SG108997A1 - Lithographic apparatus and device manufacturing method - Google Patents
Lithographic apparatus and device manufacturing methodInfo
- Publication number
- SG108997A1 SG108997A1 SG200404366A SG200404366A SG108997A1 SG 108997 A1 SG108997 A1 SG 108997A1 SG 200404366 A SG200404366 A SG 200404366A SG 200404366 A SG200404366 A SG 200404366A SG 108997 A1 SG108997 A1 SG 108997A1
- Authority
- SG
- Singapore
- Prior art keywords
- device manufacturing
- lithographic apparatus
- lithographic
- manufacturing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03255228A EP1500982A1 (fr) | 2003-07-24 | 2003-07-24 | Appareil lithographique et méthode de fabrication d'un dispositif |
Publications (1)
Publication Number | Publication Date |
---|---|
SG108997A1 true SG108997A1 (en) | 2005-02-28 |
Family
ID=33484041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200404366A SG108997A1 (en) | 2003-07-24 | 2004-07-22 | Lithographic apparatus and device manufacturing method |
Country Status (8)
Country | Link |
---|---|
US (8) | US7184122B2 (fr) |
EP (2) | EP1500982A1 (fr) |
JP (1) | JP4037391B2 (fr) |
KR (1) | KR100649176B1 (fr) |
CN (2) | CN100568103C (fr) |
DE (1) | DE602004032091D1 (fr) |
SG (1) | SG108997A1 (fr) |
TW (1) | TWI245171B (fr) |
Families Citing this family (66)
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CN100568101C (zh) * | 2002-11-12 | 2009-12-09 | Asml荷兰有限公司 | 光刻装置和器件制造方法 |
US9482966B2 (en) | 2002-11-12 | 2016-11-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10503084B2 (en) | 2002-11-12 | 2019-12-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
DE10261775A1 (de) | 2002-12-20 | 2004-07-01 | Carl Zeiss Smt Ag | Vorrichtung zur optischen Vermessung eines Abbildungssystems |
SG2012031217A (en) | 2003-04-11 | 2015-09-29 | Nippon Kogaku Kk | Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly |
US7213963B2 (en) | 2003-06-09 | 2007-05-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI409853B (zh) | 2003-06-13 | 2013-09-21 | 尼康股份有限公司 | An exposure method, a substrate stage, an exposure apparatus, and an element manufacturing method |
KR101289979B1 (ko) | 2003-06-19 | 2013-07-26 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조방법 |
EP1500982A1 (fr) * | 2003-07-24 | 2005-01-26 | ASML Netherlands B.V. | Appareil lithographique et méthode de fabrication d'un dispositif |
WO2005010960A1 (fr) * | 2003-07-25 | 2005-02-03 | Nikon Corporation | Systeme d'inspection , dispositif d'inspection et procede de production pour systeme de projection optique |
KR101343720B1 (ko) * | 2003-07-28 | 2013-12-20 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법, 그리고 노광 장치의제어 방법 |
US7779781B2 (en) | 2003-07-31 | 2010-08-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI263859B (en) | 2003-08-29 | 2006-10-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
KR101419192B1 (ko) * | 2003-08-29 | 2014-07-15 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
KR101523180B1 (ko) | 2003-09-03 | 2015-05-26 | 가부시키가이샤 니콘 | 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법 |
JP4444920B2 (ja) * | 2003-09-19 | 2010-03-31 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
JP5136566B2 (ja) * | 2003-09-29 | 2013-02-06 | 株式会社ニコン | 露光装置及び露光方法並びにデバイス製造方法 |
TWI610342B (zh) | 2003-09-29 | 2018-01-01 | 曝光裝置及曝光方法、以及元件製造方法 | |
KR20060126949A (ko) | 2003-10-08 | 2006-12-11 | 가부시키가이샤 니콘 | 기판 반송 장치와 기판 반송 방법, 노광 장치와 노광 방법,및 디바이스 제조 방법 |
JP2005136364A (ja) * | 2003-10-08 | 2005-05-26 | Zao Nikon Co Ltd | 基板搬送装置、露光装置、並びにデバイス製造方法 |
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TW201738932A (zh) * | 2003-10-09 | 2017-11-01 | Nippon Kogaku Kk | 曝光裝置及曝光方法、元件製造方法 |
CN100461336C (zh) | 2003-10-31 | 2009-02-11 | 株式会社尼康 | 曝光装置以及器件制造方法 |
EP1699072B1 (fr) * | 2003-12-03 | 2016-08-31 | Nikon Corporation | Appareil et procédé d'exposition |
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KR101276392B1 (ko) | 2004-02-03 | 2013-06-19 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
US8054448B2 (en) * | 2004-05-04 | 2011-11-08 | Nikon Corporation | Apparatus and method for providing fluid for immersion lithography |
WO2005119368A2 (fr) | 2004-06-04 | 2005-12-15 | Carl Zeiss Smt Ag | Systeme permettant de mesurer la qualite d'une image d'un systeme d'imagerie optique |
US7463330B2 (en) | 2004-07-07 | 2008-12-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8384874B2 (en) * | 2004-07-12 | 2013-02-26 | Nikon Corporation | Immersion exposure apparatus and device manufacturing method to detect if liquid on base member |
CN105204296B (zh) * | 2004-08-03 | 2018-07-17 | 株式会社尼康 | 曝光装置的控制方法、曝光装置及元件制造方法 |
US7701550B2 (en) | 2004-08-19 | 2010-04-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7397533B2 (en) * | 2004-12-07 | 2008-07-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8692973B2 (en) * | 2005-01-31 | 2014-04-08 | Nikon Corporation | Exposure apparatus and method for producing device |
EP1863070B1 (fr) | 2005-01-31 | 2016-04-27 | Nikon Corporation | Appareil d'exposition et methode de fabrication d'un dispositif |
KR101211570B1 (ko) | 2005-02-10 | 2012-12-12 | 에이에스엠엘 네델란즈 비.브이. | 침지 액체, 노광 장치, 및 노광 프로세스 |
US7282701B2 (en) * | 2005-02-28 | 2007-10-16 | Asml Netherlands B.V. | Sensor for use in a lithographic apparatus |
US7324185B2 (en) | 2005-03-04 | 2008-01-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7525638B2 (en) * | 2005-03-23 | 2009-04-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
USRE43576E1 (en) | 2005-04-08 | 2012-08-14 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
JP2006303193A (ja) | 2005-04-20 | 2006-11-02 | Canon Inc | 露光装置、較正方法、およびデバイス製造方法 |
US7317507B2 (en) * | 2005-05-03 | 2008-01-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8248577B2 (en) | 2005-05-03 | 2012-08-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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CN101258581B (zh) * | 2005-09-09 | 2011-05-11 | 株式会社尼康 | 曝光装置及曝光方法以及设备制造方法 |
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CN100590173C (zh) * | 2006-03-24 | 2010-02-17 | 北京有色金属研究总院 | 一种荧光粉及其制造方法和所制成的电光源 |
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US9176393B2 (en) * | 2008-05-28 | 2015-11-03 | Asml Netherlands B.V. | Lithographic apparatus and a method of operating the apparatus |
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WO2013156236A1 (fr) * | 2012-04-19 | 2013-10-24 | Asml Netherlands B.V. | Support de substrat, appareil lithographique et procédé de fabrication de dispositif |
CN104321702B (zh) * | 2012-05-22 | 2016-11-23 | Asml荷兰有限公司 | 传感器、光刻设备以及器件制造方法 |
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JP6731118B2 (ja) | 2016-12-22 | 2020-07-29 | エーエスエムエル ネザーランズ ビー.ブイ. | 剥離耐性を向上させた上部層を有するオブジェクトを備えたリソグラフィ装置 |
CN106831787B (zh) | 2017-01-20 | 2018-10-23 | 成都倍特药业有限公司 | 用作布鲁顿酪氨酸激酶抑制剂的化合物及其制备方法和应用 |
US10976196B2 (en) | 2017-03-15 | 2021-04-13 | Asml Netherlands B.V. | Sensor mark and a method of manufacturing a sensor mark |
EP3646116B1 (fr) | 2017-06-29 | 2023-12-13 | ASML Netherlands B.V. | Système, appareil lithographique et procédé de réduction d'oxydation ou d'élimination d'oxyde sur un support de substrat |
US10871715B2 (en) | 2018-12-06 | 2020-12-22 | Asml Netherlands B.V. | Lithographic apparatus and a device manufacturing method |
EP3956728A1 (fr) | 2019-04-16 | 2022-02-23 | ASML Netherlands B.V. | Détecteur d'image pour lithographie par immersion |
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-
2003
- 2003-07-24 EP EP03255228A patent/EP1500982A1/fr not_active Withdrawn
-
2004
- 2004-07-12 TW TW093120784A patent/TWI245171B/zh not_active IP Right Cessation
- 2004-07-12 US US10/888,514 patent/US7184122B2/en not_active Expired - Lifetime
- 2004-07-12 EP EP04254151A patent/EP1500986B1/fr not_active Expired - Lifetime
- 2004-07-12 DE DE602004032091T patent/DE602004032091D1/de not_active Expired - Lifetime
- 2004-07-22 SG SG200404366A patent/SG108997A1/en unknown
- 2004-07-23 CN CNB2004100590838A patent/CN100568103C/zh not_active Expired - Lifetime
- 2004-07-23 JP JP2004215042A patent/JP4037391B2/ja not_active Expired - Fee Related
- 2004-07-23 CN CN2009102115155A patent/CN101694564B/zh not_active Expired - Lifetime
- 2004-07-23 KR KR1020040057634A patent/KR100649176B1/ko active IP Right Grant
-
2006
- 2006-12-20 US US11/641,730 patent/US7557901B2/en not_active Expired - Fee Related
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2009
- 2009-06-04 US US12/478,552 patent/US8711333B2/en active Active
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2014
- 2014-04-25 US US14/262,295 patent/US9213247B2/en not_active Expired - Fee Related
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2015
- 2015-11-13 US US14/941,320 patent/US9594308B2/en not_active Expired - Lifetime
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2017
- 2017-03-07 US US15/452,403 patent/US9804509B2/en not_active Expired - Fee Related
- 2017-10-26 US US15/795,227 patent/US10146143B2/en not_active Expired - Lifetime
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2018
- 2018-11-21 US US16/197,461 patent/US10444644B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20050012176A (ko) | 2005-01-31 |
US20180046095A1 (en) | 2018-02-15 |
JP2005045265A (ja) | 2005-02-17 |
KR100649176B1 (ko) | 2006-11-24 |
CN100568103C (zh) | 2009-12-09 |
JP4037391B2 (ja) | 2008-01-23 |
US7557901B2 (en) | 2009-07-07 |
US20190086820A1 (en) | 2019-03-21 |
TW200508817A (en) | 2005-03-01 |
EP1500982A1 (fr) | 2005-01-26 |
US20090251674A1 (en) | 2009-10-08 |
US9594308B2 (en) | 2017-03-14 |
US10444644B2 (en) | 2019-10-15 |
US8711333B2 (en) | 2014-04-29 |
US20170176876A1 (en) | 2017-06-22 |
TWI245171B (en) | 2005-12-11 |
US20160070178A1 (en) | 2016-03-10 |
US20070097343A1 (en) | 2007-05-03 |
DE602004032091D1 (de) | 2011-05-19 |
US9804509B2 (en) | 2017-10-31 |
US10146143B2 (en) | 2018-12-04 |
US20140313494A1 (en) | 2014-10-23 |
CN1577100A (zh) | 2005-02-09 |
US7184122B2 (en) | 2007-02-27 |
CN101694564A (zh) | 2010-04-14 |
EP1500986B1 (fr) | 2011-04-06 |
US9213247B2 (en) | 2015-12-15 |
CN101694564B (zh) | 2012-07-04 |
US20050041225A1 (en) | 2005-02-24 |
EP1500986A1 (fr) | 2005-01-26 |
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