JP6016584B2 - ロードロック装置 - Google Patents
ロードロック装置 Download PDFInfo
- Publication number
- JP6016584B2 JP6016584B2 JP2012246327A JP2012246327A JP6016584B2 JP 6016584 B2 JP6016584 B2 JP 6016584B2 JP 2012246327 A JP2012246327 A JP 2012246327A JP 2012246327 A JP2012246327 A JP 2012246327A JP 6016584 B2 JP6016584 B2 JP 6016584B2
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- Prior art keywords
- load lock
- container
- lock device
- holding
- chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
- F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/85978—With pump
- Y10T137/86083—Vacuum pump
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims (5)
- 大気雰囲気と真空室との間に設けられるロードロック装置であって、
前記大気雰囲気及び前記真空室に連通する容器と、
前記容器内に配置され、被処理体を保持すると共に、前記容器内を上下方向に移動可能に設けられた保持部と、
前記保持部を前記上下方向に昇降させる昇降機構と、
前記容器内を、前記容器の上部及び下部の少なくとも一方に設けられた開口部を介して真空引きする圧力調整機構と、を備え、
前記昇降機構は、
前記保持部に連結され、前記上下方向に沿って設けられる少なくとも2つの昇降軸部材と、
前記昇降軸部材を昇降させる駆動部と、を備え、
2つの前記昇降軸部材は、前記開口部を挟む位置に配置されており、
前記開口部の内径は、前記被処理体の外径と略同径であるロードロック装置。 - 前記駆動部は、2つの前記昇降軸部材のそれぞれに設けられている請求項1記載のロードロック装置。
- 大気雰囲気と真空室との間に設けられるロードロック装置であって、
前記大気雰囲気及び前記真空室に連通する容器と、
前記容器内に配置され、被処理体を保持すると共に、前記容器内を上下方向に移動可能に設けられた保持部と、
前記保持部を前記上下方向に昇降させる昇降機構と、
前記容器内を、前記容器の上部及び下部の少なくとも一方に設けられた開口部を介して真空引きする圧力調整機構と、を備え、
前記昇降機構は、
前記保持部に連結され、前記上下方向に沿って設けられる少なくとも2つの昇降軸部材と、
前記昇降軸部材を昇降させる駆動部と、を備え、
2つの前記昇降軸部材は、前記開口部を挟む位置に配置されており、
前記駆動部は、2つの前記昇降軸部材のそれぞれに設けられているロードロック装置。 - 前記保持部は、
前記被処理体を支持する支持部と、
前記支持部が設けられる板状の基部と、を備え、
前記圧力調整機構は、前記基部と前記容器とにより画成される空間を真空引きし、
2つの前記昇降軸部材は、前記基部に連結されている請求項1〜3のいずれか一項記載のロードロック装置。 - 前記保持部は、前記容器内に上下に2つ設けられており、
前記開口部は、前記容器の上部及び下部に設けられており、
前記昇降機構は、2つの前記保持部のそれぞれに設けられており、
前記圧力調整機構は、前記容器の前記上部及び前記下部に設けられた前記開口部のそれぞれに対応して設けられている請求項1〜4のいずれか一項記載のロードロック装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012246327A JP6016584B2 (ja) | 2012-11-08 | 2012-11-08 | ロードロック装置 |
KR1020130131269A KR101717322B1 (ko) | 2012-11-08 | 2013-10-31 | 로드 로크 장치 |
US14/070,121 US9303788B2 (en) | 2012-11-08 | 2013-11-01 | Load lock device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012246327A JP6016584B2 (ja) | 2012-11-08 | 2012-11-08 | ロードロック装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014096436A JP2014096436A (ja) | 2014-05-22 |
JP6016584B2 true JP6016584B2 (ja) | 2016-10-26 |
Family
ID=50621255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012246327A Active JP6016584B2 (ja) | 2012-11-08 | 2012-11-08 | ロードロック装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9303788B2 (ja) |
JP (1) | JP6016584B2 (ja) |
KR (1) | KR101717322B1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6016584B2 (ja) * | 2012-11-08 | 2016-10-26 | 東京エレクトロン株式会社 | ロードロック装置 |
JP6454201B2 (ja) * | 2015-03-26 | 2019-01-16 | 東京エレクトロン株式会社 | 基板搬送方法及び基板処理装置 |
JP7164491B2 (ja) * | 2019-06-12 | 2022-11-01 | 住友重機械工業株式会社 | 真空バルブ及び真空バルブに用いられるアクチュエータ |
KR20220086578A (ko) | 2019-09-22 | 2022-06-23 | 어플라이드 머티어리얼스, 인코포레이티드 | 멀티-웨이퍼 볼륨 단일 이송 챔버 패싯 |
KR102523365B1 (ko) * | 2020-09-23 | 2023-04-21 | 세메스 주식회사 | 기판 처리 장치 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3437734B2 (ja) * | 1997-02-26 | 2003-08-18 | 富士通株式会社 | 製造装置 |
JP4048387B2 (ja) * | 1997-09-10 | 2008-02-20 | 東京エレクトロン株式会社 | ロードロック機構及び処理装置 |
US6110011A (en) * | 1997-11-10 | 2000-08-29 | Applied Materials, Inc. | Integrated electrodeposition and chemical-mechanical polishing tool |
JP3286240B2 (ja) * | 1998-02-09 | 2002-05-27 | 日本エー・エス・エム株式会社 | 半導体処理用ロードロック装置及び方法 |
US6390894B1 (en) * | 1998-12-21 | 2002-05-21 | Derlan Aerospace Canada | Face gear manufacturing method and apparatus |
JP2001319885A (ja) * | 2000-03-02 | 2001-11-16 | Hitachi Kokusai Electric Inc | 基板処理装置及び半導体製造方法 |
US6435941B1 (en) * | 2000-05-12 | 2002-08-20 | Appllied Materials, Inc. | Apparatus and method for chemical mechanical planarization |
KR100606567B1 (ko) * | 2004-02-13 | 2006-07-28 | 주식회사 에이디피엔지니어링 | 평판표시소자 제조장치 |
JP2006185704A (ja) * | 2004-12-27 | 2006-07-13 | Toshiba Corp | 基板処理装置 |
KR100615100B1 (ko) * | 2005-08-16 | 2006-08-22 | 삼성전자주식회사 | 연마 패드 클리너 및 이를 갖는 화학기계적 연마 장치 |
JP4816545B2 (ja) * | 2007-03-30 | 2011-11-16 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP2010027810A (ja) * | 2008-07-17 | 2010-02-04 | Yaskawa Electric Corp | 真空搬送装置 |
JP6016584B2 (ja) * | 2012-11-08 | 2016-10-26 | 東京エレクトロン株式会社 | ロードロック装置 |
-
2012
- 2012-11-08 JP JP2012246327A patent/JP6016584B2/ja active Active
-
2013
- 2013-10-31 KR KR1020130131269A patent/KR101717322B1/ko active IP Right Grant
- 2013-11-01 US US14/070,121 patent/US9303788B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR101717322B1 (ko) | 2017-03-16 |
JP2014096436A (ja) | 2014-05-22 |
US20140124069A1 (en) | 2014-05-08 |
US9303788B2 (en) | 2016-04-05 |
KR20140059727A (ko) | 2014-05-16 |
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