KR101103871B1 - 반도체장치 및 그 제조방법 - Google Patents

반도체장치 및 그 제조방법 Download PDF

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Publication number
KR101103871B1
KR101103871B1 KR1020050011833A KR20050011833A KR101103871B1 KR 101103871 B1 KR101103871 B1 KR 101103871B1 KR 1020050011833 A KR1020050011833 A KR 1020050011833A KR 20050011833 A KR20050011833 A KR 20050011833A KR 101103871 B1 KR101103871 B1 KR 101103871B1
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South Korea
Prior art keywords
lead
tab
leads
tab suspension
semiconductor device
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Expired - Fee Related
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KR1020050011833A
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English (en)
Korean (ko)
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KR20060041909A (ko
Inventor
요시히코 시마누키
코지 츠치야
Original Assignee
르네사스 일렉트로닉스 가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
    • E02B3/00—Engineering works in connection with control or use of streams, rivers, coasts, or other marine sites; Sealings or joints for engineering works in general
    • E02B3/04—Structures or apparatus for, or methods of, protecting banks, coasts, or harbours
    • E02B3/12—Revetment of banks, dams, watercourses, or the like, e.g. the sea-floor
    • E02B3/14—Preformed blocks or slabs for forming essentially continuous surfaces; Arrangements thereof
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K61/00—Culture of aquatic animals
    • A01K61/10—Culture of aquatic animals of fish
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/438—Shapes or dispositions of side rails, e.g. having holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental Sciences (AREA)
  • Structural Engineering (AREA)
  • Civil Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Ocean & Marine Engineering (AREA)
  • Marine Sciences & Fisheries (AREA)
  • Zoology (AREA)
  • Animal Husbandry (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020050011833A 2004-03-23 2005-02-14 반도체장치 및 그 제조방법 Expired - Fee Related KR101103871B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004084170A JP4417150B2 (ja) 2004-03-23 2004-03-23 半導体装置
JPJP-P-2004-00084170 2004-03-23

Publications (2)

Publication Number Publication Date
KR20060041909A KR20060041909A (ko) 2006-05-12
KR101103871B1 true KR101103871B1 (ko) 2012-01-12

Family

ID=34988807

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050011833A Expired - Fee Related KR101103871B1 (ko) 2004-03-23 2005-02-14 반도체장치 및 그 제조방법

Country Status (5)

Country Link
US (2) US7176557B2 (https=)
JP (1) JP4417150B2 (https=)
KR (1) KR101103871B1 (https=)
CN (1) CN100466241C (https=)
TW (2) TWI505418B (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
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JP4372508B2 (ja) * 2003-10-06 2009-11-25 ローム株式会社 リードフレームの製造方法およびそれを用いた半導体装置の製造方法、ならびに半導体装置ならびにそれを備えた携帯機器および電子装置
JP4942020B2 (ja) * 2006-05-12 2012-05-30 ルネサスエレクトロニクス株式会社 半導体装置
JP2008071927A (ja) * 2006-09-14 2008-03-27 Renesas Technology Corp 半導体装置の製造方法および半導体装置
JP5180495B2 (ja) 2007-03-14 2013-04-10 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US7847376B2 (en) * 2007-07-19 2010-12-07 Renesas Electronics Corporation Semiconductor device and manufacturing method of the same
JP5155644B2 (ja) * 2007-07-19 2013-03-06 ルネサスエレクトロニクス株式会社 半導体装置
US7851897B1 (en) * 2008-06-16 2010-12-14 Maxim Integrated Products, Inc. IC package structures for high power dissipation and low RDSon
JP5549066B2 (ja) * 2008-09-30 2014-07-16 凸版印刷株式会社 リードフレーム型基板とその製造方法、及び半導体装置
JP2010258159A (ja) * 2009-04-23 2010-11-11 Renesas Electronics Corp 半導体装置
JP5380244B2 (ja) * 2009-10-22 2014-01-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5255009B2 (ja) * 2010-02-26 2013-08-07 ルネサスエレクトロニクス株式会社 半導体装置
US8390103B2 (en) 2010-07-12 2013-03-05 Analog Devices, Inc. Apparatus for integrated circuit packaging
JP2012227445A (ja) 2011-04-21 2012-11-15 Renesas Electronics Corp 半導体装置及びその製造方法
JP5204271B2 (ja) * 2011-06-16 2013-06-05 株式会社東芝 内視鏡装置および基板
JP2013093483A (ja) * 2011-10-27 2013-05-16 Semiconductor Components Industries Llc 半導体装置及びその製造方法
JP5798021B2 (ja) * 2011-12-01 2015-10-21 ルネサスエレクトロニクス株式会社 半導体装置
JP5817513B2 (ja) * 2011-12-27 2015-11-18 大日本印刷株式会社 半導体装置製造用リードフレーム及び半導体装置の製造方法
JP5947107B2 (ja) * 2012-05-23 2016-07-06 ルネサスエレクトロニクス株式会社 半導体装置
JP6011083B2 (ja) * 2012-07-09 2016-10-19 日亜化学工業株式会社 発光装置用リードフレームおよびその製造方法ならびに発光装置の製造方法
TWI570858B (zh) * 2014-12-23 2017-02-11 揚智科技股份有限公司 半導體封裝結構
US10083888B2 (en) * 2015-11-19 2018-09-25 Advanced Semiconductor Engineering, Inc. Semiconductor device package
US9847283B1 (en) * 2016-11-06 2017-12-19 Nexperia B.V. Semiconductor device with wettable corner leads
CN111834323B (zh) * 2020-07-29 2025-08-19 北京燕东微电子科技有限公司 一种半导体封装件及其制造方法
KR20230019692A (ko) 2021-08-02 2023-02-09 삼성전자주식회사 칩 온 필름 패키지 및 이를 포함하는 디스플레이 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09139444A (ja) * 1995-11-13 1997-05-27 Yamaha Corp 樹脂封止型半導体装置
US5936837A (en) 1997-08-11 1999-08-10 Motorola, Inc. Semiconductor component having leadframe with offset ground plane
JP2002022725A (ja) 2000-07-11 2002-01-23 Central Glass Co Ltd フッ素含有化合物ガスの検出方法
JP2002134676A (ja) 2000-09-15 2002-05-10 Samsung Techwin Co Ltd リードフレーム及びそれを備えた半導体パッケージ、並びにその半導体パッケージの製造方法

Family Cites Families (8)

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US6909179B2 (en) * 1996-03-18 2005-06-21 Renesas Technology Corp. Lead frame and semiconductor device using the lead frame and method of manufacturing the same
JP2000236060A (ja) * 1999-02-16 2000-08-29 Matsushita Electronics Industry Corp 半導体装置
MY133357A (en) * 1999-06-30 2007-11-30 Hitachi Ltd A semiconductor device and a method of manufacturing the same
JP2001230360A (ja) * 2000-02-18 2001-08-24 Hitachi Ltd 半導体集積回路装置およびその製造方法
JP3786339B2 (ja) * 2000-03-23 2006-06-14 株式会社三井ハイテック 半導体装置の製造方法
JP2002184927A (ja) * 2000-12-19 2002-06-28 Mitsui High Tec Inc 半導体装置の製造方法
JP2004022725A (ja) * 2002-06-14 2004-01-22 Renesas Technology Corp 半導体装置
KR100975692B1 (ko) * 2002-07-01 2010-08-12 가부시끼가이샤 르네사스 테크놀로지 반도체 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09139444A (ja) * 1995-11-13 1997-05-27 Yamaha Corp 樹脂封止型半導体装置
US5936837A (en) 1997-08-11 1999-08-10 Motorola, Inc. Semiconductor component having leadframe with offset ground plane
JP2002022725A (ja) 2000-07-11 2002-01-23 Central Glass Co Ltd フッ素含有化合物ガスの検出方法
JP2002134676A (ja) 2000-09-15 2002-05-10 Samsung Techwin Co Ltd リードフレーム及びそれを備えた半導体パッケージ、並びにその半導体パッケージの製造方法

Also Published As

Publication number Publication date
JP4417150B2 (ja) 2010-02-17
KR20060041909A (ko) 2006-05-12
US20070108563A1 (en) 2007-05-17
CN100466241C (zh) 2009-03-04
TWI359484B (https=) 2012-03-01
CN1674268A (zh) 2005-09-28
US7176557B2 (en) 2007-02-13
US7339261B2 (en) 2008-03-04
US20050212116A1 (en) 2005-09-29
TWI505418B (zh) 2015-10-21
TW200536088A (en) 2005-11-01
JP2005276890A (ja) 2005-10-06
TW201222744A (en) 2012-06-01

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