JP2000012656A - Handling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent collision when clamping a wafer. SOLUTION: This handling device moves a movable clamper for wafer clamping back by a cylinder device 40, which is equipped with a 1st cylinder chamber 42 supplied with negative pressure, a 1st piston 51 fitted in the 1st cylinder chamber and having the movable clamper associated, a 2nd cylinder chamber 54 formed on the 1st piston, and a 2nd piston 56 fitted in the 2nd cylinder chamber 54. The 1st piston 51 has a 1st leak hole 55 for linking the 2nd cylinder chamber 54 with a positive pressure chamber 50, the 2nd piston 56 has a 2nd leak hole 61 for linking the 2nd cylinder chamber 54 with the 1st cylinder chamber 42, and the 1st cylinder chamber 42 has a projecting stopper 43 restricting the movement of the 2nd piston 56. Negative pressure leaks through the 2nd leak hole 61, 2nd cylinder chamber 54, and 1st leak hole 55 to decrease in negative pressure value and the 1st piston 5 is reduced to a constant speed, so that collision sound, breakage, etc., can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a handling technique, and more particularly to a cylinder apparatus for driving clamping and release thereof, for example, an effective technique used for handling a semiconductor wafer in a semiconductor manufacturing process.

[0002]

2. Description of the Related Art Generally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter, referred to as a wafer) as a work is often handled by a handling apparatus in a clean room.

As a conventional wafer handling apparatus, there is a conventional wafer handling apparatus in which a main surface (hereinafter, referred to as a back surface) opposite to a side on which semiconductor elements are formed is vacuum-adsorbed and held, or a back surface of the wafer. There is a type that supports the surface and grips (clamps) the side surface of the wafer with a cylinder device.

Japanese Patent Application Laid-Open No. 9-69476 discloses an example of a wafer handling technique.

[0005]

However, in a handling apparatus that holds the back side of a wafer by vacuum suction, there is a problem that foreign matter easily adheres to the back side of the wafer.

In a handling device that supports the back surface of a wafer and clamps the side surface of the wafer by a cylinder device, the clamper collides with the side surface of the wafer when the side surface of the wafer is clamped by the cylinder device. However, there is a problem that a collision sound and breakage occur.

An object of the present invention is to provide a handling device which can be held without relying on vacuum suction and can prevent occurrence of collision.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0009]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

[0010] That is, a handling device is provided which comprises a movable clamper for pressing an object to be clamped against a fixed clamper to clamp the movable clamper, and the movable clamper is advanced and retracted by a cylinder device. A first cylinder chamber to which a negative pressure is supplied, a first piston slidably fitted to the first cylinder chamber and interlocking with the movable clamper, and a second cylinder chamber formed in the first piston. A second piston slidably fitted in the second cylinder chamber in the same direction, and the first piston is provided with a first leak hole for communicating the second cylinder chamber with the outside. The second piston has a second leak hole communicating the second cylinder chamber and the first cylinder chamber, and the second cylinder chamber has the second piston hole. A stopper for restricting the retreat of tons is characterized in that are projected.

In the above means, when a negative pressure is supplied to the first cylinder chamber, the first piston moves in the first cylinder chamber with the second piston accompanying. With the movement of the first piston, the movable clamper interlocked with the first piston presses the object to be clamped against the fixed clamper to perform clamping. At this time, the negative pressure in the first cylinder chamber rises rapidly in the beginning, but the negative pressure is attenuated because the negative pressure leaks through the second leak hole, the second cylinder chamber and the first leak hole. And is controlled to a constant value. This allows
Since the first piston is decelerated to a constant speed, the movable clamper gently comes into contact with the object to be clamped, and enters a state of clamping the object to be clamped with a constant pressing force. That is, it is possible to prevent collision noise, breakage, and the like from occurring when the movable clamper performs clamping.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a cylinder device of a handling device according to an embodiment of the present invention.
(A) is a side view, (b) is a front sectional view along line bb of (a), and (c) is a sectional view taken along line cc of (b). FIG. 2 is a front sectional view for explaining the operation. 3A and 3B are pressure-position relationship diagrams, wherein FIG. 3A shows the present embodiment and FIG. 3B shows a comparative example. FIG.
1A and 1B show the entire handling device, wherein FIG. 1A is a plan view and FIG. 1B is a front view. FIG. 5 is a partially omitted front sectional view for explaining the operation. FIG. 6 is a partially omitted perspective view showing a wafer transfer device provided with a handling device according to an embodiment of the present invention. FIG. 7 is a plan view of the same.

In the present embodiment, the handling device according to the present invention is provided in a wafer transfer device for transferring a wafer. The wafer 1 which is a work of the wafer transfer device 11 and is an example of a plate-like object is formed in a circular thin plate shape from a semiconductor such as silicon, and a notch 2 is cut in a V-shape in a part of the circumference. Have been. A plurality of wafers 1 (for example, 25 wafers for one lot) are stored in the cassette 3. That is, the cassette 3 is provided with a plurality of rows (generally, 25 rows) of holding grooves (hereinafter, referred to as slots) 4, and a plurality of wafers 1 are inserted into the slots 4, respectively. 1 are stored in a regularly aligned state.

The wafer transfer apparatus 11 includes a machine (not shown) formed in a substantially box shape, on which a loading station 12 and an unloading station 13 are provided. It is equipped as shown. Loading station 12 and unloading station 13 are elevators 14 and 1 controlled by a controller (not shown).
5 are provided. The elevators 14 and 15 are configured to raise or lower the cassette 3 mounted thereon one pitch at a time.

The wafer transfer device 11 includes an XY table 16
The rotary actuator 17 is mounted on the XY table 16 vertically upward.
A rotary shaft 18 is provided on the output shaft of the rotary actuator 17.
Are fixed vertically upward, and the turning shaft 18 is turned over 360 degrees in a horizontal plane. One end of a horizontally arranged first arm 19 is fixed to the upper end of the turning shaft 18 so as to rotate integrally.
One end of a second arm 20 disposed in parallel with the free end of the first arm 19 is rotatably supported by a shaft. The second arm 20 is driven to rotate by a built-in belt transmission 21. It has become. At the other end of the second arm 20, a handling device 30 is disposed horizontally and is rotatably supported by a shaft.
0 is driven to rotate by a belt transmission device 22 built in.

As shown in FIG. 5, the handling device 30 includes a mounting block 31, and the mounting block 31 is mounted on one end of the second arm 20. A bracket 32 formed in a flat plate shape having a substantially rectangular shape in plan view is fixed to the mounting block 31 horizontally.
A receiving plate 33 formed in a fan-like plate shape with a small opening angle is fixed to the bracket 32 horizontally. Receiving plate 33
Are set larger than the diameter of the wafer 1.

On the upper surface of the receiving plate 33, four support projections 34 are provided.
Are symmetrically arranged and protruded. Wafer 1
In order to reduce the area of contact with the wafer as much as possible and to prevent the attachment of foreign matter and metal contamination, the upper surfaces, which are the receiving surfaces of the two support projections 34, 34, are floated from the upper surface of the receiving plate 33. Are formed on an inclined surface so that the wafer 1 can be received and supported with a minimum area. A pair of fixed clampers 35, 35 are disposed symmetrically in the front-rear direction at the end of the upper surface of the receiving plate 33 on the side of the bracket 32.
Reference numerals 5 and 35 are respectively formed so as to be able to contact the outer peripheral surface of the wafer 1 locally.

A guide groove 36 is slenderly dug on the center line of the front-rear symmetrical shape on the lower surface of the receiving plate 33, and a pull plate 37 is slidably accommodated in the guide groove 36 in the longitudinal direction. A movable clamper 38 is fixed to the upper surface of the tip of the pulling plate 37. The movable clamper 38 is formed so as to be able to contact the outer peripheral surface of the wafer 1 locally, and clamps the wafer 1 in cooperation with the two fixed clampers 35. The base end of the pull plate 37 is a cylinder device 40 mounted on the mounting block 31.
Attached to.

As shown in FIGS. 1 and 2, the cylinder device 40 includes a cylinder 41 having a first cylinder chamber 42 opened. It is installed on the mounting block 31 so as to be located on the line. The first cylinder chamber 42 is formed in a shape of a circular through hole having a circular cross section.
The end face on the side is open, and the end face on the opposite side is closed by a stopper 43. A seal ring 44 is sandwiched between the outer periphery of the stopper 43 and the inner periphery of the first cylinder chamber 42 so as to seal between the mating surfaces. I have.

A negative pressure supply port 46 is opened in the cylinder 41 so as to communicate with the first cylinder chamber 42, and a negative pressure supply path 47 is connected to the negative pressure supply port 46. A vacuum pump (not shown) is connected to the negative pressure supply path 47 via a nipple 48. The vacuum pump is set to supply a negative pressure of about 60 kPa.

A first piston 51 is slidably fitted at a position closer to the opening side of the negative pressure supply port 46 of the first cylinder chamber 42. The first cylinder chamber 42 partitioned by the first piston 51 includes a negative pressure chamber 49 communicating with the negative pressure supply port 46 and a positive pressure chamber 50 communicating with the outside. A base end of the pulling plate 37 is connected to an end of the first piston 51 on the positive pressure chamber 50 side by a bolt 52. A first spring 53 is inserted into the negative pressure chamber 49 so as to constantly urge the first piston 51 toward the positive pressure chamber 50.

A second cylinder chamber 54 is submerged on the end face of the first piston 51 on the side of the negative pressure chamber 49, and a first leak hole 55 is formed on a wall of the second cylinder chamber 54 on the side of the positive pressure chamber 50. The second cylinder chamber 54 and the positive pressure chamber 50 communicate with each other. A second piston 56 is slidably fitted in the second cylinder chamber 54 in the same direction as the first piston 51.

A bolt 5 is located on the center line of the first piston 51.
A spring receiving rod 58 fixed by 7 is laid, and a second piston 56 is slidably fitted to the spring receiving rod 58. A nut 59 as a spring seat is screwed into an end of the spring receiving rod 58 on the negative pressure chamber 49 side, and a second spring 60 is provided between the nut 59 around the spring receiving rod 58 and the second piston 56. Are inserted so as to constantly urge the second piston 56 in the direction of the positive pressure chamber 50.

The second piston 56 has a second leak hole 61 formed so as to connect the negative pressure chamber 49 with the bottom chamber of the second cylinder chamber 54. The second leak hole 61 is arranged so as to be shifted in the circumferential direction with respect to the first leak hole 55. In the second cylinder chamber 54, a pair of detent pins 62 fixed to the first piston 51 are laid symmetrically.
The two detent pins 62 are slidably fitted into a pair of detent holes 63 formed in the second piston 56, respectively. This detent pin 62 and detent hole 6
3, the second piston 56 becomes the first piston 5
As a result, the circumferential displacement between the first leak hole 55 and the second leak hole 61 is always ensured.

An anti-adhesion projection 64 is provided on the surface of the second piston 56 opposite to the second cylinder chamber 54 so as to project from the second piston 56 and the second cylinder chamber 54. When the surfaces of the second piston 56 and the second cylinder chamber 54 oppose each other when the surfaces are in close contact with each other, the first leakage hole 55 and the second leakage hole 6 are prevented.
It is configured to cut off communication with the device 1.

Next, the operation of the wafer delivery apparatus according to the above configuration will be described.

As shown in FIGS. 6 and 7, an actual cassette 3A containing a plurality of wafers 1 is set on the elevator 14 of the loading station 12, and the elevator of the unloading station 13 is set in advance. An empty cassette 3 is set on 15.

The first arm 19 and the second arm 20 of the wafer transfer device 11 are extended by the rotary actuator 17 and the belt transmission devices 21 and 22 to move the receiving plate 33 of the handling device 30 to the actual cassette 3.
Inserted into A. At this time, loading station 1
When the elevators 2 are pitch-operated, the wafer 1 specified by the controller is opposed directly above the receiving plate 33. In this state, when the wafer 1 is lowered, FIG.
As shown in (a), the wafer 1 is horizontally supported by the slope groups of the four support projections 34 of the receiving plate 33.

Subsequently, the negative pressure chamber 4 of the handling device 30
Negative pressure is supplied to 9. When the negative pressure is supplied to the negative pressure chamber 49, the positive pressure chamber 50 of the first cylinder chamber 42 is maintained at the atmospheric pressure.
Move as shown in (a). At this time, since the second cylinder chamber 54 is maintained at the atmospheric pressure by the first leak hole 55, the second piston 56
Is attached to the first piston 51 while maintaining a state of being separated from the bottom of the first piston 51.

As the first piston 51 is moved, the pulling plate 37 fixed to the first piston 51 is pulled, and as shown in FIG.
8 is pressed against a part of the outer peripheral surface of the wafer 1, and the opposite side of the outer peripheral surface of the wafer 1 is pressed against the pair of fixed clampers 35, 35.
Is clamped between the movable clamper 38 and the fixed clampers 35, 35. In other words, the wafer 1 is clamped by the movable clamper 38 and the fixed clampers 35 and 35 in a state where the wafer 1 is supported from below by the group of support protrusions 34, so that the handling device 30
The state is held by.

Here, the negative pressure in the negative pressure chamber 49 rapidly rises in the initial stage as shown in FIG. However, since the first leak hole 55 and the second leak hole 61 are opened, when reaching a preset negative pressure value (45 kPa in the present embodiment), it is shown in FIG. Thus, a state is maintained in which a constant negative pressure value is maintained. That is, the negative pressure supplied to the negative pressure chamber 49 leaks into the positive pressure chamber 50 via the second leak hole 61, the second cylinder chamber 54, and the first leak hole 55. A state is maintained in which the negative pressure value set by the dependent flow rate value is maintained.

When the negative pressure value in the negative pressure chamber 49 is attenuated to a preset negative pressure value and controlled to a constant value in this manner, the first piston 51 is decelerated to a constant moving speed. The movable clamper 38 gently contacts the outer peripheral surface of the wafer 1 and presses the wafer 1 against the fixed clampers 35 with a constant pressing force. Therefore, when the movable clamper 38 clamps the wafer 1,
Does not collide with the outer peripheral surface. That is, when the movable clamper 38 clamps the wafer 1, it is possible to prevent the sound of collision with the wafer 1 and the occurrence of breakage.

By the way, when the first leak hole 55 and the second leak hole 61 are not opened and the leak passage is not secured, the negative pressure in the negative pressure chamber 49 is shown in FIG. Thus, the supplied negative pressure value (60 kPa in the illustrated example)
Until it rises at once. When the first piston 51 is moved in such a state of the high negative pressure value, the movable clamper 38 collides with the outer peripheral surface of the wafer 1 at a high speed, and holds the wafer 1 with the pressing force by the high negative pressure value. The fixed clampers 35, 35 are pressed. Therefore, when the movable clamper 38 clamps the wafer 1, there is a danger that a collision sound with the wafer 1 or damage may be caused. That is, according to the present embodiment, such a danger can be avoided beforehand.

In the present embodiment, if a situation occurs in which the wafer 1 is not clamped by the movable clamper 38, the negative pressure value of the negative pressure chamber 49 becomes as shown in FIG. The supplied negative pressure value (60 in the illustrated example)
kPa). Therefore, according to the present embodiment, by measuring the rising negative pressure value of the negative pressure chamber 49 by the pressure gauge, it is possible to detect that the movable clamper 38 has not clamped the wafer 1. . Then, when a situation where no clamping is performed is detected, the clamping operation and the wafer supporting operation are performed again. Therefore, it is possible to prevent a situation in which the handling device 30 is transferred in a state where the wafer is not clamped.

Here, if a situation occurs in which the movable clamper 38 is not clamping the wafer 1, the negative pressure chamber 4
The operation in which the negative pressure value of 9 rises at a stretch as shown in FIG.

If the movable clamper 38 is not clamped by the movable clamper 38, the position of the movable clamper 38 is not regulated by the wafer 1.
2A, the second piston 56 moves from the predetermined position, and the position of the second piston 56 is regulated by the stopper 43 as shown in FIG. 2B. When the position of the second piston 56 is restricted by the stopper 43, the first piston 51 further moves so as to eliminate the gap between the bottom surface of the second cylinder chamber 54 and the end surface of the second piston 56. The movement of the first piston 51 causes the suction prevention protrusion 64 projecting from the end face of the second piston 56 to come into contact with the second cylinder chamber 54 as shown in FIG. 2C. Thus, the communication between the first leak hole 55 and the second leak hole 61 is cut off. Since the interruption stops the negative pressure in the negative pressure chamber 49, the negative pressure value in the negative pressure chamber 49 rises at a stretch.

Incidentally, since the second piston 56 is in close contact with the bottom surface of the second cylinder chamber 54 at the suction preventing projection 64, the second piston 56 does not adhere to the bottom surface of the second cylinder chamber 54 by vacuum. That is, in a state where the second piston 56 is in close contact with the bottom surface of the second cylinder chamber 54, a gap is formed between the contact surfaces of the second piston 56 and the second cylinder chamber 54 by the suction prevention convex portion 64. Is communicated to the atmosphere by the first leak hole 55, so that the situation where the second piston 56 is vacuum-sucked to the bottom surface of the second cylinder chamber 54 is prevented.

When the wafer 1 is held by the handling device 30 as described above, the first arm 19 and the second arm 20 of the wafer transfer device 11 are rotated by the rotary actuator 17 and the belt transmission device 21.
22, the wafer 1 is moved to the actual cassette 3
Pulled out of A. Thereafter, the wafer 1 is placed in the empty cassette 3
And transferred to a predetermined slot 4.

When the wafer 1 is transferred to the slot 4 of the empty cassette 3, the supply of the negative pressure to the negative pressure chamber 49 is stopped and the positive pressure is supplied. When a positive pressure is supplied to the negative pressure chamber 49, the first piston 51 and the second piston 56
Is returned to the positive pressure chamber 50 by the first spring 53 and the second spring 60, so that the movable clamper 38 of the pulling plate 37 fixed to the first piston 51 is separated from the outer peripheral surface of the wafer 1 and returns to the original position. Return. Thereby, the clamping of the wafer 1 by the movable clamper 38 is released. When the receiving plate 33 is lowered in a state where the clamping is released, the wafer 1 supported by the four supporting protrusions 34 is transferred to the slot 4 of the empty cassette 3.

According to the above embodiment, the following effects can be obtained. (1) Since the first leak hole and the second leak hole are formed in the first piston and the second piston, the negative pressure value in the negative pressure chamber can be attenuated in a self-control manner when clamping the wafer. The moving speed of the movable clamper at the time of clamping can be reduced.

(2) By reducing the moving speed of the movable clamper at the time of clamping, collision of the movable clamper with the wafer can be prevented, and the pressing force against the wafer can be appropriately controlled. In addition, it is possible to prevent the collision sound and breakage with the wafer from occurring when the movable clamper clamps the wafer.

(3) By measuring the rising negative pressure value of the negative pressure chamber with a pressure gauge, it is possible to detect that the movable clamper has not clamped the wafer. In this case, the transfer of the wafer can be prevented beforehand, and the falling off of the wafer during transfer and the occurrence of displacement can be prevented.

(4) The second piston 56 is provided with a projection for preventing suction on the surface facing the bottom surface of the second cylinder chamber, thereby preventing the second piston from being vacuum-sucked on the bottom surface of the second cylinder chamber. Therefore, the next operation can be secured.

(5) By using a negative pressure as a driving source, scattering of foreign matter can be prevented. For example,
The suction prevention protrusion is not limited to being provided on the second piston side, and may be provided on the second cylinder chamber side or may be omitted.

The invention made by the inventor has been specifically described based on the embodiment. However, the invention is not limited to the embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say.

The detent between the first piston and the second piston is not limited to the engagement between the detent pin and the detent hole, but also means for forming the second piston and the first cylinder chamber into a rectangular shape. It may be used or may be omitted.

The wafer handling apparatus is not limited to the wafer transfer apparatus, but may be used for a wafer chuck or the like.

In the above description, the case where the invention made by the present inventor is mainly applied to the wafer handling technique which is the field of application as the background has been described. However, the present invention is not limited to this, and the invention is not limited thereto. The present invention can be applied to a device for handling a plate-like object such as a data storage medium such as a compact disk.

[0049]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

By providing the first leak hole and the second leak hole in the first piston and the second piston, the negative pressure value in the negative pressure chamber can be attenuated in a self-controlled manner when clamping the object to be handled. Therefore, the moving speed of the movable clamper at the time of clamping can be reduced. By reducing the moving speed of the movable clamper during clamping, it is possible to prevent the movable clamper from colliding with the object to be clamped, and to appropriately control the pressing force against the object to be clamped. In addition, when the movable clamper clamps the object to be clamped, it is possible to prevent the collision sound with the object to be clamped and the occurrence of breakage.

[Brief description of the drawings]

1A and 1B show a cylinder device of a handling device according to an embodiment of the present invention, wherein FIG. 1A is a side view, and FIG.
(A) is a front sectional view along the line bb of (a), (c) is (b)
FIG. 5 is a sectional view taken along the line cc of FIG.

FIG. 2 is a front sectional view for explaining the operation.

3A and 3B are pressure-position relationship diagrams, wherein FIG. 3A shows the present embodiment, and FIG. 3B shows a comparative example.

FIG. 4 shows the entire handling device, and (a)
Is a plan view, and (b) is a front view.

FIG. 5 is a partially sectional front view for explaining the operation.

FIG. 6 is a partially omitted perspective view showing a wafer transfer device provided with a handling device according to an embodiment of the present invention.

FIG. 7 is a plan view of the same.

[Explanation of symbols]

1. Wafer (article), 2. Notch, 3. Cassette, 3A
... actual cassette, 4 ... slot, 11 ... wafer transfer device, 12 ... loading station, 13 ... unloading station, 14, 15 ... elevator, 16
... XY table, 17 ... rotary actuator, 1
8: rotating shaft, 19: first arm, 20: second arm, 2
1, 22 ... belt transmission device, 30 ... handling device,
31 mounting block, 32 bracket, 33 receiving plate, 34 supporting protrusion, 35 fixed clamper, 36 guide groove, 37 pulling plate, 38 movable clamper, 40 cylinder device, 41 cylinder, 42 ... First cylinder chamber, 4
3 ... Stopper, 44 ... Seal ring, 45 ... Escape hole, 4
6 ... negative pressure supply port, 47 ... negative pressure supply path, 48 ... nipple,
49: negative pressure chamber, 50: positive pressure chamber, 51: first piston, 5
2 bolt, 53 first spring, 54 second cylinder chamber, 55 first leak hole, 56 second piston, 57
Bolt, 58 ... Paul, 59 ... Nut (spring seat), 60 ... Second spring, 61 ... Second leak hole, 62
... detent pins, 63 ... detent holes, 64 ... projections for preventing suction.

Continued on the front page (72) Inventor Hajime Noda 3-3-2 Fujibashi, Ome-shi, Tokyo F-term within Hitachi Tokyo Electronics Co., Ltd. (reference) 3F061 AA01 BA02 BB09 BD01 BF00 BF11 DD00 5F031 BB01 CC12 CC20 EE12 HH07 MM01

Claims (10)

[Claims] 1. A handling device comprising a movable clamper for clamping an object to be clamped against a fixed clamper, wherein the movable clamper is advanced and retracted by a cylinder device. A first cylinder chamber to which a negative pressure is supplied, a first piston slidably fitted to the first cylinder chamber and interlocking with the movable clamper, and a second cylinder chamber formed in the first piston. A second piston slidably fitted in the second cylinder chamber in the same direction, and the first piston is provided with a first leak hole for communicating the second cylinder chamber with the outside. The second piston is provided with a second leak hole communicating the second cylinder chamber and the first cylinder chamber, and the first cylinder chamber is provided with the second piston. Handling apparatus characterized by stopper for restricting the movement is projected. 2. An attraction prevention projection is provided on at least one of opposing surfaces of the second piston and the second cylinder chamber, and the attraction prevention projection is formed by the second piston and the second cylinder chamber. 2. The handling device according to claim 1, wherein the communication between the first leak hole and the second leak hole is interrupted when the opposite surface is in close contact. 3. The handling device according to claim 1, wherein the second piston is prevented from rotating with respect to the first piston. 4. A first spring, wherein a first spring for constantly biasing the first piston in a direction in which the movable clamper releases the clamping is inserted into the first cylinder chamber. 4. The handling device according to 2 or 3. 5. A spring receiving rod having one end fixed to the first piston penetrates the second piston, and a spring seat is attached to the other end of the spring receiving rod. 5. The handling device according to claim 1, wherein a second spring that constantly biases the second piston in the direction of the first piston is received. 6. 6. The positional relationship between the stopper and the second piston is set such that the second piston maintains a position separated from the stopper during the clamping of the movable clamper. Claim 1,
The handling device according to 2, 3, 4 or 5. 7. The handling apparatus according to claim 1, wherein the object to be clamped is a plate-like object. 8. The handling apparatus according to claim 1, wherein the object to be clamped is a semiconductor wafer. 9. The fixed clamper is disposed at one end of a receiving plate larger than an object to be clamped, and the movable clamping is disposed at the other end of the receiving plate so as to be movable forward and backward. The handling device according to claim 1, 2, 3, 4, 5, 6, or 7. 10. The handling apparatus according to claim 9, wherein a plurality of support projections projecting from the upper surface of the receiving plate to locally contact the lower surface of the object to be clamped.