SG122972A1 - Method for manufacturing compound material wafers - Google Patents

Method for manufacturing compound material wafers

Info

Publication number
SG122972A1
SG122972A1 SG200508509A SG200508509A SG122972A1 SG 122972 A1 SG122972 A1 SG 122972A1 SG 200508509 A SG200508509 A SG 200508509A SG 200508509 A SG200508509 A SG 200508509A SG 122972 A1 SG122972 A1 SG 122972A1
Authority
SG
Singapore
Prior art keywords
donor substrate
compound material
substrate
initial
initial donor
Prior art date
Application number
SG200508509A
Other languages
English (en)
Inventor
Frederic Dupont
Original Assignee
Soitec Silicon On Insulator
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec Silicon On Insulator filed Critical Soitec Silicon On Insulator
Publication of SG122972A1 publication Critical patent/SG122972A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02032—Preparing bulk and homogeneous wafers by reclaiming or re-processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/93—Ternary or quaternary semiconductor comprised of elements from three different groups, e.g. I-III-V
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/933—Germanium or silicon or Ge-Si on III-V

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
SG200508509A 2004-11-09 2005-11-08 Method for manufacturing compound material wafers SG122972A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04292655A EP1667223B1 (fr) 2004-11-09 2004-11-09 Méthode de fabrication de plaquettes composites

Publications (1)

Publication Number Publication Date
SG122972A1 true SG122972A1 (en) 2006-06-29

Family

ID=34931512

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200508509A SG122972A1 (en) 2004-11-09 2005-11-08 Method for manufacturing compound material wafers

Country Status (9)

Country Link
US (3) US7531428B2 (fr)
EP (2) EP1962340A3 (fr)
JP (1) JP4489671B2 (fr)
KR (1) KR100746182B1 (fr)
CN (2) CN101221895B (fr)
AT (1) ATE420461T1 (fr)
DE (1) DE602004018951D1 (fr)
SG (1) SG122972A1 (fr)
TW (2) TWI367544B (fr)

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JP4489671B2 (ja) 2010-06-23
CN101221895A (zh) 2008-07-16
KR100746182B1 (ko) 2007-08-03
CN100426459C (zh) 2008-10-15
EP1667223A1 (fr) 2006-06-07
DE602004018951D1 (de) 2009-02-26
US7531428B2 (en) 2009-05-12
US20090191719A1 (en) 2009-07-30
EP1962340A3 (fr) 2009-12-23
CN1790620A (zh) 2006-06-21
TW200616014A (en) 2006-05-16
ATE420461T1 (de) 2009-01-15
TW200824037A (en) 2008-06-01
EP1962340A2 (fr) 2008-08-27
TWI303842B (en) 2008-12-01
CN101221895B (zh) 2014-04-23
TWI367544B (en) 2012-07-01
JP2006140445A (ja) 2006-06-01
US20060099776A1 (en) 2006-05-11
KR20060052446A (ko) 2006-05-19
US20110049528A1 (en) 2011-03-03
US7968909B2 (en) 2011-06-28
US7851330B2 (en) 2010-12-14
EP1667223B1 (fr) 2009-01-07

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