CN101542713B - 基板处理装置和基板处理方法 - Google Patents

基板处理装置和基板处理方法 Download PDF

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Publication number
CN101542713B
CN101542713B CN2008800001223A CN200880000122A CN101542713B CN 101542713 B CN101542713 B CN 101542713B CN 2008800001223 A CN2008800001223 A CN 2008800001223A CN 200880000122 A CN200880000122 A CN 200880000122A CN 101542713 B CN101542713 B CN 101542713B
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CN
China
Prior art keywords
substrate
mentioned
storage rack
storage
conveying chamber
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Expired - Fee Related
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CN2008800001223A
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English (en)
Chinese (zh)
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CN101542713A (zh
Inventor
近藤圭祐
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Warehouses Or Storage Devices (AREA)
CN2008800001223A 2007-03-30 2008-03-28 基板处理装置和基板处理方法 Expired - Fee Related CN101542713B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007095376A JP4816545B2 (ja) 2007-03-30 2007-03-30 基板処理装置、基板処理方法及び記憶媒体
JP095376/2007 2007-03-30
PCT/JP2008/056082 WO2008120716A1 (ja) 2007-03-30 2008-03-28 基板処理装置、基板処理方法及びコンピュータ可読記憶媒体

Publications (2)

Publication Number Publication Date
CN101542713A CN101542713A (zh) 2009-09-23
CN101542713B true CN101542713B (zh) 2012-05-30

Family

ID=39808296

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008800001223A Expired - Fee Related CN101542713B (zh) 2007-03-30 2008-03-28 基板处理装置和基板处理方法

Country Status (6)

Country Link
US (1) US8382088B2 (enExample)
JP (1) JP4816545B2 (enExample)
KR (1) KR101024530B1 (enExample)
CN (1) CN101542713B (enExample)
TW (1) TW200849453A (enExample)
WO (1) WO2008120716A1 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4816545B2 (ja) * 2007-03-30 2011-11-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
GB2452320B (en) * 2007-09-03 2012-04-11 Dek Int Gmbh Workpiece processing system and method
JP2010123733A (ja) * 2008-11-19 2010-06-03 Tokyo Electron Ltd 基板処理装置及びその処理方法、並びに記憶媒体
JP5410794B2 (ja) * 2009-03-17 2014-02-05 東京エレクトロン株式会社 基板処理装置
JP5358366B2 (ja) 2009-09-14 2013-12-04 東京エレクトロン株式会社 基板処理装置及び方法
JP5947030B2 (ja) * 2010-12-28 2016-07-06 キヤノンアネルバ株式会社 基板処理方法、基板処理装置
KR101293025B1 (ko) * 2011-12-22 2013-08-05 에스엔유 프리시젼 주식회사 마스크 적재 및 기판 반송 챔버와, 마스크 적재 및 기판 반송 챔버의 운용방법
JP2013172015A (ja) * 2012-02-21 2013-09-02 Hitachi High-Technologies Corp 成膜装置、及び成膜装置用基板搬送機構
JP5959914B2 (ja) * 2012-04-18 2016-08-02 東京エレクトロン株式会社 基板処理システム、基板搬送方法および記憶媒体
JP2013247283A (ja) * 2012-05-28 2013-12-09 Tokyo Electron Ltd 搬送機構、搬送方法及び処理システム
JP5954108B2 (ja) * 2012-10-23 2016-07-20 東京エレクトロン株式会社 基板処理装置
JP6016584B2 (ja) * 2012-11-08 2016-10-26 東京エレクトロン株式会社 ロードロック装置
JP2014116545A (ja) * 2012-12-12 2014-06-26 Tokyo Electron Ltd 基板処理装置
KR101575129B1 (ko) * 2014-01-13 2015-12-08 피에스케이 주식회사 기판 이송 장치 및 방법, 그리고 기판 처리 장치
JP6494443B2 (ja) * 2015-06-15 2019-04-03 東京エレクトロン株式会社 成膜方法及び成膜装置
US10388547B2 (en) * 2017-06-23 2019-08-20 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for processing substrates
TWI717034B (zh) 2017-06-23 2021-01-21 美商應用材料股份有限公司 側儲存倉、電子裝置處理系統、和處理基板的方法
EP3696847B1 (en) 2017-10-11 2023-06-07 Rorze Corporation Pod opener
KR102110307B1 (ko) 2018-04-23 2020-05-14 코스텍시스템(주) 웨이퍼 이송 장치
JP7349240B2 (ja) * 2018-10-05 2023-09-22 東京エレクトロン株式会社 基板倉庫及び基板検査方法
US11373891B2 (en) * 2018-10-26 2022-06-28 Applied Materials, Inc. Front-ducted equipment front end modules, side storage pods, and methods of operating the same
US11244844B2 (en) * 2018-10-26 2022-02-08 Applied Materials, Inc. High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods
CN109671658B (zh) * 2018-11-29 2021-02-09 苏州方昇光电股份有限公司 基片装载系统及其基片装载方法
KR102227066B1 (ko) 2019-01-28 2021-03-15 코스텍시스템(주) 웨이퍼 이송 장치
JP7591370B2 (ja) * 2020-08-28 2024-11-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN113299586B (zh) * 2021-07-28 2021-10-19 四川通妙科技有限公司 一种芯片晶圆暂存装置及芯片晶圆暂存取件方法
TWI823271B (zh) * 2022-02-24 2023-11-21 天虹科技股份有限公司 基板傳送方法
CN117083700A (zh) 2022-03-15 2023-11-17 株式会社日立高新技术 真空处理装置
JP7215629B1 (ja) 2022-07-14 2023-01-31 Ｊｆｅエンジニアリング株式会社 バッテリ交換装置
CN118016573B (zh) * 2023-11-21 2025-06-20 唯实先端智能科技(苏州)有限公司 一种新型导流结构及高洁净晶圆光罩存储库

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260546A (ja) 1993-03-03 1994-09-16 Mitsubishi Materials Shilicon Corp 半導体ウェーハの厚さ分類装置
JPH06329208A (ja) 1993-05-20 1994-11-29 Kokusai Electric Co Ltd 半導体製造装置のウェーハ搬送装置
JPH07117809A (ja) 1993-10-21 1995-05-09 Ebara Corp 真空保管庫
JPH08148503A (ja) 1994-11-24 1996-06-07 Koyo Rindobaagu Kk 熱処理装置
JPH11111810A (ja) 1997-10-07 1999-04-23 Tokyo Electron Ltd カセット室
JP2002222844A (ja) * 2001-01-24 2002-08-09 Hitachi Kokusai Electric Inc 半導体製造装置
JP2004304116A (ja) * 2003-04-01 2004-10-28 Hitachi Kokusai Electric Inc 基板処理装置
JP2007027339A (ja) * 2005-07-15 2007-02-01 Hitachi High-Technologies Corp プラズマ処理装置

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US5944940A (en) * 1996-07-09 1999-08-31 Gamma Precision Technology, Inc. Wafer transfer system and method of using the same
JPH11251255A (ja) * 1998-02-27 1999-09-17 Super Silicon Kenkyusho:Kk 半導体ウエハ製造方法及び装置
JP3920720B2 (ja) * 2002-03-29 2007-05-30 株式会社荏原製作所 基板受渡し方法、基板受渡し機構及び基板研磨装置
US7682454B2 (en) * 2003-08-07 2010-03-23 Sundew Technologies, Llc Perimeter partition-valve with protected seals and associated small size process chambers and multiple chamber systems
JP4816545B2 (ja) * 2007-03-30 2011-11-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP4987812B2 (ja) * 2007-09-06 2012-07-25 株式会社日立国際電気 半導体装置の製造方法、基板処理方法及び基板処理装置
JP2009170547A (ja) * 2008-01-11 2009-07-30 Tokyo Electron Ltd 基板処理方法，基板処理装置，記録媒体
JP4875190B2 (ja) * 2009-08-31 2012-02-15 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260546A (ja) 1993-03-03 1994-09-16 Mitsubishi Materials Shilicon Corp 半導体ウェーハの厚さ分類装置
JPH06329208A (ja) 1993-05-20 1994-11-29 Kokusai Electric Co Ltd 半導体製造装置のウェーハ搬送装置
JPH07117809A (ja) 1993-10-21 1995-05-09 Ebara Corp 真空保管庫
JPH08148503A (ja) 1994-11-24 1996-06-07 Koyo Rindobaagu Kk 熱処理装置
JPH11111810A (ja) 1997-10-07 1999-04-23 Tokyo Electron Ltd カセット室
JP2002222844A (ja) * 2001-01-24 2002-08-09 Hitachi Kokusai Electric Inc 半導体製造装置
JP2004304116A (ja) * 2003-04-01 2004-10-28 Hitachi Kokusai Electric Inc 基板処理装置
JP2007027339A (ja) * 2005-07-15 2007-02-01 Hitachi High-Technologies Corp プラズマ処理装置

Also Published As

Publication number Publication date
JP4816545B2 (ja) 2011-11-16
KR101024530B1 (ko) 2011-03-31
WO2008120716A1 (ja) 2008-10-09
KR20090094054A (ko) 2009-09-03
JP2008258188A (ja) 2008-10-23
US8382088B2 (en) 2013-02-26
CN101542713A (zh) 2009-09-23
US20100102030A1 (en) 2010-04-29
TWI379378B (enExample) 2012-12-11
TW200849453A (en) 2008-12-16

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