IN2012DN03080A - - Google Patents
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- Publication number
- IN2012DN03080A IN2012DN03080A IN3080DEN2012A IN2012DN03080A IN 2012DN03080 A IN2012DN03080 A IN 2012DN03080A IN 3080DEN2012 A IN3080DEN2012 A IN 3080DEN2012A IN 2012DN03080 A IN2012DN03080 A IN 2012DN03080A
- Authority
- IN
- India
- Prior art keywords
- circuit
- semiconductor
- switching element
- power supply
- supply voltage
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Geometry (AREA)
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electroluminescent Light Sources (AREA)
- Semiconductor Integrated Circuits (AREA)
- Dram (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Static Random-Access Memory (AREA)
Abstract
An object is to provide a semiconductor device with reduced standby power. A transistor including an oxide semiconductor as an active layer is used as a switching element, and supply of a power supply voltage to a circuit in an integrated circuit is controlled by the switching element. Specifically, when the circuit is in an operation state, supply of the power supply voltage to the circuit is performed by the switching element, and when the circuit is in a stop state, supply of the power supply voltage to the circuit is stopped by the switching element. In addition, the circuit supplied with the power supply voltage includes a semiconductor element which is a minimum unit included in an integrated circuit formed using a semiconductor. Further, the semiconductor included in the semiconductor element contains silicon having crystallinity (crystalline silicon).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009250665 | 2009-10-30 | ||
| PCT/JP2010/067999 WO2011052386A1 (en) | 2009-10-30 | 2010-10-06 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2012DN03080A true IN2012DN03080A (en) | 2015-07-31 |
Family
ID=43921812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN3080DEN2012 IN2012DN03080A (en) | 2009-10-30 | 2010-10-06 |
Country Status (10)
| Country | Link |
|---|---|
| US (3) | US20110101333A1 (en) |
| EP (1) | EP2494595A4 (en) |
| JP (9) | JP2011119671A (en) |
| KR (7) | KR101930730B1 (en) |
| CN (1) | CN102640279B (en) |
| IN (1) | IN2012DN03080A (en) |
| MY (1) | MY172111A (en) |
| SG (3) | SG10201406989QA (en) |
| TW (2) | TWI570882B (en) |
| WO (1) | WO2011052386A1 (en) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| JP6005401B2 (en) * | 2011-06-10 | 2016-10-12 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
| WO2013061895A1 (en) * | 2011-10-28 | 2013-05-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US8907392B2 (en) * | 2011-12-22 | 2014-12-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device including stacked sub memory cells |
| US9859114B2 (en) * | 2012-02-08 | 2018-01-02 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor device with an oxygen-controlling insulating layer |
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| JP6243136B2 (en) | 2012-05-02 | 2017-12-06 | 株式会社半導体エネルギー研究所 | Switching converter |
| TWI581404B (en) | 2012-08-10 | 2017-05-01 | 半導體能源研究所股份有限公司 | Semiconductor device and method of driving the same |
| JP2014057298A (en) | 2012-08-10 | 2014-03-27 | Semiconductor Energy Lab Co Ltd | Semiconductor device driving method |
| JP2014057296A (en) | 2012-08-10 | 2014-03-27 | Semiconductor Energy Lab Co Ltd | Semiconductor device driving method |
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| US9034217B2 (en) * | 2013-06-07 | 2015-05-19 | Ngk Insulators, Ltd. | Voltage nonlinear resistor |
| CN103474473B (en) * | 2013-09-10 | 2016-02-03 | 深圳市华星光电技术有限公司 | A kind of thin film transistor switch and manufacture method thereof |
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| JP6150752B2 (en) * | 2014-03-14 | 2017-06-21 | 株式会社日本製鋼所 | Oxide-based semiconductor material and semiconductor element |
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| JP6418794B2 (en) * | 2014-06-09 | 2018-11-07 | 東京エレクトロン株式会社 | MODIFICATION TREATMENT METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
| US10020336B2 (en) | 2015-12-28 | 2018-07-10 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device and electronic device using three dimentional (3D) integration |
| JP2017162852A (en) * | 2016-03-07 | 2017-09-14 | 株式会社ジャパンディスプレイ | Semiconductor device and display device |
| KR102458660B1 (en) * | 2016-08-03 | 2022-10-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Display device and electronic device |
| CN106129122B (en) * | 2016-08-31 | 2018-12-11 | 京东方科技集团股份有限公司 | Oxide thin film transistor and preparation method thereof, array substrate, display device |
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Family Cites Families (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60154549A (en) * | 1984-01-24 | 1985-08-14 | Fujitsu Ltd | Manufacture of semiconductor device |
| JPH0792500A (en) * | 1993-06-29 | 1995-04-07 | Toshiba Corp | Semiconductor device |
| JPH08264798A (en) * | 1995-03-23 | 1996-10-11 | Semiconductor Energy Lab Co Ltd | Semiconductor device and method for manufacturing semiconductor device |
| US7348227B1 (en) * | 1995-03-23 | 2008-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP3633061B2 (en) * | 1995-10-19 | 2005-03-30 | 三菱電機株式会社 | Semiconductor integrated circuit device |
| JP4086925B2 (en) * | 1996-12-27 | 2008-05-14 | 株式会社半導体エネルギー研究所 | Active matrix display |
| JPH11233789A (en) * | 1998-02-12 | 1999-08-27 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
| JP2000243851A (en) * | 1999-02-17 | 2000-09-08 | Hitachi Ltd | Semiconductor integrated circuit device |
| EP1049167A3 (en) * | 1999-04-30 | 2007-10-24 | Sel Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| TW567363B (en) * | 1999-05-14 | 2003-12-21 | Seiko Epson Corp | Method for driving electrooptical device, drive circuit, electrooptical device, and electronic device |
| JP2001053599A (en) | 1999-08-12 | 2001-02-23 | Nec Corp | Semiconductor integrated circuit |
| JP3735855B2 (en) * | 2000-02-17 | 2006-01-18 | 日本電気株式会社 | Semiconductor integrated circuit device and driving method thereof |
| JP4275336B2 (en) * | 2001-11-16 | 2009-06-10 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
| JP4736313B2 (en) * | 2002-09-10 | 2011-07-27 | 日本電気株式会社 | Thin film semiconductor device |
| US6821826B1 (en) * | 2003-09-30 | 2004-11-23 | International Business Machines Corporation | Three dimensional CMOS integrated circuits having device layers built on different crystal oriented wafers |
| US7026713B2 (en) * | 2003-12-17 | 2006-04-11 | Hewlett-Packard Development Company, L.P. | Transistor device having a delafossite material |
| JP4045446B2 (en) * | 2004-02-12 | 2008-02-13 | カシオ計算機株式会社 | Transistor array and image processing apparatus |
| JP2006005116A (en) * | 2004-06-17 | 2006-01-05 | Casio Comput Co Ltd | Film forming method, semiconductor film, and laminated insulating film |
| JP5053537B2 (en) * | 2004-11-10 | 2012-10-17 | キヤノン株式会社 | Semiconductor device using amorphous oxide |
| JP2006278621A (en) * | 2005-03-29 | 2006-10-12 | Toppan Printing Co Ltd | Method for manufacturing transistor logic circuit |
| KR101219069B1 (en) * | 2005-05-30 | 2013-01-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Semiconductor device and driving method thereof |
| JP4842017B2 (en) * | 2005-05-30 | 2011-12-21 | 株式会社半導体エネルギー研究所 | Semiconductor device |
| JP4560502B2 (en) * | 2005-09-06 | 2010-10-13 | キヤノン株式会社 | Field effect transistor |
| JP5006598B2 (en) * | 2005-09-16 | 2012-08-22 | キヤノン株式会社 | Field effect transistor |
| JP5064747B2 (en) | 2005-09-29 | 2012-10-31 | 株式会社半導体エネルギー研究所 | Semiconductor device, electrophoretic display device, display module, electronic device, and method for manufacturing semiconductor device |
| JP5078246B2 (en) | 2005-09-29 | 2012-11-21 | 株式会社半導体エネルギー研究所 | Semiconductor device and manufacturing method of semiconductor device |
| EP1770788A3 (en) * | 2005-09-29 | 2011-09-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having oxide semiconductor layer and manufacturing method thereof |
| WO2007058248A1 (en) * | 2005-11-18 | 2007-05-24 | Idemitsu Kosan Co., Ltd. | Semiconductor thin film, method for producing same, and thin film transistor |
| TWI339442B (en) * | 2005-12-09 | 2011-03-21 | Samsung Mobile Display Co Ltd | Flat panel display and method of fabricating the same |
| TWI292281B (en) * | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
| JP2007251100A (en) * | 2006-03-20 | 2007-09-27 | Epson Imaging Devices Corp | Electro-optical device, electronic device, and semiconductor device |
| JP2007286150A (en) | 2006-04-13 | 2007-11-01 | Idemitsu Kosan Co Ltd | Electro-optical device, current control TFT substrate, and manufacturing method thereof |
| JP2008053976A (en) * | 2006-08-23 | 2008-03-06 | Toshiba Lsi System Support Kk | Semiconductor device |
| TWI514347B (en) * | 2006-09-29 | 2015-12-21 | Semiconductor Energy Lab | Display device and electronic device |
| JP4932415B2 (en) | 2006-09-29 | 2012-05-16 | 株式会社半導体エネルギー研究所 | Semiconductor device |
| KR20080050690A (en) * | 2006-12-04 | 2008-06-10 | 삼성전자주식회사 | Manufacturing Method of Organic Light Emitting Display |
| JP2008147418A (en) * | 2006-12-11 | 2008-06-26 | Hitachi Ltd | Thin film transistor device, image display device and manufacturing method thereof |
| KR20080073944A (en) * | 2007-02-07 | 2008-08-12 | 엘지전자 주식회사 | Hybrid organic EL device and method for manufacturing same |
| JP2008235871A (en) * | 2007-02-20 | 2008-10-02 | Canon Inc | Thin film transistor forming method and display device |
| JP5408842B2 (en) * | 2007-04-27 | 2014-02-05 | キヤノン株式会社 | Light emitting device and manufacturing method thereof |
| JPWO2008136505A1 (en) * | 2007-05-08 | 2010-07-29 | 出光興産株式会社 | Semiconductor device, thin film transistor, and manufacturing method thereof |
| JP5037221B2 (en) * | 2007-05-18 | 2012-09-26 | 株式会社半導体エネルギー研究所 | Liquid crystal display device and electronic device |
| US8803781B2 (en) * | 2007-05-18 | 2014-08-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
| JP5242083B2 (en) * | 2007-06-13 | 2013-07-24 | 出光興産株式会社 | Crystalline oxide semiconductor and thin film transistor using the same |
| US8354674B2 (en) * | 2007-06-29 | 2013-01-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer |
| US8033273B2 (en) * | 2007-07-02 | 2011-10-11 | Denso Corporation | Plasma ignition system |
| JP2009076879A (en) * | 2007-08-24 | 2009-04-09 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
| US8232598B2 (en) * | 2007-09-20 | 2012-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
| US7982250B2 (en) * | 2007-09-21 | 2011-07-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| TW200921226A (en) * | 2007-11-06 | 2009-05-16 | Wintek Corp | Panel structure and manufacture method thereof |
| JP2009130209A (en) * | 2007-11-26 | 2009-06-11 | Fujifilm Corp | Radiation imaging device |
| JP5430846B2 (en) | 2007-12-03 | 2014-03-05 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
| JP5366517B2 (en) * | 2007-12-03 | 2013-12-11 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
| KR100936874B1 (en) * | 2007-12-18 | 2010-01-14 | 삼성모바일디스플레이주식회사 | Method for manufacturing thin film transistor and method for manufacturing organic light emitting display device comprising thin film transistor |
| JP2009158528A (en) * | 2007-12-25 | 2009-07-16 | Sharp Corp | Semiconductor device |
| JP5121478B2 (en) * | 2008-01-31 | 2013-01-16 | 株式会社ジャパンディスプレイウェスト | Optical sensor element, imaging device, electronic device, and memory element |
| JP5305696B2 (en) * | 2008-03-06 | 2013-10-02 | キヤノン株式会社 | Semiconductor device processing method |
| JP2009250665A (en) | 2008-04-02 | 2009-10-29 | Nikon Corp | Measuring apparatus |
| US20100141230A1 (en) * | 2008-07-17 | 2010-06-10 | Exar Corporation | Self-tuning sensorless digital current-mode controller with accurate current sharing for multiphase dc-dc converters |
| JP5781720B2 (en) * | 2008-12-15 | 2015-09-24 | ルネサスエレクトロニクス株式会社 | Semiconductor device and manufacturing method of semiconductor device |
| TWI700810B (en) * | 2009-08-07 | 2020-08-01 | 日商半導體能源研究所股份有限公司 | Semiconductor device and method for manufacturing the same |
| KR102250803B1 (en) * | 2009-12-04 | 2021-05-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Semiconductor device |
| KR101523358B1 (en) * | 2009-12-04 | 2015-05-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Display device |
| KR101861991B1 (en) * | 2010-01-20 | 2018-05-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Signal processing circuit and method for driving the same |
| JP6298662B2 (en) * | 2013-03-14 | 2018-03-20 | 株式会社半導体エネルギー研究所 | Semiconductor device |
| TWI724231B (en) * | 2016-09-09 | 2021-04-11 | 日商半導體能源硏究所股份有限公司 | Storage device, method for operating storage device, semiconductor device, electronic component, and electronic device |
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