TWI359484B - - Google Patents

Download PDF

Info

Publication number
TWI359484B
TWI359484B TW094102022A TW94102022A TWI359484B TW I359484 B TWI359484 B TW I359484B TW 094102022 A TW094102022 A TW 094102022A TW 94102022 A TW94102022 A TW 94102022A TW I359484 B TWI359484 B TW I359484B
Authority
TW
Taiwan
Prior art keywords
lead
semiconductor device
wire
tab
protruding portion
Prior art date
Application number
TW094102022A
Other languages
English (en)
Chinese (zh)
Other versions
TW200536088A (en
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of TW200536088A publication Critical patent/TW200536088A/zh
Application granted granted Critical
Publication of TWI359484B publication Critical patent/TWI359484B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
    • E02B3/00—Engineering works in connection with control or use of streams, rivers, coasts, or other marine sites; Sealings or joints for engineering works in general
    • E02B3/04—Structures or apparatus for, or methods of, protecting banks, coasts, or harbours
    • E02B3/12—Revetment of banks, dams, watercourses, or the like, e.g. the sea-floor
    • E02B3/14—Preformed blocks or slabs for forming essentially continuous surfaces; Arrangements thereof
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K61/00—Culture of aquatic animals
    • A01K61/10—Culture of aquatic animals of fish
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/438—Shapes or dispositions of side rails, e.g. having holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental Sciences (AREA)
  • Structural Engineering (AREA)
  • Civil Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Ocean & Marine Engineering (AREA)
  • Marine Sciences & Fisheries (AREA)
  • Zoology (AREA)
  • Animal Husbandry (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW094102022A 2004-03-23 2005-01-24 Semiconductor device and its production method TW200536088A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004084170A JP4417150B2 (ja) 2004-03-23 2004-03-23 半導体装置

Publications (2)

Publication Number Publication Date
TW200536088A TW200536088A (en) 2005-11-01
TWI359484B true TWI359484B (https=) 2012-03-01

Family

ID=34988807

Family Applications (2)

Application Number Title Priority Date Filing Date
TW100129842A TWI505418B (zh) 2004-03-23 2005-01-24 Semiconductor device
TW094102022A TW200536088A (en) 2004-03-23 2005-01-24 Semiconductor device and its production method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW100129842A TWI505418B (zh) 2004-03-23 2005-01-24 Semiconductor device

Country Status (5)

Country Link
US (2) US7176557B2 (https=)
JP (1) JP4417150B2 (https=)
KR (1) KR101103871B1 (https=)
CN (1) CN100466241C (https=)
TW (2) TWI505418B (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4372508B2 (ja) * 2003-10-06 2009-11-25 ローム株式会社 リードフレームの製造方法およびそれを用いた半導体装置の製造方法、ならびに半導体装置ならびにそれを備えた携帯機器および電子装置
JP4942020B2 (ja) * 2006-05-12 2012-05-30 ルネサスエレクトロニクス株式会社 半導体装置
JP2008071927A (ja) * 2006-09-14 2008-03-27 Renesas Technology Corp 半導体装置の製造方法および半導体装置
JP5180495B2 (ja) 2007-03-14 2013-04-10 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US7847376B2 (en) * 2007-07-19 2010-12-07 Renesas Electronics Corporation Semiconductor device and manufacturing method of the same
JP5155644B2 (ja) * 2007-07-19 2013-03-06 ルネサスエレクトロニクス株式会社 半導体装置
US7851897B1 (en) * 2008-06-16 2010-12-14 Maxim Integrated Products, Inc. IC package structures for high power dissipation and low RDSon
JP5549066B2 (ja) * 2008-09-30 2014-07-16 凸版印刷株式会社 リードフレーム型基板とその製造方法、及び半導体装置
JP2010258159A (ja) * 2009-04-23 2010-11-11 Renesas Electronics Corp 半導体装置
JP5380244B2 (ja) * 2009-10-22 2014-01-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5255009B2 (ja) * 2010-02-26 2013-08-07 ルネサスエレクトロニクス株式会社 半導体装置
US8390103B2 (en) 2010-07-12 2013-03-05 Analog Devices, Inc. Apparatus for integrated circuit packaging
JP2012227445A (ja) 2011-04-21 2012-11-15 Renesas Electronics Corp 半導体装置及びその製造方法
JP5204271B2 (ja) * 2011-06-16 2013-06-05 株式会社東芝 内視鏡装置および基板
JP2013093483A (ja) * 2011-10-27 2013-05-16 Semiconductor Components Industries Llc 半導体装置及びその製造方法
JP5798021B2 (ja) * 2011-12-01 2015-10-21 ルネサスエレクトロニクス株式会社 半導体装置
JP5817513B2 (ja) * 2011-12-27 2015-11-18 大日本印刷株式会社 半導体装置製造用リードフレーム及び半導体装置の製造方法
JP5947107B2 (ja) * 2012-05-23 2016-07-06 ルネサスエレクトロニクス株式会社 半導体装置
JP6011083B2 (ja) * 2012-07-09 2016-10-19 日亜化学工業株式会社 発光装置用リードフレームおよびその製造方法ならびに発光装置の製造方法
TWI570858B (zh) * 2014-12-23 2017-02-11 揚智科技股份有限公司 半導體封裝結構
US10083888B2 (en) * 2015-11-19 2018-09-25 Advanced Semiconductor Engineering, Inc. Semiconductor device package
US9847283B1 (en) * 2016-11-06 2017-12-19 Nexperia B.V. Semiconductor device with wettable corner leads
CN111834323B (zh) * 2020-07-29 2025-08-19 北京燕东微电子科技有限公司 一种半导体封装件及其制造方法
KR20230019692A (ko) 2021-08-02 2023-02-09 삼성전자주식회사 칩 온 필름 패키지 및 이를 포함하는 디스플레이 장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2888183B2 (ja) * 1995-11-13 1999-05-10 ヤマハ株式会社 樹脂封止型半導体装置
US6909179B2 (en) * 1996-03-18 2005-06-21 Renesas Technology Corp. Lead frame and semiconductor device using the lead frame and method of manufacturing the same
US5936837A (en) * 1997-08-11 1999-08-10 Motorola, Inc. Semiconductor component having leadframe with offset ground plane
JP2000236060A (ja) * 1999-02-16 2000-08-29 Matsushita Electronics Industry Corp 半導体装置
MY133357A (en) * 1999-06-30 2007-11-30 Hitachi Ltd A semiconductor device and a method of manufacturing the same
JP2001230360A (ja) * 2000-02-18 2001-08-24 Hitachi Ltd 半導体集積回路装置およびその製造方法
JP3786339B2 (ja) * 2000-03-23 2006-06-14 株式会社三井ハイテック 半導体装置の製造方法
JP3640601B2 (ja) 2000-07-11 2005-04-20 セントラル硝子株式会社 フッ素含有化合物ガスの検出方法
SG102638A1 (en) * 2000-09-15 2004-03-26 Samsung Techwin Co Ltd Lead frame, semiconductor package having the same, and semiconductor package manufacturing method
JP2002184927A (ja) * 2000-12-19 2002-06-28 Mitsui High Tec Inc 半導体装置の製造方法
JP2004022725A (ja) * 2002-06-14 2004-01-22 Renesas Technology Corp 半導体装置
KR100975692B1 (ko) * 2002-07-01 2010-08-12 가부시끼가이샤 르네사스 테크놀로지 반도체 장치

Also Published As

Publication number Publication date
JP4417150B2 (ja) 2010-02-17
KR20060041909A (ko) 2006-05-12
US20070108563A1 (en) 2007-05-17
CN100466241C (zh) 2009-03-04
CN1674268A (zh) 2005-09-28
US7176557B2 (en) 2007-02-13
US7339261B2 (en) 2008-03-04
KR101103871B1 (ko) 2012-01-12
US20050212116A1 (en) 2005-09-29
TWI505418B (zh) 2015-10-21
TW200536088A (en) 2005-11-01
JP2005276890A (ja) 2005-10-06
TW201222744A (en) 2012-06-01

Similar Documents

Publication Publication Date Title
TWI359484B (https=)
US8159055B2 (en) Semiconductor device, lead-frame product used for the same and method for manufacturing the same
TW577157B (en) Leadframe, method of manufacturing the same, semiconductor device using the same, and method of manufacturing the device
CN1481019A (zh) 引线框架及其制造方法
CN1490870A (zh) 引线框及其制造方法，以及用该引线框制造的半导体器件
TW200414473A (en) Lead frame and method of manufacturing the same
JPH08125066A (ja) 樹脂封止型半導体装置とそれに用いられるリードフレーム、及び樹脂封止型半導体装置の製造方法
JP2003031730A5 (https=)
TWI546912B (zh) 具有散熱結構之半導體封裝結構及其製造方法
CN103367300A (zh) 引线框、半导体装置以及引线框的制造方法
CN110943064B (zh) 引线框架及其制造方法
CN114695303A (zh) 引线框架、引线框架的制造方法以及半导体装置
JP6524533B2 (ja) 半導体素子搭載用基板、半導体装置及び光半導体装置、並びにそれらの製造方法
JP4987041B2 (ja) 半導体装置の製造方法
TW506093B (en) Cavity down ball grid array package and its manufacturing process
JP2004247613A (ja) 半導体装置およびその製造方法
JPWO2007057954A1 (ja) 半導体装置及びその製造方法
CN105047637B (zh) 用于扁平无引线封装的通用引线框架
JP3699573B2 (ja) 半導体装置とそれに用いられる回路部材およびそれらの製造方法
CN101211886A (zh) 无外引脚导线架的封装结构
JP6428013B2 (ja) リードフレーム部材およびその製造方法、ならびに半導体装置およびその製造方法
JPH10178149A (ja) リードフレーム部材とその製造方法
TWI478252B (zh) 一種倒裝晶片的半導體裝置及製造方法
JP2022097666A (ja) リードフレームおよび半導体装置
JP2021073741A (ja) リードフレームおよび半導体装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees