TW200536088A - Semiconductor device and its production method - Google Patents

Semiconductor device and its production method Download PDF

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Publication number
TW200536088A
TW200536088A TW094102022A TW94102022A TW200536088A TW 200536088 A TW200536088 A TW 200536088A TW 094102022 A TW094102022 A TW 094102022A TW 94102022 A TW94102022 A TW 94102022A TW 200536088 A TW200536088 A TW 200536088A
Authority
TW
Taiwan
Prior art keywords
lead
semiconductor device
aforementioned
wire
leads
Prior art date
Application number
TW094102022A
Other languages
English (en)
Chinese (zh)
Other versions
TWI359484B (https=
Inventor
Yoshihiko Shimanuki
Koji Tsuchiya
Original Assignee
Renesas Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Tech Corp filed Critical Renesas Tech Corp
Publication of TW200536088A publication Critical patent/TW200536088A/zh
Application granted granted Critical
Publication of TWI359484B publication Critical patent/TWI359484B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
    • E02B3/00—Engineering works in connection with control or use of streams, rivers, coasts, or other marine sites; Sealings or joints for engineering works in general
    • E02B3/04—Structures or apparatus for, or methods of, protecting banks, coasts, or harbours
    • E02B3/12—Revetment of banks, dams, watercourses, or the like, e.g. the sea-floor
    • E02B3/14—Preformed blocks or slabs for forming essentially continuous surfaces; Arrangements thereof
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K61/00—Culture of aquatic animals
    • A01K61/10—Culture of aquatic animals of fish
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/438—Shapes or dispositions of side rails, e.g. having holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental Sciences (AREA)
  • Structural Engineering (AREA)
  • Civil Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Ocean & Marine Engineering (AREA)
  • Marine Sciences & Fisheries (AREA)
  • Zoology (AREA)
  • Animal Husbandry (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW094102022A 2004-03-23 2005-01-24 Semiconductor device and its production method TW200536088A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004084170A JP4417150B2 (ja) 2004-03-23 2004-03-23 半導体装置

Publications (2)

Publication Number Publication Date
TW200536088A true TW200536088A (en) 2005-11-01
TWI359484B TWI359484B (https=) 2012-03-01

Family

ID=34988807

Family Applications (2)

Application Number Title Priority Date Filing Date
TW094102022A TW200536088A (en) 2004-03-23 2005-01-24 Semiconductor device and its production method
TW100129842A TWI505418B (zh) 2004-03-23 2005-01-24 Semiconductor device

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW100129842A TWI505418B (zh) 2004-03-23 2005-01-24 Semiconductor device

Country Status (5)

Country Link
US (2) US7176557B2 (https=)
JP (1) JP4417150B2 (https=)
KR (1) KR101103871B1 (https=)
CN (1) CN100466241C (https=)
TW (2) TW200536088A (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4372508B2 (ja) * 2003-10-06 2009-11-25 ローム株式会社 リードフレームの製造方法およびそれを用いた半導体装置の製造方法、ならびに半導体装置ならびにそれを備えた携帯機器および電子装置
JP4942020B2 (ja) * 2006-05-12 2012-05-30 ルネサスエレクトロニクス株式会社 半導体装置
JP2008071927A (ja) * 2006-09-14 2008-03-27 Renesas Technology Corp 半導体装置の製造方法および半導体装置
JP5180495B2 (ja) * 2007-03-14 2013-04-10 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP5155644B2 (ja) * 2007-07-19 2013-03-06 ルネサスエレクトロニクス株式会社 半導体装置
US7847376B2 (en) * 2007-07-19 2010-12-07 Renesas Electronics Corporation Semiconductor device and manufacturing method of the same
US7851897B1 (en) * 2008-06-16 2010-12-14 Maxim Integrated Products, Inc. IC package structures for high power dissipation and low RDSon
JP5549066B2 (ja) * 2008-09-30 2014-07-16 凸版印刷株式会社 リードフレーム型基板とその製造方法、及び半導体装置
JP2010258159A (ja) * 2009-04-23 2010-11-11 Renesas Electronics Corp 半導体装置
JP5380244B2 (ja) * 2009-10-22 2014-01-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5255009B2 (ja) * 2010-02-26 2013-08-07 ルネサスエレクトロニクス株式会社 半導体装置
US8390103B2 (en) * 2010-07-12 2013-03-05 Analog Devices, Inc. Apparatus for integrated circuit packaging
JP2012227445A (ja) * 2011-04-21 2012-11-15 Renesas Electronics Corp 半導体装置及びその製造方法
JP5204271B2 (ja) * 2011-06-16 2013-06-05 株式会社東芝 内視鏡装置および基板
JP2013093483A (ja) * 2011-10-27 2013-05-16 Semiconductor Components Industries Llc 半導体装置及びその製造方法
JP5798021B2 (ja) * 2011-12-01 2015-10-21 ルネサスエレクトロニクス株式会社 半導体装置
JP5817513B2 (ja) * 2011-12-27 2015-11-18 大日本印刷株式会社 半導体装置製造用リードフレーム及び半導体装置の製造方法
JP5947107B2 (ja) * 2012-05-23 2016-07-06 ルネサスエレクトロニクス株式会社 半導体装置
JP6011083B2 (ja) * 2012-07-09 2016-10-19 日亜化学工業株式会社 発光装置用リードフレームおよびその製造方法ならびに発光装置の製造方法
TWI570858B (zh) * 2014-12-23 2017-02-11 揚智科技股份有限公司 半導體封裝結構
US10083888B2 (en) * 2015-11-19 2018-09-25 Advanced Semiconductor Engineering, Inc. Semiconductor device package
US9847283B1 (en) * 2016-11-06 2017-12-19 Nexperia B.V. Semiconductor device with wettable corner leads
CN111834323B (zh) * 2020-07-29 2025-08-19 北京燕东微电子科技有限公司 一种半导体封装件及其制造方法
KR20230019692A (ko) 2021-08-02 2023-02-09 삼성전자주식회사 칩 온 필름 패키지 및 이를 포함하는 디스플레이 장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2888183B2 (ja) * 1995-11-13 1999-05-10 ヤマハ株式会社 樹脂封止型半導体装置
US6909179B2 (en) * 1996-03-18 2005-06-21 Renesas Technology Corp. Lead frame and semiconductor device using the lead frame and method of manufacturing the same
US5936837A (en) * 1997-08-11 1999-08-10 Motorola, Inc. Semiconductor component having leadframe with offset ground plane
JP2000236060A (ja) * 1999-02-16 2000-08-29 Matsushita Electronics Industry Corp 半導体装置
MY133357A (en) * 1999-06-30 2007-11-30 Hitachi Ltd A semiconductor device and a method of manufacturing the same
JP2001230360A (ja) * 2000-02-18 2001-08-24 Hitachi Ltd 半導体集積回路装置およびその製造方法
JP3786339B2 (ja) * 2000-03-23 2006-06-14 株式会社三井ハイテック 半導体装置の製造方法
JP3640601B2 (ja) 2000-07-11 2005-04-20 セントラル硝子株式会社 フッ素含有化合物ガスの検出方法
SG102638A1 (en) * 2000-09-15 2004-03-26 Samsung Techwin Co Ltd Lead frame, semiconductor package having the same, and semiconductor package manufacturing method
JP2002184927A (ja) * 2000-12-19 2002-06-28 Mitsui High Tec Inc 半導体装置の製造方法
JP2004022725A (ja) * 2002-06-14 2004-01-22 Renesas Technology Corp 半導体装置
WO2004004005A1 (ja) * 2002-07-01 2004-01-08 Renesas Technology Corp. 半導体装置およびその製造方法

Also Published As

Publication number Publication date
KR101103871B1 (ko) 2012-01-12
CN100466241C (zh) 2009-03-04
TW201222744A (en) 2012-06-01
US20070108563A1 (en) 2007-05-17
TWI359484B (https=) 2012-03-01
CN1674268A (zh) 2005-09-28
KR20060041909A (ko) 2006-05-12
US20050212116A1 (en) 2005-09-29
JP4417150B2 (ja) 2010-02-17
US7176557B2 (en) 2007-02-13
TWI505418B (zh) 2015-10-21
JP2005276890A (ja) 2005-10-06
US7339261B2 (en) 2008-03-04

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MM4A Annulment or lapse of patent due to non-payment of fees