SG102037A1 - Device and method for conveying and holding plate-like member - Google Patents

Device and method for conveying and holding plate-like member

Info

Publication number
SG102037A1
SG102037A1 SG200200839A SG200200839A SG102037A1 SG 102037 A1 SG102037 A1 SG 102037A1 SG 200200839 A SG200200839 A SG 200200839A SG 200200839 A SG200200839 A SG 200200839A SG 102037 A1 SG102037 A1 SG 102037A1
Authority
SG
Singapore
Prior art keywords
conveying
holding plate
holding
plate
Prior art date
Application number
SG200200839A
Other languages
English (en)
Inventor
Kabeshita Akira
Okuda Osamu
Mimura Naoto
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG102037A1 publication Critical patent/SG102037A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
SG200200839A 1999-05-21 2000-05-19 Device and method for conveying and holding plate-like member SG102037A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14159799 1999-05-21

Publications (1)

Publication Number Publication Date
SG102037A1 true SG102037A1 (en) 2004-02-27

Family

ID=15295719

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200200838A SG111046A1 (en) 1999-05-21 2000-05-19 Device and method for conveying and holding plate-like member
SG200200839A SG102037A1 (en) 1999-05-21 2000-05-19 Device and method for conveying and holding plate-like member

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG200200838A SG111046A1 (en) 1999-05-21 2000-05-19 Device and method for conveying and holding plate-like member

Country Status (9)

Country Link
US (3) US6988612B1 (zh)
EP (2) EP1940215A3 (zh)
JP (2) JP4523217B2 (zh)
KR (1) KR100532015B1 (zh)
CN (2) CN1258312C (zh)
DE (1) DE60038292T2 (zh)
SG (2) SG111046A1 (zh)
TW (1) TW474122B (zh)
WO (1) WO2001026440A1 (zh)

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JP4970023B2 (ja) * 2006-12-25 2012-07-04 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
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JP4832410B2 (ja) * 2007-11-30 2011-12-07 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
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JP5342159B2 (ja) 2008-03-25 2013-11-13 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP4935745B2 (ja) * 2008-04-10 2012-05-23 パナソニック株式会社 粘性体の試し塗布装置
JP5199947B2 (ja) * 2009-05-20 2013-05-15 ヤマハ発動機株式会社 部品実装装置
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JP5083701B2 (ja) * 2011-01-31 2012-11-28 アキム株式会社 部品搬送装置
JP5432950B2 (ja) * 2011-05-11 2014-03-05 ヤマハ発動機株式会社 基板製造装置および印刷機
JP5723221B2 (ja) * 2011-05-31 2015-05-27 ヤマハ発動機株式会社 スクリーン印刷装置
JP5752998B2 (ja) * 2011-05-31 2015-07-22 ヤマハ発動機株式会社 スクリーン印刷装置
KR101353587B1 (ko) * 2011-10-25 2014-01-23 김창남 웨이퍼 이송장치
JP5746610B2 (ja) * 2011-12-22 2015-07-08 ヤマハ発動機株式会社 部品撮像装置および同装置を備えた部品実装装置
WO2014004838A2 (en) * 2012-06-28 2014-01-03 Universal Instruments Corporation Flexible assembly machine, system and method
JP5870863B2 (ja) * 2012-06-29 2016-03-01 オムロン株式会社 基板検査装置
JP6166903B2 (ja) 2013-01-11 2017-07-19 ヤマハ発動機株式会社 電子部品実装装置
CN103128590B (zh) * 2013-03-12 2015-09-16 宁夏巨能机器人系统有限公司 抽屉料仓纯机械式抓取定位装置
EP3021648B1 (en) 2013-07-08 2019-03-06 FUJI Corporation Substrate stopping-position determination method and substrate stopping-position determination device
JP6191006B2 (ja) * 2013-07-12 2017-09-06 パナソニックＩｐマネジメント株式会社 部品実装装置
JP6106065B2 (ja) * 2013-11-05 2017-03-29 ヤマハ発動機株式会社 部品実装装置
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CN106105419B (zh) 2014-04-02 2019-03-08 株式会社富士 元件安装机
US9839169B2 (en) * 2014-04-07 2017-12-05 Yamaha Hatsudoki Kabushiki Kaisha Printed board transport apparatus
JP6403435B2 (ja) * 2014-05-28 2018-10-10 ヤマハ発動機株式会社 部品実装装置、部品実装方法および実装データの修正方法
JP6315803B2 (ja) * 2014-07-18 2018-04-25 ヤマハ発動機株式会社 部品実装装置および搬送装置
DE102015108448B3 (de) * 2015-05-28 2016-05-12 Asm Assembly Systems Gmbh & Co. Kg Fördervorrichtung und Verfahren zum Fördern von Substraten für einen Bestückautomaten
EP3331338B1 (en) 2015-07-29 2022-06-29 FUJI Corporation Component mounting machine
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US11116121B2 (en) 2017-01-06 2021-09-07 Yamaha Hatsudoki Kabushiki Kaisha Mounting target working device
JP6793050B2 (ja) * 2017-01-30 2020-12-02 ヤマハ発動機株式会社 表面実装機
DE102017102700A1 (de) 2017-02-10 2018-09-13 Atg Luther & Maelzer Gmbh Prüfvorrichtung und Verfahren zum Prüfen von Leiterplatten
WO2019069438A1 (ja) * 2017-10-06 2019-04-11 株式会社Ｆｕｊｉ 対基板作業システム
CN107797210A (zh) * 2017-10-17 2018-03-13 安徽电信器材贸易工业有限责任公司 一种光缆排列装置
CN108357940A (zh) * 2018-02-12 2018-08-03 黄晓静 一种医疗手术器械清洗消毒用自动化输送装置
JP6945721B2 (ja) * 2018-03-15 2021-10-06 株式会社Ｆｕｊｉ 実装関連装置及び実装システム
CN108463101A (zh) * 2018-05-22 2018-08-28 深圳中科工控智能科技有限公司 全自动高速按键插件机
CN112262620B (zh) * 2018-06-13 2022-06-17 株式会社富士 对基板作业机
CN108910469B (zh) * 2018-07-27 2020-04-10 温州大学 薄片激光自动检测设备
CN110282341A (zh) * 2019-06-25 2019-09-27 英业达科技有限公司 取放装置
CN114208410B (zh) * 2019-08-01 2023-10-13 株式会社富士 自动搬运装置和具备该自动搬运装置的生产系统
JP7381250B2 (ja) * 2019-08-21 2023-11-15 株式会社Fuji 部品装着機
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JP7300003B2 (ja) * 2019-09-23 2023-06-28 常州銘賽机器人科技股▲フン▼有限公司 軌道機構用の幅調節装置及び幅調節方法
CN112770621A (zh) * 2019-11-02 2021-05-07 陈斌 一种同步贴装台式贴片机
EP4163233A1 (de) * 2021-10-08 2023-04-12 thyssenkrupp Automotive Body Solutions GmbH Rollenbahnsystem und verfahren zum verbringen eines rollenbahnsystems von einem betriebszustand in einen wartungszustand
DE102021129127A1 (de) * 2021-11-09 2023-05-11 Ersa Gmbh Transportsystem zum Transportieren von Lötgut durch eine Lötanlage und Lötanlage
CN114803515B (zh) * 2022-06-13 2023-04-25 青岛融合装备科技有限公司 一种玻璃基板缓存装置

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Also Published As

Publication number Publication date
US20050204553A1 (en) 2005-09-22
EP1185156A4 (en) 2005-11-30
JP2010157767A (ja) 2010-07-15
CN1351817A (zh) 2002-05-29
EP1940215A3 (en) 2011-03-16
KR20010113949A (ko) 2001-12-28
US6988612B1 (en) 2006-01-24
WO2001026440A1 (fr) 2001-04-12
US7219787B2 (en) 2007-05-22
JP4523217B2 (ja) 2010-08-11
US7077262B2 (en) 2006-07-18
DE60038292D1 (de) 2008-04-24
CN1838871A (zh) 2006-09-27
DE60038292T2 (de) 2009-03-12
EP1185156B1 (en) 2008-03-12
SG111046A1 (en) 2005-05-30
US20050133346A1 (en) 2005-06-23
KR100532015B1 (ko) 2005-11-29
JP4975845B2 (ja) 2012-07-11
CN100566537C (zh) 2009-12-02
EP1185156A1 (en) 2002-03-06
CN1258312C (zh) 2006-05-31
EP1940215A2 (en) 2008-07-02
TW474122B (en) 2002-01-21

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