KR101024216B1 - 기판 이송 유닛 및 기판 이송 방법 - Google Patents
기판 이송 유닛 및 기판 이송 방법 Download PDFInfo
- Publication number
- KR101024216B1 KR101024216B1 KR1020080083915A KR20080083915A KR101024216B1 KR 101024216 B1 KR101024216 B1 KR 101024216B1 KR 1020080083915 A KR1020080083915 A KR 1020080083915A KR 20080083915 A KR20080083915 A KR 20080083915A KR 101024216 B1 KR101024216 B1 KR 101024216B1
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- KR
- South Korea
- Prior art keywords
- substrate
- buffer unit
- transfer robot
- wafer transfer
- unit
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1615—Programme controls characterised by special kind of manipulator, e.g. planar, scara, gantry, cantilever, space, closed chain, passive/active joints and tendon driven manipulators
- B25J9/162—Mobile manipulator, movable base with manipulator arm mounted on it
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Orthopedic Medicine & Surgery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (7)
- 기판을 수용하는 복수의 슬롯으로 구성되는 풉 (foup);상기 기판을 대기시키는 복수의 슬롯으로 구성되는 버퍼부;상기 풉과 상기 버퍼부 사이에서 상기 기판을 로딩/언로딩하기 위한 인덱스 로봇; 및상기 버퍼부에 대기중인 기판을 각 공정 챔버로 이송하기 위한 웨이퍼 이송 로봇을 포함하고,상기 웨이퍼 이송 로봇과 상기 버퍼부는 연결되어 함께 이동하고상기 버퍼부는 반입부 및 반출부를 포함하고,상기 인덱스 로봇은 상기 반입부로 기판을 로딩하고, 상기 반출부로부터 기판을 언로딩하는, 기판 이송 유닛.
- 제 1 항에 있어서,상기 웨이퍼 이송 로봇과 상기 버퍼부는 동일 테이블 상에 장착되고,상기 테이블의 이동에 따라 상기 웨이퍼 이송 로봇과 상기 버퍼부가 함께 이동하는, 기판 이송 유닛.
- 제 2 항에 있어서,상기 테이블은 리니어 모터 또는 볼스크류에 연결되어 트랙을 따라 이동하거나 자동 제어되는 밸트 위에 연결되어 밸트의 이동에 따라 트랙을 이동하는, 기판 이송 유닛.
- 제 1 항 또는 제 2 항에 있어서,상기 웨이퍼 이송 로봇과 상기 버퍼부는 일체로 결합되거나 소정의 거리만큼 이격되어 유지되는, 기판 이송 유닛.
- 삭제
- 반도체 제조 공정이 진행되는 설비에 기판을 반출입하는 기판 이송 방법에 있어서,인덱스 로봇이 기판을 수용하는 풉 (foup) 으로부터 기판을 이송하여 버퍼부로 상기 기판을 로딩하는 단계;웨이퍼 이송 로봇이 상기 버퍼부에 로딩된 기판을 언로딩하여 각 공정 챔버로 이송하는 단계를 포함하고,상기 웨이퍼 이송 로봇과 상기 버퍼부는 연결되어 함께 이동하고,상기 버퍼부는 반입부 및 반출부를 포함하고,상기 인덱스 로봇은 상기 반입부로 기판을 로딩하고, 상기 반출부로부터 기판을 언로딩하는, 기판 이송 방법.
- 제 6 항에 있어서,상기 웨이퍼 이송 로봇과 상기 버퍼부가 연결되어 함께 이동하는 단계는, 상기 웨이퍼 이송 로봇과 상기 버퍼부가 동일 테이블 상에 장착되고 상기 테이블의 이동에 따라 상기 웨이퍼 이송 로봇과 상기 버퍼부가 함께 이동하는 것을 포함하는, 기판 이송 방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080083915A KR101024216B1 (ko) | 2008-08-27 | 2008-08-27 | 기판 이송 유닛 및 기판 이송 방법 |
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KR1020080083915A KR101024216B1 (ko) | 2008-08-27 | 2008-08-27 | 기판 이송 유닛 및 기판 이송 방법 |
Publications (2)
Publication Number | Publication Date |
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KR20100025229A KR20100025229A (ko) | 2010-03-09 |
KR101024216B1 true KR101024216B1 (ko) | 2011-03-29 |
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KR1020080083915A KR101024216B1 (ko) | 2008-08-27 | 2008-08-27 | 기판 이송 유닛 및 기판 이송 방법 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101295791B1 (ko) * | 2011-05-31 | 2013-08-09 | 세메스 주식회사 | 기판 처리 설비 및 기판 처리 방법 |
CN110867402A (zh) * | 2019-11-27 | 2020-03-06 | 北京北方华创微电子装备有限公司 | 晶圆清洗设备 |
CN114420616A (zh) * | 2022-03-28 | 2022-04-29 | 西安奕斯伟材料科技有限公司 | 槽式清洗装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08264616A (ja) * | 1995-03-27 | 1996-10-11 | Tokyo Electron Ltd | 真空処理装置および真空処理室内の基板搬送装置 |
KR20020082402A (ko) * | 2001-04-19 | 2002-10-31 | 무라타 기카이 가부시키가이샤 | 무인운반차, 무인운반차시스템 및 웨이퍼운반방법 |
JP2003188229A (ja) * | 2001-12-18 | 2003-07-04 | Hitachi Kasado Eng Co Ltd | ウエハ製造システムおよびウエハ製造方法 |
KR20050104457A (ko) * | 2004-04-28 | 2005-11-03 | 세메스 주식회사 | 반도체 제조 설비 |
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- 2008-08-27 KR KR1020080083915A patent/KR101024216B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08264616A (ja) * | 1995-03-27 | 1996-10-11 | Tokyo Electron Ltd | 真空処理装置および真空処理室内の基板搬送装置 |
KR20020082402A (ko) * | 2001-04-19 | 2002-10-31 | 무라타 기카이 가부시키가이샤 | 무인운반차, 무인운반차시스템 및 웨이퍼운반방법 |
JP2003188229A (ja) * | 2001-12-18 | 2003-07-04 | Hitachi Kasado Eng Co Ltd | ウエハ製造システムおよびウエハ製造方法 |
KR20050104457A (ko) * | 2004-04-28 | 2005-11-03 | 세메스 주식회사 | 반도체 제조 설비 |
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