JP4816545B2 - 基板処理装置、基板処理方法及び記憶媒体 - Google Patents

基板処理装置、基板処理方法及び記憶媒体 Download PDF

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Publication number
JP4816545B2
JP4816545B2 JP2007095376A JP2007095376A JP4816545B2 JP 4816545 B2 JP4816545 B2 JP 4816545B2 JP 2007095376 A JP2007095376 A JP 2007095376A JP 2007095376 A JP2007095376 A JP 2007095376A JP 4816545 B2 JP4816545 B2 JP 4816545B2
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JP
Japan
Prior art keywords
substrate
storage
transfer
storage shelf
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007095376A
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English (en)
Japanese (ja)
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JP2008258188A (ja
Inventor
圭祐 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2007095376A priority Critical patent/JP4816545B2/ja
Priority to CN2008800001223A priority patent/CN101542713B/zh
Priority to PCT/JP2008/056082 priority patent/WO2008120716A1/ja
Priority to US12/532,190 priority patent/US8382088B2/en
Priority to TW097111516A priority patent/TW200849453A/zh
Priority to KR1020087019754A priority patent/KR101024530B1/ko
Publication of JP2008258188A publication Critical patent/JP2008258188A/ja
Application granted granted Critical
Publication of JP4816545B2 publication Critical patent/JP4816545B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Warehouses Or Storage Devices (AREA)
JP2007095376A 2007-03-30 2007-03-30 基板処理装置、基板処理方法及び記憶媒体 Expired - Fee Related JP4816545B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007095376A JP4816545B2 (ja) 2007-03-30 2007-03-30 基板処理装置、基板処理方法及び記憶媒体
CN2008800001223A CN101542713B (zh) 2007-03-30 2008-03-28 基板处理装置和基板处理方法
PCT/JP2008/056082 WO2008120716A1 (ja) 2007-03-30 2008-03-28 基板処理装置、基板処理方法及びコンピュータ可読記憶媒体
US12/532,190 US8382088B2 (en) 2007-03-30 2008-03-28 Substrate processing apparatus
TW097111516A TW200849453A (en) 2007-03-30 2008-03-28 Substrate processing apparatus, substrate processing method and computer readable storage medium
KR1020087019754A KR101024530B1 (ko) 2007-03-30 2008-03-28 기판 처리 장치, 기판 처리 방법 및, 컴퓨터 판독 가능 기억 매체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007095376A JP4816545B2 (ja) 2007-03-30 2007-03-30 基板処理装置、基板処理方法及び記憶媒体

Publications (2)

Publication Number Publication Date
JP2008258188A JP2008258188A (ja) 2008-10-23
JP4816545B2 true JP4816545B2 (ja) 2011-11-16

Family

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Family Applications (1)

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JP2007095376A Expired - Fee Related JP4816545B2 (ja) 2007-03-30 2007-03-30 基板処理装置、基板処理方法及び記憶媒体

Country Status (6)

Country Link
US (1) US8382088B2 (enExample)
JP (1) JP4816545B2 (enExample)
KR (1) KR101024530B1 (enExample)
CN (1) CN101542713B (enExample)
TW (1) TW200849453A (enExample)
WO (1) WO2008120716A1 (enExample)

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JP4816545B2 (ja) * 2007-03-30 2011-11-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
GB2452320B (en) * 2007-09-03 2012-04-11 Dek Int Gmbh Workpiece processing system and method
JP2010123733A (ja) * 2008-11-19 2010-06-03 Tokyo Electron Ltd 基板処理装置及びその処理方法、並びに記憶媒体
JP5410794B2 (ja) * 2009-03-17 2014-02-05 東京エレクトロン株式会社 基板処理装置
JP5358366B2 (ja) 2009-09-14 2013-12-04 東京エレクトロン株式会社 基板処理装置及び方法
JP5947030B2 (ja) * 2010-12-28 2016-07-06 キヤノンアネルバ株式会社 基板処理方法、基板処理装置
KR101293025B1 (ko) * 2011-12-22 2013-08-05 에스엔유 프리시젼 주식회사 마스크 적재 및 기판 반송 챔버와, 마스크 적재 및 기판 반송 챔버의 운용방법
JP2013172015A (ja) * 2012-02-21 2013-09-02 Hitachi High-Technologies Corp 成膜装置、及び成膜装置用基板搬送機構
JP5959914B2 (ja) * 2012-04-18 2016-08-02 東京エレクトロン株式会社 基板処理システム、基板搬送方法および記憶媒体
JP2013247283A (ja) * 2012-05-28 2013-12-09 Tokyo Electron Ltd 搬送機構、搬送方法及び処理システム
JP5954108B2 (ja) * 2012-10-23 2016-07-20 東京エレクトロン株式会社 基板処理装置
JP6016584B2 (ja) * 2012-11-08 2016-10-26 東京エレクトロン株式会社 ロードロック装置
JP2014116545A (ja) * 2012-12-12 2014-06-26 Tokyo Electron Ltd 基板処理装置
KR101575129B1 (ko) * 2014-01-13 2015-12-08 피에스케이 주식회사 기판 이송 장치 및 방법, 그리고 기판 처리 장치
JP6494443B2 (ja) * 2015-06-15 2019-04-03 東京エレクトロン株式会社 成膜方法及び成膜装置
US10388547B2 (en) * 2017-06-23 2019-08-20 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for processing substrates
KR102360219B1 (ko) 2017-06-23 2022-02-08 어플라이드 머티어리얼스, 인코포레이티드 인덱서블 측면 저장 포드 장치, 가열식 측면 저장 포드 장치, 시스템들, 및 방법들
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KR102110307B1 (ko) 2018-04-23 2020-05-14 코스텍시스템(주) 웨이퍼 이송 장치
JP7349240B2 (ja) * 2018-10-05 2023-09-22 東京エレクトロン株式会社 基板倉庫及び基板検査方法
US11373891B2 (en) * 2018-10-26 2022-06-28 Applied Materials, Inc. Front-ducted equipment front end modules, side storage pods, and methods of operating the same
US11244844B2 (en) * 2018-10-26 2022-02-08 Applied Materials, Inc. High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods
CN109671658B (zh) * 2018-11-29 2021-02-09 苏州方昇光电股份有限公司 基片装载系统及其基片装载方法
KR102227066B1 (ko) 2019-01-28 2021-03-15 코스텍시스템(주) 웨이퍼 이송 장치
JP7591370B2 (ja) * 2020-08-28 2024-11-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN113299586B (zh) * 2021-07-28 2021-10-19 四川通妙科技有限公司 一种芯片晶圆暂存装置及芯片晶圆暂存取件方法
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Also Published As

Publication number Publication date
TWI379378B (enExample) 2012-12-11
TW200849453A (en) 2008-12-16
KR20090094054A (ko) 2009-09-03
JP2008258188A (ja) 2008-10-23
WO2008120716A1 (ja) 2008-10-09
KR101024530B1 (ko) 2011-03-31
CN101542713B (zh) 2012-05-30
US20100102030A1 (en) 2010-04-29
US8382088B2 (en) 2013-02-26
CN101542713A (zh) 2009-09-23

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