JP4524132B2 - 真空処理装置 - Google Patents
真空処理装置 Download PDFInfo
- Publication number
- JP4524132B2 JP4524132B2 JP2004100270A JP2004100270A JP4524132B2 JP 4524132 B2 JP4524132 B2 JP 4524132B2 JP 2004100270 A JP2004100270 A JP 2004100270A JP 2004100270 A JP2004100270 A JP 2004100270A JP 4524132 B2 JP4524132 B2 JP 4524132B2
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- Prior art keywords
- vacuum processing
- transfer
- transfer arm
- inclination
- substrate
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Description
前記移載室に配置された基体と、
この移載室に各々気密に接続され、基板に対して真空処理を行う複数の真空処理室と、
進退自在かつ鉛直軸周りに回転自在な移載アームを備え、前記複数の真空処理室の各々に対して基板の受け渡しを行うために前記基体に設けられた基板移載機構と、
前記移載アームの傾きを調整するために前記基体の傾きを調整するための傾き調整機構と、を備えたことを特徴とする。
また、本発明の真空処理装置は、
真空雰囲気とされる移載室と、
この移載室に各々気密に接続され、基板に対して真空処理を行う複数の真空処理室と、
進退自在かつ鉛直軸周りに回転自在な移載アームを備え、前記複数の真空処理室の各々に対して基板の受け渡しを行う基板移載機構と、
前記移載アームの傾きを調整するための傾き調整機構と、
前記移載アームの傾きを検出する傾き検出手段と、
前記傾き検出手段により検出された検出結果を記憶する記憶部と、
この記憶部に記憶された情報に基づいて傾き調整機構を制御する制御部と、を備えたことを特徴とする。更には、前記傾き検出手段は、横方向に互いに離れて配置されると共に対向する部位までの距離を検出する少なくとも3個の距離検出部と、これら距離検出部による検出結果に基づいて移載アームの傾きを推定する手段と、を備えた構成であってもよく、この場合、前記距離検出部は、移載アーム、この移載アームに保持される基板、または真空処理装置内のいずれかに設けられた構成であってもよい。
3 移載室
4A〜4D 処理チャンバ
5 移載アーム
52 基体
6A〜6C 昇降機構
7 傾き調整用治具
73 制御部
71A〜71C 光センサ
Claims (8)
- 真空雰囲気とされる移載室と、
前記移載室に配置された基体と、
この移載室に各々気密に接続され、基板に対して真空処理を行う複数の真空処理室と、
進退自在かつ鉛直軸周りに回転自在な移載アームを備え、前記複数の真空処理室の各々に対して基板の受け渡しを行うために前記基体に設けられた基板移載機構と、
前記移載アームの傾きを調整するために前記基体の傾きを調整するための傾き調整機構と、を備えたことを特徴とする真空処理装置。 - 前記傾き調整機構は、基体の周方向に沿って位置する少なくとも3箇所を各々独立して昇降させる複数の昇降機構を含むことを特徴とする請求項1記載の真空処理装置。
- 前記移載アームの傾きを検出する傾き検出手段を備えたことを特徴とする請求項1または2に記載の真空処理装置。
- 真空雰囲気とされる移載室と、
この移載室に各々気密に接続され、基板に対して真空処理を行う複数の真空処理室と、
進退自在かつ鉛直軸周りに回転自在な移載アームを備え、前記複数の真空処理室の各々に対して基板の受け渡しを行う基板移載機構と、
前記移載アームの傾きを調整するための傾き調整機構と、
前記移載アームの傾きを検出する傾き検出手段と、
前記傾き検出手段により検出された検出結果を記憶する記憶部と、
この記憶部に記憶された情報に基づいて傾き調整機構を制御する制御部と、を備えたことを特徴とする真空処理装置。 - 前記傾き検出手段は、横方向に互いに離れて配置されると共に対向する部位までの距離を検出する少なくとも3個の距離検出部と、これら距離検出部による検出結果に基づいて移載アームの傾きを推定する手段と、を備えたことを特徴とする請求項3または4記載の真空処理装置。
- 前記距離検出部は、移載アーム、この移載アームに保持される基板、または真空処理装置内のいずれかに設けられたことを特徴とする請求項5記載の真空処理装置。
- 前記傾き検出手段は、発光部と、この発光部からの光の反射光を検出する受光部と、この受光部にて受光した反射光に基づいて反射面の傾きを検出する手段と、を備えたことを特徴とする請求項3または4記載の真空処理装置。
- 前記発光部及び受光部は、移載アーム、この移載アームに保持される基板、または真空処理室内のいずれかに設けられたことを特徴とする請求項7記載の真空処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004100270A JP4524132B2 (ja) | 2004-03-30 | 2004-03-30 | 真空処理装置 |
US10/592,503 US7572742B2 (en) | 2004-03-30 | 2005-02-24 | Equipment and method for processing semiconductor |
PCT/JP2005/003035 WO2005098934A1 (ja) | 2004-03-30 | 2005-02-24 | 半導体処理装置及び方法 |
KR1020067018773A KR100816903B1 (ko) | 2004-03-30 | 2005-02-24 | 반도체 처리 장치 및 방법 |
CNB2005800060092A CN100414680C (zh) | 2004-03-30 | 2005-02-24 | 半导体处理装置和方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004100270A JP4524132B2 (ja) | 2004-03-30 | 2004-03-30 | 真空処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005286211A JP2005286211A (ja) | 2005-10-13 |
JP4524132B2 true JP4524132B2 (ja) | 2010-08-11 |
Family
ID=35125360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004100270A Expired - Fee Related JP4524132B2 (ja) | 2004-03-30 | 2004-03-30 | 真空処理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7572742B2 (ja) |
JP (1) | JP4524132B2 (ja) |
KR (1) | KR100816903B1 (ja) |
CN (1) | CN100414680C (ja) |
WO (1) | WO2005098934A1 (ja) |
Families Citing this family (33)
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JP4611918B2 (ja) * | 2006-03-09 | 2011-01-12 | 東京エレクトロン株式会社 | 処理ユニットの傾き調整方法 |
JP2008251968A (ja) | 2007-03-30 | 2008-10-16 | Hitachi High-Technologies Corp | ウエハ処理装置の運転方法 |
KR20100031681A (ko) | 2007-05-18 | 2010-03-24 | 브룩스 오토메이션 인코퍼레이티드 | 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템 |
WO2009072199A1 (ja) | 2007-12-05 | 2009-06-11 | Hirata Corporation | 基板搬送装置及び基板搬送装置の制御方法 |
JP4784599B2 (ja) * | 2007-12-28 | 2011-10-05 | 東京エレクトロン株式会社 | 真空処理装置及び真空処理方法並びに記憶媒体 |
US20100063610A1 (en) * | 2008-09-08 | 2010-03-11 | David Angell | Method of process modules performance matching |
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CN107665850B (zh) * | 2016-07-29 | 2019-09-17 | 上海微电子装备(集团)股份有限公司 | 基板的对接装置及对接方法 |
JP2018037442A (ja) * | 2016-08-29 | 2018-03-08 | 株式会社アルバック | 基板搬送装置、成膜装置および基板搬送方法 |
JP7299808B2 (ja) * | 2019-09-19 | 2023-06-28 | 川崎重工業株式会社 | 傾き調整装置、及びそれを備えるロボット |
US11335578B2 (en) * | 2020-02-13 | 2022-05-17 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer apparatus and method of measuring positional deviation of substrate |
JP7412208B2 (ja) * | 2020-02-17 | 2024-01-12 | 東京エレクトロン株式会社 | 搬送装置、処理システム及び搬送方法 |
JP2022014522A (ja) * | 2020-07-07 | 2022-01-20 | 東京エレクトロン株式会社 | 真空処理装置、及び真空処理装置の制御方法 |
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JPH0774229A (ja) * | 1993-06-25 | 1995-03-17 | Kokusai Electric Co Ltd | 半導体基板位置検知装置 |
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-
2004
- 2004-03-30 JP JP2004100270A patent/JP4524132B2/ja not_active Expired - Fee Related
-
2005
- 2005-02-24 KR KR1020067018773A patent/KR100816903B1/ko not_active IP Right Cessation
- 2005-02-24 CN CNB2005800060092A patent/CN100414680C/zh not_active Expired - Fee Related
- 2005-02-24 WO PCT/JP2005/003035 patent/WO2005098934A1/ja active Application Filing
- 2005-02-24 US US10/592,503 patent/US7572742B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0774229A (ja) * | 1993-06-25 | 1995-03-17 | Kokusai Electric Co Ltd | 半導体基板位置検知装置 |
JPH07178689A (ja) * | 1993-12-24 | 1995-07-18 | Ricoh Co Ltd | ロボットアームの位置ずれ測定方法およびその位置ずれ補正方法およびその位置ずれ補正システム |
JPH09232404A (ja) * | 1996-02-19 | 1997-09-05 | Yaskawa Electric Corp | ウェハ搬送装置 |
JPH10233426A (ja) * | 1997-02-20 | 1998-09-02 | Tokyo Electron Ltd | 自動ティ−チング方法 |
JPH11165287A (ja) * | 1997-12-08 | 1999-06-22 | Yukio Saito | 姿勢検出装置および姿勢制御装置並びにロボット制御装置 |
JP2001015575A (ja) * | 1999-07-02 | 2001-01-19 | Matsushita Electronics Industry Corp | 基板搬送装置の調整方法とその検査装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1922725A (zh) | 2007-02-28 |
KR100816903B1 (ko) | 2008-03-25 |
JP2005286211A (ja) | 2005-10-13 |
WO2005098934A1 (ja) | 2005-10-20 |
CN100414680C (zh) | 2008-08-27 |
KR20060126600A (ko) | 2006-12-07 |
US7572742B2 (en) | 2009-08-11 |
US20070275486A1 (en) | 2007-11-29 |
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