KR20070120175A - Cartesian robot cluster tool architecture - Google Patents

Abstract

A method and apparatus for processing substrates using a multi-chamber processing system that has an increased throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history, and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in vertical and horizontal directions, to access the various processing chambers retained in the processing racks. In one embodiment, a robot blade is adapted to restrain a substrate so that the accelerations experienced by the substrate during a transferring process will not cause the substrate position to change on the robot blade.

Description

Cartesian Robot Cluster Tool Architecture {CARTESIAN ROBOT CLUSTER TOOL ARCHITECTURE}

The present invention is generally directed to an integrated processing system comprising a robot and multiple processing stations capable of processing multiple substrates in parallel.

The processing to form the electronic device takes place in a multi-chamber processing system (eg, cluster tool) capable of processing the substrates in sequence (eg, semiconductor wafer) in a controlled processing environment. A typical cluster tool used to deposit (ie, coat) and develop pororesist materials, commonly known as track lithography tools, or to perform semiconductor cleaning processes, generally described as wet / clean tools, is a pod / cassette mounting apparatus. And a mainframe containing one or more substrate transfer robots for transferring substrates between the various processing chambers connected to the mainframe. Cluster tools are often used to enable substrate processing repeatedly in a controlled processing environment. A controlled processing environment has many advantages, including minimizing contamination during migration and during various substrate processing steps. Treatment in a controlled environment thus reduces the number of production defects and improves device yield.

The efficiency of the substrate manufacturing process is usually measured by two important factors: device yield and cost of ownership (CoO). These factors are important because they directly affect the cost of producing electronic devices, which in turn affect the competitiveness of the device manufacturers in the market. Cost of ownership is also affected by many other factors, but can be greatly affected by system and chamber throughput, or only by the number of substrates per hour processed using the desired processing sequence. The processing sequence is generally defined as a completed device manufacturing step, or processing recipe step, in one or more processing chambers in a cluster tool. The processing sequence may generally include several substrate (or wafer) electronic device manufacturing processing steps. In an effort to reduce cost of ownership, electronics manufacturers spend a great deal of time optimizing processing sequences and chamber processing times to achieve the maximum possible substrate throughput within the given cluster tool architecture limits and chamber processing times. In a track lithography type cluster tool, the chamber processing time is rather short (e.g., about one minute to complete the process) and the number of processing steps required to complete a typical processing sequence results in a significant portion of the time required to complete the processing sequence. Used before the interchamber substrate. A typical track lithography processing sequence will generally involve the following steps. Deposit one or more uniform photoresist (or resist) layers on the substrate surface, transfer the substrate to a stepper or scanner tool separated from the cluster tool, and then expose the photoresist layer to photoresist-modified electromagnetic radiation to form a pattern on the substrate surface , Patterned photoresist layer development. If the substrate throughput in the cluster tool is not robot limited, the longest processing recipe step will generally limit the throughput of the processing sequence. The track lithography processing sequence is different because of the short processing time and the large number of processing steps. Typical system throughput of conventional manufacturing processes, such as track lithography with typical processing, will typically be between 100-120 substrates per hour.

Other important factors in the cost of ownership are system reliability and system uptime. If the system cannot process the substrate for a long time, the user loses the opportunity to process the substrate in the cluster tool, thereby increasing the user's financial loss, which is critical for the profitability and usefulness of the cluster tool. Therefore, users and manufacturers of cluster tools spend a lot of time trying to develop reliable systems with reliable processing, reliable hardware, and increased uptime.

The industry's need to reduce the size of semiconductor devices to improve device throughput and reduce heat generation by devices has led to margins of process variation. An important factor in the track lithography process order to minimize process variations is to ensure that all substrates passing through the cluster tool have the same "wafer history". Typically, processing engineers monitor and control the wafer history of the board to control all equipment manufacturing process variables that can later affect device performance, ensuring that all boards in the same group are always processed in the same way. In order for each board to have the same "wafer history," each board must undergo the same iterative substrate processing steps (e.g. consistent coating, consistent hard bake, consistent cooling, etc.) and the timing between the different processing steps Should be the same. Lithographic form device fabrication processes are particularly sensitive to changes in process recipe parameters and timing between recipe steps, which directly affect process variability and ultimately device performance. Accordingly, there is a need for a support device and cluster tool capable of performing a processing sequence that minimizes the degree of change in processing and the change in timing between processing steps. There is also a need for support devices and cluster tools capable of performing device fabrication processes that achieve uniform and repeatable processing results while achieving the desired substrate throughput.

Therefore, what is needed is a system, method, and apparatus that can process substrates to meet desired device performance goals and increase system throughput to reduce processing order ownership costs.

The present invention provides a first processing rack comprising: a first group of processing chambers having two or more substrate processing chambers stacked vertically; And a second group of processing chambers having two or more processing chambers stacked vertically,-a first side of which two or more substrate processing chambers of the first group and the second group are aligned in a first direction; Having a first robotic assembly configured to move a substrate from said first processing rack to said substrate processing chambers, said first robotic assembly having a robot blade and a substrate receiving surface; The first robot is configured to form a movement area and to position the substrate at one or more locations generally contained within the first plane, the first plane being in a first direction and a second direction perpendicular to the first direction Parallel to-a first movement assembly adapted to position said first robot in a third direction generally perpendicular to said first plane and having an actuator assembly; And a second movement assembly adapted to position the first robot in a direction generally parallel to the first direction and having an actuator assembly; When the substrate is located on the substrate receiving surface of the robot blade, the moving region is parallel to the second direction and has a width of about 5% to 50% greater than the dimension of the substrate in the second direction. To provide a cluster tool for processing a substrate, comprising a first robotic assembly.

The present invention provides a method for manufacturing a semiconductor device comprising: a first processing rack comprising two or more groups of two or more substrate processing chambers stacked in a vertical direction; The two or more groups of the two or more substrate processing chambers have a first side aligned along a first direction to access the substrate processing chambers through two or more groups of two or more substrate processing chambers stacked in a vertical direction. A second treatment rack comprising; Said two or more groups of said at least two substrate processing chambers having a first side aligned along a first direction and accessing said substrate processing chambers through said first processing rack and said second processing rack A first robotic assembly configured to move a substrate from the first side to the substrate processing chambers of the first processing rack, comprising: a robot configured to position the substrate at one or more locations generally included in a horizontal plane; A vertical motion assembly having a motor configured to position the robot in a direction generally parallel to the vertical direction; And a horizontal motion assembly having a motor configured to position the robot in a direction generally parallel to the first direction. A second robotic assembly located between the first processing rack and the second processing rack and configured to move a substrate from the first side to the substrate processing chambers of the second processing rack, the one or more generally included in a horizontal plane A robot configured to position the substrate in position; A vertical motion assembly having a motor configured to position the robot in a direction generally parallel to the vertical direction; And a horizontal motion assembly having a motor configured to position the robot in a direction generally parallel to the first direction. And positioned between the first processing rack and the second processing rack and configured to move a substrate from the first side to the substrate processing chambers of the first processing rack from the second processing rack or from the first side. 3 A robot assembly comprising: a robot configured to position a substrate at one or more locations generally included in a horizontal plane; A vertical motion assembly having a motor configured to position the robot in a direction generally parallel to the vertical direction; And a horizontal robotic assembly having a motor configured to position the robot in a direction generally parallel to the first direction.

The present invention is directed to a process comprising: a first processing rack comprising two or more groups of two or more vertically stacked substrate processing chambers; The two or more vertically stacked substrate processing chambers of the two or more groups have access to the substrate processing chambers through them having a first side aligned along a first direction and a second side aligned along a second direction A first robotic assembly configured to move a substrate from the first side to the substrate processing chambers of the first processing rack, the first robot positioning the substrate at one or more points generally included in a horizontal plane; A first robot made up of; A vertical movement assembly having a motor configured to position the first robot in a direction generally parallel to the vertical direction; And a horizontal motion assembly having a motor configured to position the first robot in a direction generally parallel to the first direction. And a second robotic assembly configured to move the substrate from the second side to the substrate processing chambers of the first processing rack, the second robot positioning the substrate at one or more points generally included in a horizontal plane. A second robot made up of; A vertical movement assembly having a motor configured to position the second robot in a direction generally parallel to the vertical direction; And a horizontal robotic assembly having a motor configured to position the second robot in a direction generally parallel to the first direction.

Embodiments of the invention include two or more substrate processing chambers located in the cluster tool; And a first robot assembly configured to move a substrate into the at least two substrate processing chambers, the first robot configured to position the substrate in a first direction, the first robot assembly comprising: a substrate receiving surface and a first end configured to receive and transport the substrate; Having a robot blade; A first linkage member having a first pivot point and a second pivot point; A motor rotatably coupled to the first linkage member at the second pivot point; A first gear rotatably coupled to the first linkage member at the first pivot point and attached to a first end of the robot blade; And a second coaxially aligned with the second pivot point of the first linkage and rotatably coupled to the first gear, wherein the gear ratio of the second gear to the first gear is about 3: 1 to about 4: 3. A first robot comprising two gears; A first movement assembly configured to position the first robot in a second direction generally perpendicular to the first direction; And a second motion assembly having a motor configured to position the first robot in a third direction generally perpendicular to the second direction. 2. A cluster tool for processing a substrate, comprising: a first robot assembly; do.

The present invention is directed to a process comprising: a first processing rack comprising two or more groups of two or more vertically stacked substrate processing chambers; The two or more vertically stacked substrate processing chambers of the two or more groups have access to the substrate processing chambers through them having a first side aligned along a first direction and a second side aligned along a second direction A first robotic assembly configured to move a substrate from the first side to the substrate processing chambers of the first processing rack, the first robot positioning the substrate at one or more points generally included in a horizontal plane; A first robot made up of; A vertical movement assembly having a motor configured to position the first robot in a direction generally parallel to the vertical direction; And a horizontal motion assembly having a motor configured to position the first robot in a direction generally parallel to the first direction. And a second robotic assembly configured to move the substrate from the second side to the substrate processing chambers of the first processing rack, the second robot positioning the substrate at one or more points generally included in a horizontal plane. A second robot made up of; A vertical movement assembly having a motor configured to position the second robot in a direction generally parallel to the vertical direction; And a horizontal robotic assembly having a motor configured to position the second robot in a direction generally parallel to the first direction.

Embodiments of the invention include two or more substrate processing chambers located in the cluster tool; And a first robot assembly configured to move a substrate into the at least two substrate processing chambers, the first robot configured to position the substrate in a first direction, the first robot assembly comprising: a substrate receiving surface and a first end configured to receive and transport the substrate; Having a robot blade; A first linkage member having a first pivot point and a second pivot point; A motor rotatably coupled to the first linkage member at the second pivot point; A first gear rotatably coupled to the first linkage member at the first pivot point and attached to a first end of the robot blade; And a second coaxially aligned with the second pivot point of the first linkage and rotatably coupled to the first gear, wherein the gear ratio of the second gear to the first gear is about 3: 1 to about 4: 3. A first robot comprising two gears; A first movement assembly configured to position the first robot in a second direction generally perpendicular to the first direction; And a second motion assembly having a motor configured to position the first robot in a third direction generally perpendicular to the second direction. 2. A cluster tool for processing a substrate, comprising: a first robot assembly; do.

Embodiments of the invention include a first robot configured to position a substrate at one or more points generally included in a first plane; A vertical movement assembly, comprising: a slide assembly comprising a block coupled to a linear rail oriented in a vertical direction; A support plate coupled to the block and the first robot; And an actuator configured to vertically position the support plate in a vertical position along the linear rail; And a horizontal motion assembly coupled to the vertical motion assembly with a horizontal actuator configured to position the first robot and the vertical motion assembly in a horizontal direction.

Embodiments of the invention include a first robot configured to position a substrate at one or more points generally included in a first plane; A vertical movement assembly, comprising: an actuator assembly configured to vertically position the first robot, the vertical actuator configured to position the first robot vertically; And a vertical slide adapted to guide the first robot when the first robot is moved by the vertical actuator. An enclosure having one or more walls defining an interior region surrounding at least one of the components selected from the group consisting of the vertical actuator and the vertical slide; And a fan in fluid communication with the interior region configured to generate negative pressure inside the enclosure; And a horizontal movement assembly having a horizontal guide member and a horizontal actuator configured to position the first robot in a direction generally parallel to the first side of the first treatment rack. to provide.

An embodiment of the present invention provides a robot assembly comprising: a first robot assembly configured to position a substrate in a first direction, the robot blade having a substrate receiving surface and a first end; A first linkage member having a first pivot point and a second pivot point; A first gear coupled to the first end of the robot blade and rotatably coupled to the first linkage member at the first pivot point; A second gear rotatably coupled to the first gear and aligned with a second pivot point of the first linkage; And a first motor rotatably coupled to the first linkage member. The first motor is adapted to position the substrate receiving surface by rotating the first linkage and the first gear relative to the second gear-the first in a second direction generally perpendicular to the first direction A first movement assembly configured to position the robot; And a second movement assembly configured to position the first robot in a third direction generally perpendicular to the second direction.

Embodiments of the present invention provide a robot assembly comprising a robot assembly having a first end and a substrate receiving surface, the first robot assembly configured to position a substrate at one or more points along an arc generally included in the first plane; And a motor rotatably coupled to the first end of the robot blade. A first movement assembly configured to position the first robot in a second direction generally perpendicular to the first plane, an actuator assembly configured to position the first robot vertically, the first robot positioned vertically An actuator assembly comprising a vertical actuator adapted to guide and a vertical slide configured to guide the first robot when the first robot is moved by the vertical actuator; An enclosure having one or more walls defining an interior region surrounding at least one of the components selected from the group consisting of the vertical actuator and the vertical slide; And a fan adapted to generate negative pressure inside the enclosure and in fluid communication with the interior region; And a second movement assembly having a second actuator configured to position the first robot in a third direction generally perpendicular to the second direction.

Embodiments of the present invention provide a robot assembly comprising: a first robot assembly configured to position a substrate in a first direction, the robot blade having a first end and a substrate receiving surface; A first gear coupled to the first end of the robot blade; A second gear rotatably coupled to the first gear; A first motor rotatably coupled to the first gear; And a second motor rotatably coupled to the second gear; The second motor is adapted to rotate the second gear relative to the first gear to create a variable gear ratio, and to position the first robot in a second direction generally perpendicular to the first direction. An apparatus is provided for moving a substrate in a cluster tool, comprising one movement assembly.

Embodiments of the invention include a base having a substrate support surface; A reaction member located on the base; A contact member coupled to an actuator configured to urge the substrate against the reaction member; And a brake member configured to generally inhibit movement of the contact member when the contact member is positioned to press the substrate against the reaction member.

Embodiments of the invention include a base having a support surface; A reaction member located at the base; An actuator coupled to the base; A contact member coupled to the actuator supported at the edge by the reaction member and configured to press the contact member against an edge of the substrate located on the support surface; And a brake member assembly, the brake member; And a brake actuating member, the brake actuating member configured to press the brake member against the contact member such that the brake actuating creates a limiting force that generally prohibits movement of the contact member during the substrate movement process. Including, there is provided an apparatus for moving a substrate.

Embodiments of the invention include a base having a support surface; A reaction member located on the base; A contact member assembly, comprising: an actuator; And a contact member having a substrate contact surface and a compliant member positioned between the substrate contact surface and the actuator; The actuator is adapted to press the contact surface against a substrate positioned against the surface of the reaction member, the brake member assembly comprising: a brake member; And a brake actuating member configured to press the brake member against the contact member to prohibit movement of the contact member during a substrate movement process. And a sensor coupled to the contact member and adapted to sense the position of the contact surface.

Embodiments of the present invention provide a robot assembly comprising: a first robot configured to move a substrate located on a robot blade in a first direction; A first movement assembly having an actuator configured to position the first robot in a second direction; And a second movement assembly coupled to the first movement assembly with a second actuator configured to position the first movement assembly and the first robot in a third direction generally perpendicular to the second direction. ; And a substrate gripping device coupled to the robot blade and adapted to support a substrate, the substrate gripping device comprising: a reaction member located on the robot blade; An actuator coupled to the robot blade; A contact member coupled to the actuator; The actuator is adapted to constrain the substrate by pressing the contact member against an edge of the substrate located between the contact member and the reaction member, and as a brake member assembly, movement of the contact member during the brake member and substrate movement process. An apparatus for moving a substrate, comprising a substrate gripping mechanism, comprising a brake member assembly, the brake actuating member configured to press the brake member against the contact member to prohibit the contact.

Embodiments of the present invention provide a method of moving a substrate, comprising: positioning a substrate on the substrate support mechanism between a reaction member and a substrate contact member located on the substrate support mechanism; Pressing a substrate against the reaction member and generating a substrate bearing force using an actuator for pressing the substrate contact member against the substrate; And generating a limiting force configured to limit the movement of the substrate contact member during the process of moving the substrate using the brake assembly.

Embodiments of the invention include positioning a substrate on the substrate support mechanism between a reaction member and a substrate contact member located on the substrate support mechanism; Coupling the actuator with the connection member to the substrate contact member such that a connection member couples an actuator to the substrate contact member; Applying a bearing force to the substrate using an actuator that presses the substrate against the reaction member and the substrate contact member against the substrate; Storing energy in a compliant member positioned between the substrate contact member and the connection member; Limiting movement of the connecting member after the supporting force is applied to minimize the amount of change in the supporting force during the movement of the substrate; And sensing movement of the substrate by sensing movement of the substrate contact member by reduction of energy stored in the compliant member.

An embodiment of the invention is a method of receiving a substrate located in a first processing chamber on a robot substrate support, the method comprising positioning a substrate on the robot substrate support between a reaction member and a substrate contact member located on the robot substrate support. ; Generating a substrate bearing force by using an actuator that presses the substrate against the reaction member and the substrate contact member against the substrate; And positioning the brake assembly to produce a limiting force that limits the movement of the substrate contact member in the process of moving the substrate; And using a first robotic assembly configured to position the substrate at a desired position in a first direction and at a desired position in a second direction generally perpendicular to the first direction, the first from a position in the first processing chamber. Moving the robotic substrate support and the substrate to a location in a second processing chamber spaced apart from the first processing chamber along a direction.

Embodiments of the invention are located along the first direction using a first robotic assembly configured to position the substrate at a desired position in a first direction and at a desired position in a second direction generally perpendicular to the first direction. Moving the substrate to a first array of processing chambers; Moving the substrate to a second array of processing chambers located along the first direction using a second robotic assembly configured to position the substrate at a desired position in the first direction and at a desired position in the second direction ; And the first and second arrays of processing chambers located along the first direction using a third robotic assembly configured to position the substrate at a desired position in the first direction and at a desired position in the second direction. A method of moving a substrate in a cluster tool, comprising moving the substrate.

Embodiments of the present invention utilize a first robotic assembly using a first robotic assembly configured to position a substrate at a desired position in a first direction and at a desired position in a second direction generally perpendicular to the first direction. moving the substrate from a passthru chamber into a first array of processing chambers located along the first direction; Moving the substrate from the first communication chamber to the first array of processing chambers using a second robotic assembly configured to position the substrate at a desired position in the first direction and at a desired position in the second direction. ; And using a front end robot located in a front end assembly to move the substrate from a substrate cassette to the first communication chamber, wherein the front end assembly comprises a first arrangement of the processing chambers, the first robot assembly and Provided is a method of moving a substrate in a cluster tool, substantially adjacent to a moving region comprising the second robotic assembly.

Description of the invention briefly summarized above, with reference to the embodiments shown in the accompanying drawings, the above-mentioned features of the present invention can be understood in detail. The accompanying drawings illustrate only typical embodiments of the invention and therefore should not be construed to limit the scope thereof, but the invention may allow other equally effective embodiments.

1A is an isometric view showing one embodiment of the cluster tool of the present invention.

1B is a top view of the processing system shown in FIG. 1A in accordance with the present invention.

1C is a side view illustrating one embodiment of a first treatment rack 60 in accordance with the present invention.

1D is a side view illustrating one embodiment of a second treatment rack 80 in accordance with the present invention.

1E is a top view of the processing system shown in FIG. 1B in accordance with the present invention.

1F illustrates one embodiment of a processing sequence including various processing method steps.

FIG. 1G is a top view of the processing system shown in FIG. 1B, which shows the path of travel of the substrate through the cluster tool, which follows the processing sequence shown in FIG. 1F.

2A is a plan view of a processing system according to the present invention.

2B is a plan view of the processing system shown in FIG. 2A in accordance with the present invention.

FIG. 2C is a top view of the processing system shown in FIG. 2B, which shows the path of travel of the substrate through the cluster tool, which follows the processing sequence shown in FIG. 1F.

3A is a plan view of a processing system according to the present invention.

FIG. 3B is a top view of the processing system shown in FIG. 3A, which shows the path of travel of the substrate through the cluster tool, which follows the processing sequence shown in FIG. 1F.

4A is a plan view of a processing system according to the present invention.

4B is a top view of the processing system shown in FIG. 4A, which illustrates the path of travel of the substrate through the cluster tool, which follows the processing sequence shown in FIG. 1F.

5A is a plan view of a processing system according to the present invention.

FIG. 5B is a top view of the processing system shown in FIG. 5A, which shows the path of travel of the substrate through the cluster tool, which follows the processing sequence shown in FIG. 1F.

6A is a plan view of a processing system according to the present invention.

FIG. 6B is a top view of the processing system shown in FIG. 6A, which shows two possible paths of travel of the substrate through the cluster tool, following the processing sequence shown in FIG. 1F.

6C is a plan view of a processing system according to the present invention.

FIG. 6D is a top view of the processing system shown in FIG. 6C, which shows two possible paths of travel of the substrate through the cluster tool, which follows the processing sequence shown in FIG. 1F.

7A is a side view of one embodiment of an exchange chamber in accordance with the present invention.

7B is a top view of the processing system shown in FIG. 1B, in accordance with the present invention.

8A is an isometric view showing another embodiment of the cluster tool shown in FIG. 1A, which has a peripheral enclosure attached in accordance with the present invention.

8B is a cross-sectional view of the cluster tool shown in FIG. 8A, in accordance with the present invention.

8C is a sectional view of one configuration according to the present invention.

9A is an isometric view illustrating one embodiment of a robot that may be configured to move a substrate in various embodiments of a cluster tool.

10A is an isometric view illustrating one embodiment of a robot hardware assembly with a single robot assembly in accordance with the present invention.

10B is an isometric view showing one embodiment of robot hardware with a dual robot assembly in accordance with the present invention.

10C is a cross-sectional view illustrating one embodiment of the robot hardware assembly shown in FIG. 10A in accordance with the present invention.

10D is a cross-sectional view illustrating one embodiment of a robot hardware assembly in accordance with the present invention.

10E is a cross-sectional view of one embodiment of the robot hardware assembly shown in FIG. 10A in accordance with the present invention.

11A is a plan view of one embodiment of a robotic assembly showing various positions of a robot blade as it moves a substrate into a processing chamber in accordance with the present invention.

11B illustrates various possible paths of the substrate center to the processing chamber in accordance with the present invention.

11C is a plan view of one embodiment of a robotic assembly showing various positions of a robot blade as it moves a substrate into a processing chamber in accordance with the present invention.

11E is a plan view of one embodiment of a robotic assembly showing various positions of the robot blade as it moves the substrate into the processing chamber in accordance with the present invention.

11F is a plan view of one embodiment of a robotic assembly showing various positions of a robot blade as it moves a substrate into a processing chamber in accordance with the present invention.

11G is a plan view of one embodiment of a robotic assembly showing various positions of the robot blade as it moves the substrate into the processing chamber in accordance with the present invention.

11H is a top view of one embodiment of a robotic assembly showing various locations of the robot blade as it moves the substrate into the processing chamber in accordance with the present invention.

11I is a plan view of one embodiment of a robotic assembly showing various positions of a robot blade as it moves a substrate into a processing chamber in accordance with the present invention.

11J is a plan view of one embodiment of a robotic assembly in accordance with the present invention.

11K is a top view of a conventional SCARA robot of the robotic assembly located near the treatment rack.

12A is a cross-sectional view of the horizontal motion assembly shown in FIG. 9A in accordance with the present invention.

12B is a cross-sectional view of the horizontal motion assembly shown in FIG. 9A in accordance with the present invention.

12C is a cross-sectional view of the horizontal motion assembly shown in FIG. 9A in accordance with the present invention.

13A is a cross-sectional view of the vertical motion assembly shown in FIG. 9A in accordance with the present invention.

FIG. 13B is an isometric view showing one embodiment of the robot shown in FIG. 13A, which may be made to move the substrate in various embodiments of the cluster tool.

14A is an isometric view illustrating one embodiment of a robot that may be configured to move a substrate in various embodiments of a cluster tool.

15A is an isometric view illustrating one embodiment of a robot that may be configured to move a substrate in various embodiments of a cluster tool.

16A is a plan view illustrating one embodiment of a robot blade assembly that may be configured to move a substrate in various embodiments of a cluster tool.

FIG. 16B is a side cross-sectional view illustrating one embodiment of the robot blade assembly shown in FIG. 16A, which may be made to move the substrate in various embodiments of the cluster tool.

16C is a plan view illustrating one embodiment of a robot blade assembly that may be configured to move a substrate in various embodiments of a cluster tool.

FIG. 16D is a plan view illustrating one embodiment of a robot blade assembly that may be configured to move a substrate in various embodiments of a cluster tool. FIG.

The present invention generally provides a method and apparatus for processing substrates using a multi-chamber processing system (e.g., cluster tool), which system provides increased system throughput, increased system reliability, improved instrument yield performance, more repeatability Possible wafer processing history (or wafer history) and reduced footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process, in which case the substrate is coated with a photosensitive material and then moved to a stepper / scanner, which exposes the photosensitive material to some form of radiation to pattern the photosensitive material. And a certain amount of photosensitive material is then removed in the development process completed in the cluster tool. In another embodiment, the cluster tool is adapted to perform a wet / clean process sequence, in which case various substrate cleaning processes are performed on the substrate of the cluster tool.

1-6 illustrate various robot and processing chamber configurations that may be used in connection with various embodiments of the present invention. Various embodiments of the cluster tool 10 generally employ two or more robots, which are parallel to move the substrate between the various processing chambers held in the processing racks (eg, elements 60, 80, etc.). It consists of one processing configuration whereby the desired processing sequence can be performed on the substrate. In one embodiment, the parallel processing configuration comprises two or more robotic assemblies 11 (elements 11A, 11B, 11C in FIGS. 1A and 1B), which are vertical (hereafter z-direction) and horizontal directions, i.e., movement To move the substrate in a direction (x-direction) and in a direction perpendicular to the direction of movement (y-direction), whereby the substrate is aligned with the direction of movement (for example, elements 60 and 80). It can be processed in a variety of processing chambers held in. One advantage of a parallel processing configuration is that even if one of the robot blades becomes inoperable or disassembled for maintenance, the system can continue to process the substrate using another robot in the system. In general, the various embodiments described herein provide that each row or group of substrate processing chambers is maintained by two or more robots thereby providing increased throughput and increased system reliability. In addition, the various embodiments described herein are generally configured to minimize and control particles produced by the substrate movement mechanism, thereby avoiding substrate yield and substrate scrap issues that can affect the CoO of the cluster tool. . Another advantage of this configuration is that it is flexible, and the flexible and modular architecture allows you to configure the number of processing chambers, processing racks, and processing robots required to meet your throughput needs. 1-6 illustrate one embodiment of a robotic assembly 11 that may be required to carry out various aspects of the present invention, and other forms of robotic assembly 11 moving the same substrate without departing from the basic scope of the present invention. And a location function.

Configure the First Cluster Tool

A. System Configuration

1A is an isometric view of one embodiment of the cluster tool 10, which illustrates a number of aspects in accordance with the present invention that may be advantageously employed. 1A shows an embodiment of a cluster tool 10 that includes three robots, which robots are configured to access various processing chambers, which chambers have a first processing rack 60 and a second processing rack 80. And vertically stacked on the outer module 5. In one aspect, when the cluster tool 10 is used to complete the photolithography processing sequence, the external module 5 may be a stepper / scanner tool, which is attached to the rear region 45 (not shown in FIG. 1A). Perform certain additional exposure pattern processing step (s). As shown in FIG. 1A, one embodiment of the cluster tool 10 includes a front end module 24 and a central module 25.

1B is a top view of the embodiment of the cluster tool 10 shown in FIG. 1A. The front end module 24 generally includes one or more pod assemblies 105 (eg, articles 105A-D) and the front end robot assembly 15 (FIG. 1B). One or more pod assemblies 105 or front-end opening unified pods (FOUPs) are generally adapted to receive one or more cassettes 106, which cassettes may comprise one or more substrates ("W") or It can include a wafer, which substrate or wafer will be processed in the cluster tool 10. In one aspect, the front end module 24 also includes one or more pass-through positions 9 (eg elements 9A-C, FIG. 1B).

In one aspect, the central module 25 includes a first robotic assembly 11A, a second robotic assembly 11B, a third robotic assembly 11C, a rear robotic assembly 40, a first processing rack 60 and a first robotic assembly 11A. It has two processing racks 80. The first treatment rack 60 and the second treatment rack 80 may comprise various processing chambers (e.g., coater / developing chambers, bake chambers, cooling chambers, wet cleaning chambers, etc., described below (FIG. 1C-D). )), Which are adapted to perform various processing steps known in the substrate processing sequence.

1C and 1D show side views of one embodiment of the first treatment rack 60 and the second treatment rack 80, which stand at the position closest to the side 60A and the first treatment rack 60 and the second. This is the view when looking at the treatment rack 80 and will therefore match the view shown in FIGS. 1-6. The first processing rack 60 and the second processing rack 80 comprise one or more groups of processing chambers that are generally stacked vertically, which chambers are configured to perform a desired desired semiconductor or flat panel display instrument manufacturing process step on a substrate. . For example, in FIG. 1C the first processing rack 60 has five groups or columns of processing chambers stacked vertically. In general cases, the instrument fabrication processing step may include depositing a material on a surface of a substrate, cleaning the surface of the substrate, etching the substrate surface, or causing the substrate to cause physical or chemical alterations to one or more regions on the substrate. Exposing it to some form of radiation. In one embodiment, the first processing rack 60 and the second processing rack 80 have one or more processing chambers included therein, which chambers may be configured to perform one or more photolithographic processing sequence steps. In one aspect, the treatment racks 60, 80 include one or more couter / developing chambers 160, one or more cooling chambers 180, one or more bake chambers 190, one or more optical edge bead removal (OEBR) chambers ( 162, one or more post exposure bake (PEB) chambers 130, one or more support chambers 165, integrated bake / cooling chambers 800 and / or one or more hexamethyldisilazanes, HMDS) processing chamber 170. Exemplary coater / developer chambers, cooling chambers, bake chambers, OEBR chambers, PEB chambers, support chambers, integrated bake / cooling chambers and / or HMDS processing chambers, which may be made to take advantage of one or more aspects of the present invention, Described in US patent application Ser. No. 11 / 112,281, filed April 22, 2005, which is hereby incorporated by reference to the extent that it is consistent with the claimed invention. Examples of integrated bake / cooling chambers that may be made to benefit one or more aspects of the present invention are described in US patent application Ser. No. 11 / 111,154, filed April 11, 2005 and filed April 11, 2005. It is further described in US patent application Ser. No. 11 / 111,353, which is incorporated by reference to the extent consistent with the claimed invention. Examples of systems and / or processing systems that can be made to perform one or more cleaning treatments on a substrate and that can be made to benefit one or more aspects of the invention are described in US patent application Ser. No. 09 / 891,849, filed June 25, 2001. And US patent application Ser. No. 09 / 945,454, filed August 31, 2001, which is incorporated by reference to the extent consistent with the claimed invention.

In the embodiment in which the cluster tool 10 is configured to perform photolithographic type processing, as shown in FIG. 1C, the first processing rack 60 is labeled with eight coater / developing chambers 160 (CD1-8). 18 cooling chambers 180 (labeled C1-8), eight bake chambers 190 (labeled B1-8), six PEB chambers 130 (labeled PEB1-6) ), Two OEBR chambers 162 (labeled 162) and / or six HMDS processing chambers 170 (labeled DP1-6). In one embodiment, as shown in FIG. 1D, the cluster tool 10 is adapted to perform photolithographic form processing, and the second processing rack 80 includes eight coater / developing chambers 160 (CD1-8). Labeled), six integrated bake / cooling chambers 800 (BC1-6), six HMDS processing chambers 170 (labeled DP1-6) and / or six support chambers 165 (Labeled S1-6). The direction, position, shape, and number of process chambers shown in FIGS. 1C-D are not intended to limit the scope of the present invention but are intended to represent embodiments of the present invention.

Referring to FIG. 1B, in one embodiment, the front end robot assembly 15 has a cassette 106 mounted to the pod assembly 105 (see elements 105A-D) and one or more opening positions 9. To move the substrate (see opening positions 9A-C in FIG. 1B). In another embodiment, the front end robot assembly 15 is one or more of the second processing rack 80 or the first processing rack 60 in contact with the cassette and front end module 24 mounted to the pod assembly 105. The substrate is made to move between processing chambers. The front end robot assembly 15 generally includes a horizontal motion assembly 15A and a robot 15B, which in combination are adjacent positions in the central module 25 or desired horizontal and / or vertical positions in the front end module 24. The substrate may be positioned at. The front end robot assembly 15 is adapted to move one or more substrates using one or more robot blades 15C by using commands sent from the system controller 101 (described below). In one sequence, the front end robot assembly 15 is adapted to move the substrate from the cassette to one of the opening positions 9 (eg, elements 9A-C in FIG. 1B). In general, the opening position is a substrate staging area, which may comprise an opening processing chamber, which has similar characteristics to the exchange chamber 533 (FIG. 7A) or the conventional substrate cassette 106. And can receive a substrate from the first robot so that it can be removed and repositioned by the second robot. In one aspect, the opening processing chamber mounted at the opening position may include one or more processing steps, such as an HMDS processing step or a cooling / cool down processing step or a substrate notch align, depending on the desired processing sequence. The same step can be done. In one aspect, each of the opening positions (elements 9A-C in FIG. 1B) is a central robot assembly (ie, a first robotic assembly 11A, a second robotic assembly 11B, and a third robotic assembly ( 11C)).

1A-B, the first robotic assembly 11A, the second robotic assembly 11B, and the third robotic assembly 11C are included in the first processing rack 60 and the second processing rack 80. To transfer the substrate to the various processing chambers. In one embodiment, to perform the process of moving the substrate in the cluster tool 10, the first robot assembly 11A, the second robot assembly 11B, and the third robot assembly 11C are similarly configured robots. With assembly 11, each has one or more robot hardware assemblies 85, vertical movement assemblies 95, and horizontal movement assemblies 90 in communication with system controller 101. In one aspect, the side portion 60B of the first treatment rack 60 and the side portion 80A of the second treatment rack 80 include various robot assemblies (ie, a first robot assembly 11A, a second robot assembly). 11B), and all along the direction parallel to the horizontal motion assembly 90 (described below) of each of the third robotic assemblies 11C.

System controller 101 is adapted to control the position and movement of the various components used to complete the movement process. System controller 101 is generally designed to improve automation and control of the overall system, and is generally a central processing unit (CPU) (not shown), memory (not shown), and support circuits (or I / O) (not shown). ). The CPU can be any form of computer processor, which is used in industrial installations to control various system functions, chamber processing and supporting hardware (eg detectors, robots, motors, gas source hardware, etc.) and systems and chambers. The processing (eg chamber temperature, processing sequence throughput, chamber processing time, I / O signals, etc.) is monitored. The memory may be connected to a CPU and be one or more of readily available memory, such as random access memory (RAM), read only memory (ROM), floppy disk, hard disk, or other form of local or remote digital storage. Can be. Software instructions and data may be coded and stored in memory for instructing the CPU. The support circuit is also coupled to the CPU to support the processor in a conventional manner. Support circuitry may include cache, power supplies, clock circuits, input / output circuitry, subsystems, and the like. The program (or computer instruction) readable by the system controller 101 determines which tasks can be performed on the substrate. Preferably, the program is software readable by the system controller 101, which includes code for performing tasks relating to the execution of the processing sequence and the execution and monitoring of various chamber processing method steps.

Referring to FIG. 1B, the first robotic assembly 11A is adapted to access and move the substrate between the processing chambers of the first processing rack 60 from at least one side, such as side 60B. In one aspect, the third robotic assembly 11C is adapted to access and move the substrate between the processing chambers of the second processing rack 800 from at least one side, such as the side 80A. In one aspect, the second robotic assembly 11B accesses the substrate between the processing chambers of the first processing rack 60 from the side 60B and the processing chambers of the second processing rack 80 from the side 80A. And move it. FIG. 1E shows a top view of the embodiment of the cluster tool 10 shown in FIG. 1B, in which case the robot blade 87 from the second robotic assembly 11B passes through the side 60B with a first treatment rack ( In 60) to the processing chambers. The ability to extend the robot blade 87 to the processing chamber and to contract the robot blade 87 from the processing chamber is a configuration included in the horizontal motion assembly 90, the vertical motion assembly 95, and the robot hardware assembly 85. This is largely accomplished by cooperative movement of the elements and by using commands sent from the system controller 101. The ability of two or more robots to "overlap" with each other, such as the first robot assembly 11A and the second robot assembly 11B or the second robot assembly 11B and the third robot assembly 11C, is useful because it moves the substrate. This allows for redundancy, which can improve cluster reliability, uptime and increase substrate throughput. Robot “overlap” is generally the ability of two or more robots to independently move and / or access a substrate between the same processing chambers of a processing rack. The ability of two or more robots to access processing chambers redundantly can be an important aspect in preventing system robot movement bottlenecks, which makes it possible to help robots limit system throughput in the presence of robots used. Because. Thus, the substrate throughput can be increased, the wafer history of the substrate can be made more repeatable, and system reliability can be improved through the balancing of the loads each robot bears during the processing sequence.

In one aspect of the invention, the various overlapping robotic assemblies (eg, elements 11A, 11B, 11C, 11D, 11E, etc. in FIGS. 1-6) are adjacent to each other in the horizontal direction (x-direction) or in the vertical direction. Adjacent (z-direction) processing chambers can be accessed simultaneously, for example, when using the cluster tool configuration shown in FIGS. 1B and 1C, the first robotic assembly 11A can be mounted to the first processing rack 60. The processing chamber CD6 can be accessed, and the second robotic assembly 11B can access the processing chamber CD5 at the same time without impulsively or disturbing each other, in another example, shown in FIGS. 1B and 1D. When using a cluster tool configuration, the third robotic assembly 11C can access the processing chamber C6 of the second processing rack 80 and the second robotic assembly 11B can simultaneously and without colliding or disturbing each other. The processing chamber P6 can be accessed.

In one aspect, the system controller 101 is adapted to adjust the substrate movement order through the cluster tool based on the calculated optimized throughput or to work around process chambers that have become inoperable. A feature of the system controller 101 to optimize throughput is known as a logical scheduler. The logical scheduler prioritizes substrate movement and tasks based on inputs from various sensors and users distributed through the cluster tool. The logical scheduler is held in the memory of the system controller 101, such as various robots (e.g., front end robot 15, first robot assembly 11A, second robot assembly 11B, third robot assembly 11C). Etc.) to review the list of each required future tasks and to help balance the load placed on each of the various robots. A controller 101 system that maximizes the use of the cluster tool may improve the CoO of the cluster tool, create a more repeatable wafer history, and improve the reliability of the cluster tool.

In one aspect, the system controller 101 is configured to avoid collisions between the various overlapping robots and to optimize substrate throughput. In one aspect, the system controller 101 is programmed to control and monitor the motion of the horizontal motion assembly 90, the vertical motion assembly 95, and the robot hardware assembly 85 of all the robots of the cluster tool, whereby the robots Improve system throughput by preventing collisions and allowing all robots to move simultaneously. This so-called “collision avoidance system” can be performed in a variety of ways, but in general the system controller 101 monitors the position of each robot by using various sensors located on the robot or in the cluster tool during the movement process to avoid collisions. do. In one aspect, the system controller is adapted to actively change the trajectory and / or motion of each robot during the movement process, thereby minimizing the movement path length and preventing collisions.

B. Example of Move Sequence

1F shows an example of a substrate processing sequence 500 through the cluster tool 10, in which case multiple processing steps (eg, elements 501-520) after each moving step A1-A10 is completed. ) May be performed. One or more processing steps 501-520 may include performing a vacuum and / or fluid processing step on a substrate, which deposits material on the substrate surface, cleans the substrate surface, substrate surface Etching, or exposing the substrate to some form of radiation to cause a physical or chemical change in one or more regions on the substrate. Examples of general processing that can be performed are photolithography processing step, substrate cleaning processing step, CVD deposition step, ALD deposition step, electroplating processing step or electroless plating processing step. FIG. 1G shows an example of a move step, in which case the substrate may be followed to move through the cluster tool configured as the cluster tool shown in FIG. 1B following the processing sequence 500 shown in FIG. 1F. In this embodiment, the substrate is removed from the pod assembly 105 (Item # 105) by the front end robot assembly 15 and transferred to the chamber located at the communication position 9C along the movement path A1. The communication step 502 can thereby be completed on the substrate. In one embodiment, the communicating step 502 involves positioning or holding the substrate, whereby another robot can pick up the substrate from the communicating position 9C. After the communication step 502 is completed, the substrate is then moved along the movement path A2 to the first processing chamber 531 by the third robotic assembly 11C. After completing the processing step 504, the substrate is then moved to the second processing chamber 532 by the third robotic assembly 11C along the movement path A3. After performing the processing step 506, the substrate is then moved to the exchange chamber 533 by the second robotic assembly 11B along the movement path A4 (FIG. 7A). After performing the processing step 508, the substrate is moved to the external processing system 536 by the rear robot assembly 40 along the movement path A5, where the processing step 510 is performed. After performing the processing step 510, the substrate is then moved along the movement path A6 to the exchange chamber 533 by the rear robot assembly 40 where the processing step 512 is performed. In one embodiment, processing steps 508 and 512 involve positioning or holding a substrate, whereby another robot can pick up the substrate from the exchange chamber 533. After completing the processing step 512, the substrate is then moved along the movement path A7 to the processing chamber 534 by the second robotic assembly 11B where the processing step 514 is performed. Subsequently, the substrate is moved to the processing chamber 535 along the movement path A8 using the first robot assembly 11A. After the processing step 516 is completed, the first robotic assembly 11A moves the substrate along the movement path A9 to the communication chamber located at the communication position 9A. In one embodiment, the communicating step 518 involves positioning and holding the substrate, whereby another robot can pick up the substrate from the communicating position 9A. After performing communication step 518, the substrate is then moved to pod assembly 105D by front end robot assembly 15 along travel path A10.

In one embodiment, the processing steps 504, 506, 510, 514, 516 are a photoresist coating step, a bake / cool step, an exposure step performed on a stepper / scanner module, a post exposure bake / cool step, and a manifestation step, respectively. Which is described in US patent application Ser. No. 11 / 112,281, filed April 22, 2005, which is incorporated herein by reference. The bake / cool step and the post exposure bake / cool step may be performed in a single processing chamber or may be moved between the bake and cooling zones of the integrated bake / cooling chamber using an internal robot (not shown). 1F-G illustrate an example of a processing sequence that may be used to process substrates in the cluster tool 10, and rather complex movement sequences and / or processing sequences may be performed without departing from the basic scope of the present invention. .

In addition, in one embodiment, the cluster tool is not connected or in communication with the external processing system 536, so that the rear robot assembly 40 is not part of the cluster tool configuration and moves steps A5-A6 and processing steps 510. ) Is not performed on the substrate. In this configuration, all processing steps and moving steps are performed between locations or processing chambers within the cluster tool 10.

Second cluster tool configuration

A. System Configuration

2A is a top view of one embodiment of the cluster tool 10, which is between the front end robot assembly 15, the rear robot assembly 40, the system controller 101, and two processing racks (elements 60, 80). It has four robotic assemblies 11 (FIGS. 9-11; elements (11A, 11B, 11C and 11D in FIG. 2A)) located at the location of the desired substrate processing sequence using various processing chambers known from the processing racks. Is made to perform at least one aspect. The embodiment shown in FIG. 2A is similar to the configuration shown in FIGS. 1A-F except for the addition of the communication position 9D and the four robotic assemblies 11D, and therefore similar element numbers have been used as appropriate. The cluster tool configuration shown in FIG. 2A may be advantageous when substrate throughput is robot constrained, since the addition of four robotic assemblies 11D will help to eliminate the burden on other robots and may be redundantly established to establish one or more central This is because the system makes it possible to process the substrate when the robot is inoperable. In one aspect, the side 60B of the first treatment rack and the side 80A of the second treatment rack 80 are both various robot assemblies (eg, first robot assembly 11A, second robot assembly 11B). And the like are aligned along a direction parallel to each horizontal motion assembly 90 (FIGS. 9A and 12A-C).

In one aspect, the first robotic assembly 11A is configured to access and move the substrates between the processing chambers of the first processing rack 60 from the side 60B. In one aspect, the third robotic assembly 11C is adapted to access and move the substrate between the processing chambers of the second processing rack 80 from the side 80A. In one aspect, the fourth robotic assembly 11D is adapted to access and move the substrate between the processing chambers of the second processing rack 80 from the side 80A. In one aspect, the second robotic assembly 11B and the fourth robotic assembly 11D are connected to the processing chambers of the first processing rack 60 from the second processing rack 80 and the side 60B from the side 80A. Access is made.

FIG. 2B shows a top view of the embodiment of the cluster tool 10 shown in FIG. 2A, in which case the robot blade 87 from the second robot assembly 11B has a first treatment rack 60 through the side 60B. ) Into the processing chamber. The ability to extend the robot blade 87 into the processing chamber and / or deflate the robot blade 87 into the processing chamber is largely completed by the cooperative movement of the robot assembly 11 components, which is a horizontal motion assembly 90. , Vertical motion assembly 95, and robot hardware assembly 85, by use of instructions sent from system controller 101. As described above, the second robotic assembly 11B and the fourth robotic assembly 11D along the system controller 101 may be made to enable "overlap" between each robot in the cluster tool, and the system controller 'S logical scheduler can prioritize substrate movement and tasks based on inputs from various sensors and users distributed through the cluster tool, and utilizes a collision avoidance system to optimize and move substrates through the system. It may be. The use of the system controller 101 to maximize the use of the cluster tool can improve the CoO of the cluster tool, make the wafer history more repeatable, and improve system reliability.

B. Example of Move Order

2C shows an example of a move step sequence, which step may be used to complete the processing sequence described in FIG. 1F through the cluster tool configuration shown in FIG. 2A. In this embodiment, the substrate is removed from the pod assembly 105 (Item # 105D) by the front end robot assembly 15 and transferred to the chamber located at the communication location 9C along the movement path A1 and thereby communicated. Step 502 can be completed on the substrate. Once the communication step 502 is completed, the substrate is then moved along the movement path A2 to the first processing chamber 531 by the third robotic assembly 11C where the processing step 504 is completed on the substrate. . After completing the processing step 504, the substrate is then moved to the second processing chamber 532 by the fourth robotic assembly 11D along the movement path A3. After performing the processing step 506, the substrate is moved to the exchange chamber 533 by the fourth robotic assembly 11D along the movement path A4. After performing the processing step 508, the substrate is moved to the external processing system 536 by the rear robot assembly 40 along the movement path A5, where the processing step 510 is performed. After performing the processing step 510, the substrate is moved to the exchange chamber 533 (FIG. 7A) by the rear robot assembly 40 along the movement path A6, where the processing step 512 is performed. After performing the processing step 512, the substrate is moved to the processing chamber 534 by the fourth robotic assembly 11D along the movement path A7, where the processing step 514 is performed. Subsequently, the substrate is moved to the processing chamber 535 along the movement path A8 using the second robot assembly 11B. After the processing step 516 is completed, the first robotic assembly 11A moves the substrate along the movement path A9 to the communication chamber located at the communication position 9A. After performing the communicating step 518, the substrate is moved to the pod assembly 105D by the front end robot assembly 15 along the movement path A10.

In one aspect, the travel path A7 can be divided into two travel steps, which move the fourth robotic assembly 11D to pick up the substrate from the exchange chamber 533 and move it to the fourth communication position 9D. ) May then be picked up by the second robotic assembly 11B and moved to the processing chamber 534. In one aspect, each of the communication chambers is connected to any of the central robot assembly (ie, the first robot assembly 11A, the second robot assembly 11B, the third robot assembly 11C, and the fourth robot assembly 11D). Can be accessed by In another aspect, the second robotic assembly 11B can pick up the substrate from the exchange chamber 533 and move it to the processing chamber 534.

In addition, in one embodiment, the cluster tool 10 is not connected or in communication with the external processing system 536, so that the rear robot assembly 40 is not part of the cluster tool configuration, and moves steps A5-A6 and Processing step 510 is not performed on the substrate. In this configuration all processing steps and moving steps are performed in the cluster tool 10.

Third Cluster Tool Configuration

A. System Configuration

3A is a top view of one embodiment of the cluster tool 10, which cluster tool includes a front end robot assembly 15, a rear robot assembly 40, a system controller 101, and two processing racks (elements 60 and 80). Have three robotic assemblies 11 (FIGS. 9-11; elements 11A, 11B, 11C of FIG. 3A) located at least in one aspect of the desired substrate processing sequence using various processing chambers in the processing rack. It is made to perform. The embodiment shown in FIG. 3A shows the position of the communication position 9A on the side 60A of the first treatment rack 60 and the position of the first robotic assembly 11A and on the side 80B of the second treatment rack 80. Except for the position of the communication position 9C and the position of the third robot assembly 11C, it is similar to the configuration shown in Figs. 1A-F, and therefore similar element numbers have been used as appropriate. One advantage of this cluster tool configuration is that even if one of the robots in the central module 25 becomes inoperative, the system can still process the substrate using the other two robots. In addition, this configuration can eliminate or minimize the need for an anti-collision shape control feature when the robot moves the substrate between processing chambers mounted on various processing racks, because the physical overlap of the robots located next to each other. Because it is removed. Another advantage of this configuration is that it is flexible and the module architecture allows the user to configure the number of processing chambers, processing racks and processing robots required to meet the throughput requirements of the user.

In this configuration, the first robotic assembly 11A is made to access the processing chamber of the first processing rack 60 from the side 60A, and the third robotic assembly 11C is the second processing from the side 80B. Access to the processing chambers of the rack 80, the second robotic assembly 11B is the processing chamber of the first processing rack 60 from the side 80A and the second processing rack 80 from the side 60B. Is made to access. In one aspect, the side 60B of the first treatment rack 60 and the side 80A of the second treatment rack 80 are both various robot assemblies (ie, a first robot assembly 11A, a second robot assembly ( 11B), aligned along a direction parallel to each horizontal motion assembly 90 (described below) of the third robotic assembly 11C.

Along the system controller 101, the first robotic assembly 11A, the second robotic assembly 11B, and the third robotic assembly 11C allow for "overlap" between the various robots and the logical scheduler of the system controller is responsible for the cluster tool. It can be made to prioritize substrate movement and operations based on inputs from various sensors and users distributed throughout. The use of the system controller 101 and the cluster tool architecture working together to maximize the use of cluster tools to improve CoO makes the wafer history more repeatable and improves system reliability.

B. Example of Move Order

3B shows an example of the sequence of moving steps, which step is used to complete the processing sequence described in FIG. 1F via the cluster tool shown in FIG. 3A. In this embodiment, the substrate is removed from the pod assembly 105 (Item # 105D) by the front end robot assembly 15 and moved to the chamber located at the communication position 9C along the movement path A1, thereby. The communication step 502 can be completed on the substrate. If the communication step 502 is completed, the substrate is then moved along the movement path A2 to the first processing chamber 531 by the third robotic assembly 11C, in which case the processing step 504 is completed on the substrate. do. After completing the processing step 504, the substrate is moved to the second processing chamber 532 by the third robotic assembly 11C along the movement path A3. After completing the processing step 506, the substrate is moved along the movement path A4 to the exchange chamber 533 (FIG. 7A) by the second robotic assembly 11B. After performing the processing step 505, the substrate is moved to the external processing system 536 by the rear robot assembly 40 along the movement path A5, where the processing step 510 is performed. After performing the processing step 510, the substrate is moved to the exchange chamber 533 (FIG. 7A) by the rear robot assembly 40 along the movement path A6, where the processing step 512 is performed. After performing the processing step 512, the substrate is moved to the processing chamber 534 by the second robotic assembly 11C along the movement path A7, where the processing step 514 is performed. Subsequently, the substrate is moved to the processing chamber 535 along the movement path A8 using the second robot assembly 11B. After the processing step 516 is completed, the first robotic assembly 11A moves the substrate along the movement path A9 to the communication chamber located at the communication position 9A. After performing the communicating step 518, the substrate is moved to the pod assembly 105D by the front end robot assembly 15 along the movement path A10.

Further, in one embodiment, the cluster tool 10 is not connected or in communication with the external processing system 536 so that the rear robot assembly 40 is not part of the cluster tool configuration and moves steps A5-A6 and Processing step 510 is not performed on the substrate. In this configuration, all processing steps and moving steps are performed in the cluster tool 10.

Fourth Cluster Tool Configuration

A. System Configuration

4A shows two robotic assemblies 11 (FIGS. 9-11; elements 11B and 11C in FIG. 4A) located around two treatment racks (elements 60 and 80), system controller 101, and rear robot assembly 40. ), Having a front end robot assembly 15, all configured to perform at least one aspect of the desired substrate processing sequence using various processing chambers in the processing rack. The embodiment shown in FIG. 4A is similar to the configuration shown in FIG. 3A but the removal of the communication position 9A and the first robotic assembly 11A on the side 60A of the first treatment rack 60 is different and thus similar. Element numbers were used properly. One advantage of this system configuration is that it allows easy access to the chambers mounted to the first processing rack 60 and thus one or more mounted to the first processing rack 60 while the cluster tool continues to process the substrate. The processing chambers are taken down and are in operation. Another advantage is that the third robotic assembly 11C and / or the second processing rack 80 may be in operation while the substrate is being processed using the second robotic assembly 11B. This configuration can also allow the treatment chamber, which is frequently used in process sequences with short chamber treatment time, to be located in the first treatment rack 80 whereby the chamber is provided with two central robots (ie, element 11B, 11C)), thereby reducing robot movement confinement bottlenecks and improving system throughput. This configuration also eliminates or minimizes the need for an anti-collision shape control feature when the robot moves the substrate between the processing chambers mounted on the processing rack, and eliminates physical intrusion of each robot into another space. do. Another advantage of this configuration is that it is flexible and the module architecture allows the user to configure the number of processing chambers, processing racks and processing robots required to meet the user's throughput needs.

In this configuration, the third robotic assembly 11C is adapted to access and move the substrate between the processing chambers of the second processing rack 80 from the side 80B, and the second robotic assembly 11B is It is adapted to access and move the substrate between the processing chambers of the first processing rack 60 from the side 80A and the second processing rack 80. In one aspect, the side 60B of the first treatment rack 60 and the side 80A of the second treatment rack 80 are both various robot assemblies (ie, a first robot assembly 11A, a second robot assembly ( 11B), aligned along a direction parallel to each horizontal motion assembly 90 (described below) of the third robotic assembly 11C.

As described above, along the system controller 101, the second robotic assembly 11B and the fourth robotic assembly 11C are based on inputs from various sensors and users whose system controller logic scheduler is distributed through the cluster tool. It may be made to prioritize work and substrate movement. The use of the cluster tool architecture and the system controller 101 working together to maximize the use of the cluster tool to improve CoO makes wafer history more repeatable and improves system reliability.

B. Example of Move Order

4B shows an example of a sequence of movement steps that may be used to complete the processing sequence described in FIG. 1F through the cluster tool shown in FIG. 4A. In this embodiment, the substrate is removed from the pod assembly 105 (item # 105D) by the front end robot assembly 15 and transferred to the chamber located at the communication position 9C along the movement path A1, thereby. The communication step 502 can be completed on the substrate. When the communication step 502 is completed, the substrate is moved to the first processing chamber 531 by the third robotic assembly 11C along the movement path A2, where the processing step 504 is completed on the substrate. After the processing step 504 is completed, the substrate is moved to the second processing chamber 532 by the third robotic assembly 11C along the movement path A3. After performing the processing step 506, the substrate is moved to the exchange chamber 533 (FIG. 7A) by the third robotic assembly 11C along the movement path A4. After performing the processing step 508, the substrate is moved to the external processing system 536 by the rear robot assembly 40 along the movement path A5, where the processing step 510 is performed. After performing the processing step 510, the substrate is moved along the movement path A6 to the exchange chamber 533 (FIG. 7A) by the rear robot assembly 40, where the processing step 512 is performed. After performing the processing step 512, the substrate is moved to the processing chamber 534 by the second robotic assembly 11C along the movement path A7, where the processing step 514 is performed. Subsequently, the substrate is moved to the processing chamber 535 along the movement path A8 using the second robot assembly 11B. After the processing step 516 is completed, the second robotic assembly 11B moves the substrate along the movement path A9 to the communication chamber located at the communication position 9B. After performing the communicating step 518, the substrate is moved to the pod assembly 105D by the front end robot assembly 15 along the movement path A10.

Further, in one embodiment, the cluster tool 10 is not connected or in communication with the external processing system 536, so that the rear robot assembly 40 is not part of the cluster tool configuration and moves steps A5-A6. And processing step 510 is not performed on the substrate. In this configuration all processing steps and moving steps are performed in the cluster tool 10.

5th cluster tool configuration

A. System Configuration

5A is a top view of one embodiment of the cluster tool 10, which cluster tool includes a front end robot assembly 15, a rear robot assembly 40, a system controller 101, and a single processing rack (element 60). With four robotic assemblies 11 (FIGS. 9-11; elements 11A, 11B, 11C, 11D in FIG. 5A) positioned, all of which utilize a variety of processing chambers in the processing rack 60 to process desired substrate processing. Is done to carry at least one sun. The embodiment shown in Fig. 5A is similar to the configuration described above, and similar element numbers have been used as appropriate. This configuration reduces the substrate movement bottleneck experienced by a system with three or fewer robots by the use of four robots with redundant access to the processing chamber mounted to the first processing rack 60. This configuration can be particularly useful for eliminating robot-limited bottlenecks that often appear when there are a large number of processing steps in a processing sequence and short chamber processing time.

In this configuration, the first robotic assembly 11A and the second robotic assembly 11B are adapted to access and move the substrate between the processing chambers of the first processing rack 60 from the side 60A, The third robotic assembly 11C and the fourth robotic assembly 11D are configured to access and move the substrate between the processing chambers of the first processing rack 60 from the side 60B.

Along the system controller 101, the first robotic assembly 11A and the second robotic assembly 11B, and the third robotic assembly 11C and the fourth robotic assembly 11D are "overlapped" between various robots. And a logical scheduler of the system controller to prioritize substrate motions and tasks based on inputs from various sensors and users distributed through the cluster tool, and using a collision avoidance system to The system allows the substrate to be optimized and moved. Using the cluster tool architecture and the system controller 101 to work together to maximize the use of the cluster tool to improve CoO makes the wafer history more repeatable and improves system reliability.

B. Example of Move Order

5B shows an example of a movement sequence that may be used to complete the processing sequence described in FIG. 1F through the cluster tool shown in FIG. 5A. In this embodiment, the substrate is removed from the pod assembly 105 (Item # 105D) by the front end robot assembly 15 and transferred to the chamber located at the communication position 9C along the movement path A1, thereby. The communication step 502 may end on the substrate. Once the communication step 502 is completed, the substrate is then moved along the movement path A2 to the first processing chamber 531 by the third robotic assembly 11C, where the processing step 504 is completed on the substrate. . After completing the processing step 504, the substrate is moved to the second processing chamber 532 by the fourth robotic assembly 11D along the movement path A3. After performing the processing step 506, the substrate is moved to the exchange chamber 533 (FIG. 7A) by the fourth robotic assembly 11D along the movement path A4. After performing the processing step 508, the substrate is moved to the external processing system 536 by the rear robot assembly 40 along the movement path A5, where the processing step 510 is performed. After performing the processing step 510, the substrate is moved to the exchange chamber 533 (FIG. 7A) by the rear robot assembly 40 along the movement path A6, where the processing step 512 is performed. After performing the processing step 512, the substrate is moved to the processing chamber 534 by the first robotic assembly 11A along the movement path A7, where the processing step 514 is performed. Subsequently, the substrate is moved to the processing chamber 535 along the movement path A8 using the first robot assembly 11A. After completing the processing step 516, the second robotic assembly 11B moves the substrate along the movement path A9 to the communication chamber located at the communication position 9B. After performing the communicating step 518, the substrate is moved to the pod assembly 105D by the front end robot assembly 15 along the movement path A10.

Further, in one embodiment the cluster tool 10 is not connected or in communication with the external processing system 536, so that the rear robot assembly 40 is not part of the cluster tool configuration, and moves steps A5-A6 and processing. Step 510 is not performed on the substrate. In this configuration, all processing steps and moving steps are performed in the cluster tool 10.

Sixth Cluster Tool Configuration

A. System Configuration

FIG. 6A is a plan view of one embodiment of the cluster tool 10, which is a front end robot assembly 15, a rear robot assembly 40, a system controller 101, and two processing racks (elements 60, 80). With eight robotic assemblies 11 (FIGS. 9-11; elements 11A, 11B, 11C, and 11D-11H in FIG. 6A) located all around, using the various processing chambers known in the processing racks. The embodiment shown in Fig. 6A is similar to the configuration described above, and therefore similar element numbers have been used as appropriate. The use of eight robots with redundant access to the processing chambers mounted on the backplane will reduce substrate processing bottlenecks experienced by systems with fewer robots. Many It can be particularly useful in eliminating robot-limited bottlenecks that often appear when and when chamber processing times are short.

In this configuration, the first robotic assembly 11A and the second robotic assembly 11B are made to access the processing chambers of the first processing rack 60 from the side 60A, and the seventh robot assembly 11G and The eighth robotic assembly 11H is adapted to access the processing chambers of the second processing rack 80 from the side 80B. In one aspect, the third robotic assembly 11C and the fourth robotic assembly 11D are configured to access the processing chambers of the first processing rack 60 from the side 60B. In one aspect, the fifth robotic assembly 11E and the sixth robotic assembly 11F are adapted to access the processing chambers of the second processing rack 80 from the side 80A. In one aspect, the fourth robotic assembly 11D is adapted to access the processing chambers of the second processing rack 80 from the side 80A and the fifth robotic assembly 11E is configured to access the first processing rack from the side 60B. Access to the processing chambers of 60.

The robotic assembly 11A-H along the system controller 101 can be configured to allow "overlapping" between the various robots, and the logical scheduler of the system controller based on inputs from various sensors and users distributed through the cluster tool. It may be possible to prioritize substrate motions and tasks, and also use an anti-collision system to enable the robot to optimize and move the substrate through the system. Using the cluster tool architecture and the system controller 101 together to maximize the use of the cluster tool to improve CoO makes the wafer history more repeatable and improves system reliability.

B. Example of Move Order

FIG. 6B shows an example of a first processing sequence of movement steps that may be used to complete the processing sequence described in FIG. 1F through the cluster tool shown in FIG. 6A. In this embodiment, the substrate is removed from the pod assembly 105 (item # 105D) by the front end robot assembly 15 and transferred to the communication chamber 9F along the movement path A1, whereby the communication step ( 502 may be completed on the substrate. When the communication step 502 is completed, the substrate is moved to the first processing chamber 531 by the sixth robotic assembly 11F along the movement path A2, where the processing step 504 is completed on the substrate. After completing the processing step 504, the substrate is moved to the second processing chamber 532 by the sixth robotic assembly 11F along the movement path A3. After performing the processing step 506, the substrate is moved along the movement path A4 to the exchange chamber 533 (FIG. 7A) by the sixth robotic assembly 11F. After performing the processing step 508, the substrate is moved to the external processing system 536 by the rear robot assembly 40, where the processing step 510 is performed. After performing the processing step 510, the substrate is moved to the exchange chamber 533 (FIG. 7A) by the rear robot assembly 40 along the movement path A6, where the processing step 512 is performed. After performing the processing step 512, the substrate is moved to the processing chamber 534 by the fifth robotic assembly 11E along the movement path A7, where the processing step 514 is performed. The substrate is moved to the processing chamber 535 along the movement path A8 using the fifth robot assembly 11E. After completing the processing step 516, the fifth robotic assembly 11E moves the substrate along the movement path A9 to the communication chamber located at the communication position 9E. After performing the communication step 518, the substrate moves the front end robot assembly 15 to the pod assembly 105D along the movement path A10.

6B shows an example of a second processing sequence having a moving step completed simultaneously with the first order using different processing chambers found in the second processing rack 80. As shown in FIGS. 1C-D, the first and second processing racks generally contain a number of processing chambers, which chambers use the same processing steps (eg CD1 in FIG. 1C) to perform the desired processing sequence. -8, BC1-6 in Figure 1D). Thus, in this configuration, each processing sequence can be performed using a processing chamber mounted to the processing rack. In one example, the first processing sequence is the same processing sequence as the first processing sequence (described above), which is instead of the fifth and sixth central robot assembly (ie, elements 11E-11F), respectively, as described above. And using the seventh and eighth central robots (ie elements 11G-11H), the same movement steps A1-A10, where A1'-shown as A10 '.

Further, in one embodiment, the cluster tool 10 is not connected or in communication with the external processing system 536, so that the rear robot assembly 40 is not part of the cluster tool configuration, and moves steps A5-A6 and Processing step 510 is not performed on the substrate. In this configuration, all processing steps and moving steps are performed in the cluster tool 10.

7th cluster tool configuration

A. System Configuration

6C illustrates one implementation of a cluster tool 10 similar to the configuration shown in FIG. 6A, except that one of the robotic assemblies (ie, robotic assembly 11D) is removed to reduce the system width while providing high system throughput. A plan view of an example. Thus, in this configuration, the cluster tool 10 includes a front end robot assembly 15, a rear robot assembly 40, a system controller 101 and seven robot assemblies located around two processing racks (elements 60 and 80). 11) (FIGS. 9-11; elements 11A-11C, and 11E-11H in FIG. 6C), all of which utilize at least one aspect of the desired substrate processing sequence using the various processing chambers found in the processing rack. Is done. The embodiment shown in FIG. 6C is similar to the configuration shown above, and therefore similar element numbers have been used as appropriate. This configuration will reduce the substrate movement bottleneck experienced by systems with fewer robots by using seven robots that have redundant access to the processing chambers mounted on the processing racks 60 and 80. This configuration can be particularly useful for eliminating robotic restricted form bottlenecks that are often found when the number of processing steps in a processing sequence is high and the chamber processing time is short.

In this configuration, the first robot assembly 11A and the second robot assembly 11B are made to access the processing chambers of the first processing rack 60 from the side 60A, and the seventh robot assembly 11G and The eighth robotic assembly 11H is adapted to access the processing chambers of the second processing rack 80 from the side 80B. In one aspect, the third robot assembly 11C and the fifth robotic assembly 11E are made to access the processing chambers of the first processing rack 60 from the side 60B, and the fifth robot assembly 11E. And the sixth robotic assembly 11F is adapted to access the processing chambers of the second processing rack 80 from the side 80A.

The robotic assemblies 11A-11C and 11E-11H along the system controller 101 can be configured to allow for "overlapping" between the various robots and based on inputs from various sensors and users distributed through the cluster tool. The controller's logic scheduler can prioritize board motion and tasks, and use an anti-collision system to allow the robot to optimize the substrate to move the substrate. Using the cluster tool architecture and the system controller 101 to work together to maximize the use of the cluster tool to improve CoO makes the wafer history more repeatable and improves system reliability.

B. Example of Move Order

FIG. 6D shows an example of a first processing sequence of movement steps that may be used to complete the processing sequence described in FIG. 1F through the cluster tool shown in FIG. 6C. In this embodiment, the substrate is removed from the pod assembly 105 (item # 105D) by the front end robot assembly 15 and transferred to the communication chamber 9F along the movement path A1, whereby the communication step ( 502 may be completed on the substrate. Once the communication step 502 is completed, the substrate is moved to the first processing chamber 531 by the sixth robotic assembly 11F along the movement path A2 where the processing step 504 is completed on the substrate. . After completing the processing step 504, the substrate is moved to the second processing chamber 532 by the sixth robotic assembly 11F along the movement path A3. After performing the processing step 506, the substrate is moved along the movement path A4 to the exchange chamber 533 (FIG. 7A) by the sixth robotic assembly 11F. After performing the processing step 508, the substrate is moved to the external processing system 536 by the rear robot assembly 40 along the movement path A5, where the processing step 510 is performed. After performing the processing step 510, the substrate is moved to the exchange chamber 533 (FIG. 7A) by the rear robot assembly 40 along the movement path A6, where the processing step 512 is performed. After performing the processing step 512, the substrate is moved to the processing chamber 534 by the fifth robotic assembly 11E along the movement path A7, where the processing step 514 is performed. Subsequently, the substrate is moved to the processing chamber 535 along the movement path A8 using the fifth robot assembly 11E. After the processing step 516 is completed, the fifth robotic assembly 11E moves the substrate along the movement path A9 to the communication chamber located at the communication position 9E. After performing the communicating step 518, the substrate is moved to the pod assembly 105D by the front end robot assembly 15 along the movement path A10.

FIG. 6D shows an example of a second processing sequence with movement steps that are completed concurrently with the first order using different processing chambers known in the second processing rack 80. As shown in FIGS. 1C-D, the first and second processing racks generally contain multiple processing chambers, which chambers (eg, the same processing step (s) used to perform the desired processing sequence). CD1-8 in 1C, BC1-6 in FIG. 1D). Thus, in this configuration, each processing sequence can be performed using any of the processing chambers mounted to the processing racks. In one example, the second processing sequence is the same processing sequence as the first processing sequence (described above), which, as described above, replaces the fifth and sixth central robot assembly (ie, elements 11E-11F), respectively. Using the seventh and eighth central robots (ie elements 11G-11H), the same movement steps A1-A10, here indicated as A1'-A10 ', are included.

In addition, in one embodiment, the cluster tool 10 is not connected or communicated with the external processing system 536, so that the rear robot assembly 40 is not part of the cluster tool configuration, and moves steps A5-A6 and Processing step 510 is not performed on the substrate. In this configuration, all processing steps and moving steps are performed in the cluster tool 10.

Rear robot assembly

In one embodiment, as shown in FIGS. 1-6, the central module 25 holds the substrate between the outer chamber 5 and the processing chambers held in the second processing rack 80, such as the exchange chamber 533. It contains a rear robot assembly 40 adapted to move. With reference to FIG. 1E, in one aspect, the rear robot assembly 40 generally includes a conventional selectively compliant articulated robot arm (SCARA) robot with a single arm / blade 40E. . In another embodiment, the rear robot assembly 40 may be in the form of a SCARA of a robot, which has independently controllable arms / blades (not shown), thereby exchanging and / or moving substrates in two groups. Two independently controllable arm / blade type robots may be advantageous, for example, if the robot needs to remove the substrate from the desired position before placing the next substrate in the same position. Two exemplary independently controllable arm / blade type robots are available from Asyst Technologies of Fremont, California, USA. 1-6 illustrate a configuration including a rear robot assembly 40, one embodiment of the cluster tool 10 does not include a rear robot assembly 40.

7A illustrates one embodiment of the exchange chamber 533, which may be located in the support chamber 165 (FIG. 1D) of the processing rack (eg, elements 60, 80). In one embodiment, the exchange chamber 533 is configured to receive and hold the substrate, whereby at least two robots in the cluster tool 10 may place or pick up the substrate. In one aspect, the rear robot assembly 40 and at least one robot of the central module 25 are configured to place and / or receive a substrate from the exchange chamber 533. The exchange chamber 533 generally includes a substrate support assembly 601, an enclosure 602, and at least one access port 603 formed in a wall of the enclosure 602. Substrate support assembly 601 generally has a plurality of support fingers 610 (six are shown in FIG. 7A), which have a substrate receiving surface 611 to support and hold a substrate positioned thereon. The enclosure 602 is generally a structure having one or more walls, which surround the substrate support assembly 601 to control the environment around the substrate while the substrate is held in the exchange chamber 533. The access port 603 is generally an opening in the enclosure 602 wall, which allows an external robot to approach and pick up the substrate and lower the substrate with the support finger 610. In one aspect, the substrate support assembly 601 is configured to enable the substrate to be positioned on and removed from the substrate receiving surface 611 by two or more robots, the robot 602 at an angle at least 90 degrees apart. )

In one embodiment of the cluster tool 10 shown in FIG. 7B, the base 40A of the rear robot assembly 40 is mounted on a support bracket 40C, and the support bracket is connected with the slide assembly 40B, This allows the base 40A to be located at any position along the length of the slide assembly 40B. In this configuration, the rear robot assembly 40 is adapted to move the substrate from the processing chambers of the first processing rack 60, the second processing rack 80, and / or the external module 5. The slide assembly 40B may generally include a linear ball bearing slide (not shown) and a linear actuator (not shown), which are known in the art, whereby the rear robot assembly 40 held thereon and Place the support bracket 40C. The linear actuator may be a drive linear brushless servomotor, available from Danaher Motion, Wooddale, Illinois, USA. As shown in FIG. 7B, the slide assembly 40B may be oriented in the y-direction. In this configuration, when the slide assembly 40B can move without colliding with another central robot assembly (e.g., elements 11A, 11B, etc.), to avoid collision with the robot assembly 11A, 11B, or 11C. The controller will be adapted to move the rear robot assembly 40. In one embodiment, the rear robot assembly 40 is mounted on the slide assembly 40B, which is positioned so that it does not collide with another central robot assembly.

Ambient environment control

8A shows one embodiment of a cluster tool 10 having an attached ambient control assembly 110, which encloses the cluster tool 10 to provide a controlled processing environment, where desired processing is achieved. Perform the various substrate processing steps found in the sequence. 8A shows the cluster tool 10 configuration shown in FIG. 1A with an ambient enclosure located across the processing chambers. The ambient control assembly 110 generally includes one or more filter units 112, one or more fans (not shown), and an optical cluster tool base 10A. In one aspect, one or more walls 113 are added to the cluster tool 10 to provide a controlled environment for enclosing the cluster tool 10 and performing substrate processing steps. In general, the ambient control assembly 110 is configured to control the particulate contamination level, flow regime (eg laminar or turbulent flow) and air flow rate in the cluster tool 10. Is done. In one aspect, the ambient control assembly 110 can also control the amount of static charge in the air, relative humidity, air temperature and other general processing parameters, which is conventional clean room compatible heating. It can be controlled using a heating ventilation and air conditioning (HVAC) system. In operation, the ambient control assembly 110 draws air from a source (not shown) or area out of the cluster tool 10 using a fan (not shown), and then through the filter 111 and the cluster. Air is sent through the tool 10 and then out of the cluster tool 10 through the cluster tool base 10A. In one aspect, the filter 111 is a high efficiency particulate air (HEPA) filter. The cluster tool base 10A is generally the floor or floor area of the cluster tool, which has a number of slots 10B (FIG. 12A) or other holes, which are pushed through the cluster tool 10 by a fan. It is possible for the jin air to exit the cluster tool 10.

8A illustrates one embodiment of the ambient control assembly 110, which has a number of separate ambient control assemblies 110A-C, which control to perform the various substrate processing steps found in the desired processing sequence. To provide a customized processing environment. The separated ambient control assemblies 110A-C are located across each of the robotic assemblies (eg elements 11A, 11B, etc. of FIGS. 1-6) of the central module 25, whereby each robotic assembly 11 Individually control the air flow. This configuration can be particularly advantageous in the configuration shown in FIGS. 3A and 4A because the robotic assemblies are physically separated from each other by the processing racks. Each of the individual ambient control assemblies 110A-C generally includes a filter unit 112, a fan (not shown) and an optional cluster tool base 10A and thereby discharge the controlled air.

8B shows a cross-sectional view of the ambient control assembly 110, which has a single filter unit 112, which is shown using a cross section mounted to the cluster tool 10 and oriented parallel to the y and z directions. . In this configuration, the ambient control assembly 110 has a single filter unit 112, one or more fans (not shown), and a cluster tool base 10A. In this configuration, the air (element “A”) transferred vertically from the environment control assembly 110 to the cluster tool 10 is transferred around the processing racks 60 and 80 and the robot assembly 11A-C and the cluster tool. Move out of base 10A. In one aspect, the wall 113 is configured to form and enclose a processing region inside the processing cluster tool 10, whereby the processing ambient surrounding the processing chamber held in the processing racks 60, 80 is an ambient environment. It may be controlled by air delivered by the control assembly 110.

8C shows a cross-sectional view of the ambient control assembly 110, which has a number of individual ambient control assemblies 110A-C mounted to the cluster tool 10, which are paralleled in the y and z directions. It is shown using a cross section (see Figure 1A). In this configuration, the ambient control assembly 110 extends to or up the bottom surface 114 of the cluster tool base 10A, the three ambient control assemblies 110A-C, and the ambient control assembly 110A-C. A first treatment rack 60, and a second treatment rack 80 extending to or above the bottom surface 114 of the ambient control assembly 110A-C. In general, the three ambient control assemblies 110A-C will each include one or more fans (not shown) and one filter 111. In this configuration, the air transferred vertically (element "A") from each of the environment control assemblies 110A-C to the cluster tool 10 is treated with the processing racks 60, 80 and the robot assembly 11A-C. Move in and out of the cluster tool base 10A. In one aspect, the wall 113 is adapted to enclose and form the treatment area inside the bla (10), whereby the treatment ambient around the treatment chamber held in the treatment racks (60, 80) is controlled by an ambient control assembly ( Controllable by air delivered by 110.

In another embodiment, the cluster tool 10 can be placed in a clean room environment, which allows it to deliver air containing low particulates at a desired rate through the cluster tool 10 and then move out of the cluster tool base 10A. Is done. In this configuration, the ambient control assembly 110 is generally not needed and therefore not used. The ability to control the environment and air properties around the processing chamber held in the cluster tool 10 is an important factor in minimizing and / or controlling the accumulation of particles, which can cause instrument yield problems caused by particulate contamination. .

Robot assembly

In general, the various embodiments of the cluster tool 10 described herein minimize the physical penetration of the robot into the space occupied by other cluster tool components (eg, robot (s), processing chambers) during the substrate movement process. The reduced cluster tool foot print produced by the robot design and the reduced size of the robot assembly (eg, element 11 of FIG. 9A) has particular advantages over prior art configurations. Reduced physical intrusion prevents robots from colliding with other external components. While reducing the footprint of the cluster tool, the embodiment of the robot described herein has particular advantages by the reduced number of axes required to be controlled to perform the movement movement. This aspect is important because this will improve the reliability of the robotic assembly and cluster tool. This aspect can be better understood by noting that the importance of the system is proportional to the result of the reliability of each component of the system. Thus, a robot with three actuators with 99% up-time is superior to a robot with four actuators with 99% uptime because the system uptime for three actuators with 99% uptime each. Is 97.03% and the system uptime for the four actuators with 99% uptime is 96.06%.

In addition, embodiments of the cluster tool 10 described herein are particularly well over the prior art configurations due to the reduced number of communication chambers (eg, elements 9A-C in FIG. 1B) required to move the substrate through the cluster tool. Has an advantage. The prior art cluster tool configuration generally installs an intermediate substrate holding station or generally two or more communication chambers in a processing sequence and thereby between one or more processing chambers with another robot centrally located between one or more other processing chambers during the processing sequence. The substrate can be moved between one centrally located robot. The process of continually placing the substrate in multiple communication chambers that will not perform subsequent processing steps consumes time, reduces the utilization of the robot, consumes space in the cluster tool, and increases the wear of the robot. In addition, the addition of a communication step will adversely affect instrument yield by increasing the number of substrate handoffs that will increase the amount of backside particle contamination. Thus, a substrate processing sequence that includes multiple communication steps will essentially have different substrate wafer history unless the time spent in the communication chamber is controlled for all substrates. Controlling the time in the communication chamber will increase system complexity by the added variability processing, which will adversely affect the maximum achievable substrate throughput. Aspects of the invention described herein avoid this risk of prior art configurations, since the cluster tool configuration is generally in a communication phase (eg, before any processing takes place on the substrate and after all processing steps have been completed on the substrate). (Steps 502 and 518) at 1F, and therefore will have little effect on the substrate wafer history and will not add a significant amount of substrate processing time to the processing sequence, which will result in the elimination of the communication step between the processing steps. By.

In the case where the system throughput is robot controlled, the maximum substrate throughput of the cluster tool is governed by the total number of robot motions to complete the processing sequence and the time taken to move the robot. The time it takes for the robot to do the desired movement is largely limited by the robot hardware, the distance between the processing chambers, substrate cleanliness concerns, and system control limits. In general, robot motion time will not vary significantly between one type of robot and another, and is almost consistent with the widely used industry. Thus, a cluster tool that essentially has less robot motion to complete the processing sequence will have higher system throughput than a cluster tool that requires more movement to complete the processing sequence, such as a cluster tool that includes multiple communication steps. .

Cartesian Robot Configuration

9A shows one embodiment of a robotic assembly 11, which may be used as one or more robotic assemblies 11 (eg, elements 11A-H shown in FIGS. 1-6 above). The robot assembly 11 generally includes a robot hardware assembly 85, one or more vertical robot assemblies 95, and one or more horizontal robot assemblies 90. Thus, the substrate is subjected to any desired x, y in the cluster tool 10 by the cooperative movement of the robot hardware assembly 95 vertical robot assembly 95 and the horizontal robot assembly 90 from commands sent to the system controller 101. And z position.

Robot hardware assembly 85 generally includes one or more mobile robotic assemblies 86 configured to hold, move, and position one or more substrates using instructions sent from system controller 101. In one embodiment, the mobile robot assembly 86 shown in FIGS. 9-11 is a horizontal plane, such as a plane that includes the X and Y directions shown in FIG. 11A by the movement of various mobile robot assembly 86 components. Is made to move the substrate. In one aspect, the mobile robot assembly 86 is configured to move the substrate in a plane generally parallel to the substrate support surface 87C (FIG. 10C) of the robot blade 87. 10A illustrates one embodiment of a robot hardware assembly 85 that includes a single mobile robotic assembly 86 that can be made to move a substrate. FIG. 10B illustrates one embodiment of a robot hardware assembly 85 that includes two mobile robotic assemblies 86 positioned in opposite directions from one another, whereby blades 87A-B (and first linkages 310A-310B). )) May be slightly spaced apart. The configuration shown in FIG. 10B, or an “over / under” shaped blade configuration, may be used to move the robot hardware assembly 85 in its default position to move the substrate “removed” (ie, “replace the substrate”) to another chamber. It is particularly advantageous when it is desired to remove the substrate from the processing chamber before leaving the next substrate to be processed in the same processing chamber without leaving. In another aspect, this configuration may enable the robot to fill all the blades and then move the substrate to the desired position in the tool with two or more substrate groups. The process of grouping the substrates into two or more groups can help to improve substrate throughput in the cluster tool by reducing the number of robotic movements required to move the substrate. The mobile robot assembly 86 shown in FIGS. 10A-B is in the form of two bar linkage robots 305 of the robot, provided that this configuration is of a robot assembly that can be used in connection with the embodiments described herein. It is not intended to be limiting in terms of form and orientation. In general, an embodiment of a robot hardware assembly 85 having two mobile robot assemblies 86 shown in FIG. 10B will have two mobile robot assemblies 86 containing the same basic components, and thus a single The discussion of the robotic assembly 86 is intended to describe the components present in the two robotic assembly sun (s).

An advantage of the cluster tool and robot configuration shown in FIGS. 9-11 is that the robot component and substrate move freely without colliding with other cluster tool components external to the robot assembly 11. The size of the surrounding area is minimized. This area in which the robot and substrate are free to move is known as the "movement area" (element 91 in Figure 11C). The moving region 91 can be generally formed as a volume (x, y, and z directions), where the robot moves freely with the substrate on the robot blade without colliding with other cluster tool components. Although the moving area can be described as volume, sometimes the most important aspect of the moving area is the horizontal area (x and y directions) occupied by the moving area, which directly affects the footprint and CoO of the cluster tool. The smaller the horizontal component of the region of movement, the closer the various robotic assemblies (e.g. elements 11A, 11B, 11C, etc. in Figures 1-6) can be placed together or the robot can be placed closer to the treatment rack. The horizontal area of the area is an important factor in forming the footprint of the cluster tool. One factor in the forming size of the moving area is to ensure that the moving area is large enough to reduce or prevent the robot's physical chip from the space occupied by other cluster tool components. The embodiment described herein has particular advantages over the prior art, because in this way the embodiment configures the robot assembly 86 with a moving region oriented along the direction of movement (x-direction) of the horizontal motion assembly 90. This is because the element shrinks.

With reference to FIG. 11J, the horizontal zone can be roughly divided into two components, width "W1" (y-direction) and length "L" (x-direction). The embodiment described herein has the advantage of the reduced width "W1" of the free space surrounding the robot, thereby ensuring that the robot can reliably position the substrate into the processing chamber. The benefit of reduced width "W1", an improvement over the conventional multi-bar linkage selective compliance assembly robot arm (SCARA) is largely achieved by conventional SCARA robots (e.g., item CR in Figure 11K). It can be understood by the fact that it has an arm (eg element A1) and extends the distance from the center of the robot (eg item C) when it is retracted, which is relative space (ie width) of the robot relative to each other. "W2"), since the area around the robot must be empty so that the arm component can be oriented rotationally without colliding with other cluster tool components (eg other robots, processing rack components). Conventional SCARA-type robot configurations are more complex than the embodiments described herein because they have more axes that control to position and orient the substrate in the processing chamber. Referring to FIG. 11J, in one aspect the width W1 of the moving region 91 is about 5 to about 50 percent greater than the size of the substrate (ie, substrate “S” in FIG. 11J). In one example, when the substrate is a 300 mm semiconductor wafer, the width W1 of the moving region will be about 315 mm to about 450 mm, preferably about 320 mm to about 360 mm. Referring to FIG. 1B, in one example, the spacing between the side 80A of the second processing rack 80 and the side 60B of the first processing rack 60 is about 945 mm (eg, for a 300 mm substrate processing tool). 315%). In another example, the spacing between the side 80A of the second processing rack 80 and the side 60B of the first processing rack 60 may be about 1350 mm (eg 450%) for a 300 mm substrate processing tool. have. The moving area is generally intended to describe the area in which the robot can move around the robot, which is after picking up the substrate at the desired position until the robot blade contracts and moves to the starting position SP outside the next processing chamber in the processing sequence. Area.

Two Bar Linkage Robot Assembly

10A and 10C illustrate one embodiment in the form of two bar linkage robots 305 of the mobile robot assembly 86, which generally includes a support plate 321, a first linkage 310, and a robot blade. 87, transmission system 312 (FIG. 10C), enclosure 313, and motor 320. In this configuration, the mobile robot assembly 86 is attached to the vertical motion assembly 95 via a support plate 321 attached to the vertical actuator assembly 560 (FIG. 13A). 10C shows a side cross-sectional view of one embodiment in the form of two bar linkage robots 305 of a mobile robot assembly 86. The transmission system 312 of the two bar linkage robotic 305 is configured to generate one or more power transmission elements configured to cause the movement of the robot blade 87 by the movement of the power transmission element, such as by the rotation of the motor 320. Mostly included. In general, the transmission system 312 may include conventional gears, pulleys, and the like, which are adapted to move rotational or translational movements from one element to another. The term "gear" as used herein is intended to generally describe a component that is rotationally coupled through a belt, teeth or other common means as a second component, and is made to transfer motion from one element to another. In general, the gears used herein may be conventional gear shaped or pulley shaped instruments, which may include spur gears, bevel gears, rack and / or pistons, worm gears, timing pulleys, and v. -Includes but is not limited to components such as belt pulleys. In one aspect, the transmission system 312 shown in FIG. 10C includes a first pulley system 355 and a second pulley system 361. The first pulley system 355 may include a first pulley 358 attached to the motor 320, a second pulley 356 attached to the first linkage 310, and a first pulley 270 attached to the second pulley 356. 358 has a belt 359 connecting it, whereby the motor 320 can drive the first linkage 310. In one aspect, a number of bearings 356A are configured to allow the second pulley 356 to rotate about the axis V1 of the third pulley 354.

The second pulley system 361 includes a third pulley 354 attached to the support plate 321, a fourth pulley 352 and a third pulley 354 attached to the blade 87, and a fourth pulley 352. With a belt 362 connecting it to the shaft, whereby rotation of the first linkage 310 rotates about a bearing axis 353 (pivot V2 in FIG. 11A) in which the blade 87 is coupled to the first linkage 310. Let's do it. When moving the substrate, the motor drives the first pulley 358, which rotates the second pulley 356 and the first linkage 310, which belt 362 around the fixed third pulley 354. ) And the fourth pulley 352 by the angular rotation of the first linkage 310. In one embodiment, the motor 320 and the system controller 101 are configured to form a closed loop control system, which allows all components attached thereto and the respective positions of the motor 320 to be controlled. In one aspect, the motor 320 is a stepper motor or a DC auxiliary motor.

In one aspect, the transmission ratios (eg, the ratio of the number of gear teeth, the diameter ratio) of the first pulley system 355 and the second pulley system 361 are such that the substrate is positioned by the mobile robot assembly 86. As such, the substrate may be designed to achieve the desired shape and resolution of the path through which the substrate moves (eg, element P1 in FIG. 11C or 11D). The transmission ratio will then be defined as the size of the driven element relative to the size of the driven element, in this case the ratio of the number of teeth of the third pulley 354 to the number of teeth of the fourth pulley 352, for example. to be. Thus, for example, when the first linkage 310 rotates 270 degrees, causing the blade 87 to rotate 180 degrees, the 0.667 transmission ratio or alternatively 3: 2 gear ratio. The term gear ratio refers to the speed D1 of the first gear causing the speed D2 of the second gear, or to the ratio D1: D2. Thus, the 3: 2 ratio means that three revolutions of the first gear will result in two revolutions of the second gear, so that the first gear should be about two thirds the size of the second gear. In one aspect, the gear ratio of the third pulley 354 to the fourth pulley 352 is about 3: 1 to about 4: 3, preferably about 2: 1 to about 3: 2.

FIG. 10E illustrates another embodiment in the form of two bar linkage robots 305 of the mobile robot assembly 86, which is generally a support plate 321, a first linkage 310, a robot blade 87, a transmission system. 312 (FIG. 10E), enclosure 313, motor 320, and second motor 371. The embodiment shown in FIG. 10E is similar to the embodiment shown in FIG. 10C, but the rotational position of the third pulley 354 in this configuration is controlled by the command from the controller 101 and the use of the second motor 371. Can be adjusted. 10C and 10E have the same reference numerals used in similar cases for clarity. In this configuration, the mobile robot assembly 86 is attached to the vertical motion assembly 95 via a support plate 321 attached to the vertical actuator assembly 560 (FIG. 13A). FIG. 10E shows a side cross-sectional view of one embodiment in the form of two bar linkage robots 305 of a mobile robot assembly 86. The transmission system 312 of the two bar linkage robot 305 generally comprises two power transmission elements, which are moved by the movement of the motor 320 and / or the second motor 371 of the robot blade 87. Is made to cause movement. In general, the transmission system 312 may include gears, pulleys, and the like, which are adapted to convey rotational or translational movements from one element to another. In one aspect, the transmission system 312 includes a first pulley system 355 and a second pulley system 361. The first pulley system 355 includes a first pulley 358 attached to the motor 320, a second pulley 356 attached to the first linkage 310, and a first pulley 358 on the second pulley 356. ) Has a belt (359), thereby allowing the motor 320 to drive the first linkage 310. In one aspect, a number of bearings 356A are configured to rotate the second pulley 356 about the axis V1 of the third pulley 354. In one aspect, although not shown in FIG. 10E, bearing 356A is mounted on a feature formed on support plate 3231 rather than third pulley 354 as shown in FIG. 10E.

The second pulley system 361 includes a third pulley 354 attached to the second motor 371, a fourth pulley 352 and a third pulley 354 attached to the blade 87, and a fourth pulley 352. Bearing 353 (pivot V2 in FIG. 11A), having a belt 362 that connects to it, whereby rotation of the first linkage 310 causes the blade 87 to be coupled to the first linkage 310. Rotate around. The second motor 371 is mounted on the support plate 321. When moving the substrate, the motor 320 drives the first pulley 358, which causes the second pulley 356 and the first linkage 310 to rotate, which is about the third pulley 354. Each rotation of the belt 362 and the first linkage 310 causes the fourth pulley 352 to rotate. In this configuration, in contrast to the configuration shown in FIG. 10C, the motor 320 rotates the first linkage 310, whereby the gear ratio between the third pulley 354 and the fourth pulley 352 is increased by a third. The third pulley can rotate while varying by adjusting the relative motion between the pulley 354 and the fourth pulley 352. The gear ratio will affect the movement of the robot blade 87 relative to the first linkage 310. In such a configuration, the gear ratio is not fixed by the size of the gear and can be changed in other parts of the robot blade movement operation to achieve the desired robot blade movement path (see FIG. 11D). In one embodiment, the motor 320, the second motor 371 and the system controller 101 are configured to form a closed loop control system, which is an angular position of the motor 320, an angle of the second motor 371. The position and all components attached to this element are controlled. In one aspect, the motor 320 and the second motor 371 are a stepper motor or a DC auxiliary motor.

11A-D show a top view of one embodiment of the robotic assembly 11, which shows two bar linkages to position and move the substrate in a desired position of the second processing chamber 532 held in the cluster tool 10. The robot 305 configuration is used. The two bar linkage robots 305 generally comprise a motor 320 (FIGS. 10A-C), a first linkage 310 and a rotor blade 87, which are connected such that the rotational motion of the motor 320 is first The linkage 310 is rotated, which then causes the rotor blades 87 to rotate and / or translate along a desired path. An advantage of this configuration is the robot's ability to move the substrate to the desired location of the cluster tool without extending the robot component into the space that will be occupied or occupied by other robots or system components.

11A-C show the time at the location of various mobile robot assembly 86 components (eg, T0-T2 respectively corresponding to FIGS. 11A-C) as the substrate moves into the processing chamber 532. The movement of the mobile robot assembly 86 included in the robot hardware assembly 85 is shown by showing a number of successive snapshots. Referring to FIG. 11A, at time T0 the mobile robot assembly 86 is located in the desired vertical direction (z-direction) by the use of the vertical motion assembly 95 component and by the use of the horizontal motion assembly 90 component. Located in the desired horizontal position (x-direction). The position of the robot at T0 shown in FIG. 11A will be referred to herein as the starting position (Item SP). Referring to FIG. 11B, at time T1, the first linkage 310 of the two bar linkage robot 305 pivots around the pivot point V1 and thus translates the combined robot blade 87 and pivot point ( V2) rotates and the position of the mobile robot assembly 86 in the x-direction is adjusted by the use of the system controller 101 and horizontal motion assembly 90 components. Referring to FIG. 11C, at time T2 the robot blade 87 extends the desired distance (element Y1) in the y-direction from the centerline C1 of the moving region 91 and at the desired x-direction position (element X1). Position and place the substrate in the desired final position (item FP) or in the position of the processing chamber 532. Once the robot has placed the substrate in its final position, the substrate can then be moved to a processing chamber substrate receiving component, such as a lift pin or other substrate support component (eg, element 532A in FIG. 11A). After moving the substrate to the processing chamber receiving component, the robot blade can then be retracted backwards by following the steps described above.

FIG. 11C further shows an example of one possible path (item P1) of the center of the substrate as the substrate moves from the starting position to the final position, as shown in FIGS. 11A-C above. In one aspect of the invention, the shape of the path is by adjusting the rotational position of the first linkage 310 relative to the position of the mobile robot assembly 86 along the x-direction by the use of a horizontal motion assembly 90. can be changed. This feature has an advantage, because the shape of the curve does not penetrate the moving region 91 of another robot or collide with various processing chamber substrate receiving components (eg, element 532A). May be specifically made to access the processing chamber. This advantage is particularly well seen when the processing chamber is a configuration that is approached from a number of different directions or orientations, which can be used to prevent collisions between the substrate receiving component and the robot blade 87 and to reliably support the substrate. Limit the position and orientation of the substrate receiving component.

11D shows some examples of possible paths P1-P3 that can be used to move the substrate to a desired location in the processing chamber 532. The paths P1-P3 shown in FIGS. 11D-F show the movement of the center of the substrate or the center of the substrate support region of the robot blade 87 when positioned by the robot blade 11 assembly. The substrate movement path P2 shown in FIG. 11D shows the path of the substrate when the second pulley system 361 of the mobile robot assembly 86 has a transmission ratio of 2: 1. Since the motion of the substrate is a straight line when using a 2: 1 transmission ratio, this configuration can eliminate the need to move the robot hardware assembly in the X-direction while extending the robot blade 87 in the Y-direction. The benefit of reduced complexity of motion in this configuration can be controlled by the inability to design a reliable substrate receiving component in certain cases, which will cause the substrate to be moved from the various other sides of the processing chamber to the processing chamber. Will not collide with the robot blade 87 when.

11E-11F illustrate multi-step movement movements of the substrate into the processing chamber 532. In one embodiment, the multi-step movement movement is divided into three movement paths (paths P1-P3), which move the substrate into the processing chamber 532 (FIG. 11E) or move the substrate out of the processing chamber (FIG. 11F. Can be used). This configuration may be particularly useful for reducing the high acceleration experienced by the robot assembly 11 and the substrate during the movement process and may also be useful for reducing the complexity of the robot motion by using as many single axis controls as possible during the movement process. . The high acceleration experienced by the robot can generate vibrations in the robot assembly, which can affect the movement process position accuracy, the reliability of the robot assembly, and the possible movement of the substrate on the robot blade. The cause of the high acceleration experienced by the robotic assembly 11 occurs when coordinated motion is used to move the substrate. As used herein, the term "harmonized motion" is used to describe the movement of two or more axes (eg, mobile robot assembly 86, horizontal motion assembly 90, vertical motion assembly 95) at the same time and thereby Move the substrate from point to point.

11E illustrates three travel path multi-step travel motions, which are used to move the substrate to the substrate receiving component 532A that appears in the processing chamber 532. Before the multi-step movement movement process is performed, the mobile robot assembly 86 is generally positioned at its starting position (SP in FIG. 11E), which is desired by the use of the horizontal movement assembly 90 component (x-direction). ) And by the use of the vertical motion assembly 95 components may require the substrate to be moved in the desired vertical orientation (y-direction). In one aspect, when the substrate is in the starting position, the substrate is then moved along the path P1 to the final position FP using the mobile robot assembly 86, the horizontal motion assembly 90, and the system controller 101. . In another aspect, the substrate is located along path P1 using a reduced number of control axes, such as only one axis of control. For example, a single axis of control may be completed by causing movement of the robot blade and substrate by control of the mobile robot assembly 86 in communication with the controller 101. The use of a single axis in this configuration can greatly simplify the robot blade movement or control of the substrate and reduce the time it takes to move from the starting point to the intermediate position. In the next step in the multi-step movement movement process, by moving the substrate receiving component 532A vertically by using a substrate receiving component actuator (not shown) or by using the vertical motion assembly 95 component. By moving in the z-direction, the substrate is moved to a processing chamber substrate receiving component, such as a lift pin or other substrate support component (eg, element 532A in FIG. 11A). In one aspect, as shown in FIGS. 11E and 11F, the mobile robot assembly 86 is adapted to move the substrate W in a plane parallel to the X and Y directions, as shown by paths P1 and P3. .

After moving the substrate to the processing chamber receiving component, the robot blade can be retracted along the travel paths P2 and P3. In certain cases the path P2 may require coordinated motion between the mobile robot assembly 86 and the horizontal motion assembly 90, thereby supporting the substrate as the robot blade contracts from the processing chamber 532. Ensure that it does not bump into component 532A. In one aspect, as shown in FIG. 11E, the path P2 describing the movement of the center of the substrate support region of the robot blade 87 is defined between the final position and the completion point EP position from the final position FP. It is a linear path extending to the intermediate point (IP). In general, the midpoint is the point where the robot blade contracts very sufficiently so that it does not come into contact with any of the chamber components when the robot blade moves in a simplified or accelerated motion along the path P3 to the end point position. Will not. In one aspect, if the robot blade is in an intermediate point position, the substrate is moved along the path P3 to the end point by the use of the mobile robot assembly 86, the horizontal motion assembly 90, and the system controller 101. In one aspect, the substrate is located at the end point EP by using only one axis of control, such as by the movement of the mobile robot assembly 86 in communication with the controller 101. In this configuration, the use of a single axis can greatly simplify the control of the movement and reduce the time it takes to move from the intermediate point IP to the end point EP position.

11F illustrates three travel path multi-step travel motions used to remove a substrate from a known substrate receiving component 532A in the processing chamber 532. Before the multi-step movement movement process shown in FIG. 11F is performed, the mobile robot assembly 86 is generally in its starting position (SP in FIG. 11F), which is the desired horizontal position by use of the horizontal movement assembly 90 component. It may be desired to move the substrate in the (x-direction) and by the use of the vertical motion assembly 95 component in the desired vertical orientation (z-direction). In one aspect, if the substrate is in the starting position, the substrate is moved along the path P1 to the intermediate position IP using the mobile robot assembly 86, the horizontal motion assembly 90, and the system controller 101. In general, the intermediate position is the point at which the robot blade is inserted very sufficiently so that it does not come into contact with any of the chamber components when the robot blade moves in a simplified or accelerated motion along the path P1 to an intermediate point. In another aspect, the substrate is located along path P1 using a reduced control axis, such as only one axis of control. For example, a single control axis can be completed by causing movement of the substrate and robot blade by control of the mobile robot assembly 86 in communication with the controller 101. In this configuration, the use of a single axis can greatly simplify the control of the substrate or robot blade movement and reduce the time taken to move from the starting point to the intermediate position.

After moving the substrate to an intermediate position, the robot blade can be inserted into the chamber along the path P2. In some cases the path P2 may require coordinated motion between the mobile robot assembly 86 and the horizontal motion assembly 90, thereby extending the robot blade 87 as the robot blade extends into the processing chamber 532. Ensure that it does not collide with the substrate support component 532A. In one aspect, as shown in FIG. 11F, the path P2 describing the motion of the center of the substrate support region of the robot blade 87 is a linear path extending from the intermediate point IP to the final position FP. After the robot blade is in its final position, z- is moved by moving the substrate receiving component 532A vertically by the use of a substrate receiving component actuator (not shown) or by the use of the vertical motion assembly 95. The substrate is removed from the processing chamber substrate receiving component 532A by moving the mobile robot assembly 86 in the direction.

After removing the substrate from the processing chamber receiving component, the robot blade can be retracted along the path P3. In certain cases, path P3 may require coordinated motion between mobile robot assembly 86 and horizontal motion assembly 90. In one aspect, the substrate is located at the end point EP using only one control axis, such as by the motion of the mobile robot assembly 86 in communication with the controller 101. In this configuration, the use of a single axis can greatly simplify the control of movement and reduce the time taken to move from the final position FP to the end point EP position. In one aspect, as shown in FIG. 11F, the path P3 describing the motion of the center of the substrate support region of the robot blade 87 is a non-linear path extending from the final position FP to a constant end point EP. .

Single axis robot assembly

10D and 11G-I show another embodiment of the robot assembly 11, in which case the mobile robot assembly 86A is a single axis linkage 306 (FIG. 10D) configuration and thereby retained in the cluster tool 10. The substrate is moved and positioned at a desired position of the second processing chamber 532. Single-axis linkage 306 generally includes a motor 307 (FIG. 10D) and a robot blade 87, which is connected such that the rotational movement of the motor 320 rotates the robot blade 87. The advantage of this configuration is the robot's ability to move the substrate to the desired position in the cluster tool using a less complex and more cost-effective single axis to control the blade 87 and can also be occupied by other robots during the movement process. Reduces the chance of robot components extending into space.

10D shows a side cross-sectional view of a single axis linkage 306, which generally includes a motor 307, a support plate 321, and a robot blade 87, which are connected to the motor 307. In one embodiment, as shown in FIG. 10D, the robot blade 87 is connected to the first pulley system 355. The first pulley system 355 includes a first pulley 358 attached to the motor 320, a second pulley 356 attached to the robot blade 87, and a first pulley 358 for the second pulley 356. To a belt 359 connected to it. In this configuration, the second pulley 356 is mounted on the bearing 354A and on a pivot 364 attached to the support plate 321. In one embodiment of the single axis linkage 306, the robot blade 87 is directly coupled to the motor 307, thereby reducing the number of robotic components, reducing robot assembly cost and complexity, and the first pulley system 355. Reduce the need to maintain components Single-axis linkage 306 may be advantageous because of simplified motion control and thus improved robotic and system reliability.

11G-J is a top view in the form of a single axis linkage 306 of the mobile robot assembly 86, which illustrates the time (eg, the location of various mobile robot assembly 86 components as the substrate is moved into the processing chamber 532). For example, the motion of the single-axis linkage 306 is shown by showing multiple sequential snapshots according to T0-T2). 11G, at time T0 the mobile robot assembly 86 is desired by the use of the horizontal position (x-direction) and the use of the vertical movement assembly 95 components by the use of the horizontal movement assembly 90 components. Generally located in a vertical orientation (z-direction). The robot position at T0 shown in FIG. 11C will be referred to herein as the starting position (item SP described above). Referring to FIG. 11H, at T1 the robot blade 87 is pivoted around the pivot point V1, thus causing the robot blade 87 to rotate, and the position of the mobile robot assembly 86 is determined by the system controller 101. By use in the x-direction. Referring to FIG. 11, at time T2 the robot blade 87 is rotated to the desired angle and the robot assembly is located at the desired x-direction position whereby the substrate is positioned at the desired final position FP in the processing chamber 532 or It is located in the handoff position. 11D described above shows some examples of possible paths P1-P3 that can be used to move the substrate to a desired location in the processing chamber 532 by the use of a single-axis linkage 306. After moving the substrate to the processing chamber receiving component, the robot blade can be retracted in reverse according to the steps described above.

Horizontal movement assembly

12A shows a cross-sectional view of one embodiment of a horizontal motion assembly 90 taken along a plane parallel to the y-direction. 12B is a side cross-sectional view of one embodiment of the robotic assembly 11 which is cut centrally to the length of the horizontal motion assembly 90. Horizontal motion assembly 90 generally includes enclosure 460, actuator assembly 443, and sled mount 451. Actuator assembly 443 generally includes at least one horizontal linear slide assembly 468 and a motion assembly 442. Vertical motion assembly 95 is attached to horizontal motion assembly 90 via sled mount 451. The sled mount 451 is a structural component that supports various loads that are created as the vertical movement assembly 95 is positioned by the horizontal movement assembly 90. The horizontal motion assembly 90 has two horizontal linears, each having a support mount 452 for supporting the weight of the vertical motion assembly 95 and the sled mount 451, a bearing block 458, and a linear rail 455. It generally includes a slide assembly 468. This configuration allows for a smooth and accurate movement of the vertical movement assembly 95 along the length of the horizontal movement assembly 90. Linear rail 455 and bearing block 458 can be linear ball bearing slides or conventional linear guides, which are known in the art.

12A-B, the movement assembly 442 includes two or more drive belt pulleys 454A, drive belts 440 configured to control the position of the vertical movement assembly 95 along the length of the horizontal movement assembly 90. ), Horizontal robot actuators 367 (FIGS. 10A and 12A), and sled mounts 451. In general, the drive belt 440 is attached to (e.g., coupled to, bolted to, or clamped) to the sled mount 451 and thereby forms a continuous loop that moves along the length of the horizontal motion assembly 90. Which is supported at the end of the horizontal motion assembly 90 by two or more drive belt pulleys 454A. 12B shows one configuration with four drive belt pulleys 454A. In one embodiment, the horizontal robot actuator 367 is attached to one of the drive belt pulleys 454A whereby the rotational movement of the pulleys 454A is attached to the sled mount 451 attached to the vertical motion assembly 95. And drive belt 440 will move along horizontal linear slide assembly 468. In one embodiment, the horizontal robot actuator 367 is a direct drive linear brushless servomotor, which is adapted to move the robot relative to the horizontal linear slide assembly 468.

Enclosure 460 generally includes a base 464, one or more outer walls 463, and an enclosure top plate 462. Enclosure 460 is configured to cover and support components in horizontal motion assembly 90 for safety and contamination reduction reasons. Since the particles produced by the mechanical components roll, slide or come into contact with each other, it is important to ensure that the horizontal motion assembly 90 does not contaminate the substrate surface while the substrate moves through the cluster tool 10. Do. Enclosure 460 defines an enclosed area that minimizes the chance of particles generated inside enclosure 460 going to the substrate surface. Particulate contamination directly affects instrument yield and CoO of the cluster tool.

Enclosure top plate 462 includes a plurality of slots 471, the plurality of support mounts 452 of the horizontal linear slide assembly 468 connected to the sled mount 451, and the enclosure top plate 462. ) To extend. In one aspect, the width of the slot 471 (the size of the opening in the y-direction) is such that it minimizes the chance of particles out of the horizontal motion assembly 90.

The base 464 of the enclosure 460 is a structural member designed to support a rod made by the weight of the sled mount 451 and the vertical motion assembly 95 and a rod made by the movement of the vertical motion assembly 95. . In one aspect, the base 464 further includes a plurality of base slots 464A, which slots are located along the length of the horizontal motion assembly 90, thereby slots 471 of the enclosure top plate 462. The incoming air exits the enclosure out of the slot 10B formed in the cluster tool base 10A and through the base slot 464A. In one embodiment of the cluster tool 10, the cluster tool base 10A is not used and thus the horizontal motion assembly 90 and the processing rack may be located on the floor of the area where the cluster tool 10 is installed. In one aspect, the base 464 is positioned above the cluster tool base 10A or the floor by the use of the enclosure support 461, thereby restricting the flow of air through the horizontal motion assembly 90, without restricting a uniform flow path. to provide. In one aspect the enclosure support 461 can be configured to act as a conventional vibration damper. The air flow created by the cleanroom surroundings or ambient control assembly 110, preferably flowing down through the enclosure 460 in one direction, reduces the likelihood that particles generated inside the enclosure 460 will be directed toward the substrate surface. Helps to reduce. In one aspect, the slot 471 and base slot 464A formed in the enclosure top plate are designed to limit the volume of air flowing from the ambient control assembly 110 whereby a pressure drop of at least 0.1 "wg is achieved. Between the exterior of the enclosure top plate 462 relative to the interior region of 460. In one aspect, the central region 430 of the enclosure 460 is separated from other parts of the horizontal motion assembly by use of the interior wall 465. It is formed to isolate this area The addition of the inner wall 465 can minimize the recirculation of air entering the enclosure 460 and can act as an air flow flow feature.

12A and 13A, in one aspect of the enclosure 460, the drive belt is positioned to form a small gap between the drive belt slot 472 and the drive belt 440 formed in the enclosure top plate 462. . This configuration may be advantageous to prevent particles generated inside the enclosure 460 from going outside of the enclosure 460.

Referring to FIG. 12C, in another aspect of the enclosure 460, the fan unit 481 is configured to draw air from the interior of the enclosure 460 through the base slot 464A formed in the base 464 and the base 464. ) May be attached. In another aspect, fan unit 481 pushes air containing particulates through filter 482 to remove the particles before they are exhausted through cluster tool base 10A or floor (see item “A”). . In this configuration, the fan 483 included in the fan unit is designed to create a negative pressure inside the enclosure 460 whereby air outside the enclosure is drawn into the enclosure, thus leaking particles generated inside the enclosure 460. Limit your chances of leaving In one embodiment, filter 482 is a HEPA type filter or other type filter, which may remove particulates generated from air. In one aspect, the length and width of the slot 471, and the size of the fan 483, is about 0.02 inch of water pressure drop created between the point inside the enclosure 460 and the point outside the enclosure 460. (˜5 Pa) to about 1 inch of water (˜250 Pa).

In one embodiment of the horizontal motion assembly, the shield belt 479 is positioned to cover the slot 471 thereby preventing particles generated inside the horizontal motion assembly 90 from going to the substrate. In this configuration, the shield belt 479 forms a continuous loop along the length of the horizontal motion assembly 90, which is located in the slot 471 and is an open area formed between the shield belt 479 and the enclosure top plate 462. Make it as small as possible. In general, the shielding belt 479 is attached (eg coupled, bolted or clamped) to the support mount 452, thereby forming a continuous loop along the length of the horizontal motion assembly 90, which is two or more drives. It is supported at the end of the horizontal motion assembly 90 by a belt pulley (not shown). In the configuration shown in FIG. 12C, the shield belt 479 may be attached to the support mount 452 at the level of the slot 471 (not shown) and machined into the base 464 to form a continuous loop. It returns through the horizontal motion assembly 90 of the channel 478. Thus, the shielding belt 479 surrounds the inner region of the horizontal motion assembly 90.

Vertical motion assembly

13A-B illustrate one embodiment of a vertical motion assembly 95. 13A is a top view of a vertical motion assembly 95 showing various aspects of the design. Vertical motion assembly 95 generally includes vertical support 570, vertical actuator assembly 560, fan assembly 580, support plate 321, and vertical enclosure 590. The vertical support 570 is generally a structural member bolted, welded or mounted to the sled mount 451 and is adapted to support the various components present in the vertical motion assembly 95.

The fan assembly 580 generally includes a fan 582 and a tube 581, which forms a plenum region 584 in fluid communication with the fan 582. The fan 582 is configured to transmit aerodynamic movement by using mechanical means such as, for example, a rotating fan blade, a moving bellows, a moving diaphragm, or a moving close toleranced machine gear. The fan 582 is configured to create a negative pressure in the plenum region 584 in fluid communication with the interior region 586 and the plurality of slots 585 formed in the tube 581 to the outside of the enclosure 590. It is made to induce negative pressure in the inner region 586 of 590. In one aspect, the number, size, and distribution of slots 585, which may be round, elliptical or rectangular, are designed to evenly draw air from all regions of the vertical motion assembly 95. In one aspect, the interior region 586 comprises a number of cables used to transmit signals between various robotic hardware assemblies 85 and components in the vertical motion assembly 95 components with the system controller 101. It may be made to accommodate (not shown). In one aspect, the fan 582 is configured to deliver air removed from the interior region 586 to the central region 430 of the horizontal motion assembly 90, where the horizontal motion assembly 90 is through the base slot 464A. Air is exhausted from the

Vertical actuator assembly 560 generally includes vertical motor 507 (FIGS. 12A and 13B), pulley assembly 576 (FIG. 13B), and vertical slide assembly 577. The vertical slide assembly 577 generally includes a bearing block 573 and a linear rail 574 attached to the motion block 572 and the vertical support 570 of the pulley assembly 576. The vertical slide assembly 577 is configured to guide and provide a smooth and accurate movement of the robot hardware assembly 85, and to load a heavy load created by the movement of the robot hardware assembly 85 along the length of the vertical motion assembly 95. To be supported. Linear rail 574 and bearing block 573 may be a linear ball bearing slide, an accurate shaft guide system, or a conventional linear guide, which is well known in the art. Typical linear ball bearing slides, accurate shaft guide systems, or conventional linear guides are available from SKF USA Inc., or the Daedal Division of Parker Hannifin Corporation of Irwin, PA.

Referring to FIGS. 13A and 13B, the pulley assembly 576 generally includes a drive belt 571, a motion block 572 and two or more pulleys 575 (eg, elements 575A and 575B), which are vertical supports 570. ) And the vertical motor 507, whereby the support plate (eg elements 321A-321B in FIG. 13B) and the robot hardware assembly 85 may be positioned along the length of the vertical motion assembly 95. Can be. In general, drive belt 571 is attached (eg coupled, bolted, or clamped) to motion block 572, thereby forming a continuous loop along the length of vertical motion assembly 95 and forming two or more drive belt pulleys. 575 (eg elements 575A, 575B) are supported at the ends of the vertical motion assembly 95. 13B shows one configuration with two drive belt pulleys 575A-B. In one aspect, the vertical motor 507 is attached to one of the drive belt pulleys 575B whereby the rotational movement of the pulleys 575B causes the drive belt 571 and the support plate, and the robot hardware assembly 85 to be vertically linear. Will move along slide assembly 577. In one embodiment, the vertical motor 507 is a direct drive linear brushless auxiliary motor, which is adapted to move the robot hardware assembly 85 relative to the vertical slide assembly 577, thus driving the drive belt 571 and two or more. Pulley 575 is not needed.

Vertical enclosure 590 generally includes one or more exterior walls 591 and enclosure top 592 (FIG. 9A) and slots 593 (FIGS. 9A, 12A, and 13A). The vertical enclosure 590 is made to cover the components of the vertical motion assembly 95 for reasons of safety and contamination reduction. In one aspect, the vertical enclosure 590 is supported and attached by the vertical support 570. Since particles that roll, slide or come into contact with each other are produced by the mechanical components, it is ensured that the components of the vertical motion assembly 95 do not contaminate the substrate while the substrate moves through the cluster tool 10. It is important. Thus, enclosure 590 forms an enclosed area that minimizes the chance of particles generated inside enclosure 590 towards the substrate surface. Particulate contamination directly affects instrument yield and CoO of the cluster tool. Thus, in one aspect, the size (ie, length and width) of the slots 593 and / or the size (eg, flow rate) of the fan 582 is determined by the number of particles that can exit from the vertical motion assembly 95. It is configured to be minimized. In one aspect, the length (z-direction) and width (x-direction) of the slot 593 and the size of the fan 582 are the pressure drop created between the inner region 586 and the outer point of the outer wall 591. About 0.02 inches of water (˜5 Pa) to about 1 inch of water (˜250 Pa). In one aspect, the slot 593 is about 0.25 inches to about 6 inches wide.

Embodiments described herein employ prior art designs configured to lift robotic components by components that must be folded, shortened or retracted back into itself to reach the vertical position of the lowest position. It generally has advantages over it. The lowest position of the robot is problematic because it is limited by the size and orientation of the vertical motion component that must be folded back, shortened or retracted itself into its original position, due to the collision of the vertical motion component. The position of the vertical components of the prior art, when it can no longer be retracted, is called "dead space" or "solid height", which means that the lowest robot position of the retracted component Because you are limited by height. In general, the embodiments described herein avoid this problem, since the bottom of one or more mobile robotic assemblies 86 is not supported below by the components of the vertical motion assembly 95 and thus the lowest position is only robot hardware. This is because it is limited only by the size of the assembly 85 components and the length of the linear rail 574. In one embodiment, as shown in FIGS. 13A-13B, the robotic assembly is supported in a cantilever fashion by a support plate 321 mounted to the vertical slide assembly 577. The components of the robot hardware assembly 85 and the configuration of the support plate 321 as shown in FIGS. 10C-10E are not intended to limit the scope of the invention described herein, but rather the robot hardware assembly 85 and the support plate ( The orientation of 321 may be made to achieve the desired vertical stroke and / or desired structural rigidity of the vertical motion assembly 95.

In addition, embodiments of the vertical motion assembly 95 described herein have advantages over prior art movement designs, such as needing to be folded back, shortened or retracted on their own, along the vertical slide assembly 577. This is due to the improved accuracy and / or precision of the robot hardware 85 movement by forced movement. Thus, in one aspect of the invention, the motion of the robot hardware assembly is guided by a rigid member (eg vertical slide assembly 577), which is configured when the component moves along the length of the vertical motion assembly 95. Provide structural rigidity and positional accuracy to the element.

Dual horizontal motion assembly configuration

14A shows one embodiment of the robotic assembly 11, which utilizes two horizontal motion assemblies 90 that can be used with one or more robotic assemblies 11A-H shown in FIGS. 1-6. In this configuration, the robot assembly 11 generally includes a robot hardware assembly 85, a vertical motion assembly 95 and two horizontal motion assemblies 90 (eg elements 90A, 90B). Thus, the substrate is subjected to any desired x, y and z directions by the mutual motion of the robot hardware assembly 85, the vertical robot assembly 95 and the horizontal robot assembly 90A-B from the instructions sent by the system controller 101. It can be located as. One advantage of this configuration is that the stiffness of the robot assembly 11 structure during the dynamic movement of the vertical movement assembly 95 along the direction of movement (x-direction) can be improved with higher acceleration during movement and improved substrate processing time. Is there.

In one aspect, the components found in the vertical motion assembly 95, the upper horizontal motion assembly 90B and the lower horizontal motion assembly 90A include the same basic components as described above, and therefore like numbers Will be used as appropriate. In one aspect, the vertical movement assembly 95 includes an upper sled mount 451B and a lower sled positioned along the x-direction using the movement assembly 442 held in each of the horizontal movement assemblies 90A, 90B. It is connected to mount 451A. In another embodiment of the robotic assembly 11, a single movement assembly 442 mounted to one horizontal movement assembly (eg element 90A) and another horizontal movement assembly (eg element 90B) is a vertical movement assembly 95. Acts as a support to guide one end of

Board Grouping

In an effort to reduce cost of ownership (CoO) and become more competitive in the marketplace, electronics manufacturers spend a lot of time optimizing processing sequences and chamber processing times, thereby eliminating possible cluster tool architecture limitations and chamber processing times. Get the best substrate through In processing sequences with many processing steps and short chamber processing times, an important part of the time it takes to process the substrate is occupied by moving the substrate in the cluster tool between the various chambers. In one embodiment of the cluster tool 10, CoO is reduced by grouping the substrates and moving and processing the substrates into two or more groups. Thus, this parallel processing form should increase system throughput, reduce the number of robotic operations, and allow the placement of substrates between processing chambers, thus reducing wear and tear on the robot and system reliability. To increase.

In one embodiment of the cluster tool 10, the front end robot assembly 15, the robot assembly 11 (eg elements 11A, 11B, etc., FIGS. 1-6) and / or the rear robot assembly 40 are both It can be made to move the substrate to the above group, thereby improving the system throughput by processing the substrate in parallel. For example, in one aspect, the robot hardware assembly 85 has a number of independently controllable mobile robot assemblies 86A, 86B (FIG. 10B), which pick up one or more substrates from multiple processing chambers and then It is used to move and release the substrate into a number of subsequent processing chambers. In another aspect, each mobile robot assembly 86 (eg 86A or 86B) is configured to pick up, move, and put down multiple substrates individually. In this case, for example, a robot hardware assembly 85 having two mobile robot assemblies 86 may be made to pick up the substrate "W" from the first processing chamber using the first blade 87A and thereafter. It is moved to the second processing chamber to pick up the substrate using the second blade 87B, whereby it can be moved and put down into a group.

As shown in FIG. 15A, in one embodiment of the robot assembly 11, the robot hardware assembly 85 includes two robot hardware assemblies 85 (eg, elements 85A, 85B), which are at least one. It has a robotic assembly 86, which is spaced apart by a desired distance or pitch (element “A”) and is adapted to pick up or lower a substrate simultaneously from two different processing chambers. The spacing or pitch A between the two robotic hardware assemblies 85 can be configured to correspond to the spacing between two processing chambers mounted in one of the processing racks, so that the robot assembly 11 can simultaneously process two It makes it possible to access the chamber. Thus, this configuration has the particular advantage of improving substrate throughput and cluster tool reliability by being able to move two or more substrates in groups.

Robot Blade Hardware Configuration

16A-16D illustrate one embodiment of a robot blade assembly 900, which is used to hold and support a substrate “W” while the substrate is moved through the cluster tool 10 using the robot assembly 11. It may be used with some of the embodiments described herein. In one embodiment, the robot blade assembly 9000 can be configured to replace the blade 87 and thus the first pulley shown in FIGS. 10A-10E at the connection point (element "CP") formed in the blade base 901. It may be coupled to system 355 or second pulley system 361 components. The robot blade assembly 900 of the invention is configured to support, "hold" or limit the substrate "W" whereby the acceleration experienced by the substrate during the movement process moves the substrate position from a known position on the robot blade assembly 900. Will not be. Movement of the substrate during the migration process will produce particles and reduce substrate position accuracy and repeatability by the robot. In the worst case, the acceleration may cause the substrate to be dropped by the robot blade assembly 900.

The acceleration experienced by the substrate can be separated into three components: a horizontal radial acceleration component, a horizontal axial acceleration component, and a vertical acceleration component. The acceleration experienced by the substrate is generated as the substrate is accelerated or decelerated in the X, Y and Z directions during substrate movement through the cluster tool 10. Referring to FIG. 16A, the horizontal radial acceleration component and the horizontal axial acceleration component are shown as forces F _A and F _R , respectively. This force is related to the mass of the substrate multiplied by the acceleration of the substrate minus any frictional force generated between the substrate and the robot blade assembly 900 components. In the embodiment described above, radial acceleration is generally generated when the substrate is rotated to position by the mobile robot assembly 86 and can act in both directions (ie, + Y or -Y direction). Axial acceleration is generally generated and can work in both directions when the substrate is positioned in the X-direction by the horizontal motion assembly 90 and / or by the movement of the mobile robot assembly 86 (ie, + X or −). X direction). Vertical acceleration is generally generated when the substrate is positioned in the Z-direction by the vertical motion assembly 95 and can act in both directions (ie, + Z or -Z directions) or can act as cantilever induced structural vibrations. have.

16A is a schematic top view of one embodiment of a robot blade assembly 900 configured to support a substrate “W”. The robot blade assembly 900 includes a blade base 901, an actuator 910, a brake mechanism 920, a position sensor 930, a clamp assembly 905, one or more reaction members 908 (eg one shown). And one or more substrate support components 909. Clamp assembly 905 generally includes one or more contact members 907 (ie, two contact members shown in FIG. 16A) or clamp plate 906 mounted on clamp plate 906. The clamp plate 906, the contact member 907, the reaction member 908 and the blade base 901 may be made of metal (eg aluminum, nickel coated aluminum, SST), ceramic material (eg silicon carbide), or It can be made of plastic material, which can reliably withstand the acceleration (e.g. 10-30 m / s ² ) experienced by the robot blade assembly 900 during the movement process and generate particles by interaction with the substrate. Or won't pull. FIG. 16B is a side schematic cross-sectional view of the robot blade assembly 900 shown in FIG. 16A, which is split through the center of the robot blade assembly 900. For clarity, the components located behind the cross-sectional plane of FIG. 16B are left out while the brake assembly 930 is shown in this figure (eg, contact member 907).

Referring to FIGS. 16A and 16B, in use, the substrate “W” is formed of the reaction member 908 by a bearing force transmitted by the actuator 910 to the substrate “W” through the contact member 907 of the clamp assembly 905. Pressed against the retention surface 908B. In one aspect, the contact member 907 is adapted to press and contact the edge “E” of the substrate “W” against the retention surface 908B. In one aspect, the bearing force can be about 0.01 to about 3 kilogram force (kgf). In one embodiment, it is desirable to distribute the contact member 907 at an angular distance "A" as shown in FIG. 16A, whereby axial and radial bearing forces when the substrate is moved by the robot assembly 11. To the substrate.

The process of limiting the substrate to be reliably moved through the cluster tool 10 using the robot blade assembly 900 will generally require three steps to completion. One or more of the steps described below may be completed simultaneously or sequentially without changing the basic scope of the invention described herein. Prior to the start of the process of picking up the substrate, the clamp assembly 905 is retracted in the + X direction (not shown). The first step begins when the substrate is picked up from the substrate support component (e.g., communication positions 9A-H in elements 532A, 2A, 3A, etc. in FIGS. 11A-11I), whereby the substrates each support the substrate. It lies on the substrate support surfaces 908A, 909A on the component 909 and the reaction member 908. Next, the substrate is mounted on the robot blade assembly 900 by a bearing force F1 transmitted by the actuator 910 to the substrate " W " through the contact member 907 of the reaction member 908 and the clamp assembly 905. Until limited, the clamp assembly 905 is moved in the -X direction. In the last step, the clamp assembly 905 is supported or "locked" in position by the brake mechanism 920, thereby preventing the acceleration of the substrate during the transfer process significantly changing the bearing force F1 and thus The substrate is moved relative to the support surface. After the brake mechanism 920 restricts the cluster tool 10, the substrate may be moved to another point in the cluster tool 10. In order to place the substrate on the substrate support component, the steps described above may be completed in reverse.

In one aspect of the robot blade assembly 900, the brake mechanism 920 is configured to restrict movement of the clamp assembly 905 in at least one direction (eg, + X direction) during the movement process. The ability to limit the movement of the clamp assembly 905 in the direction opposite to the bearing force F1 supplied by the clamp assembly 905 will prevent the horizontal axial acceleration from significantly reducing the bearing force and thus allow the substrate to rotate around. This may produce particles or prevent them from falling by the blade assembly 9000 during the movement process. In another aspect, the brake mechanism 920 is configured to limit the movement of the clamp assembly 905 in at least two directions (eg, + X and -X directions). In this configuration, the ability to limit the movement of the clamp assembly in a direction parallel to the direction of bearing force F1 prevents the horizontal axial acceleration from significantly increasing the bearing force that may cause substrate breakage or chipping, or It prevents a significant reduction in bearing capacity, which can produce particles or cause the substrate to fall. In another embodiment, the brake mechanism 905 is configured to limit all six degree of freedom of the clamp assembly 905 to prevent or minimize movement of the substrate. The ability to limit movement of the clamp assembly 905 in the desired direction can be performed by using a component configured to limit the movement of the clamp assembly 905. General components that may be used to limit the movement of the clamp assembly 905 may include conventional latching mechanisms (eg door latch type mechanisms) or other similar mechanisms. In one aspect, the movement of the clamp assembly 905 is limited by a mechanism, which applies a limiting force (element F2 in FIG. 16A), such as the opposing brake assembly 920A described below.

In one embodiment, the position sensor 930 is used to sense the position of the clamp assembly 905, whereby the controller 101 can determine the state of the blade assembly 900 at any time during the movement process. In one aspect, the position sensor 930 is a clamp plate (-X) in the -X direction due to the absence of a substrate on the blade assembly 900 or the position of the clamp plate 906 from the force transmitted by the actuator 910. By indicating that 906 is moving away, it is made to detect that the substrate is misplaced on the support surfaces (elements 908A and 909A). Similarly, position sensor 930 and controller 101 may be configured to detect the presence of the substrate by indicating that the clamp plate 906 position is within a range of corresponding acceptable positions when the substrate is present. In one aspect, the position sensor 930 consists of a plurality of optical position sensors, linear variable displacement transducers (LVDTs), or other significant position sensing devices located at desired points, which accommodate the clamp plate 906. It can be used to distinguish between possible and unacceptable locations.

FIG. 16C schematically shows a top view of one embodiment of a blade assembly (element 900A), which has an opposing brake assembly 920A, which replaces the schematic representation of the brake assembly 920 in FIG. 16A. . The opposing brake assembly 920A is configured to limit the position of the clamp plate 906 during the substrate movement process. The embodiment shown in Fig. 16C is similar to the configuration shown in Figs. 16A-B, except that the opposing brake assembly 920A, the actuator assembly 910A and various supporting components have been added, and similar element numbers for clarity. Was used appropriately. Embodiments of the robot blade assembly 900A include a blade base 901, an actuator assembly 910A, an opposing brake mechanism 920A, a position sensor 930, a clamp assembly 905, a reaction member 908 and a substrate support configuration. Generally includes an element 909. In one embodiment, the clamp plate 906 is mounted on a linear slide (not shown) attached to the blade base 901 to align and limit the movement of the clamp plate 906 in the desired direction (eg, x-direction). Is mounted on.

In one embodiment, actuator assembly 910A is clamped through actuator 911, actuator coupling shaft 911A, coupling member 912, guide assembly 914, connecting member 915, and connecting member 915. And a connecting plate 916 connected to the plate 906 and the coupling member 912. Coupling member 912 may be a conventional coupling joint or "floating joint", which is commonly used to connect various motion control components to each other. In one embodiment, the connecting plate 916 is directly connected to the actuator coupling shaft 911A of the actuator 911. The guide assembly 914 can be a linear slide assembly or a ball bearing slide, which is connected to the connecting plate 916 to align and guide the movement of the connecting plate and the clamp plate 906. The actuator 911 is configured to position the clamp plate 906 by moving the coupling shaft 911A, the coupling member 912, the coupling member 915, and the coupling plate 916. In one aspect, actuator 911 is an air cylinder, linear motor, or other substantial positioning and force transmitting mechanism.

In one embodiment, the opposing brake assembly 920A includes an actuator coupled to the brake contact member 922 and coupled to the blade base 901. In this configuration, the opposite brake assembly 921A is configured to limit or "lock" the clamp plate 906 by the limiting force F2 generated by the opposite brake assembly 920A. In one embodiment, when the actuator 921 presses the brake contact member 922 against the connecting plate 916 (element F3), the limiting force F2 is applied to the connecting plate 916 and the brake contact member 922. It is created by the friction force formed between. In this configuration the guide assembly 914 is designed to receive the side rods generated from the brake force F3 transmitted by the actuator 921. The resulting limiting force F2 supporting the clamp plate 906 is equal to the brake force F3 multiplied by the static coefficient of friction occurring between the brake contact member 922 and the connecting plate 916. The size of the actuator 921, the brake contact member 922 and the connection plate 916 material, and the choice of the surface finish are such that the resulting limiting force is always greater than any force generated during acceleration of the substrate during the movement process. Can be optimized to ensure that In one aspect, the limiting force (F2) generated is in the range of about 0.5 to about 3.5 kilogram-force (kgf). In one aspect, the brake contact member 922 may be made of a rubber or polymeric material, such as polyurethane, ethylene-propylene rubber (EPDM), natural rubber, butyl rubber or other suitable polymeric material, The connecting plate 916 is made of aluminum alloy or stainless steel alloy. In one aspect, although not shown, the engagement shaft 911A of the actuator 911 is directly coupled to the clamp plate 906, and the brake contact member 922 of the opposing brake assembly 920A is coupled to the engagement shaft 911A or the like. Contact with the clamp plate and thereby prevent its movement.

FIG. 16D schematically illustrates a top view of one embodiment of blade assembly 900A, which blade assembly has another configuration of opposing brake assembly 920A as shown in FIG. 16C. In this configuration, the opposing brake assembly 920A has a constant position between the rare arm 923, which is connected to the brake contact member 922 at one end, the actuator 921 at the other end of the lever arm, and both ends of the lever arm. It includes a pivot point "P" located at. In one aspect, the pivot point is connected to the blade base 901 and is adapted to support the lever arm 923, and the force F4 supplied from the actuator 921 to the lever arm 923 as the brake contact member 922. Is pressed against the connecting plate 916. In this configuration, by strategically positioning the pivot point “P” a mechanical advantage can be generated by the use of lever arm 923, which lever arm supplies brake force F3 and limiting force F2. The limiting force exceeds the force obtained by direct contact with the force that generates the components of the actuator 921.

FIG. 16D shows one embodiment of a blade assembly 900A, which blade assembly between the clamp plate 906 and the connecting member 915 to help detect the presence or absence of a substrate on the blade assembly 900A. Compliant member 917 located at. The compliant member generally adds additional degrees of freedom used with the position sensor 930 and the controller 101, whereby the substrate on the blade assembly 900A when the limiting force F2 is applied to the connecting plate 916. Detects the presence or absence of a. If no other degrees of freedom are present in the blade assembly 900A, the limiting force F2 that prevents the clamp plate 906 from moving is such that the position sensor 930 and the controller 101 may move or otherwise move the substrate during or before the substrate movement process. Prevent or interfere with detection of loss.

Thus, in one embodiment, the actuator assembly 910A includes an actuator 911, an actuator coupling shaft 911A, a coupling member 912, a guide assembly 914, a connection member 915, a compliant member 917, It generally includes a clamp plate guide assembly 918 and a connecting plate 916 connected to the clamp plate 906 and to the coupling member 912 via the connecting member 915 and the compliant member 917. The clamp plate guide assembly 918 is a conventional linear slide assembly or ball bearing slide, which is connected to the clamp plate 906 to align and guide the movement.

The compliant member 917 is typically a flexible component such as a spring, flexure or other similar mechanism, which can be reliably measured by the position sensor 930 when the substrate is moved or "lost". Sufficient force can be delivered upon release of the potential energy generated by the deflection while applying the bearing force F1 to move the clamp plate 906 in a viable amount. In one aspect, the compliant member 917 is a spring, which has a spring rate low enough for the spring to reach "solid height" when the bearing force F1 is applied to the substrate. In another aspect, the connecting member 915, the compliant member 917, and the clamp plate 906 cause the connecting member 915 to come into contact with the clamp plate 906 or reach a floor thereon when the bearing force F1 is applied. It is designed to bottom out. One advantage of this type of configuration is that it prevents the bearing force F1 from changing during the movement, since the compliant member 917 cannot be further deflected by the acceleration experienced by the substrate during the movement. It will reduce the number of particles formed and prevent the loss of the substrate.

The following steps are intended to illustrate an example of how the compliant member 917 can be used to detect the presence of a substrate on the blade assembly 900A after the limiting force F2 is applied to the connecting plate 916. In a first step, the actuator 911 includes a reaction member 908 and a clamp assembly that bias the compliant member 917 in an amount such that the gap “G” between the connecting member 915 and the clamp plate 906 contracts. The support force F1 is applied to the substrate through the connecting member 907 of 905. The controller 101 then confirms to ensure that the clamp plate 906 is in an acceptable position by displaying and monitoring the information received from the position sensor 930. If the substrate is sensed and in the desired position on the blade assembly 900A, the limiting force F2 is applied to the connecting plate 916 to limit the movement in a direction parallel to the direction of the bearing force F1. Then, if the substrate is moved and / or "un-gripped", by the deflection during the application of the bearing force F1, the potential energy generated in the compliant member 917 is limited to the clamp plate 906. Will move away from the connecting plate 916, which is then sensed by the position sensor 930 and the controller 101. Movement of the clamp plate 906 represented by the position sensor 930 enables the controller 101 to stop the movement process or prevents the movement process from occurring, which damages the substrate and the system. Can be prevented.

The foregoing is intended to illustrate embodiments of the invention, and other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims (87)

A cluster tool for processing substrates, As the first treatment rack, A first group of two or more processing chambers stacked vertically; And A first processing rack comprising a second group of two or more processing chambers stacked vertically, the two or more substrate processing chambers of the first group and the second group having a first side aligned in a first direction A first robotic assembly configured to move a substrate from said first processing rack to said substrate processing chambers, A first robot having a robot blade and a substrate receiving surface located thereon; The first robot is configured to form a movement area and to position the substrate at one or more locations generally included in the first plane, the first plane being in a first direction and a second direction perpendicular to the first direction Parallel to A first movement assembly configured to position the first robot in a third direction generally perpendicular to the first plane; And A second movement assembly configured to position the first robot in a direction generally parallel to the first direction; When the substrate is located on the substrate receiving surface of the robot blade, the moving region is parallel to the second direction and has a width of about 5% to 50% greater than the dimension of the substrate in the second direction. Including, a first robot assembly, Cluster tool for processing substrates. The method of claim 1, Further comprising a second robot having a robot blade having a substrate receiving surface, Wherein the second robot is configured to position the substrate at one or more locations generally included in a second plane, wherein the first plane and the second plane are spaced apart, Cluster tool for processing substrates. The method of claim 1, The first movement assembly, An actuator assembly configured to vertically position the first robot, A vertical actuator configured to position the first robot vertically; And a vertical slide configured to guide the first robot when the first robot is moved by the vertical actuator. Actuator assembly; An enclosure having an interior region surrounding at least one component selected from the group consisting of the vertical actuator and the vertical slider; And further comprising a fan adapted to generate negative pressure in the enclosure and in fluid communication with the interior region. Cluster tool for processing substrates. The method of claim 1, The cluster tool, As the second treatment rack, A first group of two or more processing chambers stacked vertically; And A second processing rack, comprising a second group of two or more processing chambers stacked vertically; Two or more substrate processing chambers of the first and second groups having a first side aligned along a first direction A second robotic assembly configured to move a substrate from said second processing rack to said substrate processing chambers, A second robot having a second robot blade and a substrate receiving surface located thereon; The second robot is configured to form a movement area and to position the substrate at one or more locations generally contained within the second plane, the second plane being in a second direction perpendicular to the first direction and the first direction; Parallelism A first movement assembly having an actuator assembly configured to position the second robot in a second direction generally perpendicular to the second plane; And A second movement assembly having an actuator assembly configured to position the second robot in a direction generally parallel to the first direction; When the substrate is located on the receiving surface of the second robot blade, the second moving area is about 5% to 50% larger than the dimension of the substrate in the second direction and has a width parallel to the second direction. Having Including, a second robot assembly, Cluster tool for processing substrates. The method of claim 4, wherein The cluster tool, A third robotic assembly configured to move a substrate into the first processing rack and the substrate processing chambers of the first processing rack, A third robot having a third robot blade and a substrate receiving surface located thereon; The third robot is configured to form a movement area and to position the substrate at one or more points generally included in a third plane, the third plane being in a first direction and a second direction perpendicular to the first direction Parallel to A first movement assembly having an actuator assembly configured to position the second robot in a third direction generally perpendicular to the third plane; And A second movement assembly having an actuator assembly configured to position the second robot in a direction generally parallel to the first direction; When the substrate is positioned on the substrate receiving surface of the third robot blade, the third moving area is about 5% to about 50% larger than the substrate dimension in the second direction and has a width parallel to the second direction. Having Further comprising, a third robot assembly, Cluster tool for processing substrates. A cluster tool for processing substrates, A first processing rack comprising two or more groups of two or more substrate processing chambers stacked in a vertical direction; The two or more substrate processing chambers of the two or more groups have a first side aligned along a first direction and thereby access the substrate processing chambers A second processing rack comprising two or more groups of two or more substrate processing chambers stacked in a vertical direction; The two or more substrate processing chambers of the two or more groups have a first side aligned along a first direction and thereby access the substrate processing chambers A first robotic assembly located between the first processing rack and the second processing rack and adapted to move a substrate from the first side to the substrate processing chambers of the first processing rack, A robot configured to position the substrate at one or more locations generally included in the horizontal plane; A vertical movement assembly having a vertical actuator assembly configured to position the robot in a direction generally parallel to the vertical direction; And A first robotic assembly comprising a horizontal motion assembly having a motor configured to position the robot in a direction generally parallel to the first direction; A second robotic assembly located between the first processing rack and the second processing rack and configured to move a substrate from the first side to the substrate processing chambers of the second processing rack, A robot configured to position the substrate at one or more locations generally included in the horizontal plane; A vertical movement assembly having a vertical actuator assembly configured to position the robot in a direction generally parallel to the vertical direction; And A second robotic assembly comprising a horizontal motion assembly having a motor configured to position the robot in a direction generally parallel to the first direction; And A third located between the first processing rack and the second processing rack and configured to move a substrate from the first side to the substrate processing chambers of the first processing rack from the second processing rack or from the first side; As a robotic assembly, A robot adapted to position the substrate at one or more locations generally included in the horizontal plane; A vertical movement assembly having a vertical actuator assembly configured to position the robot in a direction generally parallel to the vertical direction; And A third robot assembly comprising a horizontal motion assembly having a motor configured to position the robot in a direction generally parallel to the first direction, Cluster tool for processing substrates. The method of claim 6, And further including an enclosure having one or more walls defining a processing area in which the first processing rack, second processing rack, first robot assembly, second robot assembly, and third robot assembly are located, wherein air is passed through the filter. Having a fan to pass into the processing region, Cluster tool for processing substrates. The method of claim 7, wherein Further comprising a fourth robotic assembly positioned in the processing region and adapted to move the substrate to and from the processing chamber of the first processing rack and an external location of the enclosure; Cluster tool for processing substrates. The method of claim 6, A second processing rack positioned between the first processing rack and the second processing rack and adapted to move a substrate from the first side to the second processing rack or from the first side to the substrate processing chambers of the first processing rack. 4 additional robot assemblies, This fourth robot assembly, A robot configured to position the substrate at one or more locations generally included in the horizontal plane; A vertical movement assembly having a vertical actuator assembly configured to position the robot in a direction generally parallel to the vertical direction; And A horizontal motion assembly having a motor configured to position the robot in a direction generally parallel to the first direction, Cluster tool for processing substrates. The method of claim 6, A cassette configured to hold two or more substrates; A first communication chamber configured to receive a substrate from a front end robot and the first robot assembly; A second communication chamber configured to receive a substrate from the front end robot and the second robot assembly; Further comprising a third communication chamber adapted to receive a substrate from the front end robot and the third robot assembly, Wherein the front end robot is adapted to move the substrate to and from the cassette and the first, second and third communication chambers, Cluster tool for processing substrates. The method of claim 6, Each of the horizontal motion assembly of the first robot assembly, the horizontal motion assembly of the second robot assembly, and the horizontal motion assembly of the third robot assembly, An enclosure having a base and one or more walls surrounding the interior region; And Further comprising one or more fan assemblies in fluid communication with the interior region of the enclosure, Cluster tool for processing substrates. The method of claim 6, A robot blade configured to receive and transport a substrate by the robot of the first robot assembly, the second robot assembly, and the third robot assembly; And substantially a motor in rotational communication with the robot blade. Cluster tool for processing substrates. The method of claim 6, The robot of the first robot assembly, the second robot assembly, and the third robot assembly, A robot blade having a first end and a substrate receiving surface; The substrate receiving surface is adapted to receive and transport the substrate A first linkage member having a first pivot point adapted to rotate about the first end of the robot blade; And Substantially further comprising a motor in rotational communication with the first linkage member and the robot blade, Cluster tool for processing substrates. The method of claim 6, Each of the vertical motion assembly of the first robot assembly, the vertical motion assembly of the second robot assembly, and the vertical motion assembly of the third robot assembly, An enclosure having a filter and one or more walls surrounding the interior region; And Further comprising a fan assembly in fluid communication with the interior region of the enclosure and configured to remove fluid from the interior region through the filter; Cluster tool for processing substrates. The method of claim 6, Each of the first robot assembly, the second robot assembly, and the third robot assembly, An enclosure having a filter and one or more walls surrounding the interior region; And Further comprising at least one fan assembly in fluid communication with an interior region of the enclosure and configured to allow air to flow through the filter toward the first, second, or third robot, Cluster tool for processing substrates. The method of claim 6, Each of the first robot assembly, the second robot assembly, and the third robot assembly, Further comprising a second robot adapted to position the substrate on the second horizontal plane, Wherein the horizontal plane and the second horizontal plane are spaced apart from each other, Cluster tool for processing substrates. The method of claim 6, Each of the vertical movement assemblies of the first, second and third robotic assemblies, A vertical actuator assembly, comprising: a vertical actuator configured to vertically position the first robot; And a vertical slide configured to guide the first robot when the first robot is moved by the vertical actuator; An enclosure having an interior region surrounding at least one component selected from the group consisting of the vertical actuator and the vertical slide; And And further comprising a fan configured to generate negative pressure inside the enclosure and in fluid communication with the interior region. Cluster tool for processing substrates. A cluster tool for processing substrates, A first processing rack comprising two or more groups of two or more vertically stacked substrate processing chambers; The two or more vertically stacked substrate processing chambers of the two or more groups have access to the substrate processing chambers through them having a first side aligned along a first direction and a second side aligned along a second direction - A first robotic assembly configured to move a substrate from the first side to the substrate processing chambers of the first processing rack, the first robot comprising: A first robot configured to position the substrate at one or more points generally included in the horizontal plane; A vertical movement assembly having a motor configured to position the first robot in a direction generally parallel to the vertical direction; And A first robotic assembly comprising a horizontal motion assembly having a motor configured to position the first robot in a direction generally parallel to the first direction; And A second robotic assembly configured to move a substrate from the second side to the substrate processing chambers of the first processing rack, the second robot comprising: A second robot configured to position the substrate at one or more points generally included in the horizontal plane; A vertical movement assembly having a motor configured to position the second robot in a direction generally parallel to the vertical direction; And A second robotic assembly comprising a horizontal motion assembly having a motor configured to position the second robot in a direction generally parallel to the first direction; Cluster tool for processing substrates. The method of claim 18, A third robotic assembly configured to move a substrate to the substrate processing chambers of the first processing rack from the first side rotor; The third robot assembly, A third robot configured to position the substrate at one or more points generally included in the horizontal plane; A vertical movement assembly having a motor configured to position the third robot in a direction generally parallel to the vertical direction; And A horizontal motion assembly having a motor configured to position the third robot in a direction generally parallel to the first direction, Cluster tool for processing substrates. The method of claim 18, A second processing rack comprising two or more groups of two or more vertically stacked substrate processing chambers; At least two groups of the at least two vertically stacked substrate processing chambers have access to the substrate processing chambers with a first side aligned along the first direction; and Further comprising a first robotic assembly adapted to move a substrate from the first side to the substrate processing chambers of the second processing rack, Cluster tool for processing substrates. The method of claim 18, A cassette configured to hold two or more substrates; A first communication chamber configured to receive a substrate from a front end robot and the first robot assembly; A second communication chamber configured to receive a substrate from a front end robot and the second robot assembly; And Further comprising the front end robot configured to move a substrate from the first and second communication chambers and cassettes and cassettes, Cluster tool for processing substrates. The method of claim 18, Each of the horizontal motion assembly of the first robot assembly and the horizontal motion assembly of the second robot assembly, An enclosure having a base and one or more walls surrounding the interior region; And Further comprising one or more fan assemblies in fluid communication with the interior region of the enclosure, Cluster tool for processing substrates. The method of claim 18, The robot of the first robot assembly and the second robot assembly, A robot blade configured to receive and transport the substrate; And substantially a motor in rotational communication with the robot blade. Cluster tool for processing substrates. The method of claim 18, The robot of the first robot assembly and the second robot assembly, A robot blade having a first receiving end and a substrate receiving surface adapted to receive and transport the substrate; A first linkage member having a first pivot point configured to rotate the first end of the robot blade about; And Substantially further comprising a motor in rotational communication with the first linkage member and the robot blade, Cluster tool for processing substrates. The method of claim 18, Each of the vertical movement assembly of the first robotic assembly and the vertical movement assembly of the second robotic assembly, An enclosure having a filter and one or more walls surrounding the interior region; And Further comprising a fan assembly in fluid communication with the interior region of the enclosure and configured to remove fluid from the interior region through the filter; Cluster tool for processing substrates. The method of claim 18, Each of the first robot assembly and the second robot assembly, An enclosure having a filter and one or more walls surrounding the interior region; And Further comprising at least one fan assembly in fluid communication with an interior region of the enclosure and configured to allow air to flow through the filter towards the first, second, or third robot, Cluster tool for processing substrates. The method of claim 18, Each of the first robot assembly and the second robot assembly, Further comprising a second robot adapted to position the substrate on the second horizontal plane, Wherein the horizontal plane and the second horizontal plane are spaced apart from each other, Cluster tool for processing substrates. A cluster tool for processing substrates, Two or more substrate processing chambers located in the cluster tool; And A first robotic assembly configured to move a substrate into the two or more substrate processing chambers, A first robot configured to position a substrate in a first direction, A robot blade having a first receiving end and a substrate receiving surface adapted to receive and transport the substrate; A first linkage member having a first pivot point and a second pivot point; A motor rotatably coupled to the first linkage member at the second pivot point; A first gear rotatably coupled to the first linkage member at the first pivot point and attached to a first end of the robot blade; And A second coaxially aligned with the second pivot point of the first linkage and rotationally coupled to the first gear, wherein the gear ratio of the second gear to the first gear is about 3: 1 to about 4: 3 A first robot comprising a gear; A first movement assembly configured to position the first robot in a second direction generally perpendicular to the first direction; And A first robotic assembly comprising a second movement assembly having a motor configured to position the first robot in a third direction generally perpendicular to the second direction; Cluster tool for processing substrates. An apparatus for moving a substrate in a cluster tool, A first robot configured to position the substrate at one or more points generally included in the first plane; As a vertical motion assembly, A slide assembly comprising a block coupled to a linear rail oriented in a vertical direction; A support plate coupled to the block and the first robot; And A vertical movement assembly comprising an actuator configured to vertically position the support plate in a vertical position along the linear rail; And A horizontal motion assembly coupled to the vertical motion assembly with a horizontal actuator configured to position the first robot and the vertical motion assembly in a horizontal direction, An apparatus for moving a substrate in a cluster tool. The method of claim 29, Further comprising a second horizontal motion assembly coupled to the vertical motion assembly with a second horizontal actuator configured to position the vertical motion assembly and the first robot in a horizontal direction; An apparatus for moving a substrate in a cluster tool. The method of claim 29, Further comprising an ambient control assembly having a fan configured to push air through the filter and towards a substrate located on the first robot, An apparatus for moving a substrate in a cluster tool. The method of claim 29, Further comprising a second robot configured to position the substrate at one or more points generally included in the second plane, The vertical motion assembly, Further comprising a second block coupled to the linear rail or a second support plate coupled to the linear rail through the block and coupled to the second robot and the linear rail, The actuator is configured to vertically position the second support plate in a vertical position along the linear rail, Wherein the second plane of the second robot is generally parallel to the first plane of the first robot and the second plane is spaced apart from the first plane, An apparatus for moving a substrate in a cluster tool. The method of claim 29, The vertical motion assembly, An enclosure having one or more walls defining an interior region surrounding at least one component selected from the group consisting of the actuator and the slide assembly; A slot formed in one of the one or more walls of the enclosure; The support plate extending through the slot; And Further comprising a fan configured to create a pressure drop between the inner region and the enclosure outer point, which is about 0.02 inch of water to about 1 inch of water, An apparatus for moving a substrate in a cluster tool. An apparatus for moving a substrate in a cluster tool, A first robot configured to position the substrate at one or more points generally included in the first plane; As a vertical motion assembly, An actuator assembly configured to vertically position the first robot, comprising: a vertical actuator configured to vertically position the first robot; And a vertical slide adapted to guide the first robot when the first robot is moved by the vertical actuator. An enclosure having one or more walls defining an interior region surrounding at least one of the components selected from the group consisting of the vertical actuator and the vertical slide; And A vertical motion assembly including a fan in fluid communication with the interior region configured to generate negative pressure inside the enclosure; And A horizontal movement assembly having a horizontal guide member and a horizontal actuator configured to position the first robot in a direction generally parallel to the first side of the first treatment rack; An apparatus for moving a substrate in a cluster tool. The method of claim 34, wherein The horizontal motion assembly, A second enclosure, the second enclosure having one or more walls surrounding the horizontal guide member and defining an interior region within the second enclosure; And And further comprising a fan configured to generate negative pressure inside the second enclosure and in fluid communication with the interior region. An apparatus for moving a substrate in a cluster tool. The method of claim 34, wherein The vertical motion assembly, A slot formed in one of the one or more walls of the enclosure; A support plate extending through the slot and coupled to the vertical slide and the first robot; And Further comprising a fan configured to create a pressure drop between the inner region and the enclosure outer point, which is about 0.02 to about 1 inch of water, An apparatus for moving a substrate in a cluster tool. The method of claim 34, wherein Further comprising an ambient control assembly having a fan facing the substrate located on the first robot and adapted to push air through the filter; An apparatus for moving a substrate in a cluster tool. An apparatus for moving a substrate in a cluster tool, A first robotic assembly configured to position a substrate in a first direction, A robot blade having a substrate receiving surface and a first end; A first linkage member having a first pivot point and a second pivot point; A first gear coupled to the first end of the robot blade and rotatably coupled to the first linkage member at the first pivot point; A second gear rotatably coupled to the first gear and aligned with a second pivot point of the first linkage; And A first robot assembly comprising a first motor rotatably coupled to the first linkage member; The first motor is adapted to position the substrate receiving surface by rotating the first linkage and the first gear relative to the second gear. A first movement assembly configured to position the first robot in a second direction generally perpendicular to the first direction; And A second movement assembly adapted to position the first robot in a third direction generally perpendicular to the second direction, An apparatus for moving a substrate in a cluster tool. The method of claim 38, The gear ratio of the second gear to the first gear is about 3: 1 to about 4: 3, An apparatus for moving a substrate in a cluster tool. The method of claim 38, The second gear is coupled to a second motor, A controller in communication with the first motor and the second motor is adapted to adjust the rotational speed of the first linkage relative to the second gear during the movement process; An apparatus for moving a substrate in a cluster tool. An apparatus for moving a substrate in a cluster tool, A first robotic assembly configured to position a substrate at one or more points along an arc generally included in a first plane, A robot assembly having a first end and a substrate receiving surface; And A first robot assembly comprising a motor rotatably coupled to a first end of the robot blade; A first movement assembly configured to position the first robot in a second direction generally perpendicular to the first plane, An actuator assembly configured to position the first robot vertically, the actuator actuating the first robot when the first robot is moved by the vertical actuator and the vertical actuator configured to position the first robot vertically An actuator assembly comprising a vertical slide; An enclosure having one or more walls defining an interior region surrounding at least one of the components selected from the group consisting of the vertical actuator and the vertical slide; And A first movement assembly configured to create a negative pressure inside the enclosure and including a fan in fluid communication with the interior region; And A second movement assembly having a second actuator configured to position the first robot in a third direction generally perpendicular to the second direction, An apparatus for moving a substrate in a cluster tool. 42. The method of claim 41 wherein The second movement assembly, A second enclosure, the second enclosure having one or more walls defining an interior region within the second enclosure and surrounding the second actuator; And And further comprising a fan configured to generate negative pressure inside the second enclosure and in fluid communication with the interior region. An apparatus for moving a substrate in a cluster tool. An apparatus for moving a substrate in a cluster tool, A first robotic assembly configured to position a substrate in a first direction, A robot blade having a first end and a substrate receiving surface; A first gear coupled to the first end of the robot blade; A second gear rotatably coupled to the first gear; A first motor rotatably coupled to the first gear; And A first robot assembly comprising a second motor rotatably coupled to the second gear; The second motor is adapted to rotate the second gear relative to the first gear to make a variable gear ratio; and A first movement assembly adapted to position the first robot in a second direction generally perpendicular to the first direction, An apparatus for moving a substrate in a cluster tool. The method of claim 43, Further comprising a second movement assembly adapted to position the first robot in a third direction, generally perpendicular to the second direction, An apparatus for moving a substrate in a cluster tool. The method of claim 43, Wherein the second direction is generally perpendicular to the first direction, An apparatus for moving a substrate in a cluster tool. An apparatus for moving a substrate, A base having a substrate support surface; A reaction member located on the base; A contact member coupled to an actuator configured to urge the substrate against the reaction member; And A brake member configured to generally inhibit movement of the contact member when the contact member is positioned to press the substrate against the reaction member, Apparatus for moving the substrate. The method of claim 46, A restraining force is created by the contact between the brake member and the contact member, Apparatus for moving the substrate. The method of claim 46, Further comprising a sensor coupled to the contact member and configured to sense the position of the contact member, Apparatus for moving the substrate. The method of claim 46, And a controller in communication with the sensor and the actuator to detect misplacement of the substrate on the support surface, Apparatus for moving the substrate. An apparatus for moving a substrate, A base having a support surface; A reaction member located at the base; An actuator coupled to the base; A contact member coupled to the actuator supported at the edge by the reaction member and configured to press the contact member against an edge of the substrate located on the support surface; And Brake member assembly, Brake member; And And a brake member assembly, the brake actuating member configured to press the brake member against the contact member such that the brake actuating creates a limiting force that generally prohibits movement of the contact member during the substrate movement process. doing, Apparatus for moving the substrate. 51. The method of claim 50, Wherein the limiting force is created by the contact between the brake member and the contact member, Apparatus for moving the substrate. 51. The method of claim 50, The limiting force is a frictional force generated between the brake member and the surface of the contact member, Apparatus for moving the substrate. 51. The method of claim 50, Further comprising a sensor coupled to the contact member and configured to sense the position of the contact member, Apparatus for moving the substrate. The method of claim 53 wherein Further comprising a controller in communication with the sensor and the actuator to detect misplacement of the substrate on the support surface, Apparatus for moving the substrate. An apparatus for moving a substrate, A base having a support surface; A reaction member located on the base; As a contact member assembly, Actuators; And A contact member assembly comprising a contact member having a substrate contact surface and a compliant member positioned between the substrate contact surface and the actuator; The actuator is adapted to press the contact surface against a substrate positioned against the surface of the reaction member. Brake member assembly, Brake member; And A brake member assembly including a brake actuating member configured to press the brake member against the contact member to inhibit movement of the contact member during a substrate movement process; And A sensor made to sense the position of the contact surface and coupled to the contact member, Apparatus for moving the substrate. The method of claim 55, The compliant member is a spring, Apparatus for moving the substrate. The method of claim 55, The brake member assembly further comprises a lever arm having a first end coupled to the brake actuating member and a second end coupled to the brake member, The lever arm is coupled to a pivot point and configured to interfere with the movement of the contact member and generate a breaking force greater than the force generated by the brake actuating member, Apparatus for moving the substrate. An apparatus for moving a substrate, As a robotic assembly, A first robot configured to move a substrate located on the robot blade in a first direction; A first movement assembly having an actuator configured to position the first robot in a second direction; And A robot assembly comprising a second movement assembly coupled to the first movement assembly with a second actuator configured to position the first movement assembly and the first robot in a third direction generally perpendicular to the second direction; And A substrate gripping device coupled to the robot blade and adapted to support a substrate, the substrate gripping device comprising: A reaction member located on the robot blade; An actuator coupled to the robot blade; A contact member coupled to the actuator; The actuator is configured to limit the substrate by pressing the contact member against an edge of the substrate located between the contact member and the reaction member; and A brake member assembly comprising a brake member assembly, the brake member assembly comprising a brake member and a brake actuating member configured to press the brake member against the contact member to inhibit movement of the contact member during a substrate movement process. Including a ping mechanism, Apparatus for moving the substrate. The method of claim 58, The substrate gripping mechanism further comprising a sensor adapted to sense the position of the contact member and coupled to the contact member, Apparatus for moving the substrate. The method of claim 58, The substrate gripping mechanism further comprises a controller in communication with the sensor and the actuator to detect misplacement of the substrate on the support surface; Apparatus for moving the substrate. The method of claim 58, The substrate gripping mechanism further comprising a compliant member adapted to store energy when the contact member is pressed against the substrate surface by the actuator and positioned between the contact member and the actuator, Apparatus for moving the substrate. As a method of moving the substrate, Positioning a substrate on the substrate support mechanism between the reaction member located on the substrate support mechanism and the substrate contact member; Pressing a substrate against the reaction member and generating a substrate bearing force using an actuator for pressing the substrate contact member against the substrate; And Generating a limiting force configured to limit the movement of the substrate contact member during the process of moving the substrate using the brake assembly, How to Move a Substrate. 63. The method of claim 62, After the bearing force is applied to the substrate, the limiting force is generated, How to move the substrate. 63. The method of claim 62, Detecting the movement of the substrate contact member by use of a controller, How to Move a Substrate. 63. The method of claim 62, Positioning the substrate support mechanism in a starting position; Moving the substrate support mechanism from the start position to a final position; And Further comprising positioning a substrate on the substrate support mechanism, generating the substrate support force, and generating the limiting force; How to move the substrate. 63. The method of claim 62, A first arrangement of processing chambers located along the first direction using a first robotic assembly configured to position the substrate at a desired position in a first direction and in a desired position in a second direction generally perpendicular to the first direction And moving the substrate located on the substrate support mechanism with the How to move the substrate. As a method of moving the substrate, Positioning a substrate on the substrate support mechanism between a reaction member located on the substrate support mechanism and the substrate contact member; Coupling the actuator with the connection member to the substrate contact member such that a connection member couples an actuator to the substrate contact member; Applying a bearing force to the substrate using an actuator that presses the substrate against the reaction member and the substrate contact member against the substrate; Storing energy in a compliant member positioned between the substrate contact member and the connection member; Limiting movement of the connecting member after the supporting force is applied to minimize the amount of change in the supporting force during the movement of the substrate; And Sensing movement of the substrate by sensing movement of the substrate contact member by reduction of energy stored in the compliant member; How to move the substrate. The method of claim 67 wherein Further comprising: stopping the movement of the substrate support mechanism when the sensed movement of the substrate contact member exceeds a user defined value, How to move the substrate. The method of claim 67 wherein Using a first robotic assembly configured to position a substrate positioned on the substrate support mechanism at a desired position in a first direction and at a desired position in a second direction generally perpendicular to the first direction, Further comprising moving to a first array of processing chambers located along the first direction, How to move the substrate. The method of claim 69, The second direction is generally aligned in a vertical direction, How to Move a Substrate. As a method of moving the substrate, Receiving a substrate located in a first processing chamber on a robot substrate support, the method comprising: Positioning a substrate on the robot substrate support between a reaction member located on the robot substrate support and a substrate contact member; Generating a substrate bearing force by using an actuator that presses the substrate against the reaction member and the substrate contact member against the substrate; And Receiving a substrate, the method comprising positioning a brake assembly to create a limiting force that limits movement of the substrate contact member in the course of moving the substrate; And The first direction from a position in the first processing chamber, using a first robotic assembly configured to position the substrate at a desired position in a first direction and at a desired position in a second direction generally perpendicular to the first direction. Moving the robotic substrate support and the substrate to a location in a second processing chamber spaced apart from the first processing chamber along; How to move the substrate. The method of claim 71 wherein The limiting force is generated after the bearing force is applied to the substrate, How to move the substrate. The method of claim 71 wherein Further comprising sensing a movement of the substrate contact member using a controller, How to move the substrate. The method of claim 71 wherein Wherein the second direction is generally aligned with the vertical direction, How to Move a Substrate. As a method of moving a substrate in a cluster tool, To a first arrangement of processing chambers located along the first direction using a first robotic assembly configured to position the substrate at a desired position in a first direction and at a desired position in a second direction generally perpendicular to the first direction. Moving the substrate; Moving the substrate to a second array of processing chambers located along the first direction using a second robotic assembly configured to position the substrate at a desired position in the first direction and at a desired position in the second direction ; And A substrate in the first and second arrays of processing chambers located along the first direction using a third robotic assembly configured to position the substrate at a desired position in the first direction and at a desired position in the second direction. Including moving the A method of moving a substrate in a cluster tool. 76. The method of claim 75 wherein The third robot assembly is substantially adjacent to the first and second robot assemblies, A method of moving a substrate in a cluster tool. 77. The method of claim 76, Wherein the third robot assembly is located between the first and second robot assemblies, A method of moving a substrate in a cluster tool. 76. The method of claim 75 wherein Wherein the spacing of the first robot assembly relative to the third robot assembly and the spacing of the second robot assembly relative to the third robot assembly are about 5% to about 50% greater than the dimensions of the processing surface of the substrate, A method of moving a substrate in a cluster tool. 76. The method of claim 75 wherein The distance between the center line of the first robot assembly with respect to the center line of the third robot assembly and the center line of the second robot assembly with respect to the center line of the third robot assembly is about 315 mm to about 450 mm, The distance between the center lines is measured in a direction substantially perpendicular to the first direction, A method of moving a substrate in a cluster tool. 76. The method of claim 75 wherein The distance between the center line of the substrate located on the first robot assembly or the second robot assembly relative to the center line of the substrate located on the third robot assembly during the process of moving the substrate in the first direction is the processing of the substrate. About 5% to about 50% larger than the dimensions of the cotton, A method of moving a substrate in a cluster tool. 76. The method of claim 75 wherein The substrate in a first and second arrangement of the processing chambers located along the first direction using a fourth robotic assembly configured to position the substrate at a desired position in the first direction and at a desired position in the second direction. Further comprising the step of moving, A method of moving a substrate in a cluster tool. 76. The method of claim 75 wherein Generating a pressure below atmospheric pressure in an enclosure formed around the first actuator assembly included in the first robot assembly, the second robot assembly, and the third robot assembly, The first actuator assembly configured to position the substrate in the second direction, A method of moving a substrate in a cluster tool. As a method of moving a substrate in a cluster tool, The first from a first passthru chamber, using a first robot assembly configured to position the substrate at a desired position in a first direction and at a desired position in a second direction generally perpendicular to the first direction. Moving the substrate to a first array of processing chambers located along a direction; Moving the substrate from the first communication chamber to the first array of processing chambers using a second robotic assembly configured to position the substrate at a desired position in the first direction and at a desired position in the second direction. ; And Using a front end robot located in a front end assembly to move the substrate from the substrate cassette to the first communication chamber, The front end assembly is substantially adjacent to a moving region comprising the first array of processing chambers, the first robot assembly and the second robot assembly, A method of moving a substrate in a cluster tool. 84. The method of claim 83 wherein Moving the substrate from the second communication chamber to the first array of processing chambers using the first or second robotic assembly, Wherein the second communication chamber is located spaced apart in the first direction from one or more processing chambers of the first array of processing chambers, A method of moving a substrate in a cluster tool. 84. The method of claim 83 wherein Further comprising a front end assembly having a front end robot adapted to move the substrate from the substrate cassette to the first communication chamber, A method of moving a substrate in a cluster tool. 84. The method of claim 83 wherein Wherein the front end robot, the first robot assembly and the second robot assembly are configured to move the substrate to and from the second communication chamber, A method of moving a substrate in a cluster tool. 84. The method of claim 83 wherein Generating a pressure below atmospheric pressure in an enclosure formed around the first actuator assembly included in the first robot assembly and the second robot assembly, The first actuator assembly configured to position the substrate in the second direction, A method of moving a substrate in a cluster tool.

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