JP4417150B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4417150B2
JP4417150B2 JP2004084170A JP2004084170A JP4417150B2 JP 4417150 B2 JP4417150 B2 JP 4417150B2 JP 2004084170 A JP2004084170 A JP 2004084170A JP 2004084170 A JP2004084170 A JP 2004084170A JP 4417150 B2 JP4417150 B2 JP 4417150B2
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JP
Japan
Prior art keywords
lead
tab
semiconductor device
leads
tab suspension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004084170A
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English (en)
Japanese (ja)
Other versions
JP2005276890A5 (https=
JP2005276890A (ja
Inventor
好彦 嶋貫
孝司 土屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2004084170A priority Critical patent/JP4417150B2/ja
Priority to US11/038,070 priority patent/US7176557B2/en
Priority to TW100129842A priority patent/TWI505418B/zh
Priority to TW094102022A priority patent/TW200536088A/zh
Priority to CNB2005100082591A priority patent/CN100466241C/zh
Priority to KR1020050011833A priority patent/KR101103871B1/ko
Publication of JP2005276890A publication Critical patent/JP2005276890A/ja
Priority to US11/653,402 priority patent/US7339261B2/en
Publication of JP2005276890A5 publication Critical patent/JP2005276890A5/ja
Application granted granted Critical
Publication of JP4417150B2 publication Critical patent/JP4417150B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
    • E02B3/00—Engineering works in connection with control or use of streams, rivers, coasts, or other marine sites; Sealings or joints for engineering works in general
    • E02B3/04—Structures or apparatus for, or methods of, protecting banks, coasts, or harbours
    • E02B3/12—Revetment of banks, dams, watercourses, or the like, e.g. the sea-floor
    • E02B3/14—Preformed blocks or slabs for forming essentially continuous surfaces; Arrangements thereof
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K61/00—Culture of aquatic animals
    • A01K61/10—Culture of aquatic animals of fish
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/438—Shapes or dispositions of side rails, e.g. having holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental Sciences (AREA)
  • Structural Engineering (AREA)
  • Civil Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Ocean & Marine Engineering (AREA)
  • Marine Sciences & Fisheries (AREA)
  • Zoology (AREA)
  • Animal Husbandry (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2004084170A 2004-03-23 2004-03-23 半導体装置 Expired - Fee Related JP4417150B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2004084170A JP4417150B2 (ja) 2004-03-23 2004-03-23 半導体装置
US11/038,070 US7176557B2 (en) 2004-03-23 2005-01-21 Semiconductor device
TW094102022A TW200536088A (en) 2004-03-23 2005-01-24 Semiconductor device and its production method
TW100129842A TWI505418B (zh) 2004-03-23 2005-01-24 Semiconductor device
CNB2005100082591A CN100466241C (zh) 2004-03-23 2005-02-07 半导体器件
KR1020050011833A KR101103871B1 (ko) 2004-03-23 2005-02-14 반도체장치 및 그 제조방법
US11/653,402 US7339261B2 (en) 2004-03-23 2007-01-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004084170A JP4417150B2 (ja) 2004-03-23 2004-03-23 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009174238A Division JP4987041B2 (ja) 2009-07-27 2009-07-27 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2005276890A JP2005276890A (ja) 2005-10-06
JP2005276890A5 JP2005276890A5 (https=) 2007-05-10
JP4417150B2 true JP4417150B2 (ja) 2010-02-17

Family

ID=34988807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004084170A Expired - Fee Related JP4417150B2 (ja) 2004-03-23 2004-03-23 半導体装置

Country Status (5)

Country Link
US (2) US7176557B2 (https=)
JP (1) JP4417150B2 (https=)
KR (1) KR101103871B1 (https=)
CN (1) CN100466241C (https=)
TW (2) TWI505418B (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4372508B2 (ja) * 2003-10-06 2009-11-25 ローム株式会社 リードフレームの製造方法およびそれを用いた半導体装置の製造方法、ならびに半導体装置ならびにそれを備えた携帯機器および電子装置
JP4942020B2 (ja) * 2006-05-12 2012-05-30 ルネサスエレクトロニクス株式会社 半導体装置
JP2008071927A (ja) * 2006-09-14 2008-03-27 Renesas Technology Corp 半導体装置の製造方法および半導体装置
JP5180495B2 (ja) 2007-03-14 2013-04-10 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US7847376B2 (en) * 2007-07-19 2010-12-07 Renesas Electronics Corporation Semiconductor device and manufacturing method of the same
JP5155644B2 (ja) * 2007-07-19 2013-03-06 ルネサスエレクトロニクス株式会社 半導体装置
US7851897B1 (en) * 2008-06-16 2010-12-14 Maxim Integrated Products, Inc. IC package structures for high power dissipation and low RDSon
JP5549066B2 (ja) * 2008-09-30 2014-07-16 凸版印刷株式会社 リードフレーム型基板とその製造方法、及び半導体装置
JP2010258159A (ja) * 2009-04-23 2010-11-11 Renesas Electronics Corp 半導体装置
JP5380244B2 (ja) * 2009-10-22 2014-01-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5255009B2 (ja) * 2010-02-26 2013-08-07 ルネサスエレクトロニクス株式会社 半導体装置
US8390103B2 (en) 2010-07-12 2013-03-05 Analog Devices, Inc. Apparatus for integrated circuit packaging
JP2012227445A (ja) 2011-04-21 2012-11-15 Renesas Electronics Corp 半導体装置及びその製造方法
JP5204271B2 (ja) * 2011-06-16 2013-06-05 株式会社東芝 内視鏡装置および基板
JP2013093483A (ja) * 2011-10-27 2013-05-16 Semiconductor Components Industries Llc 半導体装置及びその製造方法
JP5798021B2 (ja) * 2011-12-01 2015-10-21 ルネサスエレクトロニクス株式会社 半導体装置
JP5817513B2 (ja) * 2011-12-27 2015-11-18 大日本印刷株式会社 半導体装置製造用リードフレーム及び半導体装置の製造方法
JP5947107B2 (ja) * 2012-05-23 2016-07-06 ルネサスエレクトロニクス株式会社 半導体装置
JP6011083B2 (ja) * 2012-07-09 2016-10-19 日亜化学工業株式会社 発光装置用リードフレームおよびその製造方法ならびに発光装置の製造方法
TWI570858B (zh) * 2014-12-23 2017-02-11 揚智科技股份有限公司 半導體封裝結構
US10083888B2 (en) * 2015-11-19 2018-09-25 Advanced Semiconductor Engineering, Inc. Semiconductor device package
US9847283B1 (en) * 2016-11-06 2017-12-19 Nexperia B.V. Semiconductor device with wettable corner leads
CN111834323B (zh) * 2020-07-29 2025-08-19 北京燕东微电子科技有限公司 一种半导体封装件及其制造方法
KR20230019692A (ko) 2021-08-02 2023-02-09 삼성전자주식회사 칩 온 필름 패키지 및 이를 포함하는 디스플레이 장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2888183B2 (ja) * 1995-11-13 1999-05-10 ヤマハ株式会社 樹脂封止型半導体装置
US6909179B2 (en) * 1996-03-18 2005-06-21 Renesas Technology Corp. Lead frame and semiconductor device using the lead frame and method of manufacturing the same
US5936837A (en) * 1997-08-11 1999-08-10 Motorola, Inc. Semiconductor component having leadframe with offset ground plane
JP2000236060A (ja) * 1999-02-16 2000-08-29 Matsushita Electronics Industry Corp 半導体装置
MY133357A (en) * 1999-06-30 2007-11-30 Hitachi Ltd A semiconductor device and a method of manufacturing the same
JP2001230360A (ja) * 2000-02-18 2001-08-24 Hitachi Ltd 半導体集積回路装置およびその製造方法
JP3786339B2 (ja) * 2000-03-23 2006-06-14 株式会社三井ハイテック 半導体装置の製造方法
JP3640601B2 (ja) 2000-07-11 2005-04-20 セントラル硝子株式会社 フッ素含有化合物ガスの検出方法
SG102638A1 (en) * 2000-09-15 2004-03-26 Samsung Techwin Co Ltd Lead frame, semiconductor package having the same, and semiconductor package manufacturing method
JP2002184927A (ja) * 2000-12-19 2002-06-28 Mitsui High Tec Inc 半導体装置の製造方法
JP2004022725A (ja) * 2002-06-14 2004-01-22 Renesas Technology Corp 半導体装置
KR100975692B1 (ko) * 2002-07-01 2010-08-12 가부시끼가이샤 르네사스 테크놀로지 반도체 장치

Also Published As

Publication number Publication date
KR20060041909A (ko) 2006-05-12
US20070108563A1 (en) 2007-05-17
CN100466241C (zh) 2009-03-04
TWI359484B (https=) 2012-03-01
CN1674268A (zh) 2005-09-28
US7176557B2 (en) 2007-02-13
US7339261B2 (en) 2008-03-04
KR101103871B1 (ko) 2012-01-12
US20050212116A1 (en) 2005-09-29
TWI505418B (zh) 2015-10-21
TW200536088A (en) 2005-11-01
JP2005276890A (ja) 2005-10-06
TW201222744A (en) 2012-06-01

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