SG71685A1 - Component mounting apparatus and method and component mounting equipment - Google Patents
Component mounting apparatus and method and component mounting equipmentInfo
- Publication number
- SG71685A1 SG71685A1 SG1996011033A SG1996011033A SG71685A1 SG 71685 A1 SG71685 A1 SG 71685A1 SG 1996011033 A SG1996011033 A SG 1996011033A SG 1996011033 A SG1996011033 A SG 1996011033A SG 71685 A1 SG71685 A1 SG 71685A1
- Authority
- SG
- Singapore
- Prior art keywords
- component mounting
- equipment
- mounting apparatus
- mounting equipment
- component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49137—Different components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53061—Responsive to work or work-related machine element
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Automatic Assembly (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7286969A JPH09130084A (ja) | 1995-11-06 | 1995-11-06 | 部品実装装置および部品実装設備 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG71685A1 true SG71685A1 (en) | 2000-04-18 |
Family
ID=17711309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996011033A SG71685A1 (en) | 1995-11-06 | 1996-11-05 | Component mounting apparatus and method and component mounting equipment |
Country Status (5)
Country | Link |
---|---|
US (2) | US5778525A (zh) |
JP (1) | JPH09130084A (zh) |
KR (1) | KR100296485B1 (zh) |
CN (5) | CN1096223C (zh) |
SG (1) | SG71685A1 (zh) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7100278B2 (en) | 1995-11-06 | 2006-09-05 | Matsushita Electric Industrial Co., Ltd. | Component mounting apparatus and method |
US6789310B1 (en) * | 1995-11-06 | 2004-09-14 | Matsushita Electric Industrial Co., Ltd. | Component mounting apparatus |
JPH09130084A (ja) | 1995-11-06 | 1997-05-16 | Matsushita Electric Ind Co Ltd | 部品実装装置および部品実装設備 |
JP3549327B2 (ja) * | 1996-03-11 | 2004-08-04 | 松下電器産業株式会社 | 部品装着方法及び部品装着機 |
JPH1065392A (ja) | 1996-08-19 | 1998-03-06 | Matsushita Electric Ind Co Ltd | 電子部品供給装置及び電子部品実装方法 |
US6568069B1 (en) * | 1997-02-24 | 2003-05-27 | Siemens Aktiengesellschaft | Apparatus for manufacture of electrical assemblies |
JPH11289194A (ja) * | 1998-04-06 | 1999-10-19 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
JP4126762B2 (ja) * | 1998-07-30 | 2008-07-30 | 松下電器産業株式会社 | 電子部品の実装方法 |
US6571462B1 (en) * | 1999-04-27 | 2003-06-03 | Matsushita Electric Industrial Co., Ltd | Electronic component mounting apparatus using duplicate sources of components |
KR100311749B1 (ko) * | 1999-05-27 | 2001-10-18 | 정문술 | 표면실장장치의 모듈 헤드 원점조정장치 및 방법 |
DE19925217A1 (de) * | 1999-06-01 | 2000-12-21 | Siemens Ag | Verfahren zum Bestücken von Substraten mit Bauelementen |
JP4346847B2 (ja) * | 1999-06-16 | 2009-10-21 | アッセンブレオン エヌ ヴィ | 部品配置機械 |
KR100328345B1 (ko) * | 1999-09-01 | 2002-03-12 | 정문술 | 표면실장장치 및 그 실장방법 |
CN1204801C (zh) * | 1999-11-05 | 2005-06-01 | 松下电器产业株式会社 | 元器件安装装置及方法 |
EP1284096B1 (de) * | 2000-05-23 | 2004-10-06 | Siemens Aktiengesellschaft | Vorrichtung zum bestücken von substraten mit elektrischen bauteilen |
DE10025443A1 (de) * | 2000-05-23 | 2001-12-06 | Siemens Ag | Vorrichtung zum Bestücken von Substraten mit elektrischen Bauteilen |
JP4762480B2 (ja) | 2000-08-22 | 2011-08-31 | パナソニック株式会社 | 部品実装装置及び方法 |
JP3588444B2 (ja) * | 2000-10-26 | 2004-11-10 | 松下電器産業株式会社 | 電子部品、部品実装装置及び部品実装方法 |
DE10064108A1 (de) * | 2000-12-21 | 2002-07-18 | Siemens Production & Logistics | Bestückkopf und Bestücksystem für eine Bestückvorrichtung zum Bestücken von Bauelementen |
JP4503873B2 (ja) * | 2001-03-30 | 2010-07-14 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP2002299889A (ja) * | 2001-03-30 | 2002-10-11 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
US7043820B2 (en) * | 2001-07-27 | 2006-05-16 | Fuji Machine Mfg. Co., Ltd. | Electric-component mounting system |
US6874225B2 (en) * | 2001-12-18 | 2005-04-05 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus |
JP3973439B2 (ja) * | 2002-02-07 | 2007-09-12 | 松下電器産業株式会社 | 電子部品実装装置及び方法 |
CN101267728B (zh) * | 2002-11-21 | 2011-09-21 | 富士机械制造株式会社 | 元件安装设备 |
JP2004265886A (ja) | 2003-01-15 | 2004-09-24 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
JP3739752B2 (ja) * | 2003-02-07 | 2006-01-25 | 株式会社 ハリーズ | ランダム周期変速可能な小片移載装置 |
CN100488348C (zh) * | 2003-07-03 | 2009-05-13 | 阿森姆布里昂股份有限公司 | 一种元件定位装置 |
JP4408682B2 (ja) * | 2003-10-31 | 2010-02-03 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
DE102004007703B3 (de) * | 2004-02-16 | 2005-06-23 | Mühlbauer Ag | Vorrichtung und Verfahren zum Überprüfen und Umdrehen elektronischer Bauelemente |
JP2006049336A (ja) * | 2004-07-30 | 2006-02-16 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
KR20060069074A (ko) | 2004-12-17 | 2006-06-21 | 삼성전자주식회사 | 액정 표시 장치의 제조 시스템 및 제조 방법 |
DE102005023704A1 (de) * | 2005-05-23 | 2006-11-30 | Siemens Ag | Zuführeinrichtung für elektrische Bauteile, zugehöriges Steuerverfahren und Steuerverfahren für ein entsprechendes Bestücksystem |
JP4733499B2 (ja) * | 2005-10-31 | 2011-07-27 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP4237766B2 (ja) | 2006-02-10 | 2009-03-11 | パナソニック株式会社 | 部品実装機制御方法、部品実装機およびプログラム |
US8407889B2 (en) * | 2006-03-07 | 2013-04-02 | Panasonic Corporation | Component mounting condition determination method |
WO2008015988A1 (en) * | 2006-07-31 | 2008-02-07 | Panasonic Corporation | Component mounting condition determining method |
JP4580972B2 (ja) * | 2006-11-09 | 2010-11-17 | パナソニック株式会社 | 部品実装方法 |
US8156642B2 (en) * | 2007-04-03 | 2012-04-17 | Panasonic Corporation | Component mounting method |
JP4997124B2 (ja) * | 2008-01-21 | 2012-08-08 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着ヘッド及び電子部品装着装置 |
CN101567015B (zh) * | 2008-04-21 | 2011-01-05 | 英业达股份有限公司 | 电路板上元件的配置方法 |
KR100997919B1 (ko) | 2008-11-26 | 2010-12-03 | 세메스 주식회사 | 탭 프리본딩 장치 및 방법 |
TWI512858B (zh) * | 2009-03-23 | 2015-12-11 | Toray Eng Co Ltd | Installation device and installation method |
JP5278122B2 (ja) * | 2009-04-06 | 2013-09-04 | ソニー株式会社 | トレイ供給装置 |
JP5341042B2 (ja) * | 2010-09-14 | 2013-11-13 | パナソニック株式会社 | 電子部品実装装置及び電子部品実装方法 |
US8454067B2 (en) * | 2010-10-28 | 2013-06-04 | Standard Knapp Inc. | Adjustable gripper head assembly |
NL2007777C2 (nl) * | 2011-11-11 | 2013-05-14 | Assembleon Bv | Component-plaatsingsinrichting voorzien van een machineframe en ten minste twee component-opneemeenheden, alsmede werkwijze voor het aandrijven van een dergelijke component-plaatsingsinrichting. |
JP6054685B2 (ja) * | 2012-09-06 | 2016-12-27 | 富士機械製造株式会社 | 電子部品実装機 |
WO2014207861A1 (ja) * | 2013-06-27 | 2014-12-31 | 富士機械製造株式会社 | 部品実装機 |
EP3267780B1 (en) * | 2015-03-06 | 2021-10-27 | FUJI Corporation | Method for optimizing arrangement of part types, and device for optimizing arrangement of part types |
JP6527228B2 (ja) * | 2015-06-24 | 2019-06-05 | 株式会社Fuji | 基板検査機 |
WO2018026085A1 (ko) * | 2016-08-05 | 2018-02-08 | 한화테크윈주식회사 | 본딩 시스템 |
JP7341390B2 (ja) * | 2019-12-19 | 2023-09-11 | Smc株式会社 | ピッチ可変装置 |
EP4178768A1 (en) * | 2020-07-08 | 2023-05-17 | Milara Incorporated | Flexible modular assembly system |
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JPH01187898A (ja) | 1988-01-22 | 1989-07-27 | Toshiba Corp | 物品移載方式およびその装置 |
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JPH0810795B2 (ja) * | 1989-09-06 | 1996-01-31 | 松下電器産業株式会社 | 電子部品の実装装置及び実装方法 |
JP2773307B2 (ja) | 1989-10-17 | 1998-07-09 | 松下電器産業株式会社 | 電子部品の実装方法 |
JP2729845B2 (ja) | 1989-12-28 | 1998-03-18 | 山形カシオ株式会社 | 電子部品搭載装置 |
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JPH0821790B2 (ja) * | 1990-02-15 | 1996-03-04 | 松下電器産業株式会社 | ロータリーヘッド式電子部品実装装置 |
FR2661311B1 (fr) | 1990-04-20 | 1992-08-07 | Eurosoft Robotique | Dispositif et procede de montage automatique de composants electroniques. |
JP2517178B2 (ja) * | 1991-03-04 | 1996-07-24 | 松下電器産業株式会社 | 電子部品の実装方法 |
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US5741114A (en) * | 1992-08-07 | 1998-04-21 | Yamaha Hatsudoki Kabushiki Kaisha | Method for mounting components and apparatus therefor |
JPH0677693A (ja) | 1992-08-25 | 1994-03-18 | Matsushita Electric Ind Co Ltd | 電子部品装着装置 |
JPH0762817B2 (ja) | 1992-10-23 | 1995-07-05 | 日本ネサマック株式会社 | ペングリップ式入力装置 |
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US5323528A (en) * | 1993-06-14 | 1994-06-28 | Amistar Corporation | Surface mount placement system |
JPH0715171A (ja) * | 1993-06-28 | 1995-01-17 | Matsushita Electric Ind Co Ltd | 部品装着装置 |
JPH0722787A (ja) | 1993-06-30 | 1995-01-24 | Matsushita Electric Ind Co Ltd | 電子部品実装設備 |
JP3342119B2 (ja) * | 1993-08-02 | 2002-11-05 | 富士機械製造株式会社 | 電子部品装着システム |
JPH07115296A (ja) * | 1993-10-15 | 1995-05-02 | Sanyo Electric Co Ltd | 部品実装機の制御装置 |
JP3197714B2 (ja) | 1993-11-15 | 2001-08-13 | 三洋電機株式会社 | 部品装着装置 |
JP3313224B2 (ja) * | 1994-01-25 | 2002-08-12 | 松下電器産業株式会社 | 電子部品実装装置 |
JPH0846388A (ja) * | 1994-08-03 | 1996-02-16 | Matsushita Electric Ind Co Ltd | 部品実装装置 |
JPH0878882A (ja) * | 1994-09-02 | 1996-03-22 | Fuji Mach Mfg Co Ltd | 対回路基板トランスファ作業装置 |
US5651176A (en) * | 1995-06-30 | 1997-07-29 | Ma Laboratories, Inc. | Vibratory feeder trays and synchronous mass production apparatus for circuit board fabrication |
JPH09130084A (ja) | 1995-11-06 | 1997-05-16 | Matsushita Electric Ind Co Ltd | 部品実装装置および部品実装設備 |
US5743001A (en) * | 1996-08-16 | 1998-04-28 | Amistar Corporation | Surface mount placement system with single step, multiple place carriage |
-
1995
- 1995-11-06 JP JP7286969A patent/JPH09130084A/ja active Pending
-
1996
- 1996-11-05 SG SG1996011033A patent/SG71685A1/en unknown
- 1996-11-05 US US08/740,992 patent/US5778525A/en not_active Expired - Lifetime
- 1996-11-06 KR KR1019960052338A patent/KR100296485B1/ko not_active IP Right Cessation
- 1996-11-06 CN CN96121623A patent/CN1096223C/zh not_active Expired - Lifetime
- 1996-11-06 CN CNB2005100927545A patent/CN100531549C/zh not_active Expired - Lifetime
- 1996-11-06 CN CNB011244127A patent/CN1223257C/zh not_active Expired - Lifetime
- 1996-11-06 CN CNB2006101018563A patent/CN100521904C/zh not_active Expired - Lifetime
-
2001
- 2001-07-23 CN CNB011244119A patent/CN1214700C/zh not_active Expired - Lifetime
-
2006
- 2006-05-08 US US11/429,063 patent/US7356919B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100531549C (zh) | 2009-08-19 |
US20060200975A1 (en) | 2006-09-14 |
KR100296485B1 (ko) | 2001-10-24 |
JPH09130084A (ja) | 1997-05-16 |
CN1735334A (zh) | 2006-02-15 |
CN1345179A (zh) | 2002-04-17 |
CN1096223C (zh) | 2002-12-11 |
US7356919B2 (en) | 2008-04-15 |
US5778525A (en) | 1998-07-14 |
CN1897807A (zh) | 2007-01-17 |
KR970032352A (ko) | 1997-06-26 |
CN1223257C (zh) | 2005-10-12 |
CN1154058A (zh) | 1997-07-09 |
CN1345178A (zh) | 2002-04-17 |
CN100521904C (zh) | 2009-07-29 |
CN1214700C (zh) | 2005-08-10 |
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