SG161244A1 - Resist underlayer coating forming composition for forming photo- crosslinking cured resist underlayer coating - Google Patents

Resist underlayer coating forming composition for forming photo- crosslinking cured resist underlayer coating

Info

Publication number
SG161244A1
SG161244A1 SG201002399-2A SG2010023992A SG161244A1 SG 161244 A1 SG161244 A1 SG 161244A1 SG 2010023992 A SG2010023992 A SG 2010023992A SG 161244 A1 SG161244 A1 SG 161244A1
Authority
SG
Singapore
Prior art keywords
underlayer coating
resist underlayer
forming
coating
forming composition
Prior art date
Application number
SG201002399-2A
Other languages
English (en)
Inventor
Satoshi Takei
Tetsuya Shinjo
Motohiko Hidaka
Original Assignee
Nissan Chemical Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Ind Ltd filed Critical Nissan Chemical Ind Ltd
Publication of SG161244A1 publication Critical patent/SG161244A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
SG201002399-2A 2005-04-19 2006-04-11 Resist underlayer coating forming composition for forming photo- crosslinking cured resist underlayer coating SG161244A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005120692 2005-04-19
JP2005253922 2005-09-01

Publications (1)

Publication Number Publication Date
SG161244A1 true SG161244A1 (en) 2010-05-27

Family

ID=37214669

Family Applications (2)

Application Number Title Priority Date Filing Date
SG201002399-2A SG161244A1 (en) 2005-04-19 2006-04-11 Resist underlayer coating forming composition for forming photo- crosslinking cured resist underlayer coating
SG2013079140A SG195598A1 (en) 2005-04-19 2006-04-11 Resist underlayer coating forming composition for forming photo-crosslinking cured resist underlayer coating

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2013079140A SG195598A1 (en) 2005-04-19 2006-04-11 Resist underlayer coating forming composition for forming photo-crosslinking cured resist underlayer coating

Country Status (8)

Country Link
US (2) US8426111B2 (zh)
EP (1) EP1879070A4 (zh)
JP (2) JP4993119B2 (zh)
KR (1) KR101366793B1 (zh)
CN (2) CN101164014B (zh)
SG (2) SG161244A1 (zh)
TW (1) TWI391789B (zh)
WO (1) WO2006115044A1 (zh)

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WO2019124514A1 (ja) 2017-12-20 2019-06-27 日産化学株式会社 光硬化性シリコン含有被覆膜形成組成物
US10388510B2 (en) 2018-01-12 2019-08-20 International Business Machines Corporation Wet strippable OPL using reversible UV crosslinking and de-crosslinking
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Also Published As

Publication number Publication date
JPWO2006115044A1 (ja) 2008-12-18
US9134610B2 (en) 2015-09-15
US8426111B2 (en) 2013-04-23
EP1879070A4 (en) 2010-09-29
KR101366793B1 (ko) 2014-02-25
TW200710580A (en) 2007-03-16
JP4993119B2 (ja) 2012-08-08
WO2006115044A1 (ja) 2006-11-02
TWI391789B (zh) 2013-04-01
SG195598A1 (en) 2013-12-30
KR20070120601A (ko) 2007-12-24
JP2012088738A (ja) 2012-05-10
US20130189850A1 (en) 2013-07-25
CN101164014B (zh) 2013-06-12
CN101164014A (zh) 2008-04-16
US20090130594A1 (en) 2009-05-21
EP1879070A1 (en) 2008-01-16
JP5120577B2 (ja) 2013-01-16
CN102621814A (zh) 2012-08-01

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