WO2008120716A1 - 基板処理装置、基板処理方法及びコンピュータ可読記憶媒体 - Google Patents

基板処理装置、基板処理方法及びコンピュータ可読記憶媒体 Download PDF

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Publication number
WO2008120716A1
WO2008120716A1 PCT/JP2008/056082 JP2008056082W WO2008120716A1 WO 2008120716 A1 WO2008120716 A1 WO 2008120716A1 JP 2008056082 W JP2008056082 W JP 2008056082W WO 2008120716 A1 WO2008120716 A1 WO 2008120716A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
storing
substrate processing
transfer
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/056082
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Keisuke Kondoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to CN2008800001223A priority Critical patent/CN101542713B/zh
Priority to US12/532,190 priority patent/US8382088B2/en
Publication of WO2008120716A1 publication Critical patent/WO2008120716A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Warehouses Or Storage Devices (AREA)
PCT/JP2008/056082 2007-03-30 2008-03-28 基板処理装置、基板処理方法及びコンピュータ可読記憶媒体 Ceased WO2008120716A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800001223A CN101542713B (zh) 2007-03-30 2008-03-28 基板处理装置和基板处理方法
US12/532,190 US8382088B2 (en) 2007-03-30 2008-03-28 Substrate processing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007095376A JP4816545B2 (ja) 2007-03-30 2007-03-30 基板処理装置、基板処理方法及び記憶媒体
JP2007-095376 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008120716A1 true WO2008120716A1 (ja) 2008-10-09

Family

ID=39808296

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056082 Ceased WO2008120716A1 (ja) 2007-03-30 2008-03-28 基板処理装置、基板処理方法及びコンピュータ可読記憶媒体

Country Status (6)

Country Link
US (1) US8382088B2 (enExample)
JP (1) JP4816545B2 (enExample)
KR (1) KR101024530B1 (enExample)
CN (1) CN101542713B (enExample)
TW (1) TW200849453A (enExample)
WO (1) WO2008120716A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100236718A1 (en) * 2009-03-17 2010-09-23 Tokyo Electron Limited Substrate processing apparatus
CN118016573A (zh) * 2023-11-21 2024-05-10 唯实先端智能科技(苏州)有限公司 一种新型导流结构及高洁净晶圆光罩存储库

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4816545B2 (ja) * 2007-03-30 2011-11-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
GB2452320B (en) * 2007-09-03 2012-04-11 Dek Int Gmbh Workpiece processing system and method
JP2010123733A (ja) * 2008-11-19 2010-06-03 Tokyo Electron Ltd 基板処理装置及びその処理方法、並びに記憶媒体
JP5358366B2 (ja) * 2009-09-14 2013-12-04 東京エレクトロン株式会社 基板処理装置及び方法
JP5947030B2 (ja) 2010-12-28 2016-07-06 キヤノンアネルバ株式会社 基板処理方法、基板処理装置
KR101293025B1 (ko) * 2011-12-22 2013-08-05 에스엔유 프리시젼 주식회사 마스크 적재 및 기판 반송 챔버와, 마스크 적재 및 기판 반송 챔버의 운용방법
JP2013172015A (ja) * 2012-02-21 2013-09-02 Hitachi High-Technologies Corp 成膜装置、及び成膜装置用基板搬送機構
JP5959914B2 (ja) * 2012-04-18 2016-08-02 東京エレクトロン株式会社 基板処理システム、基板搬送方法および記憶媒体
JP2013247283A (ja) * 2012-05-28 2013-12-09 Tokyo Electron Ltd 搬送機構、搬送方法及び処理システム
JP5954108B2 (ja) * 2012-10-23 2016-07-20 東京エレクトロン株式会社 基板処理装置
JP6016584B2 (ja) * 2012-11-08 2016-10-26 東京エレクトロン株式会社 ロードロック装置
JP2014116545A (ja) * 2012-12-12 2014-06-26 Tokyo Electron Ltd 基板処理装置
KR101575129B1 (ko) * 2014-01-13 2015-12-08 피에스케이 주식회사 기판 이송 장치 및 방법, 그리고 기판 처리 장치
JP6494443B2 (ja) * 2015-06-15 2019-04-03 東京エレクトロン株式会社 成膜方法及び成膜装置
US10388547B2 (en) * 2017-06-23 2019-08-20 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for processing substrates
KR102360219B1 (ko) 2017-06-23 2022-02-08 어플라이드 머티어리얼스, 인코포레이티드 인덱서블 측면 저장 포드 장치, 가열식 측면 저장 포드 장치, 시스템들, 및 방법들
EP3696847B1 (en) 2017-10-11 2023-06-07 Rorze Corporation Pod opener
KR102110307B1 (ko) 2018-04-23 2020-05-14 코스텍시스템(주) 웨이퍼 이송 장치
JP7349240B2 (ja) * 2018-10-05 2023-09-22 東京エレクトロン株式会社 基板倉庫及び基板検査方法
US11244844B2 (en) * 2018-10-26 2022-02-08 Applied Materials, Inc. High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods
US11373891B2 (en) * 2018-10-26 2022-06-28 Applied Materials, Inc. Front-ducted equipment front end modules, side storage pods, and methods of operating the same
CN109671658B (zh) * 2018-11-29 2021-02-09 苏州方昇光电股份有限公司 基片装载系统及其基片装载方法
KR102227066B1 (ko) 2019-01-28 2021-03-15 코스텍시스템(주) 웨이퍼 이송 장치
JP7591370B2 (ja) * 2020-08-28 2024-11-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN113299586B (zh) * 2021-07-28 2021-10-19 四川通妙科技有限公司 一种芯片晶圆暂存装置及芯片晶圆暂存取件方法
TWI823271B (zh) * 2022-02-24 2023-11-21 天虹科技股份有限公司 基板傳送方法
WO2023175743A1 (ja) * 2022-03-15 2023-09-21 株式会社日立ハイテク 真空処理装置
JP7215629B1 (ja) 2022-07-14 2023-01-31 Ｊｆｅエンジニアリング株式会社 バッテリ交換装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260546A (ja) * 1993-03-03 1994-09-16 Mitsubishi Materials Shilicon Corp 半導体ウェーハの厚さ分類装置
JPH06329208A (ja) * 1993-05-20 1994-11-29 Kokusai Electric Co Ltd 半導体製造装置のウェーハ搬送装置
JPH07117809A (ja) * 1993-10-21 1995-05-09 Ebara Corp 真空保管庫
JPH08148503A (ja) * 1994-11-24 1996-06-07 Koyo Rindobaagu Kk 熱処理装置
JPH11111810A (ja) * 1997-10-07 1999-04-23 Tokyo Electron Ltd カセット室
JP2002222844A (ja) * 2001-01-24 2002-08-09 Hitachi Kokusai Electric Inc 半導体製造装置
JP2004304116A (ja) * 2003-04-01 2004-10-28 Hitachi Kokusai Electric Inc 基板処理装置
JP2007027339A (ja) * 2005-07-15 2007-02-01 Hitachi High-Technologies Corp プラズマ処理装置

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US5944940A (en) * 1996-07-09 1999-08-31 Gamma Precision Technology, Inc. Wafer transfer system and method of using the same
JPH11251255A (ja) * 1998-02-27 1999-09-17 Super Silicon Kenkyusho:Kk 半導体ウエハ製造方法及び装置
JP3920720B2 (ja) * 2002-03-29 2007-05-30 株式会社荏原製作所 基板受渡し方法、基板受渡し機構及び基板研磨装置
WO2005015613A2 (en) * 2003-08-07 2005-02-17 Sundew Technologies, Llc Perimeter partition-valve with protected seals
JP4816545B2 (ja) * 2007-03-30 2011-11-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP4987812B2 (ja) * 2007-09-06 2012-07-25 株式会社日立国際電気 半導体装置の製造方法、基板処理方法及び基板処理装置
JP2009170547A (ja) * 2008-01-11 2009-07-30 Tokyo Electron Ltd 基板処理方法，基板処理装置，記録媒体
JP4875190B2 (ja) * 2009-08-31 2012-02-15 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260546A (ja) * 1993-03-03 1994-09-16 Mitsubishi Materials Shilicon Corp 半導体ウェーハの厚さ分類装置
JPH06329208A (ja) * 1993-05-20 1994-11-29 Kokusai Electric Co Ltd 半導体製造装置のウェーハ搬送装置
JPH07117809A (ja) * 1993-10-21 1995-05-09 Ebara Corp 真空保管庫
JPH08148503A (ja) * 1994-11-24 1996-06-07 Koyo Rindobaagu Kk 熱処理装置
JPH11111810A (ja) * 1997-10-07 1999-04-23 Tokyo Electron Ltd カセット室
JP2002222844A (ja) * 2001-01-24 2002-08-09 Hitachi Kokusai Electric Inc 半導体製造装置
JP2004304116A (ja) * 2003-04-01 2004-10-28 Hitachi Kokusai Electric Inc 基板処理装置
JP2007027339A (ja) * 2005-07-15 2007-02-01 Hitachi High-Technologies Corp プラズマ処理装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100236718A1 (en) * 2009-03-17 2010-09-23 Tokyo Electron Limited Substrate processing apparatus
US9330950B2 (en) * 2009-03-17 2016-05-03 Tokyo Electron Limited Substrate processing apparatus
CN118016573A (zh) * 2023-11-21 2024-05-10 唯实先端智能科技(苏州)有限公司 一种新型导流结构及高洁净晶圆光罩存储库

Also Published As

Publication number Publication date
JP2008258188A (ja) 2008-10-23
CN101542713B (zh) 2012-05-30
TWI379378B (enExample) 2012-12-11
KR20090094054A (ko) 2009-09-03
KR101024530B1 (ko) 2011-03-31
US20100102030A1 (en) 2010-04-29
CN101542713A (zh) 2009-09-23
JP4816545B2 (ja) 2011-11-16
US8382088B2 (en) 2013-02-26
TW200849453A (en) 2008-12-16

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