SG10201903542TA - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- SG10201903542TA SG10201903542TA SG10201903542TA SG10201903542TA SG10201903542TA SG 10201903542T A SG10201903542T A SG 10201903542TA SG 10201903542T A SG10201903542T A SG 10201903542TA SG 10201903542T A SG10201903542T A SG 10201903542TA SG 10201903542T A SG10201903542T A SG 10201903542TA
- Authority
- SG
- Singapore
- Prior art keywords
- circuit
- semiconductor
- switching element
- power supply
- supply voltage
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Geometry (AREA)
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Electroluminescent Light Sources (AREA)
- Static Random-Access Memory (AREA)
- Dram (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009250665 | 2009-10-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201903542TA true SG10201903542TA (en) | 2019-05-30 |
Family
ID=43921812
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201903542TA SG10201903542TA (en) | 2009-10-30 | 2010-10-06 | Semiconductor device |
SG10201406989QA SG10201406989QA (en) | 2009-10-30 | 2010-10-06 | Semiconductor device |
SG2012013652A SG178895A1 (en) | 2009-10-30 | 2010-10-06 | Semiconductor device |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201406989QA SG10201406989QA (en) | 2009-10-30 | 2010-10-06 | Semiconductor device |
SG2012013652A SG178895A1 (en) | 2009-10-30 | 2010-10-06 | Semiconductor device |
Country Status (10)
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101770976B1 (ko) | 2009-12-11 | 2017-08-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
KR20190018049A (ko) * | 2010-03-08 | 2019-02-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치를 제작하는 방법 |
US8541781B2 (en) * | 2011-03-10 | 2013-09-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
CN102646592B (zh) * | 2011-05-03 | 2014-12-03 | 京东方科技集团股份有限公司 | 薄膜场效应晶体管器件及其制备方法 |
WO2012157472A1 (en) * | 2011-05-13 | 2012-11-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP6091083B2 (ja) | 2011-05-20 | 2017-03-08 | 株式会社半導体エネルギー研究所 | 記憶装置 |
US20120298998A1 (en) | 2011-05-25 | 2012-11-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming oxide semiconductor film, semiconductor device, and method for manufacturing semiconductor device |
KR20140003315A (ko) | 2011-06-08 | 2014-01-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 스퍼터링 타겟, 스퍼터링 타겟의 제조 방법 및 박막의 형성 방법 |
JP6005401B2 (ja) * | 2011-06-10 | 2016-10-12 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
KR20140086954A (ko) * | 2011-10-28 | 2014-07-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
US8907392B2 (en) * | 2011-12-22 | 2014-12-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device including stacked sub memory cells |
US9859114B2 (en) * | 2012-02-08 | 2018-01-02 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor device with an oxygen-controlling insulating layer |
JP6034048B2 (ja) * | 2012-04-23 | 2016-11-30 | 株式会社半導体エネルギー研究所 | 表示装置、電子機器 |
JP6243136B2 (ja) | 2012-05-02 | 2017-12-06 | 株式会社半導体エネルギー研究所 | スイッチングコンバータ |
JP2014057298A (ja) | 2012-08-10 | 2014-03-27 | Semiconductor Energy Lab Co Ltd | 半導体装置の駆動方法 |
TWI581404B (zh) | 2012-08-10 | 2017-05-01 | 半導體能源研究所股份有限公司 | 半導體裝置以及該半導體裝置的驅動方法 |
JP2014057296A (ja) | 2012-08-10 | 2014-03-27 | Semiconductor Energy Lab Co Ltd | 半導体装置の駆動方法 |
TWI600157B (zh) | 2012-11-16 | 2017-09-21 | 半導體能源研究所股份有限公司 | 半導體裝置 |
US9034217B2 (en) * | 2013-06-07 | 2015-05-19 | Ngk Insulators, Ltd. | Voltage nonlinear resistor |
CN103474473B (zh) * | 2013-09-10 | 2016-02-03 | 深圳市华星光电技术有限公司 | 一种薄膜晶体管开关及其制造方法 |
US9257290B2 (en) * | 2013-12-25 | 2016-02-09 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Low temperature poly-silicon thin film transistor and manufacturing method thereof |
US9443876B2 (en) | 2014-02-05 | 2016-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display device including the semiconductor device, display module including the display device, and electronic device including the semiconductor device, the display device, and the display module |
US9881986B2 (en) | 2014-02-24 | 2018-01-30 | Lg Display Co., Ltd. | Thin film transistor substrate and display using the same |
US10186528B2 (en) | 2014-02-24 | 2019-01-22 | Lg Display Co., Ltd. | Thin film transistor substrate and display using the same |
US10985196B2 (en) | 2014-02-24 | 2021-04-20 | Lg Display Co., Ltd. | Thin film transistor substrate with intermediate insulating layer and display using the same |
EP2911199B1 (en) | 2014-02-24 | 2020-05-06 | LG Display Co., Ltd. | Thin film transistor substrate and display using the same |
EP2911202B1 (en) | 2014-02-24 | 2019-02-20 | LG Display Co., Ltd. | Thin film transistor substrate and display using the same |
US10325937B2 (en) | 2014-02-24 | 2019-06-18 | Lg Display Co., Ltd. | Thin film transistor substrate with intermediate insulating layer and display using the same |
EP2911195B1 (en) | 2014-02-24 | 2020-05-27 | LG Display Co., Ltd. | Thin film transistor substrate and display using the same |
US9214508B2 (en) | 2014-02-24 | 2015-12-15 | Lg Display Co., Ltd. | Thin film transistor substrate with intermediate insulating layer and display using the same |
JP6150752B2 (ja) * | 2014-03-14 | 2017-06-21 | 株式会社日本製鋼所 | 酸化物系半導体材料および半導体素子 |
WO2015159179A1 (en) * | 2014-04-18 | 2015-10-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device |
JP6418794B2 (ja) * | 2014-06-09 | 2018-11-07 | 東京エレクトロン株式会社 | 改質処理方法及び半導体装置の製造方法 |
US10020336B2 (en) | 2015-12-28 | 2018-07-10 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device and electronic device using three dimentional (3D) integration |
JP2017162852A (ja) * | 2016-03-07 | 2017-09-14 | 株式会社ジャパンディスプレイ | 半導体装置および表示装置 |
KR102458660B1 (ko) * | 2016-08-03 | 2022-10-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 전자 기기 |
CN106129122B (zh) * | 2016-08-31 | 2018-12-11 | 京东方科技集团股份有限公司 | 氧化物薄膜晶体管及其制备方法、阵列基板、显示装置 |
JP6832656B2 (ja) * | 2016-09-14 | 2021-02-24 | 株式会社ジャパンディスプレイ | 半導体装置の製造方法 |
CN110476200B (zh) * | 2017-03-29 | 2021-11-16 | 夏普株式会社 | Tft基板、tft基板的制造方法、显示装置 |
US10340387B2 (en) * | 2017-09-20 | 2019-07-02 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Low temperature poly-silicon thin film transistor, manufacturing method thereof, and array substrate |
TWI677741B (zh) * | 2018-11-12 | 2019-11-21 | 友達光電股份有限公司 | 顯示裝置 |
EP3745471A1 (en) * | 2019-05-31 | 2020-12-02 | OSRAM Opto Semiconductors GmbH | Method of laser treatment of a semiconductor wafer comprising algainp-leds to increase their light generating efficiency |
KR20220028008A (ko) | 2019-07-04 | 2022-03-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 촬상 장치 및 전자 기기 |
JP6861871B2 (ja) * | 2020-04-14 | 2021-04-21 | 株式会社半導体エネルギー研究所 | 表示装置 |
KR102807777B1 (ko) * | 2020-12-28 | 2025-05-14 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
CN113921048B (zh) * | 2021-10-19 | 2025-03-25 | 吉林大学 | 基于二位晶体管存储器的可进行四进制逻辑运算的集成电路 |
CN114823327B (zh) * | 2022-05-10 | 2025-09-02 | 北京燕东微电子科技有限公司 | 半导体器件的热氧化方法和制造方法 |
CN115792559B (zh) * | 2022-11-02 | 2025-08-29 | 长鑫存储技术有限公司 | 扫描速度确定方法及装置、电子设备和存储介质 |
Family Cites Families (66)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60154549A (ja) * | 1984-01-24 | 1985-08-14 | Fujitsu Ltd | 半導体装置の製造方法 |
JPH0792500A (ja) * | 1993-06-29 | 1995-04-07 | Toshiba Corp | 半導体装置 |
JPH08264798A (ja) * | 1995-03-23 | 1996-10-11 | Semiconductor Energy Lab Co Ltd | 半導体装置および半導体装置作製方法 |
US7348227B1 (en) * | 1995-03-23 | 2008-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
JP3633061B2 (ja) * | 1995-10-19 | 2005-03-30 | 三菱電機株式会社 | 半導体集積回路装置 |
JP4086925B2 (ja) * | 1996-12-27 | 2008-05-14 | 株式会社半導体エネルギー研究所 | アクティブマトリクスディスプレイ |
JPH11233789A (ja) * | 1998-02-12 | 1999-08-27 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
JP2000243851A (ja) * | 1999-02-17 | 2000-09-08 | Hitachi Ltd | 半導体集積回路装置 |
EP2256808A2 (en) * | 1999-04-30 | 2010-12-01 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device and manufacturing method therof |
TW567363B (en) * | 1999-05-14 | 2003-12-21 | Seiko Epson Corp | Method for driving electrooptical device, drive circuit, electrooptical device, and electronic device |
JP2001053599A (ja) * | 1999-08-12 | 2001-02-23 | Nec Corp | 半導体集積回路 |
JP3735855B2 (ja) * | 2000-02-17 | 2006-01-18 | 日本電気株式会社 | 半導体集積回路装置およびその駆動方法 |
JP4275336B2 (ja) * | 2001-11-16 | 2009-06-10 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4736313B2 (ja) * | 2002-09-10 | 2011-07-27 | 日本電気株式会社 | 薄膜半導体装置 |
US6821826B1 (en) * | 2003-09-30 | 2004-11-23 | International Business Machines Corporation | Three dimensional CMOS integrated circuits having device layers built on different crystal oriented wafers |
US7026713B2 (en) * | 2003-12-17 | 2006-04-11 | Hewlett-Packard Development Company, L.P. | Transistor device having a delafossite material |
JP4045446B2 (ja) * | 2004-02-12 | 2008-02-13 | カシオ計算機株式会社 | トランジスタアレイ及び画像処理装置 |
JP2006005116A (ja) * | 2004-06-17 | 2006-01-05 | Casio Comput Co Ltd | 膜形成方法、半導体膜、及び積層絶縁膜 |
JP5053537B2 (ja) * | 2004-11-10 | 2012-10-17 | キヤノン株式会社 | 非晶質酸化物を利用した半導体デバイス |
JP2006278621A (ja) * | 2005-03-29 | 2006-10-12 | Toppan Printing Co Ltd | トランジスタ論理回路の製造方法 |
JP4842017B2 (ja) * | 2005-05-30 | 2011-12-21 | 株式会社半導体エネルギー研究所 | 半導体装置 |
WO2006129578A1 (en) * | 2005-05-30 | 2006-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
JP4560502B2 (ja) * | 2005-09-06 | 2010-10-13 | キヤノン株式会社 | 電界効果型トランジスタ |
JP5006598B2 (ja) * | 2005-09-16 | 2012-08-22 | キヤノン株式会社 | 電界効果型トランジスタ |
EP3614442A3 (en) * | 2005-09-29 | 2020-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having oxide semiconductor layer and manufactoring method thereof |
JP5064747B2 (ja) | 2005-09-29 | 2012-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法 |
JP5078246B2 (ja) | 2005-09-29 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
US20090090914A1 (en) * | 2005-11-18 | 2009-04-09 | Koki Yano | Semiconductor thin film, method for producing the same, and thin film transistor |
TWI339442B (en) * | 2005-12-09 | 2011-03-21 | Samsung Mobile Display Co Ltd | Flat panel display and method of fabricating the same |
TWI292281B (en) * | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
JP2007251100A (ja) * | 2006-03-20 | 2007-09-27 | Epson Imaging Devices Corp | 電気光学装置、電子機器および半導体装置 |
JP2007286150A (ja) * | 2006-04-13 | 2007-11-01 | Idemitsu Kosan Co Ltd | 電気光学装置、並びに、電流制御用tft基板及びその製造方法 |
JP2008053976A (ja) * | 2006-08-23 | 2008-03-06 | Toshiba Lsi System Support Kk | 半導体装置 |
TWI514347B (zh) * | 2006-09-29 | 2015-12-21 | Semiconductor Energy Lab | 顯示裝置和電子裝置 |
JP4932415B2 (ja) * | 2006-09-29 | 2012-05-16 | 株式会社半導体エネルギー研究所 | 半導体装置 |
KR20080050690A (ko) * | 2006-12-04 | 2008-06-10 | 삼성전자주식회사 | 유기 발광 표시 장치의 제조 방법 |
JP2008147418A (ja) * | 2006-12-11 | 2008-06-26 | Hitachi Ltd | 薄膜トランジスタ装置、画像表示装置およびその製造方法 |
KR20080073944A (ko) * | 2007-02-07 | 2008-08-12 | 엘지전자 주식회사 | 하이브리드 유기 전계 발광 소자 및 그 제조방법 |
JP2008235871A (ja) * | 2007-02-20 | 2008-10-02 | Canon Inc | 薄膜トランジスタの形成方法及び表示装置 |
JP5408842B2 (ja) * | 2007-04-27 | 2014-02-05 | キヤノン株式会社 | 発光装置およびその製造方法 |
WO2008136505A1 (ja) * | 2007-05-08 | 2008-11-13 | Idemitsu Kosan Co., Ltd. | 半導体デバイス及び薄膜トランジスタ、並びに、それらの製造方法 |
JP5037221B2 (ja) * | 2007-05-18 | 2012-09-26 | 株式会社半導体エネルギー研究所 | 液晶表示装置及び電子機器 |
US8803781B2 (en) * | 2007-05-18 | 2014-08-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
JP5242083B2 (ja) * | 2007-06-13 | 2013-07-24 | 出光興産株式会社 | 結晶酸化物半導体、及びそれを用いてなる薄膜トランジスタ |
US8354674B2 (en) * | 2007-06-29 | 2013-01-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer |
US8033273B2 (en) * | 2007-07-02 | 2011-10-11 | Denso Corporation | Plasma ignition system |
JP2009076879A (ja) * | 2007-08-24 | 2009-04-09 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
US8232598B2 (en) * | 2007-09-20 | 2012-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US7982250B2 (en) * | 2007-09-21 | 2011-07-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
TW200921226A (en) * | 2007-11-06 | 2009-05-16 | Wintek Corp | Panel structure and manufacture method thereof |
JP2009130209A (ja) * | 2007-11-26 | 2009-06-11 | Fujifilm Corp | 放射線撮像素子 |
JP5430846B2 (ja) | 2007-12-03 | 2014-03-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP5366517B2 (ja) * | 2007-12-03 | 2013-12-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
KR100936874B1 (ko) * | 2007-12-18 | 2010-01-14 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터의 제조 방법 및 박막 트랜지스터를구비하는 유기전계발광 표시 장치의 제조 방법 |
JP2009158528A (ja) * | 2007-12-25 | 2009-07-16 | Sharp Corp | 半導体装置 |
JP5121478B2 (ja) * | 2008-01-31 | 2013-01-16 | 株式会社ジャパンディスプレイウェスト | 光センサー素子、撮像装置、電子機器、およびメモリー素子 |
JP5305696B2 (ja) * | 2008-03-06 | 2013-10-02 | キヤノン株式会社 | 半導体素子の処理方法 |
JP2009250665A (ja) | 2008-04-02 | 2009-10-29 | Nikon Corp | 計測装置 |
US20100141230A1 (en) * | 2008-07-17 | 2010-06-10 | Exar Corporation | Self-tuning sensorless digital current-mode controller with accurate current sharing for multiphase dc-dc converters |
JP5781720B2 (ja) * | 2008-12-15 | 2015-09-24 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
TWI650848B (zh) * | 2009-08-07 | 2019-02-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
CN104992962B (zh) * | 2009-12-04 | 2018-12-25 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
CN105609509A (zh) * | 2009-12-04 | 2016-05-25 | 株式会社半导体能源研究所 | 显示装置 |
KR101861991B1 (ko) * | 2010-01-20 | 2018-05-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 신호 처리 회로 및 신호 처리 회로를 구동하기 위한 방법 |
JP6298662B2 (ja) * | 2013-03-14 | 2018-03-20 | 株式会社半導体エネルギー研究所 | 半導体装置 |
TWI724231B (zh) * | 2016-09-09 | 2021-04-11 | 日商半導體能源硏究所股份有限公司 | 記憶體裝置及其工作方法、半導體裝置、電子構件以及電子裝置 |
-
2010
- 2010-10-06 IN IN3080DEN2012 patent/IN2012DN03080A/en unknown
- 2010-10-06 KR KR1020217038926A patent/KR102473794B1/ko active Active
- 2010-10-06 KR KR1020127013414A patent/KR20120091239A/ko not_active Ceased
- 2010-10-06 MY MYPI2012700044A patent/MY172111A/en unknown
- 2010-10-06 EP EP10826520.8A patent/EP2494595A4/en not_active Withdrawn
- 2010-10-06 KR KR1020227041631A patent/KR102808755B1/ko active Active
- 2010-10-06 KR KR1020177027911A patent/KR101930730B1/ko active Active
- 2010-10-06 KR KR1020257015227A patent/KR20250075719A/ko active Pending
- 2010-10-06 SG SG10201903542TA patent/SG10201903542TA/en unknown
- 2010-10-06 SG SG10201406989QA patent/SG10201406989QA/en unknown
- 2010-10-06 WO PCT/JP2010/067999 patent/WO2011052386A1/en active Application Filing
- 2010-10-06 CN CN201080050571.6A patent/CN102640279B/zh active Active
- 2010-10-06 KR KR1020197037728A patent/KR102334468B1/ko active Active
- 2010-10-06 SG SG2012013652A patent/SG178895A1/en unknown
- 2010-10-06 KR KR1020187036160A patent/KR102062077B1/ko active Active
- 2010-10-26 US US12/912,083 patent/US20110101333A1/en not_active Abandoned
- 2010-10-26 JP JP2010239474A patent/JP2011119671A/ja not_active Withdrawn
- 2010-10-27 TW TW104119985A patent/TWI603458B/zh not_active IP Right Cessation
- 2010-10-27 TW TW099136686A patent/TWI570882B/zh not_active IP Right Cessation
-
2015
- 2015-05-27 JP JP2015107379A patent/JP2015207769A/ja not_active Withdrawn
-
2016
- 2016-11-04 JP JP2016215823A patent/JP6280974B2/ja not_active Expired - Fee Related
-
2018
- 2018-01-22 JP JP2018008008A patent/JP2018085534A/ja not_active Withdrawn
- 2018-02-13 US US15/895,466 patent/US20180174891A1/en not_active Abandoned
-
2019
- 2019-09-13 JP JP2019167064A patent/JP6840810B2/ja active Active
-
2021
- 2021-02-17 JP JP2021022972A patent/JP2021103300A/ja not_active Withdrawn
- 2021-12-01 US US17/539,469 patent/US20220093452A1/en active Pending
-
2022
- 2022-06-21 JP JP2022099459A patent/JP2022141651A/ja not_active Withdrawn
-
2023
- 2023-11-28 JP JP2023200814A patent/JP7625061B2/ja active Active
-
2025
- 2025-01-21 JP JP2025008406A patent/JP2025069212A/ja active Pending
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201903542TA (en) | Semiconductor device | |
MY158782A (en) | Memory Device, Semiconductor Device, And Electronic Device | |
MY158956A (en) | Logic circuit and semiconductor device | |
EP2526622A4 (en) | SEMICONDUCTOR COMPONENT | |
JP2011119671A5 (enrdf_load_stackoverflow) | ||
EP2519972A4 (en) | MEMORY DEVICE AND SEMICONDUCTOR DEVICE | |
MY163862A (en) | Logic circuit and semiconductor device | |
MY159871A (en) | Semiconductor device | |
WO2008147801A3 (en) | Half-bridge circuits employing normally on switches and methods of preventing unintended current flow therein | |
WO2013011289A3 (en) | Switching circuits | |
JP2013214296A5 (enrdf_load_stackoverflow) | ||
WO2010062727A3 (en) | Low drop out (ldo) bypass voltage regulator | |
WO2011008717A3 (en) | Integrated power supplies and combined high-side plus low-side switches | |
MY157390A (en) | Switching circuit and semiconductor module | |
WO2013002959A3 (en) | Low-power, low-latency power-gate apparatus and method | |
WO2012069045A3 (de) | Schaltung zum schutz gegen verpolung | |
JP2011060876A5 (ja) | 半導体装置 | |
GB2462935B (en) | Lamp | |
TW200744101A (en) | Semiconductor memory device with reduced current consumption | |
JP2009165114A5 (enrdf_load_stackoverflow) | ||
TW200637096A (en) | Power clamp circuit and semiconductor device | |
CN102799130B (zh) | 低电压微功耗电源开关及控制方法 | |
WO2014041524A3 (en) | Static transfer switch off detection and transfer management | |
TW201218597A (en) | High voltage start-up device for switch mode power supplies | |
JP2015520537A5 (enrdf_load_stackoverflow) |