WO2008120716A1 - 基板処理装置、基板処理方法及びコンピュータ可読記憶媒体 - Google Patents

基板処理装置、基板処理方法及びコンピュータ可読記憶媒体 Download PDF

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Publication number
WO2008120716A1
WO2008120716A1 PCT/JP2008/056082 JP2008056082W WO2008120716A1 WO 2008120716 A1 WO2008120716 A1 WO 2008120716A1 JP 2008056082 W JP2008056082 W JP 2008056082W WO 2008120716 A1 WO2008120716 A1 WO 2008120716A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
storing
substrate processing
transfer
chamber
Prior art date
Application number
PCT/JP2008/056082
Other languages
English (en)
French (fr)
Inventor
Keisuke Kondoh
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to US12/532,190 priority Critical patent/US8382088B2/en
Priority to CN2008800001223A priority patent/CN101542713B/zh
Publication of WO2008120716A1 publication Critical patent/WO2008120716A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

　搬入出ポートに載置されたキャリア内から搬送室内の基板搬送部により基板を取り出して処理モジュールに受け渡し、当該処理モジュール内にて基板の処理を行う基板処理装置が開示される。この基板処理装置は、搬送室の外側に当該搬送室に連通するように搬送口を介して接続された基板保管室と、基板保管室に設けられ、第１の保管目的で複数の基板を保管するための第１の保管棚と、基板保管室に設けられ、第１の保管目的とは異なる第２の保管目的で複数の基板を保管する第２の保管棚と、第１の保管棚及び第２の保管棚のうちの一方の基板保管領域を、当該基板保管領域と基板搬送部との間で搬送口を介して基板の受け渡しができるように位置するために、当該第１の保管棚及び第２の保管棚を移動する移動機構と、を備える。
PCT/JP2008/056082 2007-03-30 2008-03-28 基板処理装置、基板処理方法及びコンピュータ可読記憶媒体 WO2008120716A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/532,190 US8382088B2 (en) 2007-03-30 2008-03-28 Substrate processing apparatus
CN2008800001223A CN101542713B (zh) 2007-03-30 2008-03-28 基板处理装置和基板处理方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-095376 2007-03-30
JP2007095376A JP4816545B2 (ja) 2007-03-30 2007-03-30 基板処理装置、基板処理方法及び記憶媒体

Publications (1)

Publication Number Publication Date
WO2008120716A1 true WO2008120716A1 (ja) 2008-10-09

Family

ID=39808296

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056082 WO2008120716A1 (ja) 2007-03-30 2008-03-28 基板処理装置、基板処理方法及びコンピュータ可読記憶媒体

Country Status (6)

Country Link
US (1) US8382088B2 (ja)
JP (1) JP4816545B2 (ja)
KR (1) KR101024530B1 (ja)
CN (1) CN101542713B (ja)
TW (1) TW200849453A (ja)
WO (1) WO2008120716A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100236718A1 (en) * 2009-03-17 2010-09-23 Tokyo Electron Limited Substrate processing apparatus

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JP4816545B2 (ja) * 2007-03-30 2011-11-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
GB2452320B (en) * 2007-09-03 2012-04-11 Dek Int Gmbh Workpiece processing system and method
JP2010123733A (ja) * 2008-11-19 2010-06-03 Tokyo Electron Ltd 基板処理装置及びその処理方法、並びに記憶媒体
JP5358366B2 (ja) 2009-09-14 2013-12-04 東京エレクトロン株式会社 基板処理装置及び方法
JP5947030B2 (ja) 2010-12-28 2016-07-06 キヤノンアネルバ株式会社 基板処理方法、基板処理装置
KR101293025B1 (ko) * 2011-12-22 2013-08-05 에스엔유 프리시젼 주식회사 마스크 적재 및 기판 반송 챔버와, 마스크 적재 및 기판 반송 챔버의 운용방법
JP2013172015A (ja) * 2012-02-21 2013-09-02 Hitachi High-Technologies Corp 成膜装置、及び成膜装置用基板搬送機構
JP5959914B2 (ja) * 2012-04-18 2016-08-02 東京エレクトロン株式会社 基板処理システム、基板搬送方法および記憶媒体
JP2013247283A (ja) * 2012-05-28 2013-12-09 Tokyo Electron Ltd 搬送機構、搬送方法及び処理システム
JP5954108B2 (ja) * 2012-10-23 2016-07-20 東京エレクトロン株式会社 基板処理装置
JP6016584B2 (ja) * 2012-11-08 2016-10-26 東京エレクトロン株式会社 ロードロック装置
JP2014116545A (ja) * 2012-12-12 2014-06-26 Tokyo Electron Ltd 基板処理装置
KR101575129B1 (ko) * 2014-01-13 2015-12-08 피에스케이 주식회사 기판 이송 장치 및 방법, 그리고 기판 처리 장치
JP6494443B2 (ja) * 2015-06-15 2019-04-03 東京エレクトロン株式会社 成膜方法及び成膜装置
US10388547B2 (en) * 2017-06-23 2019-08-20 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for processing substrates
KR102423761B1 (ko) 2017-06-23 2022-07-20 어플라이드 머티어리얼스, 인코포레이티드 인덱서블 측면 저장 포드 장치, 가열식 측면 저장 포드 장치, 시스템들, 및 방법들
CN111164745B (zh) 2017-10-11 2023-09-12 日商乐华股份有限公司 盒开启器
KR102110307B1 (ko) 2018-04-23 2020-05-14 코스텍시스템(주) 웨이퍼 이송 장치
JP7349240B2 (ja) * 2018-10-05 2023-09-22 東京エレクトロン株式会社 基板倉庫及び基板検査方法
US11244844B2 (en) * 2018-10-26 2022-02-08 Applied Materials, Inc. High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods
US11373891B2 (en) * 2018-10-26 2022-06-28 Applied Materials, Inc. Front-ducted equipment front end modules, side storage pods, and methods of operating the same
CN109671658B (zh) * 2018-11-29 2021-02-09 苏州方昇光电股份有限公司 基片装载系统及其基片装载方法
KR102227066B1 (ko) 2019-01-28 2021-03-15 코스텍시스템(주) 웨이퍼 이송 장치
JP2022039827A (ja) * 2020-08-28 2022-03-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN113299586B (zh) * 2021-07-28 2021-10-19 四川通妙科技有限公司 一种芯片晶圆暂存装置及芯片晶圆暂存取件方法
TWI823271B (zh) * 2022-02-24 2023-11-21 天虹科技股份有限公司 基板傳送方法
US20240297058A1 (en) * 2022-03-15 2024-09-05 Hitachi High-Tech Corporation Vacuum processing apparatus
JP7215629B1 (ja) 2022-07-14 2023-01-31 Ｊｆｅエンジニアリング株式会社 バッテリ交換装置

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Patent Citations (8)

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Publication number Priority date Publication date Assignee Title
JPH06260546A (ja) * 1993-03-03 1994-09-16 Mitsubishi Materials Shilicon Corp 半導体ウェーハの厚さ分類装置
JPH06329208A (ja) * 1993-05-20 1994-11-29 Kokusai Electric Co Ltd 半導体製造装置のウェーハ搬送装置
JPH07117809A (ja) * 1993-10-21 1995-05-09 Ebara Corp 真空保管庫
JPH08148503A (ja) * 1994-11-24 1996-06-07 Koyo Rindobaagu Kk 熱処理装置
JPH11111810A (ja) * 1997-10-07 1999-04-23 Tokyo Electron Ltd カセット室
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JP2007027339A (ja) * 2005-07-15 2007-02-01 Hitachi High-Technologies Corp プラズマ処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100236718A1 (en) * 2009-03-17 2010-09-23 Tokyo Electron Limited Substrate processing apparatus
US9330950B2 (en) * 2009-03-17 2016-05-03 Tokyo Electron Limited Substrate processing apparatus

Also Published As

Publication number Publication date
KR101024530B1 (ko) 2011-03-31
JP4816545B2 (ja) 2011-11-16
US20100102030A1 (en) 2010-04-29
CN101542713B (zh) 2012-05-30
US8382088B2 (en) 2013-02-26
TW200849453A (en) 2008-12-16
KR20090094054A (ko) 2009-09-03
TWI379378B (ja) 2012-12-11
JP2008258188A (ja) 2008-10-23
CN101542713A (zh) 2009-09-23

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