CN102037551B - 真空处理系统、真空处理系统上使用的缓冲模块及真空处理系统的托盘传送方法 - Google Patents
真空处理系统、真空处理系统上使用的缓冲模块及真空处理系统的托盘传送方法 Download PDFInfo
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- CN102037551B CN102037551B CN2009801186700A CN200980118670A CN102037551B CN 102037551 B CN102037551 B CN 102037551B CN 2009801186700 A CN2009801186700 A CN 2009801186700A CN 200980118670 A CN200980118670 A CN 200980118670A CN 102037551 B CN102037551 B CN 102037551B
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- 238000000034 method Methods 0.000 title claims abstract description 105
- 239000000758 substrate Substances 0.000 claims abstract description 83
- 238000005530 etching Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 67
- 230000000873 masking effect Effects 0.000 claims description 66
- 230000008093 supporting effect Effects 0.000 claims description 30
- 230000005540 biological transmission Effects 0.000 claims description 26
- 238000007740 vapor deposition Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 abstract 1
- 238000009489 vacuum treatment Methods 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000010200 validation analysis Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Robotics (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (22)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080047005A KR101428522B1 (ko) | 2008-05-21 | 2008-05-21 | 진공처리시스템, 진공처리시스템에 사용되는 버퍼모듈 및진공처리시스템의 트레이 이송방법 |
KR10-2008-0047005 | 2008-05-21 | ||
PCT/KR2009/002678 WO2009142446A2 (ko) | 2008-05-21 | 2009-05-21 | 진공처리시스템, 진공처리시스템에 사용되는 버퍼모듈 및 진공처리시스템의 트레이 이송방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102037551A CN102037551A (zh) | 2011-04-27 |
CN102037551B true CN102037551B (zh) | 2012-10-10 |
Family
ID=41340689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009801186700A Expired - Fee Related CN102037551B (zh) | 2008-05-21 | 2009-05-21 | 真空处理系统、真空处理系统上使用的缓冲模块及真空处理系统的托盘传送方法 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101428522B1 (zh) |
CN (1) | CN102037551B (zh) |
WO (1) | WO2009142446A2 (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102969223B (zh) * | 2011-08-31 | 2016-01-13 | 细美事有限公司 | 基板处理设备及基板处理方法 |
KR101629349B1 (ko) | 2013-03-13 | 2016-06-10 | 대우조선해양 주식회사 | 피독 방지용 배기가스 배출 시스템 |
KR102010877B1 (ko) | 2013-03-13 | 2019-08-14 | 대우조선해양 주식회사 | 배관 일체형 탈질 시스템 및 방법 |
KR102010876B1 (ko) | 2013-03-13 | 2019-08-14 | 대우조선해양 주식회사 | 배기가스 배출 시스템 및 그 설치 방법 |
CN104183525B (zh) * | 2013-05-22 | 2017-08-18 | 理想能源设备(上海)有限公司 | 一种真空环境中快速传送大型托盘的装置及其使用方法 |
JP6156513B2 (ja) * | 2013-11-22 | 2017-07-05 | 株式会社島津製作所 | 基板処理システム |
KR101736855B1 (ko) * | 2015-05-29 | 2017-05-18 | 세메스 주식회사 | 기판 처리 설비 |
WO2017119786A1 (ko) * | 2016-01-07 | 2017-07-13 | (주)제이티 | 이송툴모듈 및 그를 가지는 소자핸들러 |
CN108061808B (zh) * | 2016-11-08 | 2021-02-23 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种用于纳米材料实验的真空互联系统及方法 |
KR102173658B1 (ko) * | 2016-11-30 | 2020-11-03 | 주식회사 원익아이피에스 | 기판처리시스템 |
CN110741468A (zh) * | 2017-05-29 | 2020-01-31 | 应用材料意大利有限公司 | 用于在基板处理中使用的方法和设备 |
WO2021071340A1 (ko) * | 2019-10-10 | 2021-04-15 | (주)제이티 | 가압모듈 및 그를 가지는 소자 핸들러 |
JP7536582B2 (ja) * | 2020-10-01 | 2024-08-20 | ニデックインスツルメンツ株式会社 | 搬送システム |
CN113764543B (zh) * | 2021-11-10 | 2022-01-25 | 晋能清洁能源科技股份公司 | 太阳能电池在镀膜生产中提升非晶硅表面洁净度的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000036527A (ja) * | 1998-07-17 | 2000-02-02 | Tokyo Electron Ltd | 基板搬送処理装置及び基板搬送処理方法 |
CN101038858A (zh) * | 2006-03-14 | 2007-09-19 | 东京毅力科创株式会社 | 基板缓冲装置及方法和处理装置以及控制程序和存储介质 |
KR20070095098A (ko) * | 2006-03-20 | 2007-09-28 | 삼성전자주식회사 | 반도체 기판의 이송 장치 및 이를 이용한 기판 이송 방법 |
KR100790789B1 (ko) * | 2006-07-03 | 2008-01-02 | 코닉시스템 주식회사 | 반도체 공정장치 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07297255A (ja) * | 1994-04-26 | 1995-11-10 | Dainippon Screen Mfg Co Ltd | 基板保持装置 |
JP3350234B2 (ja) * | 1994-06-06 | 2002-11-25 | 東京エレクトロン株式会社 | 被処理体のバッファ装置、これを用いた処理装置及びその搬送方法 |
-
2008
- 2008-05-21 KR KR1020080047005A patent/KR101428522B1/ko active IP Right Grant
-
2009
- 2009-05-21 CN CN2009801186700A patent/CN102037551B/zh not_active Expired - Fee Related
- 2009-05-21 WO PCT/KR2009/002678 patent/WO2009142446A2/ko active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000036527A (ja) * | 1998-07-17 | 2000-02-02 | Tokyo Electron Ltd | 基板搬送処理装置及び基板搬送処理方法 |
CN101038858A (zh) * | 2006-03-14 | 2007-09-19 | 东京毅力科创株式会社 | 基板缓冲装置及方法和处理装置以及控制程序和存储介质 |
KR20070095098A (ko) * | 2006-03-20 | 2007-09-28 | 삼성전자주식회사 | 반도체 기판의 이송 장치 및 이를 이용한 기판 이송 방법 |
KR100790789B1 (ko) * | 2006-07-03 | 2008-01-02 | 코닉시스템 주식회사 | 반도체 공정장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20090120943A (ko) | 2009-11-25 |
CN102037551A (zh) | 2011-04-27 |
WO2009142446A2 (ko) | 2009-11-26 |
WO2009142446A3 (ko) | 2010-03-11 |
KR101428522B1 (ko) | 2014-08-12 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: Gyeonggi Do, South Korea Applicant after: WONIK IPS Co.,Ltd. Address before: Gyeonggi Do, South Korea Applicant before: IPS Co.,Ltd. |
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COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: INTEGRATED PROCESS SYSTEMS LTD. TO: WONIK IPS CO., LTD. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: Gyeonggi Do Korea Pyeongtaek paint 78-40 (jije Dong strange street) Patentee after: Lap Yi Cmi Holdings Ltd. Address before: Gyeonggi Do, South Korea Patentee before: WONIK IPS Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20160729 Address after: South Korea Gyeonggi Do Ping Ze Zhenwei Zhenwei group produced 75 road surface Patentee after: WONIK IPS Co.,Ltd. Address before: Gyeonggi Do Korea Pyeongtaek paint 78-40 (jije Dong strange street) Patentee before: Lap Yi Cmi Holdings Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121010 |