TW200727369A - A dicing die adhesive film for semiconductor - Google Patents

A dicing die adhesive film for semiconductor

Info

Publication number
TW200727369A
TW200727369A TW095115141A TW95115141A TW200727369A TW 200727369 A TW200727369 A TW 200727369A TW 095115141 A TW095115141 A TW 095115141A TW 95115141 A TW95115141 A TW 95115141A TW 200727369 A TW200727369 A TW 200727369A
Authority
TW
Taiwan
Prior art keywords
die
semiconductor
adhesive layer
dicing
adhesive film
Prior art date
Application number
TW095115141A
Other languages
Chinese (zh)
Other versions
TWI318428B (en
Inventor
Byoung-Un Kang
Jai-Hoon Kim
Joon-Mo Seo
Tae-Hyun Sung
Dong-Cheon Shin
Kyung-Tae Wi
Original Assignee
Ls Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ls Cable Ltd filed Critical Ls Cable Ltd
Publication of TW200727369A publication Critical patent/TW200727369A/en
Application granted granted Critical
Publication of TWI318428B publication Critical patent/TWI318428B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)

Abstract

A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.
TW095115141A 2005-04-28 2006-04-27 A dicing die adhesive film for semiconductor TWI318428B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20050035742 2005-04-28
KR1020060007280A KR100737610B1 (en) 2005-04-28 2006-01-24 A dicing die adhesive film for semi-conductor

Publications (2)

Publication Number Publication Date
TW200727369A true TW200727369A (en) 2007-07-16
TWI318428B TWI318428B (en) 2009-12-11

Family

ID=37651722

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115141A TWI318428B (en) 2005-04-28 2006-04-27 A dicing die adhesive film for semiconductor

Country Status (2)

Country Link
KR (1) KR100737610B1 (en)
TW (1) TWI318428B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479557B (en) * 2009-12-24 2015-04-01 Nitto Denko Corp Film for flip chip type semiconductor back surface
TWI637439B (en) * 2012-12-14 2018-10-01 琳得科股份有限公司 Protective film forming film
TWI817969B (en) * 2017-12-28 2023-10-11 日商日東電工股份有限公司 Cut crystal adhesive film

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100844383B1 (en) * 2007-03-13 2008-07-07 도레이새한 주식회사 Adhesive film for stacking semiconductor chip
KR100864555B1 (en) * 2007-05-04 2008-10-20 엘에스엠트론 주식회사 Die adhesive film
KR101047923B1 (en) 2007-12-27 2011-07-08 주식회사 엘지화학 Dicing die bonding film and semiconductor device with excellent burr characteristics and reliability
KR101246480B1 (en) * 2010-05-07 2013-03-21 후루카와 덴키 고교 가부시키가이샤 Tape for processing wafer
KR102388287B1 (en) * 2015-10-01 2022-04-18 셍기 테크놀로지 코. 엘티디. Cover lay and flexible printed circuit board
JP6949421B2 (en) * 2017-05-09 2021-10-13 株式会社ディスコ Processing method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4168368B2 (en) 2002-03-19 2008-10-22 日立化成工業株式会社 Adhesive sheet, semiconductor device and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479557B (en) * 2009-12-24 2015-04-01 Nitto Denko Corp Film for flip chip type semiconductor back surface
TWI637439B (en) * 2012-12-14 2018-10-01 琳得科股份有限公司 Protective film forming film
TWI817969B (en) * 2017-12-28 2023-10-11 日商日東電工股份有限公司 Cut crystal adhesive film

Also Published As

Publication number Publication date
TWI318428B (en) 2009-12-11
KR20060113372A (en) 2006-11-02
KR100737610B1 (en) 2007-07-10

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees