ja) * 2016-09-13 2021-11-24 セイコーエプソン株式会社 電子機器
WO2018067242A1 (en) * 2016-10-03 2018-04-12 Thomson Licensing Detachable epidermal electronics
US10141215B2 (en) 2016-11-03 2018-11-27 Rohinni, LLC Compliant needle for direct transfer of semiconductor devices
WO2018089450A1 (en) * 2016-11-08 2018-05-17 Massachusetts Institute Of Technology Systems and methods of facial treatment and strain sensing
US20180306770A1 (en) * 2016-11-16 2018-10-25 Purdue Research Foundation Biological sensing system having micro-electrode array
US10504767B2 (en) 2016-11-23 2019-12-10 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
US10471545B2 (en) 2016-11-23 2019-11-12 Rohinni, LLC Top-side laser for direct transfer of semiconductor devices
EP3568837A1 (en) * 2017-01-12 2019-11-20 Navix International Limited Flattened view for intra-lumenal navigation
WO2018132600A1 (en) * 2017-01-13 2018-07-19 Nthdegree Technologies Worldwide Inc. Printing complex electronic circuits using a printable solution defined by a patterned hydrophobic layer
US10062588B2 (en) 2017-01-18 2018-08-28 Rohinni, LLC Flexible support substrate for transfer of semiconductor devices
EP3576612A4 (en) * 2017-02-01 2020-12-23 The George Washington University MULTIFUNCTIONAL, COMPLIANT, HIGH RESOLUTION ELECTRONIC DEVICE FOR THE DIAGNOSIS AND TREATMENT OF ARRHYTHMIA
WO2018185171A1 (en) * 2017-04-04 2018-10-11 Roche Diabetes Care Gmbh Medical sensor system, in particular continuous glucose monitoring system
US11768196B2 (en) 2017-07-07 2023-09-26 President And Fellows Of Harvard College Current-based stimulators for electrogenic cells and related methods
DE102017118686A1 (de) * 2017-08-16 2019-02-21 Aesculap Ag Verfahren zur Zustandserfassung an Passivierungsschichten einer Verkapselung
JP6933937B2 (ja) * 2017-09-13 2021-09-08 日本メクトロン株式会社 感湿シート及び感湿システム
EP3684463B1 (en) 2017-09-19 2025-05-14 Neuroenhancement Lab, LLC Method and apparatus for neuroenhancement
WO2019071075A1 (en) * 2017-10-06 2019-04-11 Massachusetts Institute Of Technology PIEZOELECTRIC DEVICES FOR GASTROINTESTINAL MOTILITY DETECTION
US10014390B1 (en) 2017-10-10 2018-07-03 Globalfoundries Inc. Inner spacer formation for nanosheet field-effect transistors with tall suspensions
EP3697298B1 (en) 2017-10-18 2025-03-12 LifeLens Technologies, Inc. Medical device with circuitry for capturing and processing physiological signals
KR102049598B1 (ko) * 2017-10-26 2019-11-27 계명대학교 산학협력단 삽입형 생체 임피던스 측정장치 및 이를 이용한 심부전 모니터링 시스템
US12174140B2 (en) 2017-11-01 2024-12-24 President And Fellows Of Harvard College Electronic circuits for analyzing electrogenic cells and related methods
US11717686B2 (en) 2017-12-04 2023-08-08 Neuroenhancement Lab, LLC Method and apparatus for neuroenhancement to facilitate learning and performance
KR102095437B1 (ko) * 2017-12-06 2020-04-01 재단법인대구경북과학기술원 풍선 타입 망막 자극장치 및 이의 제조방법
US11478603B2 (en) 2017-12-31 2022-10-25 Neuroenhancement Lab, LLC Method and apparatus for neuroenhancement to enhance emotional response
US12280219B2 (en) 2017-12-31 2025-04-22 NeuroLight, Inc. Method and apparatus for neuroenhancement to enhance emotional response
US11351537B2 (en) * 2018-02-02 2022-06-07 University Of Central Florida Research Foundation, Inc. System and method for forming a biological microdevice
US11000220B2 (en) 2018-03-13 2021-05-11 Biosense Webster (Israel) Ltd. SNR of intracardiac signals
US11992686B2 (en) 2018-03-16 2024-05-28 The Regents Of The University Of California Flexible spinal cord stimulators for pain and trauma management through neuromodulation
JP7258121B2 (ja) * 2018-03-30 2023-04-14 ノースウェスタン ユニヴァーシティ ワイヤレス皮膚センサ、ならびに方法および使用
US11364361B2 (en) 2018-04-20 2022-06-21 Neuroenhancement Lab, LLC System and method for inducing sleep by transplanting mental states
US10410905B1 (en) 2018-05-12 2019-09-10 Rohinni, LLC Method and apparatus for direct transfer of multiple semiconductor devices
US11020605B2 (en) 2018-05-29 2021-06-01 Carewear Corp. Method and system for irradiating tissue with pulsed blue and red light to reduce muscle fatigue, enhance wound healing and tissue repair, and reduce pain
EP3575087A1 (en) 2018-05-29 2019-12-04 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Protection of foldable electronics
CN113382683A (zh) 2018-09-14 2021-09-10 纽罗因恒思蒙特实验有限责任公司 改善睡眠的系统和方法
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
US11270983B2 (en) 2018-10-15 2022-03-08 Semtech Corporation System and method for providing mechanical isolation of assembled diodes
JP6871985B2 (ja) * 2018-10-17 2021-05-19 日東電工株式会社 生体センサおよびその製造方法
EP3868287B1 (en) 2018-10-17 2023-11-29 Nitto Denko Corporation Biological sensor and production method therefor
US11571128B2 (en) 2018-10-24 2023-02-07 The George Washington University Fast label-free method for mapping cardiac physiology
KR102089997B1 (ko) * 2018-10-25 2020-03-17 서울대학교 산학협력단 생체 삽입용 장치 및 이를 제조하는 방법
WO2020189790A1 (ja) * 2019-03-20 2020-09-24 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP6886538B2 (ja) * 2019-03-26 2021-06-16 日東電工株式会社 貼付型生体センサ
US11678828B2 (en) 2019-03-26 2023-06-20 Nitto Denko Corporation Stick-on biosensor
EP3718599A1 (en) * 2019-04-01 2020-10-07 Koninklijke Philips N.V. Treatment planning for focal therapy treatments
CN113573771A (zh) * 2019-04-05 2021-10-29 梅姆斯蒂姆有限责任公司 包括电极阵列的刺激装置
US12558146B2 (en) 2019-04-11 2026-02-24 Btl Medical Solutions A.S. Methods and devices for aesthetic treatment of biological structures by radiofrequency and magnetic energy
US11786694B2 (en) 2019-05-24 2023-10-17 NeuroLight, Inc. Device, method, and app for facilitating sleep
US11344245B2 (en) 2019-06-11 2022-05-31 Biosense Webster (Israel) Ltd. Visually differentiating primary and secondary activations on electrophysiological maps
WO2020250148A1 (en) * 2019-06-13 2020-12-17 Cochlear Limited Tissue-stimulating prosthesis dissolution barrier
WO2021016485A1 (en) * 2019-07-24 2021-01-28 The Trustees Of Columbia University In The City Of New York Integrated, flexible, implantable, optical neural interrogation apparatus, computer-accessible medium, system, and method for use and implementation thereof
WO2021021977A1 (en) * 2019-07-31 2021-02-04 Med-El Elektromedizinische Geraete Gmbh Printed tattoo electrode respiration sensor for laryngeal pacemakers
WO2021024128A1 (en) 2019-08-02 2021-02-11 Bionime Corporation Physiological signal monitoring device
US20220280094A1 (en) * 2019-08-29 2022-09-08 Berne University Of Applied Sciences Kit comprising implantable, flexible multi-lead cardiac monitor with open-circular shape and implantation tool to accommodate reversibly said monitor
MX2019012160A (es) * 2019-10-09 2021-04-12 Font Reaulx Rojas Enrique De Una placa termosensible de registros cualitativos de la temperatura de componente de organismos vivos por medio de un silicon termosensible.
IL295739B2 (en) * 2020-02-20 2026-03-01 Univ Leland Stanford Junior System and method for targeting and treating abnormal biological rhythms
US11201153B2 (en) 2020-02-26 2021-12-14 International Business Machines Corporation Stacked field effect transistor with wrap-around contacts
KR102942012B1 (ko) * 2020-03-17 2026-03-20 엘지이노텍 주식회사 센싱 장치
BR112022022112A2 (pt) 2020-05-04 2022-12-13 Btl Healthcare Technologies As Dispositivo para tratamento não assistido do paciente
US11878167B2 (en) 2020-05-04 2024-01-23 Btl Healthcare Technologies A.S. Device and method for unattended treatment of a patient
TWI781403B (zh) * 2020-05-14 2022-10-21 美宸科技股份有限公司 織物型應變計、織物型壓力計與智慧型衣物
JP7844357B2 (ja) 2020-06-17 2026-04-13 プレジデント アンド フェローズ オブ ハーバード カレッジ 細胞のパターニングおよび空間電気化学マッピングのためのシステムおよび方法
CN116157531A (zh) 2020-06-17 2023-05-23 哈佛学院院长及董事 用于经由阻抗测量进行细胞标测的设备及其操作方法
WO2021257686A1 (en) 2020-06-17 2021-12-23 President And Fellows Of Harvard College Complementary metal-oxide-semiconductor (cmos) multi-well apparatus for electrical cell assessment
WO2022027143A1 (en) * 2020-08-06 2022-02-10 Curiato Inc. System and method for modular flexible sensing array system
US12225638B2 (en) * 2021-02-12 2025-02-11 William Marsh Rice University Integrated microheater array for efficient and localized heating of magnetic nanoparticles at microwave frequencies
US12364424B2 (en) * 2021-03-11 2025-07-22 President And Fellows Of Harvard College Fluorinated elastomers for brain probes and other applications
EP4304859A4 (en) 2021-03-11 2025-02-05 President and Fellows of Harvard College FLUORO-ELASTOMERS FOR BRAIN PROBES AND OTHER APPLICATIONS
SE544822C2 (en) * 2021-04-13 2022-12-06 Saab Ab An antenna structure and method for manufacturing the same
JP7595932B2 (ja) * 2021-04-14 2024-12-09 株式会社ニューロシューティカルズ センサーデバイス
KR102905932B1 (ko) 2021-05-18 2025-12-30 삼성전자주식회사 연신 소자 및 전자 기기
CN113325199B (zh) * 2021-06-09 2022-04-29 东南大学 一种热电堆式高灵敏度柔性加速度传感器及其制备方法
DE102021206864B4 (de) * 2021-06-30 2023-05-11 Siemens Healthcare Gmbh Integriertes differentielles Spannungsmesssystem zur Messung von bioelektrischen Signalen eines Patienten
US11916073B2 (en) 2021-08-03 2024-02-27 International Business Machines Corporation Stacked complementary field effect transistors
US20240148312A1 (en) * 2021-10-13 2024-05-09 Tokyo Institute Of Technology Recording and/or stimulation neural electrode to be attached to brain surface upon use, and recording or stimulation method using same
CN114366110A (zh) * 2021-12-09 2022-04-19 南方科技大学 柔性肌电电极阵列及其制备方法和应用
CN116407763A (zh) 2021-12-29 2023-07-11 精能医学股份有限公司 电刺激方法和电刺激装置
US20240222889A1 (en) * 2022-12-30 2024-07-04 Verily Life Sciences Llc Systems and methods for ingress sealing of electrical contacts for wearable or implantable devices
TWI856472B (zh) * 2022-12-30 2024-09-21 致茂電子股份有限公司 校準系統及其校準載板
WO2024256942A1 (en) * 2023-06-12 2024-12-19 Shahriari Dena Devices and systems for chronic optical neuromodulation
WO2025081280A1 (en) * 2023-10-19 2025-04-24 The Governors Of The University Of Alberta Concave microlens
US20260097225A1 (en) 2024-10-08 2026-04-09 Btl Medical Solutions A.S. Devices and methods for application of a magnetic field to the nervous system
CN119405323B (zh) * 2024-11-20 2025-11-28 浙江大学金华研究院 基于ZnO薄膜晶体管的植入式脊髓神经信号采集电极阵列

Family Cites Families (351)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4058418A (en) 1974-04-01 1977-11-15 Solarex Corporation Fabrication of thin film solar cells utilizing epitaxial deposition onto a liquid surface to obtain lateral growth
US3949410A (en) 1975-01-23 1976-04-06 International Business Machines Corporation Jet nozzle structure for electrohydrodynamic droplet formation and ink jet printing system therewith
US4471003A (en) 1980-11-25 1984-09-11 Cann Gordon L Magnetoplasmadynamic apparatus and process for the separation and deposition of materials
US4487162A (en) 1980-11-25 1984-12-11 Cann Gordon L Magnetoplasmadynamic apparatus for the separation and deposition of materials
US4392451A (en) 1980-12-31 1983-07-12 The Boeing Company Apparatus for forming thin-film heterojunction solar cells employing materials selected from the class of I-III-VI2 chalcopyrite compounds
US4715235A (en) * 1985-03-04 1987-12-29 Asahi Kasei Kogyo Kabushiki Kaisha Deformation sensitive electroconductive knitted or woven fabric and deformation sensitive electroconductive device comprising the same
US4761335A (en) 1985-03-07 1988-08-02 National Starch And Chemical Corporation Alpha-particle protection of semiconductor devices
US4784720A (en) 1985-05-03 1988-11-15 Texas Instruments Incorporated Trench etch process for a single-wafer RIE dry etch reactor
US4855017A (en) 1985-05-03 1989-08-08 Texas Instruments Incorporated Trench etch process for a single-wafer RIE dry etch reactor
US4663828A (en) 1985-10-11 1987-05-12 Energy Conversion Devices, Inc. Process and apparatus for continuous production of lightweight arrays of photovoltaic cells
US4766670A (en) 1987-02-02 1988-08-30 International Business Machines Corporation Full panel electronic packaging structure and method of making same
CA1292572C (en) 1988-10-25 1991-11-26 Fernando C. Lebron Cardiac mapping system simulator
US5178957A (en) 1989-05-02 1993-01-12 Minnesota Mining And Manufacturing Company Noble metal-polymer composites and flexible thin-film conductors prepared therefrom
US5086785A (en) 1989-08-10 1992-02-11 Abrams/Gentille Entertainment Inc. Angular displacement sensors
US5118400A (en) 1990-01-29 1992-06-02 Spire Corporation Method of making biocompatible electrodes
US5108819A (en) 1990-02-14 1992-04-28 Eli Lilly And Company Thin film electrical component
EP0455067B1 (de) 1990-05-03 2003-02-26 F. Hoffmann-La Roche Ag Mikrooptischer Sensor
US5475514A (en) 1990-12-31 1995-12-12 Kopin Corporation Transferred single crystal arrayed devices including a light shield for projection displays
US5204144A (en) 1991-05-10 1993-04-20 Celestech, Inc. Method for plasma deposition on apertured substrates
US5246003A (en) 1991-08-28 1993-09-21 Nellcor Incorporated Disposable pulse oximeter sensor
JPH06118441A (ja) 1991-11-05 1994-04-28 Tadanobu Kato 表示セル
US5313094A (en) 1992-01-28 1994-05-17 International Business Machines Corportion Thermal dissipation of integrated circuits using diamond paths
US5687737A (en) 1992-10-09 1997-11-18 Washington University Computerized three-dimensional cardiac mapping with interactive visual displays
JPH06163365A (ja) 1992-11-25 1994-06-10 Nec Corp 半導体装置の製造方法
DE4241045C1 (de) 1992-12-05 1994-05-26 Bosch Gmbh Robert Verfahren zum anisotropen Ätzen von Silicium
US5793107A (en) 1993-10-29 1998-08-11 Vlsi Technology, Inc. Polysilicon pillar heat sinks for semiconductor on insulator circuits
US5427096A (en) 1993-11-19 1995-06-27 Cmc Assemblers, Inc. Water-degradable electrode
US5545291A (en) 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
US6864570B2 (en) 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5824186A (en) 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5904545A (en) 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
US5514242A (en) 1993-12-30 1996-05-07 Saint Gobain/Norton Industrial Ceramics Corporation Method of forming a heat-sinked electronic component
EP0676814B1 (en) 1994-04-06 2006-03-22 Denso Corporation Process of producing trench semiconductor device
US5434751A (en) 1994-04-11 1995-07-18 Martin Marietta Corporation Reworkable high density interconnect structure incorporating a release layer
US5753529A (en) 1994-05-05 1998-05-19 Siliconix Incorporated Surface mount and flip chip technology for total integrated circuit isolation
US5525815A (en) 1994-10-03 1996-06-11 General Electric Company Diamond film structure with high thermal conductivity
US5767578A (en) 1994-10-12 1998-06-16 Siliconix Incorporated Surface mount and flip chip technology with diamond film passivation for total integated circuit isolation
US5625471A (en) 1994-11-02 1997-04-29 Litel Instruments Dual plate holographic imaging technique and masks
US5917534A (en) 1995-06-29 1999-06-29 Eastman Kodak Company Light-emitting diode arrays with integrated photodetectors formed as a monolithic device and methods and apparatus for using same
US6639578B1 (en) 1995-07-20 2003-10-28 E Ink Corporation Flexible displays
US6459418B1 (en) 1995-07-20 2002-10-01 E Ink Corporation Displays combining active and non-active inks
GB9611437D0 (en) 1995-08-03 1996-08-07 Secr Defence Biomaterial
WO1997006012A1 (en) 1995-08-04 1997-02-20 International Business Machines Corporation Stamp for a lithographic process
US5772905A (en) 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
GB9601289D0 (en) 1996-01-23 1996-03-27 Nimbus Manufacturing Uk Limite Manufacture of optical data storage disc
US5790151A (en) 1996-03-27 1998-08-04 Imaging Technology International Corp. Ink jet printhead and method of making
US6784023B2 (en) 1996-05-20 2004-08-31 Micron Technology, Inc. Method of fabrication of stacked semiconductor devices
KR100616479B1 (ko) 1996-10-17 2006-08-28 세이코 엡슨 가부시키가이샤 반도체 장치 및 그 제조방법, 회로기판 및 플렉시블 기판
DE19643550A1 (de) 1996-10-24 1998-05-14 Leybold Systems Gmbh Lichttransparentes, Wärmestrahlung reflektierendes Schichtensystem
US5691245A (en) 1996-10-28 1997-11-25 He Holdings, Inc. Methods of forming two-sided HDMI interconnect structures
US5997569A (en) 1997-01-29 1999-12-07 Light Sciences Limited Partnership Flexible and adjustable grid for medical therapy
US6980196B1 (en) 1997-03-18 2005-12-27 Massachusetts Institute Of Technology Printable electronic display
US6059812A (en) 1997-03-21 2000-05-09 Schneider (Usa) Inc. Self-expanding medical device for centering radioactive treatment sources in body vessels
US5998291A (en) 1997-04-07 1999-12-07 Raytheon Company Attachment method for assembly of high density multiple interconnect structures
AUPO662497A0 (en) 1997-05-05 1997-05-29 Cardiac Crc Nominees Pty Limited An epicardial electrode array
US5907189A (en) 1997-05-29 1999-05-25 Lsi Logic Corporation Conformal diamond coating for thermal improvement of electronic packages
JPH1126344A (ja) 1997-06-30 1999-01-29 Hitachi Ltd パターン形成方法及び装置並びに半導体装置の製造方法
DE19829309B4 (de) 1997-07-04 2008-02-07 Fuji Electric Co., Ltd., Kawasaki Verfahren zur Herstellung eines thermischen Oxidfilms auf Siliciumcarbid
US6024702A (en) 1997-09-03 2000-02-15 Pmt Corporation Implantable electrode manufactured with flexible printed circuit
US5928001A (en) 1997-09-08 1999-07-27 Motorola, Inc. Surface mountable flexible interconnect
FR2769640B1 (fr) 1997-10-15 1999-12-17 Sgs Thomson Microelectronics Amelioration de la resistance mecanique d'une tranche de silicium monocristallin
DE19748173A1 (de) 1997-10-31 1999-05-06 Ahlers Horst Dr Ing Habil Elektronikbauelemente einschließlich Sensoren
US6171730B1 (en) 1997-11-07 2001-01-09 Canon Kabushiki Kaisha Exposure method and exposure apparatus
JP3406207B2 (ja) 1997-11-12 2003-05-12 シャープ株式会社 表示用トランジスタアレイパネルの形成方法
JP3219043B2 (ja) 1998-01-07 2001-10-15 日本電気株式会社 半導体装置のパッケージ方法および半導体装置
US5955781A (en) 1998-01-13 1999-09-21 International Business Machines Corporation Embedded thermal conductors for semiconductor chips
GB9805214D0 (en) 1998-03-11 1998-05-06 Univ Glasgow Cell adhesion
US6316283B1 (en) 1998-03-25 2001-11-13 Asulab Sa Batch manufacturing method for photovoltaic cells
JP2891256B1 (ja) 1998-04-27 1999-05-17 株式会社コスモテック 転写基板及び転写シール
US6057212A (en) 1998-05-04 2000-05-02 International Business Machines Corporation Method for making bonded metal back-plane substrates
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
AU1722700A (en) 1998-11-16 2000-06-05 Cambridge Scientific, Inc. Biopolymer-based holographic optical element
US6097984A (en) 1998-11-25 2000-08-01 Medtronic, Inc. System and method of stimulation for treating gastro-esophageal reflux disease
US6236883B1 (en) 1999-02-03 2001-05-22 The Trustees Of Columbia University In The City Of New York Methods and systems for localizing reentrant circuits from electrogram features
US6850312B2 (en) 1999-03-16 2005-02-01 Alien Technology Corporation Apparatuses and methods for flexible displays
US6281038B1 (en) 1999-02-05 2001-08-28 Alien Technology Corporation Methods for forming assemblies
JP2002536695A (ja) 1999-02-05 2002-10-29 エイリアン・テクノロジイ・コーポレーション アセンブリを形成するための装置および方法
US6274508B1 (en) 1999-02-05 2001-08-14 Alien Technology Corporation Apparatuses and methods used in forming assemblies
US6555408B1 (en) 1999-02-05 2003-04-29 Alien Technology Corporation Methods for transferring elements from a template to a substrate
US6683663B1 (en) 1999-02-05 2004-01-27 Alien Technology Corporation Web fabrication of devices
US6606079B1 (en) 1999-02-16 2003-08-12 Alien Technology Corporation Pixel integrated circuit
US6291896B1 (en) 1999-02-16 2001-09-18 Alien Technology Corporation Functionally symmetric integrated circuit die
US6380729B1 (en) 1999-02-16 2002-04-30 Alien Technology Corporation Testing integrated circuit dice
US6752505B2 (en) 1999-02-23 2004-06-22 Solid State Opto Limited Light redirecting films and film systems
US6334960B1 (en) 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US6316278B1 (en) 1999-03-16 2001-11-13 Alien Technology Corporation Methods for fabricating a multiple modular assembly
US6468638B2 (en) 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
KR100434537B1 (ko) 1999-03-31 2004-06-05 삼성전자주식회사 다공질 실리콘 혹은 다공질 산화 실리콘을 이용한 두꺼운 희생층을 가진 다층 구조 웨이퍼 및 그 제조방법
US6433401B1 (en) 1999-04-06 2002-08-13 Analog Devices Imi, Inc. Microfabricated structures with trench-isolation using bonded-substrates and cavities
EE04249B1 (et) 1999-04-21 2004-02-16 Asper O� Meetod biopolümeermaatriksi lugemiseks ja fluorestsentsdetektor
US6276775B1 (en) 1999-04-29 2001-08-21 Hewlett-Packard Company Variable drop mass inkjet drop generator
US6225149B1 (en) 1999-05-03 2001-05-01 Feng Yuan Gan Methods to fabricate thin film transistors and circuits
JP3447619B2 (ja) 1999-06-25 2003-09-16 株式会社東芝 アクティブマトリクス基板の製造方法、中間転写基板
WO2001008242A1 (en) 1999-07-21 2001-02-01 E Ink Corporation Preferred methods for producing electrical circuit elements used to control an electronic display
US6517995B1 (en) 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
AU1348901A (en) 1999-10-28 2001-05-08 P1 Diamond, Inc. Improved diamond thermal management components
US6479395B1 (en) 1999-11-02 2002-11-12 Alien Technology Corporation Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
US6527964B1 (en) 1999-11-02 2003-03-04 Alien Technology Corporation Methods and apparatuses for improved flow in performing fluidic self assembly
US6623579B1 (en) 1999-11-02 2003-09-23 Alien Technology Corporation Methods and apparatus for fluidic self assembly
US6420266B1 (en) 1999-11-02 2002-07-16 Alien Technology Corporation Methods for creating elements of predetermined shape and apparatuses using these elements
JP2003513756A (ja) 1999-11-12 2003-04-15 アンジオテック ファーマシューティカルズ，インコーポレイテッド 放射性治療と細胞周期インヒビターとの組合せの組成物
US6451191B1 (en) 1999-11-18 2002-09-17 3M Innovative Properties Company Film based addressable programmable electronic matrix articles and methods of manufacturing and using the same
WO2001066833A1 (en) 2000-03-06 2001-09-13 University Of Connecticut Apparatus and method for fabrication of photonic crystals
JP2004501405A (ja) 2000-06-22 2004-01-15 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 光学イメージを形成する方法、この方法に用いるマスク、この方法を用いてデバイスを製造する方法、およびこの方法を遂行するための装置
US6403397B1 (en) 2000-06-28 2002-06-11 Agere Systems Guardian Corp. Process for fabricating organic semiconductor device involving selective patterning
EP1297387A2 (en) 2000-06-30 2003-04-02 President And Fellows of Harvard College Electric microcontact printing method and apparatus
JP4120184B2 (ja) 2000-06-30 2008-07-16 セイコーエプソン株式会社 実装用微小構造体および光伝送装置
US6723576B2 (en) 2000-06-30 2004-04-20 Seiko Epson Corporation Disposing method for semiconductor elements
AU2001281743A1 (en) 2000-07-21 2002-02-05 Micro Managed Photons A/S Surface plasmon polariton band gap structures
US6780696B1 (en) 2000-09-12 2004-08-24 Alien Technology Corporation Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs
JP2002092984A (ja) 2000-09-18 2002-03-29 Hitachi Maxell Ltd スタンパ及びその製造方法、並びにプラスチック基板
US6980184B1 (en) 2000-09-27 2005-12-27 Alien Technology Corporation Display devices and integrated circuits
US6814898B1 (en) 2000-10-17 2004-11-09 Seagate Technology Llc Imprint lithography utilizing room temperature embossing
GB2385975B (en) 2000-11-21 2004-10-13 Avery Dennison Corp Display device and methods of manufacture and control
US6750480B2 (en) 2000-11-27 2004-06-15 Kopin Corporation Bipolar transistor with lattice matched base layer
US6743982B2 (en) 2000-11-29 2004-06-01 Xerox Corporation Stretchable interconnects using stress gradient films
US6608360B2 (en) 2000-12-15 2003-08-19 University Of Houston One-chip micro-integrated optoelectronic sensor
US20070031607A1 (en) 2000-12-19 2007-02-08 Alexander Dubson Method and apparatus for coating medical implants
US6666821B2 (en) * 2001-01-08 2003-12-23 Medtronic, Inc. Sensor system
EP1372602B1 (en) 2001-01-09 2007-04-18 Microchips, Inc. Flexible microchip devices for ophthalmic and other applications
US6655286B2 (en) 2001-01-19 2003-12-02 Lucent Technologies Inc. Method for preventing distortions in a flexibly transferred feature pattern
US20020110766A1 (en) 2001-02-09 2002-08-15 Industrial Technology Research Institute Process method of using excimer laser for forming micro spherical and non-spherical polymeric structure array
FR2820952B1 (fr) 2001-02-16 2003-05-16 Lucas Sa G Melangeuse distributrice de produits pour l'alimentation du betail
JP3665579B2 (ja) 2001-02-26 2005-06-29 ソニーケミカル株式会社 電気装置製造方法
US7189435B2 (en) 2001-03-14 2007-03-13 University Of Massachusetts Nanofabrication
US6417025B1 (en) 2001-04-02 2002-07-09 Alien Technology Corporation Integrated circuit packages assembled utilizing fluidic self-assembly
US6667548B2 (en) 2001-04-06 2003-12-23 Intel Corporation Diamond heat spreading and cooling technique for integrated circuits
US7232460B2 (en) 2001-04-25 2007-06-19 Xillus, Inc. Nanodevices, microdevices and sensors on in-vivo structures and method for the same
US6864435B2 (en) 2001-04-25 2005-03-08 Alien Technology Corporation Electrical contacts for flexible displays
AU2002257289A1 (en) 2001-05-17 2002-11-25 The Board Of Trustees Of The Leland Stanford Junior University Device and method for three-dimensional spatial localization and functional interconnection of different types of cells
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US6988667B2 (en) 2001-05-31 2006-01-24 Alien Technology Corporation Methods and apparatuses to identify devices
AU2002322105A1 (en) 2001-06-14 2003-01-02 Amberware Systems Corporation Method of selective removal of sige alloys
US20030006527A1 (en) 2001-06-22 2003-01-09 Rabolt John F. Method of fabricating micron-and submicron-scale elastomeric templates for surface patterning
US6984934B2 (en) 2001-07-10 2006-01-10 The Trustees Of Princeton University Micro-lens arrays for display intensity enhancement
US6657289B1 (en) 2001-07-13 2003-12-02 Alien Technology Corporation Apparatus relating to block configurations and fluidic self-assembly processes
US6590346B1 (en) 2001-07-16 2003-07-08 Alien Technology Corporation Double-metal background driven displays
US6856830B2 (en) 2001-07-19 2005-02-15 Bin He Method and apparatus of three dimension electrocardiographic imaging
US6661037B2 (en) 2001-07-20 2003-12-09 Microlink Devices, Inc. Low emitter resistance contacts to GaAs high speed HBT
AU2002322581A1 (en) 2001-07-20 2003-03-03 Microlink Devices, Inc. Graded base gaassb for high speed gaas hbt
US6917061B2 (en) 2001-07-20 2005-07-12 Microlink Devices, Inc. AlGaAs or InGaP low turn-on voltage GaAs-based heterojunction bipolar transistor
US6706402B2 (en) 2001-07-25 2004-03-16 Nantero, Inc. Nanotube films and articles
US6949199B1 (en) 2001-08-16 2005-09-27 Seagate Technology Llc Heat-transfer-stamp process for thermal imprint lithography
US6863219B1 (en) 2001-08-17 2005-03-08 Alien Technology Corporation Apparatuses and methods for forming electronic assemblies
US6731353B1 (en) 2001-08-17 2004-05-04 Alien Technology Corporation Method and apparatus for transferring blocks
JP2003077940A (ja) 2001-09-06 2003-03-14 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
AUPR795401A0 (en) 2001-09-28 2001-10-18 University Of Queensland, The Components based on melanin and melanin-like bio-molecules and processes for their production
US20030069510A1 (en) * 2001-10-04 2003-04-10 Semler Herbert J. Disposable vital signs monitor
US7193504B2 (en) 2001-10-09 2007-03-20 Alien Technology Corporation Methods and apparatuses for identification
US6936181B2 (en) 2001-10-11 2005-08-30 Kovio, Inc. Methods for patterning using liquid embossing
KR100944886B1 (ko) 2001-10-30 2010-03-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제조 방법
US7169669B2 (en) 2001-12-04 2007-01-30 Origin Energy Solar Pty. Ltd. Method of making thin silicon sheets for solar cells
US6844673B1 (en) 2001-12-06 2005-01-18 Alien Technology Corporation Split-fabrication for light emitting display structures
US6887450B2 (en) 2002-01-02 2005-05-03 Zyvex Corporation Directional assembly of carbon nanotube strings
US6653030B2 (en) 2002-01-23 2003-11-25 Hewlett-Packard Development Company, L.P. Optical-mechanical feature fabrication during manufacture of semiconductors and other micro-devices and nano-devices that include micron and sub-micron features
KR20040105705A (ko) 2002-01-23 2004-12-16 에이리언 테크놀로지 코포레이션 소형 및 대형 부품을 갖는 장치 및 그 장치의 제조 방법
US6608370B1 (en) 2002-01-28 2003-08-19 Motorola, Inc. Semiconductor wafer having a thin die and tethers and methods of making the same
US20030149456A1 (en) 2002-02-01 2003-08-07 Rottenberg William B. Multi-electrode cardiac lead adapter with multiplexer
US6693384B1 (en) 2002-02-01 2004-02-17 Alien Technology Corporation Interconnect structure for electronic devices
JP3975272B2 (ja) 2002-02-21 2007-09-12 独立行政法人産業技術総合研究所 超微細流体ジェット装置
EP1340622B1 (en) 2002-03-01 2006-12-13 Dai Nippon Printing Co., Ltd. Thermally transferable image protective sheet, method for protective layer formation, and record produced by said method
EP1487935A1 (en) 2002-03-07 2004-12-22 Acreo AB Electrochemical device
JP3889700B2 (ja) 2002-03-13 2007-03-07 三井金属鉱業株式会社 Ｃｏｆフィルムキャリアテープの製造方法
US6950220B2 (en) 2002-03-18 2005-09-27 E Ink Corporation Electro-optic displays, and methods for driving same
US20040026684A1 (en) 2002-04-02 2004-02-12 Nanosys, Inc. Nanowire heterostructures for encoding information
US6872645B2 (en) 2002-04-02 2005-03-29 Nanosys, Inc. Methods of positioning and/or orienting nanostructures
WO2003089515A1 (en) 2002-04-22 2003-10-30 Konica Minolta Holdings, Inc. Organic semiconductor composition, organic semiconductor element, and process for producing the same
KR100867286B1 (ko) 2002-04-24 2008-11-06 이 잉크 코포레이션 전자 표시장치
EP1357773A3 (en) 2002-04-25 2005-11-30 Matsushita Electric Industrial Co., Ltd. Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
JP2005524239A (ja) 2002-04-29 2005-08-11 シリコン・パイプ・インコーポレーテッド ダイレクト・コネクト形信号システム
DE10219120A1 (de) 2002-04-29 2003-11-20 Infineon Technologies Ag Oberflächenfunktionalisierte anorganische Halbleiterpartikel als elektrische Halbleiter für mikroelektronische Anwendungen
EP2662211A1 (en) 2002-06-24 2013-11-13 Tufts University Silk biomaterials and methods of use thereof
AU2003253690A1 (en) 2002-06-24 2004-01-06 Massachusetts Institute Of Technology Silk biomaterials and methods of use thereof
US20040136866A1 (en) 2002-06-27 2004-07-15 Nanosys, Inc. Planar nanowire based sensor elements, devices, systems and methods for using and making same
US7117581B2 (en) 2002-08-02 2006-10-10 Symbol Technologies, Inc. Method for high volume assembly of radio frequency identification tags
EP1530510A1 (de) 2002-08-27 2005-05-18 Nanosys GMBH Verfahren zur hydrophobierung der oberfläche eines porösen substrats unter beibehaltung seiner porosität
EP1537187B1 (en) 2002-09-05 2012-08-15 Nanosys, Inc. Organic species that facilitate charge transfer to or from nanostructures
WO2004027822A2 (en) 2002-09-05 2004-04-01 Nanosys, Inc. Oriented nanostructures and methods of preparing
WO2004023527A2 (en) 2002-09-05 2004-03-18 Nanosys, Inc. Nanostructure and nanocomposite based compositions and photovoltaic devices
EP1537445B1 (en) 2002-09-05 2012-08-01 Nanosys, Inc. Nanocomposites
CA2499965C (en) 2002-09-30 2013-03-19 Nanosys, Inc. Large-area nanoenabled macroelectronic substrates and uses therefor
WO2004032191A2 (en) 2002-09-30 2004-04-15 Nanosys, Inc. Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites
US7051945B2 (en) * 2002-09-30 2006-05-30 Nanosys, Inc Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites
CA2499944A1 (en) 2002-09-30 2004-04-15 Nanosys, Inc. Integrated displays using nanowire transistors
AU2003282548A1 (en) 2002-10-10 2004-05-04 Nanosys, Inc. Nano-chem-fet based biosensors
US20040081384A1 (en) 2002-10-25 2004-04-29 Datesman Aaron M. Multiple-mode planar-waveguide sensor, fabrication materials and techniques
US7067903B2 (en) 2002-11-07 2006-06-27 Kabushiki Kaisha Kobe Seiko Sho Heat spreader and semiconductor device and package using the same
US20040200734A1 (en) 2002-12-19 2004-10-14 Co Man Sung Nanotube-based sensors for biomolecules
EP1434282A3 (en) * 2002-12-26 2007-06-27 Konica Minolta Holdings, Inc. Protective layer for an organic thin-film transistor
WO2004062697A2 (en) 2003-01-07 2004-07-29 Tufts University Silk fibroin materials and use thereof
US7190051B2 (en) 2003-01-17 2007-03-13 Second Sight Medical Products, Inc. Chip level hermetic and biocompatible electronics package using SOI wafers
JP2006521278A (ja) 2003-03-11 2006-09-21 ナノシス・インコーポレイテッド ナノクリスタルを生成するためのプロセスおよびそれによって生成されるナノクリスタル
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US7491892B2 (en) 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
US20050227389A1 (en) 2004-04-13 2005-10-13 Rabin Bhattacharya Deformable organic devices
US7465678B2 (en) 2003-03-28 2008-12-16 The Trustees Of Princeton University Deformable organic devices
EP1467224A1 (en) 2003-04-07 2004-10-13 CSEM Centre Suisse d'Electronique et de Microtechnique SA Optical proximity detector
CA2562415C (en) 2003-04-10 2015-10-27 Tufts University Concentrated aqueous silk fibroin solutions free of organic solvents and uses thereof
US7056409B2 (en) 2003-04-17 2006-06-06 Nanosys, Inc. Structures, systems and methods for joining articles and materials and uses therefor
US7074294B2 (en) 2003-04-17 2006-07-11 Nanosys, Inc. Structures, systems and methods for joining articles and materials and uses therefor
US20050038498A1 (en) 2003-04-17 2005-02-17 Nanosys, Inc. Medical device applications of nanostructured surfaces
JP4871726B2 (ja) 2003-04-28 2012-02-08 ナノシス・インク． 超疎液性表面、その作製法及び用途
US20040211458A1 (en) 2003-04-28 2004-10-28 General Electric Company Tandem photovoltaic cell stacks
US7803574B2 (en) 2003-05-05 2010-09-28 Nanosys, Inc. Medical device applications of nanostructured surfaces
TWI427709B (zh) 2003-05-05 2014-02-21 Nanosys Inc 用於增加表面面積之應用的奈米纖維表面
AU2003902270A0 (en) 2003-05-09 2003-05-29 Origin Energy Solar Pty Ltd Separating and assembling semiconductor strips
US7244326B2 (en) 2003-05-16 2007-07-17 Alien Technology Corporation Transfer assembly for manufacturing electronic devices
WO2005000483A1 (en) 2003-06-06 2005-01-06 Tufts University Method for forming inorganic coatings
US7494896B2 (en) 2003-06-12 2009-02-24 International Business Machines Corporation Method of forming magnetic random access memory (MRAM) devices on thermally-sensitive substrates using laser transfer
US7033961B1 (en) 2003-07-15 2006-04-25 Rf Micro Devices, Inc. Epitaxy/substrate release layer
US7439158B2 (en) 2003-07-21 2008-10-21 Micron Technology, Inc. Strained semiconductor by full wafer bonding
JP2007501525A (ja) 2003-08-04 2007-01-25 ナノシス・インコーポレイテッド ナノワイヤ複合体およびこれらに由来する電子基板を作製するためのシステムおよび方法
WO2005015480A2 (en) 2003-08-09 2005-02-17 Alien Technology Corporation Methods and apparatuses to identify devices
US7223609B2 (en) 2003-08-14 2007-05-29 Agilent Technologies, Inc. Arrays for multiplexed surface plasmon resonance detection of biological molecules
JP2005072528A (ja) 2003-08-28 2005-03-17 Shin Etsu Chem Co Ltd 薄層電界効果トランジスター及びその製造方法
US7029951B2 (en) 2003-09-12 2006-04-18 International Business Machines Corporation Cooling system for a semiconductor device and method of fabricating same
KR20060098432A (ko) 2003-09-24 2006-09-18 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 반도체 장치, 식별 라벨, 정보 전달 매체 및 반도체 장치제조 방법
US20050082526A1 (en) 2003-10-15 2005-04-21 International Business Machines Corporation Techniques for layer transfer processing
DE10349963A1 (de) 2003-10-24 2005-06-02 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Herstellung einer Folie
US7689260B2 (en) 2003-11-06 2010-03-30 The Regents Of The University Of Colorado Shape-memory polymer coated electrodes
DE112004001974T5 (de) 2003-11-11 2006-08-24 Tae Ii Kim Werbefolie mit retroreflektiver Mikroprismenfolie und Verfahren zum Herstellen derselben
EP1700161B1 (en) 2003-12-01 2018-01-24 The Board of Trustees of the University of Illinois Methods and devices for fabricating three-dimensional nanoscale structures
US20050124712A1 (en) 2003-12-05 2005-06-09 3M Innovative Properties Company Process for producing photonic crystals
US20090198293A1 (en) 2003-12-19 2009-08-06 Lawrence Cauller Microtransponder Array for Implant
US7632087B2 (en) 2003-12-19 2009-12-15 Wd Media, Inc. Composite stamper for imprint lithography
DK1704585T3 (en) 2003-12-19 2017-05-22 Univ North Carolina Chapel Hill Methods for preparing isolated micro- and nanostructures using soft lithography or printing lithography
DE10361940A1 (de) 2003-12-24 2005-07-28 Restate Patent Ag Degradationssteuerung biodegradierbarer Implantate durch Beschichtung
US20050187608A1 (en) 2004-02-24 2005-08-25 O'hara Michael D. Radioprotective compound coating for medical devices
TWI299358B (en) 2004-03-12 2008-08-01 Hon Hai Prec Ind Co Ltd Thermal interface material and method for making same
US7052924B2 (en) 2004-03-29 2006-05-30 Articulated Technologies, Llc Light active sheet and methods for making the same
CN100383213C (zh) 2004-04-02 2008-04-23 清华大学 一种热界面材料及其制造方法
US20080055581A1 (en) 2004-04-27 2008-03-06 Rogers John A Devices and methods for pattern generation by ink lithography
US7195733B2 (en) * 2004-04-27 2007-03-27 The Board Of Trustees Of The University Of Illinois Composite patterning devices for soft lithography
JP2005322858A (ja) 2004-05-11 2005-11-17 Shinko Electric Ind Co Ltd 半導体装置の製造方法
US20050261561A1 (en) 2004-05-24 2005-11-24 Christopher W. Jones Blood testing and therapeutic compound delivery system
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US8217381B2 (en) * 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
CN102683391B (zh) * 2004-06-04 2015-11-18 伊利诺伊大学评议会 用于制造并组装可印刷半导体元件的方法和设备
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
US8178656B2 (en) 2004-06-11 2012-05-15 Trustees Of Tufts College Silk-based drug delivery system
US7629691B2 (en) 2004-06-16 2009-12-08 Honeywell International Inc. Conductor geometry for electronic circuits fabricated on flexible substrates
US7425523B2 (en) 2004-07-05 2008-09-16 Dai Nippon Printing Co., Ltd. Thermal transfer recording material and thermal transfer recording method
US7687886B2 (en) 2004-08-19 2010-03-30 Microlink Devices, Inc. High on-state breakdown heterojunction bipolar transistor
WO2006029034A2 (en) * 2004-09-02 2006-03-16 Philometron, Inc. Monitoring platform for detection of hypovolemia, hemorrhage and blood loss
WO2006028996A2 (en) 2004-09-03 2006-03-16 Trustees Of Tufts College Emulsan-alginate microspheres and methods of use thereof
US20080280360A1 (en) 2004-10-12 2008-11-13 Trustees Of Tufts College Method for Producing Biomaterial Scaffolds
TWI256374B (en) * 2004-10-12 2006-06-11 Ind Tech Res Inst PDMS valve-less micro pump structure and method for producing the same
US7662545B2 (en) 2004-10-14 2010-02-16 The Board Of Trustees Of The University Of Illinois Decal transfer lithography
US7621044B2 (en) 2004-10-22 2009-11-24 Formfactor, Inc. Method of manufacturing a resilient contact
US7896807B2 (en) 2004-10-29 2011-03-01 Worcester Polytechnic Institute Multi-channel electrophysiologic signal data acquisition system on an integrated circuit
CA2586197C (en) 2004-11-04 2012-08-14 Mesophotonics Limited Metal nano-void photonic crystal for enhanced raman spectroscopy
CN105696138B (zh) 2004-11-09 2019-02-01 得克萨斯大学体系董事会 纳米纤维纱线、带和板的制造和应用
US7695602B2 (en) 2004-11-12 2010-04-13 Xerox Corporation Systems and methods for transporting particles
US7408187B2 (en) * 2004-11-19 2008-08-05 Massachusetts Institute Of Technology Low-voltage organic transistors on flexible substrates using high-gate dielectric insulators by room temperature process
JP2006186294A (ja) 2004-12-03 2006-07-13 Toppan Printing Co Ltd 薄膜トランジスタ及びその製造方法
US20060127817A1 (en) 2004-12-10 2006-06-15 Eastman Kodak Company In-line fabrication of curved surface transistors
US20060129056A1 (en) 2004-12-10 2006-06-15 Washington University Electrocorticography telemitter
US7229901B2 (en) 2004-12-16 2007-06-12 Wisconsin Alumni Research Foundation Fabrication of strained heterojunction structures
US20060132025A1 (en) 2004-12-22 2006-06-22 Eastman Kodak Company Flexible display designed for minimal mechanical strain
US7960509B2 (en) 2005-01-14 2011-06-14 Trustees Of Tufts College Fibrous protein fusions and use thereof in the formation of advanced organic/inorganic composite materials
US7374968B2 (en) 2005-01-28 2008-05-20 Hewlett-Packard Development Company, L.P. Method of utilizing a contact printing stamp
US7794742B2 (en) 2005-02-08 2010-09-14 University Of Washington Devices for promoting epithelial cell differentiation and keratinization
JP2008532317A (ja) 2005-02-28 2008-08-14 シリコン・ジェネシス・コーポレーション レイヤ転送プロセス用の基板強化方法および結果のデバイス
WO2006104069A1 (ja) 2005-03-28 2006-10-05 Pioneer Corporation ゲート絶縁膜、有機トランジスタ、有機ｅｌ表示装置の製造方法、ディスプレイ
US9290579B2 (en) 2005-04-20 2016-03-22 Trustees Of Tufts College Covalently immobilized protein gradients in three-dimensional porous scaffolds
WO2006116030A2 (en) 2005-04-21 2006-11-02 Aonex Technologies, Inc. Bonded intermediate substrate and method of making same
EP2932998B1 (en) 2005-04-28 2019-12-25 Second Sight Medical Products, Inc. Flexible circuit electrode array
US8024022B2 (en) 2005-05-25 2011-09-20 Alfred E. Mann Foundation For Scientific Research Hermetically sealed three-dimensional electrode array
WO2006130721A2 (en) 2005-06-02 2006-12-07 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US7763353B2 (en) 2005-06-10 2010-07-27 Ut-Battelle, Llc Fabrication of high thermal conductivity arrays of carbon nanotubes and their composites
WO2007000037A1 (en) 2005-06-29 2007-01-04 Mitchell, Richard, J. Bendable high flux led array
US7479404B2 (en) 2005-07-08 2009-01-20 The Board Of Trustees Of The University Of Illinois Photonic crystal biosensor structure and fabrication method
ATE526378T1 (de) 2005-08-02 2011-10-15 Tufts College Verfahren zur stufenweisen ablagerung von seidenfibroinbeschichtungen
US20070043416A1 (en) 2005-08-19 2007-02-22 Cardiac Pacemakers, Inc. Implantable electrode array
KR100758699B1 (ko) 2005-08-29 2007-09-14 재단법인서울대학교산학협력재단 고종횡비 나노구조물 형성방법 및 이를 이용한 미세패턴형성방법
US8005526B2 (en) 2005-08-31 2011-08-23 The Regents Of The University Of Michigan Biologically integrated electrode devices
CN101507379A (zh) * 2005-09-06 2009-08-12 超刀片公司 三维多层模块化计算机体系结构
AU2006311850B2 (en) 2005-11-02 2011-06-16 Second Sight Medical Products, Inc. Implantable microelectronic device and method of manufacture
US20070123963A1 (en) 2005-11-29 2007-05-31 Peter Krulevitch Method for producing flexible, stretchable, and implantable high-density microelectrode arrays
DE102006008501B3 (de) 2006-02-23 2007-10-25 Albert-Ludwigs-Universität Freiburg Sonde und Verfahren zur Datenübertragung zwischen einem Gehirn und einer Datenverarbeitungsvorrichtung
EP1991723A2 (en) 2006-03-03 2008-11-19 The Board Of Trustees Of The University Of Illinois Methods of making spatially aligned nanotubes and nanotube arrays
US20080038236A1 (en) 2006-03-06 2008-02-14 Artecel Sciences, Inc. Biocompatible scaffolds and adipose-derived stem cells
US20070233208A1 (en) 2006-03-28 2007-10-04 Eastman Kodak Company Light therapy bandage with imbedded emitters
US20070227586A1 (en) 2006-03-31 2007-10-04 Kla-Tencor Technologies Corporation Detection and ablation of localized shunting defects in photovoltaics
WO2008030666A2 (en) 2006-07-25 2008-03-13 The Board Of Trustees Of The University Of Illinois Multispectral plasmonic crystal sensors
DE102006037433B4 (de) 2006-08-09 2010-08-19 Ovd Kinegram Ag Verfahren zur Herstellung eines Mehrschichtkörpers sowie Mehrschichtkörper
EP3936857B1 (en) 2006-09-01 2023-06-21 Pacific Biosciences Of California, Inc. Substrates, systems and methods for analyzing materials
EP2064710A4 (en) 2006-09-06 2011-05-04 Univ Illinois CONTROLLED BUCKET STRUCTURES IN SEMICONDUCTOR CONNECTIONS AND NANOMEMBRANES FOR EXPANDABLE ELECTRONIC ARTICLES
KR101430587B1 (ko) 2006-09-20 2014-08-14 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들
EP1903000B1 (fr) 2006-09-25 2019-09-18 Sorin CRM SAS Composant biocompatible implantable incorporant un élément actif intégré tel qu'un capteur de mesure d'un paramètre physiologique, microsystème électromécanique ou circuit électronique
WO2008118133A2 (en) 2006-09-26 2008-10-02 Trustees Of Tufts College Silk microspheres for encapsulation and controlled release
US8195021B2 (en) 2006-11-03 2012-06-05 Tufts University/Trustees Of Tufts College Biopolymer optical waveguide and method of manufacturing the same
US8529835B2 (en) 2006-11-03 2013-09-10 Tufts University Biopolymer sensor and method of manufacturing the same
JP2010509645A (ja) 2006-11-03 2010-03-25 トラスティーズ オブ タフツ カレッジ ナノパターンが形成されたバイオポリマー光学デバイスおよびその製造方法
WO2008118211A2 (en) 2006-11-03 2008-10-02 Trustees Of Tufts College Biopolymer photonic crystals and method of manufacturing the same
US20100068740A1 (en) 2006-11-03 2010-03-18 Trustees Of Tufts College Microfluidic device with a cylindrical microchannel and a method for fabricating same
US7868354B2 (en) * 2006-11-08 2011-01-11 Duke University GaN-based nitric oxide sensors and methods of making and using the same
WO2008108838A2 (en) 2006-11-21 2008-09-12 Charles Stark Draper Laboratory, Inc. Microfluidic devices and methods for fabricating the same
WO2008085904A1 (en) 2007-01-05 2008-07-17 Charles Stark Draper Laboratory, Inc. Biodegradable electronic devices
KR101519038B1 (ko) 2007-01-17 2015-05-11 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 프린팅­기반 어셈블리에 의해 제조되는 광학 시스템
JP2008202022A (ja) 2007-01-23 2008-09-04 Fujifilm Corp 光ナノインプリントリソグラフィ用硬化性組成物およびそれを用いたパターン形成方法
US8057390B2 (en) 2007-01-26 2011-11-15 The Regents Of The University Of Michigan High-resolution mapping of bio-electric fields
WO2008106485A2 (en) 2007-02-27 2008-09-04 Trustees Of Tufts College Tissue-engineered silk organs
JP2008237686A (ja) * 2007-03-28 2008-10-09 Sanyo Electric Co Ltd 伸縮可能センサ及び該センサを用いた体調管理装置
WO2008136958A1 (en) 2007-04-30 2008-11-13 Opthera, Inc. Uva1-led phototherapy device and method
US8803781B2 (en) 2007-05-18 2014-08-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
KR20100029217A (ko) 2007-05-29 2010-03-16 트러스티즈 오브 터프츠 칼리지 음파 처리를 이용한 실크 피브로인 겔화 방법
WO2009011709A1 (en) 2007-07-19 2009-01-22 The Board Of Trustees Of The University Of Illinois High resolution electrohydrodynamic jet printing for manufacturing systems
US9808557B2 (en) 2007-08-10 2017-11-07 Trustees Of Tufts College Tubular silk compositions and methods of use thereof
JP4594973B2 (ja) * 2007-09-26 2010-12-08 株式会社東芝 不揮発性半導体記憶装置
JP2009088269A (ja) * 2007-09-28 2009-04-23 Toshiba Corp 半導体装置、およびその製造方法
CA2742844C (en) 2007-11-05 2017-02-28 Trustees Of Tufts College Fabrication of silk fibroin photonic structures by nanocontact imprinting
US20090149930A1 (en) 2007-12-07 2009-06-11 Thermage, Inc. Apparatus and methods for cooling a treatment apparatus configured to non-invasively deliver electromagnetic energy to a patient's tissue
AU2008336322B2 (en) 2007-12-10 2013-02-14 Neuronano Ab Medical electrode, electrode bundle and electrode bundle array
US8290557B2 (en) 2007-12-12 2012-10-16 Medtronic, Inc. Implantable optical sensor and method for use
GB0800797D0 (en) 2008-01-16 2008-02-27 Cambridge Entpr Ltd Neural interface
CA2713251A1 (en) 2008-02-07 2009-08-13 Trustees Of Tufts College 3-dimensional silk hydroxyapatite compositions
CN103872002B (zh) 2008-03-05 2017-03-01 伊利诺伊大学评议会 可拉伸和可折叠的电子器件
WO2009114115A1 (en) 2008-03-10 2009-09-17 S.E.A. Medical Systems, Inc. Intravenous fluid monitoring
EP2265171B1 (en) 2008-03-12 2016-03-09 The Trustees of the University of Pennsylvania Flexible and scalable sensor arrays for recording and modulating physiologic activity
US8206774B2 (en) 2008-03-13 2012-06-26 Trustees Of Tufts College Diazonium salt modification of silk polymer
WO2009118678A1 (en) 2008-03-26 2009-10-01 Philips Intellectual Property & Standards Gmbh Light emitting diode device
US8470701B2 (en) 2008-04-03 2013-06-25 Advanced Diamond Technologies, Inc. Printable, flexible and stretchable diamond for thermal management
US9068282B2 (en) 2008-04-08 2015-06-30 Trustees Of Tufts College System and method for making biomaterial structures
MX341351B (es) 2008-05-15 2016-08-17 Tufts College Liberacion de adenosina basada en polimero de seda: potencial terapeutico para la epilepsia.
WO2010005707A1 (en) 2008-06-16 2010-01-14 The Board Of Trustees Of The University Of Illinois Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates
WO2009155397A2 (en) 2008-06-18 2009-12-23 Trustees Of Tufts College Edible holographic silk products
WO2010036807A1 (en) 2008-09-24 2010-04-01 The Board Of Trustees Of The University Of Illinois Arrays of ultrathin silicon solar microcells
EP2703017B1 (en) 2008-09-26 2017-03-01 Trustees Of Tufts College Active silk muco-adhesives, silk electrogelation process, and devices
US20110223153A1 (en) 2008-10-09 2011-09-15 Trustees Of Tufts College Modified silk films containing glycerol
CN102281834B (zh) 2008-10-10 2017-08-22 卡斯滕·尼尔斯·古特 用于植入的装置和用于植入的方法
CN102203935A (zh) 2008-10-27 2011-09-28 Nxp股份有限公司 生物兼容电极
WO2010057142A2 (en) 2008-11-17 2010-05-20 Trustees Of Tufts College Surface modification of silk fibroin matrices with poly(ethylene glycol) useful as anti adhesion barriers and anti thrombotic materials
WO2010065957A2 (en) 2008-12-05 2010-06-10 Trustees Of Tufts College Vascularized living skin constructs and methods of use thereof
KR100992411B1 (ko) 2009-02-06 2010-11-05 (주)실리콘화일 피사체의 근접여부 판단이 가능한 이미지센서
EP2396276B1 (en) 2009-02-12 2016-08-31 Trustees Of Tufts College Nanoimprinting of silk fibroin structures for biomedical and biophotonic applications
JP5909362B2 (ja) 2009-03-04 2016-04-26 タフツ ユニバーシティー／トラスティーズ オブ タフツ カレッジ 抗生物質送達のための絹フィブロインシステム
TWI592996B (zh) 2009-05-12 2017-07-21 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
WO2011005381A2 (en) 2009-06-01 2011-01-13 Trustees Of Tufts College Vortex-induced silk fibroin gelation for encapsulation and delivery
US20120171770A1 (en) 2009-07-10 2012-07-05 Trustees Of Tufts College Bioengineered silk protein-based nucleic acid delivery systems
WO2011008842A2 (en) 2009-07-14 2011-01-20 Trustees Of Tufts College Electrospun silk material systems for wound healing
AU2010307268B2 (en) 2009-07-20 2015-05-14 Tufts University/Trustees Of Tufts College All-protein implantable, resorbable reflectors
US8293486B2 (en) 2009-07-21 2012-10-23 Trustees Of Tufts College Functionalization of silk material by avidin-biotin interaction
WO2011026101A2 (en) 2009-08-31 2011-03-03 Trustees Of Tufts College Silk transistor devices
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