TW200802632A - Fabrication method of semiconductor device - Google Patents

Fabrication method of semiconductor device

Info

Publication number
TW200802632A
TW200802632A TW096112744A TW96112744A TW200802632A TW 200802632 A TW200802632 A TW 200802632A TW 096112744 A TW096112744 A TW 096112744A TW 96112744 A TW96112744 A TW 96112744A TW 200802632 A TW200802632 A TW 200802632A
Authority
TW
Taiwan
Prior art keywords
vacuuming
collet
vacuum
pipe
chip
Prior art date
Application number
TW096112744A
Other languages
English (en)
Inventor
Hiroshi Maki
Masayuki Mochizuki
Ryuichi Takano
Yoshiaki Makita
Haruhiko Fukasawa
Keisuke Nadamoto
Tatsuyuki Okubo
Original Assignee
Renesas Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Tech Corp filed Critical Renesas Tech Corp
Publication of TW200802632A publication Critical patent/TW200802632A/zh

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Classifications

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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
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TW096112744A 2006-05-23 2007-04-11 Fabrication method of semiconductor device TW200802632A (en)

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* Cited by examiner, † Cited by third party
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TWI673806B (zh) * 2015-11-12 2019-10-01 南韓商韓美半導體股份有限公司 熱壓鍵合裝置
TWI652143B (zh) 2016-03-18 2019-03-01 日商荏原製作所股份有限公司 研磨裝置及研磨方法
TWI676226B (zh) * 2017-05-31 2019-11-01 日商捷進科技有限公司 半導體製造裝置及半導體裝置的製造方法
TWI777823B (zh) * 2020-11-25 2022-09-11 中國商蘇州晶湛半導體有限公司 光電裝置及其製備方法

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US20100055878A1 (en) 2010-03-04
KR20130083872A (ko) 2013-07-23
KR20070113109A (ko) 2007-11-28
CN101079374A (zh) 2007-11-28
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JP5054933B2 (ja) 2012-10-24
KR101360635B1 (ko) 2014-02-07

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