CN108305846B - 一种硅片上料/下料传输系统及其工作方法 - Google Patents
一种硅片上料/下料传输系统及其工作方法 Download PDFInfo
- Publication number
- CN108305846B CN108305846B CN201710021386.8A CN201710021386A CN108305846B CN 108305846 B CN108305846 B CN 108305846B CN 201710021386 A CN201710021386 A CN 201710021386A CN 108305846 B CN108305846 B CN 108305846B
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- tray
- silicon
- flower
- adjacent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 230
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 224
- 239000010703 silicon Substances 0.000 title claims abstract description 224
- 238000000034 method Methods 0.000 title claims description 42
- 230000005540 biological transmission Effects 0.000 title claims description 27
- 238000007599 discharging Methods 0.000 title description 7
- 235000012431 wafers Nutrition 0.000 claims abstract description 206
- 239000000463 material Substances 0.000 claims abstract description 14
- 230000033001 locomotion Effects 0.000 claims description 6
- 238000011017 operating method Methods 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 241000252254 Catostomidae Species 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 238000009776 industrial production Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 241000196324 Embryophyta Species 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710021386.8A CN108305846B (zh) | 2017-01-12 | 2017-01-12 | 一种硅片上料/下料传输系统及其工作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710021386.8A CN108305846B (zh) | 2017-01-12 | 2017-01-12 | 一种硅片上料/下料传输系统及其工作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108305846A CN108305846A (zh) | 2018-07-20 |
CN108305846B true CN108305846B (zh) | 2020-06-19 |
Family
ID=62872258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710021386.8A Active CN108305846B (zh) | 2017-01-12 | 2017-01-12 | 一种硅片上料/下料传输系统及其工作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108305846B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109065492A (zh) * | 2018-10-15 | 2018-12-21 | 深圳市捷佳伟创新能源装备股份有限公司 | 一种生产线竖向上料系统及硅片传输系统 |
CN111169979B (zh) * | 2019-12-10 | 2021-06-15 | 苏州市创怡盛实业有限公司 | 机械手搬运方法以及系统 |
CN111805417A (zh) * | 2020-06-03 | 2020-10-23 | 浙江博蓝特半导体科技股份有限公司 | 晶片研磨生产用上下料装置及晶片批量取放方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101764076A (zh) * | 2008-10-30 | 2010-06-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 半导体加工设备及其传输系统及基片的传输方法 |
CN104409405A (zh) * | 2014-11-18 | 2015-03-11 | 中国电子科技集团公司第四十八研究所 | 用平板式pecvd制备hit太阳电池的传片机构及方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002059961A1 (fr) * | 2001-01-24 | 2002-08-01 | Takehide Hayashi | Systeme de transfert d'une seule tranche en semi-conducteur et unite de transfert associee |
JP4761907B2 (ja) * | 2005-09-28 | 2011-08-31 | 株式会社Sokudo | 基板処理装置 |
-
2017
- 2017-01-12 CN CN201710021386.8A patent/CN108305846B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101764076A (zh) * | 2008-10-30 | 2010-06-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 半导体加工设备及其传输系统及基片的传输方法 |
CN104409405A (zh) * | 2014-11-18 | 2015-03-11 | 中国电子科技集团公司第四十八研究所 | 用平板式pecvd制备hit太阳电池的传片机构及方法 |
Also Published As
Publication number | Publication date |
---|---|
CN108305846A (zh) | 2018-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102290486B (zh) | 用于加载或卸载基板的基板处理装置 | |
JP5543318B2 (ja) | 基板搬送方法 | |
CN102037551B (zh) | 真空处理系统、真空处理系统上使用的缓冲模块及真空处理系统的托盘传送方法 | |
US9694989B2 (en) | Workpiece handling system and methods of workpiece handling | |
CN108305846B (zh) | 一种硅片上料/下料传输系统及其工作方法 | |
KR20140089517A (ko) | 로드 포트, efem | |
JP6747136B2 (ja) | 基板処理装置 | |
US9669552B2 (en) | System and method for quick-swap of multiple substrates | |
KR20130043371A (ko) | 다이 본딩 장치 | |
TWI462212B (zh) | Processing system and processing methods | |
US8845262B2 (en) | Substrate processing apparatus, substrate processing method and storage medium storing substrate processing program | |
US9214369B2 (en) | Dynamic pitch substrate lift | |
EP1867591A1 (en) | Conveying system | |
KR20100033282A (ko) | 태양전지용 웨이퍼의 로딩 및 언로딩 장치 | |
US9458535B2 (en) | Semiconductor manufacturing device and semiconductor manufacturing method | |
KR101311616B1 (ko) | 처리 시스템 및 처리 방법 | |
KR101014747B1 (ko) | 태양전지용 웨이퍼의 로딩 및 언로딩 장치 | |
US20130160261A1 (en) | Apparatus for manufacturing semiconductor wafer | |
US20230207363A1 (en) | Inter-floor transport apparatus and logistics transport system including the same | |
US20090022574A1 (en) | Workpiece loading system | |
US20080279658A1 (en) | Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory | |
KR101717815B1 (ko) | 카세트 픽업 유닛 및 이를 포함하는 증착 시스템 | |
KR101355916B1 (ko) | 기판 처리 장치 및 기판 이송 방법 | |
TW202341320A (zh) | 用於混合式基板接合系統的foup或卡匣儲存器 | |
CN117096078A (zh) | 反应舟的硅片装卸方法及装卸系统 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 201306 plant 3, Lane 2699, Jiangshan Road, Lingang xinpian District, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Patentee after: Ideal Wanlihui Semiconductor Equipment (Shanghai) Co.,Ltd. Address before: 201203 No.1, Curie Road, Zhangjiang hi tech, Pudong New Area, Shanghai Patentee before: SHANGHAI LIXIANG WANLIHUI FILM EQUIPMENT Co.,Ltd. |
|
EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20180720 Assignee: HEFEI IDEA TECHNOLOGIES CO.,LTD. Assignor: Ideal Wanlihui Semiconductor Equipment (Shanghai) Co.,Ltd. Contract record no.: X2023980036582 Denomination of invention: A silicon wafer loading/unloading transmission system and its working method Granted publication date: 20200619 License type: Common License Record date: 20230614 |