JP4816545B2 - 基板処理装置、基板処理方法及び記憶媒体 - Google Patents

基板処理装置、基板処理方法及び記憶媒体 Download PDF

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Publication number
JP4816545B2
JP4816545B2 JP2007095376A JP2007095376A JP4816545B2 JP 4816545 B2 JP4816545 B2 JP 4816545B2 JP 2007095376 A JP2007095376 A JP 2007095376A JP 2007095376 A JP2007095376 A JP 2007095376A JP 4816545 B2 JP4816545 B2 JP 4816545B2
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JP
Japan
Prior art keywords
substrate
storage
transfer
storage shelf
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007095376A
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English (en)
Japanese (ja)
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JP2008258188A (ja
Inventor
圭祐 近藤
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2007095376A priority Critical patent/JP4816545B2/ja
Priority to CN2008800001223A priority patent/CN101542713B/zh
Priority to US12/532,190 priority patent/US8382088B2/en
Priority to PCT/JP2008/056082 priority patent/WO2008120716A1/ja
Priority to KR1020087019754A priority patent/KR101024530B1/ko
Priority to TW097111516A priority patent/TW200849453A/zh
Publication of JP2008258188A publication Critical patent/JP2008258188A/ja
Application granted granted Critical
Publication of JP4816545B2 publication Critical patent/JP4816545B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Warehouses Or Storage Devices (AREA)
JP2007095376A 2007-03-30 2007-03-30 基板処理装置、基板処理方法及び記憶媒体 Expired - Fee Related JP4816545B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007095376A JP4816545B2 (ja) 2007-03-30 2007-03-30 基板処理装置、基板処理方法及び記憶媒体
CN2008800001223A CN101542713B (zh) 2007-03-30 2008-03-28 基板处理装置和基板处理方法
US12/532,190 US8382088B2 (en) 2007-03-30 2008-03-28 Substrate processing apparatus
PCT/JP2008/056082 WO2008120716A1 (ja) 2007-03-30 2008-03-28 基板処理装置、基板処理方法及びコンピュータ可読記憶媒体
KR1020087019754A KR101024530B1 (ko) 2007-03-30 2008-03-28 기판 처리 장치, 기판 처리 방법 및, 컴퓨터 판독 가능 기억 매체
TW097111516A TW200849453A (en) 2007-03-30 2008-03-28 Substrate processing apparatus, substrate processing method and computer readable storage medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007095376A JP4816545B2 (ja) 2007-03-30 2007-03-30 基板処理装置、基板処理方法及び記憶媒体

Publications (2)

Publication Number Publication Date
JP2008258188A JP2008258188A (ja) 2008-10-23
JP4816545B2 true JP4816545B2 (ja) 2011-11-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007095376A Expired - Fee Related JP4816545B2 (ja) 2007-03-30 2007-03-30 基板処理装置、基板処理方法及び記憶媒体

Country Status (6)

Country Link
US (1) US8382088B2 (enExample)
JP (1) JP4816545B2 (enExample)
KR (1) KR101024530B1 (enExample)
CN (1) CN101542713B (enExample)
TW (1) TW200849453A (enExample)
WO (1) WO2008120716A1 (enExample)

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JP4816545B2 (ja) * 2007-03-30 2011-11-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
GB2452320B (en) * 2007-09-03 2012-04-11 Dek Int Gmbh Workpiece processing system and method
JP2010123733A (ja) * 2008-11-19 2010-06-03 Tokyo Electron Ltd 基板処理装置及びその処理方法、並びに記憶媒体
JP5410794B2 (ja) * 2009-03-17 2014-02-05 東京エレクトロン株式会社 基板処理装置
JP5358366B2 (ja) * 2009-09-14 2013-12-04 東京エレクトロン株式会社 基板処理装置及び方法
JP5947030B2 (ja) 2010-12-28 2016-07-06 キヤノンアネルバ株式会社 基板処理方法、基板処理装置
KR101293025B1 (ko) * 2011-12-22 2013-08-05 에스엔유 프리시젼 주식회사 마스크 적재 및 기판 반송 챔버와, 마스크 적재 및 기판 반송 챔버의 운용방법
JP2013172015A (ja) * 2012-02-21 2013-09-02 Hitachi High-Technologies Corp 成膜装置、及び成膜装置用基板搬送機構
JP5959914B2 (ja) * 2012-04-18 2016-08-02 東京エレクトロン株式会社 基板処理システム、基板搬送方法および記憶媒体
JP2013247283A (ja) * 2012-05-28 2013-12-09 Tokyo Electron Ltd 搬送機構、搬送方法及び処理システム
JP5954108B2 (ja) * 2012-10-23 2016-07-20 東京エレクトロン株式会社 基板処理装置
JP6016584B2 (ja) * 2012-11-08 2016-10-26 東京エレクトロン株式会社 ロードロック装置
JP2014116545A (ja) * 2012-12-12 2014-06-26 Tokyo Electron Ltd 基板処理装置
KR101575129B1 (ko) * 2014-01-13 2015-12-08 피에스케이 주식회사 기판 이송 장치 및 방법, 그리고 기판 처리 장치
JP6494443B2 (ja) * 2015-06-15 2019-04-03 東京エレクトロン株式会社 成膜方法及び成膜装置
US10388547B2 (en) * 2017-06-23 2019-08-20 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for processing substrates
TWI717034B (zh) 2017-06-23 2021-01-21 美商應用材料股份有限公司 側儲存倉、電子裝置處理系統、和處理基板的方法
CN111164745B (zh) * 2017-10-11 2023-09-12 日商乐华股份有限公司 盒开启器
KR102110307B1 (ko) 2018-04-23 2020-05-14 코스텍시스템(주) 웨이퍼 이송 장치
JP7349240B2 (ja) * 2018-10-05 2023-09-22 東京エレクトロン株式会社 基板倉庫及び基板検査方法
US11373891B2 (en) * 2018-10-26 2022-06-28 Applied Materials, Inc. Front-ducted equipment front end modules, side storage pods, and methods of operating the same
US11244844B2 (en) * 2018-10-26 2022-02-08 Applied Materials, Inc. High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods
CN109671658B (zh) * 2018-11-29 2021-02-09 苏州方昇光电股份有限公司 基片装载系统及其基片装载方法
KR102227066B1 (ko) 2019-01-28 2021-03-15 코스텍시스템(주) 웨이퍼 이송 장치
JP7591370B2 (ja) * 2020-08-28 2024-11-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN113299586B (zh) * 2021-07-28 2021-10-19 四川通妙科技有限公司 一种芯片晶圆暂存装置及芯片晶圆暂存取件方法
TWI823271B (zh) * 2022-02-24 2023-11-21 天虹科技股份有限公司 基板傳送方法
WO2023175743A1 (ja) * 2022-03-15 2023-09-21 株式会社日立ハイテク 真空処理装置
JP7215629B1 (ja) 2022-07-14 2023-01-31 Ｊｆｅエンジニアリング株式会社 バッテリ交換装置
CN118016573B (zh) * 2023-11-21 2025-06-20 唯实先端智能科技(苏州)有限公司 一种新型导流结构及高洁净晶圆光罩存储库

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Also Published As

Publication number Publication date
TWI379378B (enExample) 2012-12-11
CN101542713B (zh) 2012-05-30
TW200849453A (en) 2008-12-16
WO2008120716A1 (ja) 2008-10-09
KR101024530B1 (ko) 2011-03-31
JP2008258188A (ja) 2008-10-23
KR20090094054A (ko) 2009-09-03
CN101542713A (zh) 2009-09-23
US8382088B2 (en) 2013-02-26
US20100102030A1 (en) 2010-04-29

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