SG161244A1 - Resist underlayer coating forming composition for forming photo- crosslinking cured resist underlayer coating - Google Patents
Resist underlayer coating forming composition for forming photo- crosslinking cured resist underlayer coatingInfo
- Publication number
- SG161244A1 SG161244A1 SG201002399-2A SG2010023992A SG161244A1 SG 161244 A1 SG161244 A1 SG 161244A1 SG 2010023992 A SG2010023992 A SG 2010023992A SG 161244 A1 SG161244 A1 SG 161244A1
- Authority
- SG
- Singapore
- Prior art keywords
- underlayer coating
- resist underlayer
- forming
- coating
- forming composition
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials For Photolithography (AREA)
- Paints Or Removers (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Polymerisation Methods In General (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005120692 | 2005-04-19 | ||
JP2005253922 | 2005-09-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG161244A1 true SG161244A1 (en) | 2010-05-27 |
Family
ID=37214669
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013079140A SG195598A1 (en) | 2005-04-19 | 2006-04-11 | Resist underlayer coating forming composition for forming photo-crosslinking cured resist underlayer coating |
SG201002399-2A SG161244A1 (en) | 2005-04-19 | 2006-04-11 | Resist underlayer coating forming composition for forming photo- crosslinking cured resist underlayer coating |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013079140A SG195598A1 (en) | 2005-04-19 | 2006-04-11 | Resist underlayer coating forming composition for forming photo-crosslinking cured resist underlayer coating |
Country Status (8)
Country | Link |
---|---|
US (2) | US8426111B2 (zh) |
EP (1) | EP1879070A4 (zh) |
JP (2) | JP4993119B2 (zh) |
KR (1) | KR101366793B1 (zh) |
CN (2) | CN101164014B (zh) |
SG (2) | SG195598A1 (zh) |
TW (1) | TWI391789B (zh) |
WO (1) | WO2006115044A1 (zh) |
Families Citing this family (43)
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KR101436336B1 (ko) * | 2005-12-06 | 2014-09-01 | 닛산 가가쿠 고교 가부시키 가이샤 | 광가교 경화의 레지스트 하층막을 형성하기 위한 규소 함유레지스트 하층막 형성 조성물 |
US8227172B2 (en) | 2006-10-12 | 2012-07-24 | Nissan Chemical Industries, Ltd. | Method of producing semiconductor device using resist underlayer film by photo-crosslinking curing |
CN101946209B (zh) * | 2008-02-18 | 2014-01-22 | 日产化学工业株式会社 | 具有环状氨基的含有硅的形成抗蚀剂下层膜的组合物 |
JP5545429B2 (ja) * | 2008-02-20 | 2014-07-09 | 日産化学工業株式会社 | 光硬化膜形成組成物及び光硬化膜形成方法 |
JP5621982B2 (ja) * | 2008-08-18 | 2014-11-12 | 日産化学工業株式会社 | オニウム基を有するシリコン含有レジスト下層膜形成組成物 |
JP5534230B2 (ja) | 2008-12-19 | 2014-06-25 | 日産化学工業株式会社 | アニオン基を有するシリコン含有レジスト下層膜形成組成物 |
CN102460301B (zh) | 2009-06-02 | 2014-08-06 | 日产化学工业株式会社 | 含有带硫醚键的硅的抗蚀剂下层膜形成用组合物 |
JP5660330B2 (ja) * | 2009-08-19 | 2015-01-28 | 日産化学工業株式会社 | 脂肪族環と芳香族環を含有する樹脂を含むリソグラフィー用レジスト下層膜形成組成物 |
CN102498440B (zh) * | 2009-09-16 | 2016-11-16 | 日产化学工业株式会社 | 含有具有磺酰胺基的硅的形成抗蚀剂下层膜的组合物 |
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WO2011102470A1 (ja) | 2010-02-19 | 2011-08-25 | 日産化学工業株式会社 | 窒素含有環を有するシリコン含有レジスト下層膜形成組成物 |
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CN107406713B (zh) * | 2015-04-03 | 2021-05-25 | 日产化学工业株式会社 | 具有光交联基的高低差基板被覆用组合物 |
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2006
- 2006-04-11 EP EP06731612A patent/EP1879070A4/en not_active Withdrawn
- 2006-04-11 CN CN2006800132803A patent/CN101164014B/zh active Active
- 2006-04-11 CN CN2012100607212A patent/CN102621814A/zh active Pending
- 2006-04-11 SG SG2013079140A patent/SG195598A1/en unknown
- 2006-04-11 JP JP2007514552A patent/JP4993119B2/ja active Active
- 2006-04-11 US US11/918,135 patent/US8426111B2/en active Active
- 2006-04-11 SG SG201002399-2A patent/SG161244A1/en unknown
- 2006-04-11 KR KR1020077026292A patent/KR101366793B1/ko active IP Right Grant
- 2006-04-11 WO PCT/JP2006/307665 patent/WO2006115044A1/ja active Application Filing
- 2006-04-18 TW TW095113823A patent/TWI391789B/zh active
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2012
- 2012-01-10 JP JP2012002242A patent/JP5120577B2/ja active Active
-
2013
- 2013-03-12 US US13/797,009 patent/US9134610B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20130189850A1 (en) | 2013-07-25 |
CN101164014A (zh) | 2008-04-16 |
JP4993119B2 (ja) | 2012-08-08 |
JPWO2006115044A1 (ja) | 2008-12-18 |
KR20070120601A (ko) | 2007-12-24 |
TW200710580A (en) | 2007-03-16 |
SG195598A1 (en) | 2013-12-30 |
WO2006115044A1 (ja) | 2006-11-02 |
CN101164014B (zh) | 2013-06-12 |
JP2012088738A (ja) | 2012-05-10 |
EP1879070A1 (en) | 2008-01-16 |
US8426111B2 (en) | 2013-04-23 |
CN102621814A (zh) | 2012-08-01 |
US20090130594A1 (en) | 2009-05-21 |
JP5120577B2 (ja) | 2013-01-16 |
EP1879070A4 (en) | 2010-09-29 |
TWI391789B (zh) | 2013-04-01 |
US9134610B2 (en) | 2015-09-15 |
KR101366793B1 (ko) | 2014-02-25 |
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