WO2009142446A3 - 진공처리시스템, 진공처리시스템에 사용되는 버퍼모듈 및 진공처리시스템의 트레이 이송방법 - Google Patents

진공처리시스템, 진공처리시스템에 사용되는 버퍼모듈 및 진공처리시스템의 트레이 이송방법 Download PDF

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WO2009142446A3
WO2009142446A3 PCT/KR2009/002678 KR2009002678W WO2009142446A3 WO 2009142446 A3 WO2009142446 A3 WO 2009142446A3 KR 2009002678 W KR2009002678 W KR 2009002678W WO 2009142446 A3 WO2009142446 A3 WO 2009142446A3
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tray
module
processing system
vacuum processing
loading
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PCT/KR2009/002678
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French (fr)
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WO2009142446A2 (ko
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이주희
차근수
양효성
진상우
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주식회사 아이피에스
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Priority to CN2009801186700A priority Critical patent/CN102037551B/zh
Publication of WO2009142446A2 publication Critical patent/WO2009142446A2/ko
Publication of WO2009142446A3 publication Critical patent/WO2009142446A3/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Robotics (AREA)

Abstract

본 발명은 진공처리시스템에 관한 것으로서, 상세하게는 진공상태에서 기판의 표면을 식각, 증착하는 등 기판에 대한 진공처리를 수행하는 진공처리시스템에 관한 것이다. 본 발명은 다수개의 기판들이 트레이에 로딩되거나 언로딩되는 로딩/언로딩모듈과; 상기 로딩/언로딩모듈의 일측에 설치되고 다수개의 기판들이 로딩된 트레이를 이송받아 공정을 수행할 수 있도록 밀폐된 처리공간을 가지는 하나 이상의 공정모듈과; 트레이가 임시로 로딩되는 하나 이상의 버퍼부를 가지며, 상기 버퍼부에서 상기 로딩/언로딩모듈로부터 트레이를 이송받아 상기 공정모듈로 전달하기 전에 트레이의 상측에 다수개의 슬릿이 형성된 커버부재로 복개하며, 상기 공정모듈로부터 커버부재가 복개된 트레이를 이송받아 상기 로딩/언로딩모듈로 전달하기 전에 커버부재를 트레이로부터 제거하는 버퍼모듈과; 상기 로딩/언로딩모듈 및 상기 버퍼모듈 간의 트레이 이송 및 상기 공정모듈 및 상기 버퍼모듈 간의 트레이 이송을 수행하는 이송부를 포함하는 것을 특징으로 하는 진공처리시스템을 개시한다.
PCT/KR2009/002678 2008-05-21 2009-05-21 진공처리시스템, 진공처리시스템에 사용되는 버퍼모듈 및 진공처리시스템의 트레이 이송방법 WO2009142446A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009801186700A CN102037551B (zh) 2008-05-21 2009-05-21 真空处理系统、真空处理系统上使用的缓冲模块及真空处理系统的托盘传送方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0047005 2008-05-21
KR1020080047005A KR101428522B1 (ko) 2008-05-21 2008-05-21 진공처리시스템, 진공처리시스템에 사용되는 버퍼모듈 및진공처리시스템의 트레이 이송방법

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Publication Number Publication Date
WO2009142446A2 WO2009142446A2 (ko) 2009-11-26
WO2009142446A3 true WO2009142446A3 (ko) 2010-03-11

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KR (1) KR101428522B1 (ko)
CN (1) CN102037551B (ko)
WO (1) WO2009142446A2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108061808A (zh) * 2016-11-08 2018-05-22 中国科学院苏州纳米技术与纳米仿生研究所 一种用于纳米材料实验的真空互联系统及方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102969223B (zh) * 2011-08-31 2016-01-13 细美事有限公司 基板处理设备及基板处理方法
KR102010877B1 (ko) 2013-03-13 2019-08-14 대우조선해양 주식회사 배관 일체형 탈질 시스템 및 방법
KR102010876B1 (ko) 2013-03-13 2019-08-14 대우조선해양 주식회사 배기가스 배출 시스템 및 그 설치 방법
KR101629349B1 (ko) 2013-03-13 2016-06-10 대우조선해양 주식회사 피독 방지용 배기가스 배출 시스템
CN104183525B (zh) * 2013-05-22 2017-08-18 理想能源设备(上海)有限公司 一种真空环境中快速传送大型托盘的装置及其使用方法
CN105555684A (zh) * 2013-11-22 2016-05-04 株式会社岛津制作所 基板处理系统
KR101736855B1 (ko) 2015-05-29 2017-05-18 세메스 주식회사 기판 처리 설비
WO2017119786A1 (ko) * 2016-01-07 2017-07-13 (주)제이티 이송툴모듈 및 그를 가지는 소자핸들러
KR102173658B1 (ko) * 2016-11-30 2020-11-03 주식회사 원익아이피에스 기판처리시스템
WO2018219424A1 (en) * 2017-05-29 2018-12-06 Applied Materials Italia S.R.L. Method and apparatus for use in substrate processing
TW202137363A (zh) * 2019-10-10 2021-10-01 南韓商宰體有限公司 加壓模組以及具有該加壓模組的元件處理器
JP2022059212A (ja) * 2020-10-01 2022-04-13 日本電産サンキョー株式会社 搬送システム
CN113764543B (zh) * 2021-11-10 2022-01-25 晋能清洁能源科技股份公司 太阳能电池在镀膜生产中提升非晶硅表面洁净度的方法

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JPH07297255A (ja) * 1994-04-26 1995-11-10 Dainippon Screen Mfg Co Ltd 基板保持装置
JPH07335717A (ja) * 1994-06-06 1995-12-22 Tokyo Electron Ltd 被処理体のバッファ装置、これを用いた処理装置及びその搬送方法
JP2000036527A (ja) * 1998-07-17 2000-02-02 Tokyo Electron Ltd 基板搬送処理装置及び基板搬送処理方法
KR20070095098A (ko) * 2006-03-20 2007-09-28 삼성전자주식회사 반도체 기판의 이송 장치 및 이를 이용한 기판 이송 방법
KR100790789B1 (ko) * 2006-07-03 2008-01-02 코닉시스템 주식회사 반도체 공정장치

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JP4884039B2 (ja) * 2006-03-14 2012-02-22 東京エレクトロン株式会社 基板バッファ装置、基板バッファリング方法、基板処理装置、制御プログラムおよびコンピュータ読取可能な記憶媒体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297255A (ja) * 1994-04-26 1995-11-10 Dainippon Screen Mfg Co Ltd 基板保持装置
JPH07335717A (ja) * 1994-06-06 1995-12-22 Tokyo Electron Ltd 被処理体のバッファ装置、これを用いた処理装置及びその搬送方法
JP2000036527A (ja) * 1998-07-17 2000-02-02 Tokyo Electron Ltd 基板搬送処理装置及び基板搬送処理方法
KR20070095098A (ko) * 2006-03-20 2007-09-28 삼성전자주식회사 반도체 기판의 이송 장치 및 이를 이용한 기판 이송 방법
KR100790789B1 (ko) * 2006-07-03 2008-01-02 코닉시스템 주식회사 반도체 공정장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108061808A (zh) * 2016-11-08 2018-05-22 中国科学院苏州纳米技术与纳米仿生研究所 一种用于纳米材料实验的真空互联系统及方法

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Publication number Publication date
CN102037551A (zh) 2011-04-27
WO2009142446A2 (ko) 2009-11-26
KR101428522B1 (ko) 2014-08-12
CN102037551B (zh) 2012-10-10
KR20090120943A (ko) 2009-11-25

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