TW200707621A - Cartesian robot cluster tool architecture - Google Patents

Cartesian robot cluster tool architecture

Info

Publication number
TW200707621A
TW200707621A TW095114022A TW95114022A TW200707621A TW 200707621 A TW200707621 A TW 200707621A TW 095114022 A TW095114022 A TW 095114022A TW 95114022 A TW95114022 A TW 95114022A TW 200707621 A TW200707621 A TW 200707621A
Authority
TW
Taiwan
Prior art keywords
processing
cluster tool
substrate
racks
various
Prior art date
Application number
TW095114022A
Other languages
Chinese (zh)
Other versions
TWI345817B (en
Inventor
Mike Rice
Jeffrey Hudgens
Charles Carlson
William Tyler Weaver
Robert Lowrance
Eric Englhardt
Dean C Hruzek
Dave Silvetti
Michael Kuchar
Kirk Van Katwyk
Van Hoskins
Vinay Shah
Steve Hongkham
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/315,984 external-priority patent/US7651306B2/en
Priority claimed from US11/315,873 external-priority patent/US7374391B2/en
Priority claimed from US11/315,778 external-priority patent/US20060182535A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200707621A publication Critical patent/TW200707621A/en
Application granted granted Critical
Publication of TWI345817B publication Critical patent/TWI345817B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

A method and apparatus for processing substrates using a multi-chamber processing system that has an increased throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history, and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in vertical and horizontal directions, to access the various processing chambers retained in the processing racks. In one embodiment, a robot blade is adapted to restrain a substrate so that the accelerations experienced by the substrate during a transferring process will not cause the substrate position to change on the robot blade.
TW95114022A 2005-04-22 2006-04-19 Cartesian robot cluster tool architecture TWI345817B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US67384805P 2005-04-22 2005-04-22
US11/315,984 US7651306B2 (en) 2004-12-22 2005-12-22 Cartesian robot cluster tool architecture
US11/315,873 US7374391B2 (en) 2005-12-22 2005-12-22 Substrate gripper for a substrate handling robot
US11/315,778 US20060182535A1 (en) 2004-12-22 2005-12-22 Cartesian robot design

Publications (2)

Publication Number Publication Date
TW200707621A true TW200707621A (en) 2007-02-16
TWI345817B TWI345817B (en) 2011-07-21

Family

ID=36676525

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95114022A TWI345817B (en) 2005-04-22 2006-04-19 Cartesian robot cluster tool architecture

Country Status (5)

Country Link
JP (2) JP5265343B2 (en)
KR (1) KR100960765B1 (en)
CN (3) CN101164138B (en)
TW (1) TWI345817B (en)
WO (1) WO2006115745A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI727579B (en) * 2019-09-30 2021-05-11 大陸商瀋陽芯源微電子設備股份有限公司 Photoresist coating and development apparatus

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CN101332604B (en) * 2008-06-20 2010-06-09 哈尔滨工业大学 Control method of man machine interaction mechanical arm
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US9435826B2 (en) 2012-05-08 2016-09-06 Kla-Tencor Corporation Variable spacing four-point probe pin device and method
JP6182065B2 (en) * 2013-12-27 2017-08-16 東京エレクトロン株式会社 Substrate processing equipment
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US9555545B2 (en) * 2014-05-21 2017-01-31 Bot & Dolly, Llc Systems and methods for time-based parallel robotic operation
JP6559976B2 (en) * 2015-03-03 2019-08-14 川崎重工業株式会社 Substrate transfer robot and substrate processing system
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JP6425639B2 (en) * 2015-04-08 2018-11-21 東京エレクトロン株式会社 Substrate processing system
TWI602131B (en) * 2016-05-26 2017-10-11 台灣積體電路製造股份有限公司 Storage system and method for controlling the storage system
KR101885257B1 (en) * 2016-11-03 2018-08-03 포톤데이즈(주) An Apparatus for Testing Optical Properties and Reliabilities of Photonic Devices with a Structure of a Plural of Magazines
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TWI678277B (en) * 2017-03-21 2019-12-01 德律科技股份有限公司 Barrier detection method and anti-collision method of pressing bed
JP6902379B2 (en) * 2017-03-31 2021-07-14 東京エレクトロン株式会社 Processing system
CN114026680A (en) * 2019-02-14 2022-02-08 柿子技术公司 Linear robot with double-link arm
JP7536582B2 (en) 2020-10-01 2024-08-20 ニデックインスツルメンツ株式会社 Transport System
US20230150120A1 (en) * 2021-11-17 2023-05-18 Kawasaki Jukogyo Kabushiki Kaisha Substrate Conveying Robot and Substrate Conveying Robot System

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Publication number Priority date Publication date Assignee Title
TWI727579B (en) * 2019-09-30 2021-05-11 大陸商瀋陽芯源微電子設備股份有限公司 Photoresist coating and development apparatus

Also Published As

Publication number Publication date
WO2006115745A1 (en) 2006-11-02
TWI345817B (en) 2011-07-21
JP5329705B2 (en) 2013-10-30
CN101164138B (en) 2012-10-17
JP2008538654A (en) 2008-10-30
JP2013030787A (en) 2013-02-07
CN102867764A (en) 2013-01-09
CN101164138A (en) 2008-04-16
JP5265343B2 (en) 2013-08-14
KR20070120175A (en) 2007-12-21
KR100960765B1 (en) 2010-06-01
CN102867764B (en) 2015-06-17
CN102176425A (en) 2011-09-07
CN102176425B (en) 2013-02-06

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees