TW200849453A - Substrate processing apparatus, substrate processing method and computer readable storage medium - Google Patents
Substrate processing apparatus, substrate processing method and computer readable storage medium Download PDFInfo
- Publication number
- TW200849453A TW200849453A TW097111516A TW97111516A TW200849453A TW 200849453 A TW200849453 A TW 200849453A TW 097111516 A TW097111516 A TW 097111516A TW 97111516 A TW97111516 A TW 97111516A TW 200849453 A TW200849453 A TW 200849453A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- storage
- transfer
- storage rack
- unit
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 236
- 238000003860 storage Methods 0.000 title claims abstract description 221
- 238000012545 processing Methods 0.000 title claims abstract description 122
- 238000003672 processing method Methods 0.000 title claims description 12
- 238000012546 transfer Methods 0.000 claims abstract description 107
- 230000007246 mechanism Effects 0.000 claims abstract description 31
- 238000010926 purge Methods 0.000 claims description 14
- 239000007795 chemical reaction product Substances 0.000 claims description 10
- 235000010627 Phaseolus vulgaris Nutrition 0.000 claims 1
- 244000046052 Phaseolus vulgaris Species 0.000 claims 1
- 239000008267 milk Substances 0.000 claims 1
- 210000004080 milk Anatomy 0.000 claims 1
- 235000013336 milk Nutrition 0.000 claims 1
- 238000013022 venting Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 67
- 238000000746 purification Methods 0.000 description 39
- 239000007789 gas Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 19
- 230000008569 process Effects 0.000 description 17
- 238000004140 cleaning Methods 0.000 description 14
- 238000013461 design Methods 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 206010011469 Crying Diseases 0.000 description 1
- 241000219112 Cucumis Species 0.000 description 1
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Warehouses Or Storage Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007095376A JP4816545B2 (ja) | 2007-03-30 | 2007-03-30 | 基板処理装置、基板処理方法及び記憶媒体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200849453A true TW200849453A (en) | 2008-12-16 |
| TWI379378B TWI379378B (enExample) | 2012-12-11 |
Family
ID=39808296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097111516A TW200849453A (en) | 2007-03-30 | 2008-03-28 | Substrate processing apparatus, substrate processing method and computer readable storage medium |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8382088B2 (enExample) |
| JP (1) | JP4816545B2 (enExample) |
| KR (1) | KR101024530B1 (enExample) |
| CN (1) | CN101542713B (enExample) |
| TW (1) | TW200849453A (enExample) |
| WO (1) | WO2008120716A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI789436B (zh) * | 2017-10-11 | 2023-01-11 | 日商樂華股份有限公司 | 收納盒開啟器 |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4816545B2 (ja) * | 2007-03-30 | 2011-11-16 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| GB2452320B (en) * | 2007-09-03 | 2012-04-11 | Dek Int Gmbh | Workpiece processing system and method |
| JP2010123733A (ja) * | 2008-11-19 | 2010-06-03 | Tokyo Electron Ltd | 基板処理装置及びその処理方法、並びに記憶媒体 |
| JP5410794B2 (ja) * | 2009-03-17 | 2014-02-05 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP5358366B2 (ja) | 2009-09-14 | 2013-12-04 | 東京エレクトロン株式会社 | 基板処理装置及び方法 |
| JP5947030B2 (ja) * | 2010-12-28 | 2016-07-06 | キヤノンアネルバ株式会社 | 基板処理方法、基板処理装置 |
| KR101293025B1 (ko) * | 2011-12-22 | 2013-08-05 | 에스엔유 프리시젼 주식회사 | 마스크 적재 및 기판 반송 챔버와, 마스크 적재 및 기판 반송 챔버의 운용방법 |
| JP2013172015A (ja) * | 2012-02-21 | 2013-09-02 | Hitachi High-Technologies Corp | 成膜装置、及び成膜装置用基板搬送機構 |
| JP5959914B2 (ja) * | 2012-04-18 | 2016-08-02 | 東京エレクトロン株式会社 | 基板処理システム、基板搬送方法および記憶媒体 |
| JP2013247283A (ja) * | 2012-05-28 | 2013-12-09 | Tokyo Electron Ltd | 搬送機構、搬送方法及び処理システム |
| JP5954108B2 (ja) * | 2012-10-23 | 2016-07-20 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP6016584B2 (ja) * | 2012-11-08 | 2016-10-26 | 東京エレクトロン株式会社 | ロードロック装置 |
| JP2014116545A (ja) * | 2012-12-12 | 2014-06-26 | Tokyo Electron Ltd | 基板処理装置 |
| KR101575129B1 (ko) * | 2014-01-13 | 2015-12-08 | 피에스케이 주식회사 | 기판 이송 장치 및 방법, 그리고 기판 처리 장치 |
| JP6494443B2 (ja) * | 2015-06-15 | 2019-04-03 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
| US10388547B2 (en) * | 2017-06-23 | 2019-08-20 | Applied Materials, Inc. | Side storage pods, equipment front end modules, and methods for processing substrates |
| KR102360219B1 (ko) | 2017-06-23 | 2022-02-08 | 어플라이드 머티어리얼스, 인코포레이티드 | 인덱서블 측면 저장 포드 장치, 가열식 측면 저장 포드 장치, 시스템들, 및 방법들 |
| KR102110307B1 (ko) | 2018-04-23 | 2020-05-14 | 코스텍시스템(주) | 웨이퍼 이송 장치 |
| JP7349240B2 (ja) * | 2018-10-05 | 2023-09-22 | 東京エレクトロン株式会社 | 基板倉庫及び基板検査方法 |
| US11373891B2 (en) * | 2018-10-26 | 2022-06-28 | Applied Materials, Inc. | Front-ducted equipment front end modules, side storage pods, and methods of operating the same |
| US11244844B2 (en) * | 2018-10-26 | 2022-02-08 | Applied Materials, Inc. | High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods |
| CN109671658B (zh) * | 2018-11-29 | 2021-02-09 | 苏州方昇光电股份有限公司 | 基片装载系统及其基片装载方法 |
| KR102227066B1 (ko) | 2019-01-28 | 2021-03-15 | 코스텍시스템(주) | 웨이퍼 이송 장치 |
| JP7591370B2 (ja) * | 2020-08-28 | 2024-11-28 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| CN113299586B (zh) * | 2021-07-28 | 2021-10-19 | 四川通妙科技有限公司 | 一种芯片晶圆暂存装置及芯片晶圆暂存取件方法 |
| TWI823271B (zh) * | 2022-02-24 | 2023-11-21 | 天虹科技股份有限公司 | 基板傳送方法 |
| CN117083700A (zh) | 2022-03-15 | 2023-11-17 | 株式会社日立高新技术 | 真空处理装置 |
| JP7215629B1 (ja) | 2022-07-14 | 2023-01-31 | Ｊｆｅエンジニアリング株式会社 | バッテリ交換装置 |
| CN118016573B (zh) * | 2023-11-21 | 2025-06-20 | 唯实先端智能科技(苏州)有限公司 | 一种新型导流结构及高洁净晶圆光罩存储库 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2899192B2 (ja) * | 1993-03-03 | 1999-06-02 | 三菱マテリアルシリコン株式会社 | 半導体ウェーハの厚さ分類装置 |
| JPH06329208A (ja) * | 1993-05-20 | 1994-11-29 | Kokusai Electric Co Ltd | 半導体製造装置のウェーハ搬送装置 |
| JPH07117809A (ja) * | 1993-10-21 | 1995-05-09 | Ebara Corp | 真空保管庫 |
| JP2952748B2 (ja) * | 1994-11-24 | 1999-09-27 | 光洋リンドバーグ株式会社 | 熱処理装置 |
| US5944940A (en) * | 1996-07-09 | 1999-08-31 | Gamma Precision Technology, Inc. | Wafer transfer system and method of using the same |
| JPH11111810A (ja) * | 1997-10-07 | 1999-04-23 | Tokyo Electron Ltd | カセット室 |
| JPH11251255A (ja) * | 1998-02-27 | 1999-09-17 | Super Silicon Kenkyusho:Kk | 半導体ウエハ製造方法及び装置 |
| JP2002222844A (ja) * | 2001-01-24 | 2002-08-09 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
| JP3920720B2 (ja) * | 2002-03-29 | 2007-05-30 | 株式会社荏原製作所 | 基板受渡し方法、基板受渡し機構及び基板研磨装置 |
| JP2004304116A (ja) * | 2003-04-01 | 2004-10-28 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| EP1661161A2 (en) * | 2003-08-07 | 2006-05-31 | Sundew Technologies, LLC | Perimeter partition-valve with protected seals |
| JP4695936B2 (ja) * | 2005-07-15 | 2011-06-08 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| JP4816545B2 (ja) * | 2007-03-30 | 2011-11-16 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| JP4987812B2 (ja) * | 2007-09-06 | 2012-07-25 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法及び基板処理装置 |
| JP2009170547A (ja) * | 2008-01-11 | 2009-07-30 | Tokyo Electron Ltd | 基板処理方法，基板処理装置，記録媒体 |
| JP4875190B2 (ja) * | 2009-08-31 | 2012-02-15 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
-
2007
- 2007-03-30 JP JP2007095376A patent/JP4816545B2/ja not_active Expired - Fee Related
-
2008
- 2008-03-28 WO PCT/JP2008/056082 patent/WO2008120716A1/ja not_active Ceased
- 2008-03-28 KR KR1020087019754A patent/KR101024530B1/ko not_active Expired - Fee Related
- 2008-03-28 CN CN2008800001223A patent/CN101542713B/zh not_active Expired - Fee Related
- 2008-03-28 US US12/532,190 patent/US8382088B2/en not_active Expired - Fee Related
- 2008-03-28 TW TW097111516A patent/TW200849453A/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI789436B (zh) * | 2017-10-11 | 2023-01-11 | 日商樂華股份有限公司 | 收納盒開啟器 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI379378B (enExample) | 2012-12-11 |
| KR20090094054A (ko) | 2009-09-03 |
| JP2008258188A (ja) | 2008-10-23 |
| WO2008120716A1 (ja) | 2008-10-09 |
| KR101024530B1 (ko) | 2011-03-31 |
| JP4816545B2 (ja) | 2011-11-16 |
| CN101542713B (zh) | 2012-05-30 |
| US20100102030A1 (en) | 2010-04-29 |
| US8382088B2 (en) | 2013-02-26 |
| CN101542713A (zh) | 2009-09-23 |
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