JP5053537B2 - Semiconductor device using amorphous oxide - Google Patents

Description

  The present invention relates to a semiconductor device, an electric element, and a circuit using an amorphous oxide. In particular, the present invention relates to a semiconductor device using an amorphous oxide.

  2. Description of the Related Art In recent years, flat and thin image display devices (Flat Panel Displays: FPD) have been put into practical use due to advances in liquid crystal and electroluminescence (EL) technologies.

  These FPDs are driven by an active matrix circuit of a field effect thin film transistor (TFT) using an amorphous silicon thin film or a polycrystalline silicon thin film provided on a glass substrate as an active layer.

  On the other hand, in order to further reduce the thickness, weight, and breakage resistance of these FPDs, an attempt has been made to use a lightweight and flexible resin substrate instead of a glass substrate.

  However, the manufacture of the transistor using the above-described silicon thin film requires a relatively high temperature thermal process and is generally difficult to form directly on a resin substrate having low heat resistance.

  In view of this, TFTs that can be formed at a low temperature and that use an oxide semiconductor thin film made of, for example, ZnO have been actively developed (Patent Document 1).

Thus, a new semiconductor device is expected.
Japanese Patent Laid-Open No. 2003-298062

  Therefore, an object of the present invention is to provide various semiconductor devices using amorphous oxides, circuits using the same, and the like.

Integrated circuit of the present invention, In -Zn-Ga oxide, In-Zn-Ga-Mg oxide, In-Zn oxide, In-Sn oxide, Sn-In-Zn oxide, In oxide, Zn A circuit including an N-type TFT using an amorphous oxide which is one of —Ga oxide and In—Ga oxide as an N-type semiconductor, and the N-type semiconductor includes oxygen has become an electron carrier concentration less than 10 18 ^/ cm ³ by a has been formed at a predetermined concentration containing atmosphere, the N-type TFT, the gate voltage is not applied when the source of the same - a current between the drain terminal 10 It is less than microamperes and has a field effect mobility of more than 1 cm ² / (V · sec).
Further, the integrated circuit of the present invention includes an In—Zn—Ga oxide, an In—Zn—Ga—Mg oxide, an In—Zn oxide, an In—Sn oxide, a Sn—In—Zn oxide, and an In oxide. , A Zn-Ga oxide, and an In-Ga oxide, which is a component including an N-type TFT using an amorphous oxide as an N-type semiconductor. After the film formation, the electron carrier concentration is less than 10 ¹⁸ / cm ³ due to the post-treatment in the atmosphere containing oxygen , so that the N-type TFT can be connected between the source and drain terminals when no gate voltage is applied. The current is less than 10 microamperes and the field effect mobility is more than 1 cm ² / (V · sec).
Furthermore, the integrated circuit of the present invention includes In—Zn—Ga oxide, In—Zn—Ga—Mg oxide, In—Zn oxide, In—Sn oxide, Sn—In—Zn oxide, In oxidation. A circuit including an N-type TFT using an amorphous oxide that is any one of an oxide, a Zn—Ga oxide, and an In—Ga oxide as an N-type semiconductor, and the N-type semiconductor Has an electron carrier concentration of less than 10 ¹⁸ / cm ³ because the film is formed in an atmosphere containing oxygen at a predetermined concentration and then post-treated in an atmosphere containing oxygen , whereby the N-type TFT has a gate voltage The current between the source and drain terminals when no voltage is applied is less than 10 microamperes, and the field effect mobility is more than 1 cm ² / (V · sec).

  By the way, when the present inventor examined an oxide semiconductor, it was found that ZnO cannot generally form a stable amorphous phase. Since most ZnO exhibits a polycrystalline phase, carriers are scattered at the interface between the polycrystalline particles, and as a result, it seems that the electron mobility cannot be increased.

  In addition, oxygen defects are easily introduced into ZnO, and a large number of carrier electrons are generated. Therefore, it is difficult to reduce the electrical conductivity. For this reason, it was found that even when the gate voltage of the transistor is not applied, a large current flows between the source terminal and the drain terminal, and the normally-off operation of the TFT cannot be realized. It also seems difficult to increase the on / off ratio of the transistor.

Further, the present inventor has amorphous oxide film _{Zn x M y In z O (} x + 3y / 2 + 3z / 2) ( in the formula as described in JP 2000-044236, M is Al And at least one element of Ga). This material has an electron carrier concentration of 10 ¹⁸ / cm ³ or more, and is a suitable material as a simple transparent electrode.

However, it has been found that when an oxide having an electron carrier concentration of 10 ¹⁸ / cm ³ or more is used for the TFT channel layer, the on / off ratio is not sufficient, which is not suitable for a normally-off type TFT.

That is, in the conventional amorphous oxide film, a film having an electron carrier concentration of less than 10 ¹⁸ / cm ³ could not be obtained.

Therefore, when the present inventor fabricated a TFT using an amorphous oxide having an electron carrier concentration of less than 10 ¹⁸ / cm ³ as an active layer of a field effect transistor, a TFT having desired characteristics can be obtained. I discovered that.

  Moreover, it has been found that such an amorphous oxide can be suitably used for semiconductor devices other than TFTs.

As a result of intensive research and development on InGaO ₃ (ZnO) _m and film formation conditions of this material, the present inventors have controlled the oxygen atmosphere conditions during film formation to reduce the electron carrier concentration to 10 It has been found that it can be less than ¹⁸ / cm ³ .

  Moreover, it has been found that such an amorphous oxide can be suitably used for semiconductor devices other than TFTs.

That is, the present invention is a semiconductor device characterized in that an amorphous oxide having an electron carrier concentration at room temperature of less than 10 ¹⁸ / cm ³ is used as an electron conductor material. Yet another aspect of the present invention is a semiconductor device characterized in that an amorphous oxide characterized by an increase in electron carrier concentration and an increase in electron mobility is used as an electron conductor material.

  According to the present invention, a novel integrated circuit using an amorphous oxide can be provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

First, a semiconductor device according to the present invention will be described as a first embodiment, an integrated circuit will be described as a second embodiment, and then an amorphous oxide used in the present invention will be described in detail. .
(First Embodiment: Semiconductor Device)
First, a semiconductor device having a P-type region and an N-type region will be described.
The semiconductor device here includes a PN junction type transistor and a heterojunction device.

In the present invention, as an amorphous oxide constituting the N-type region, an oxide having an electron carrier concentration of less than 10 ¹⁸ / cm ³ , or an electron carrier concentration increases and the electron mobility tends to increase. It is characterized by using an oxide. This amorphous oxide will be described later.

  Note that it is also preferable that the N-type region is provided in the P-type region or the P-type region is provided in the N-type region on the substrate.

  It is also a preferred embodiment that the P-type region and the N-type region are formed in the same layer on the substrate.

  It is also a preferred embodiment that the P-type region and the N-type region are made of different materials of amorphous oxide.

  Furthermore, the present invention relates to an SIT element using the transparent oxide semiconductor film as an N-type semiconductor.

  An example will be described with reference to FIG.

  Specifically, an electrode 11-1 is formed on the insulating substrate 10 made of glass, plastic, or the like with ITO capable of forming an ohmic contact with the transparent oxide semiconductor, and then the transparent oxide semiconductor film is formed on the electrode. 13 is formed. Further, a plurality of electrodes 12 are formed in the oxide film with a material having a work function larger than the absolute value of the Fermi level of the semiconductor film, for example, Pt, and the oxide film is stacked. Then, the SIT element can be manufactured by forming the electrode 11-2 with the same material as the electrode 11-1. Therefore, an effect of realizing an element having a higher current capability than that of the TFT using the transparent oxide semiconductor film can be obtained.

  Further, the Pt of the electrode 12 is made thin, or a P-type transparent oxide semiconductor whose absolute value of the Fermi level is larger than the absolute value of the Fermi level of the semiconductor film is used as the electrode 12. A transparent SIT element can be produced.

  The present invention relates to an SBT element using the transparent oxide semiconductor film as an N-type semiconductor.

  Specifically, the transparent oxide N-type semiconductor film 1 is formed on an insulating substrate such as glass or plastic. Subsequently, electrodes 11-1 and 11-2 are formed on the oxide film by ITO capable of forming an ohmic contact. Then, the SBT element is manufactured by forming the gate electrode 12 with a material having a work function larger than the absolute value of the Fermi level of the semiconductor film, for example, Pt, between the electrodes 11-1 and 11-2. be able to. Therefore, an effect of realizing a transistor element that can control the current between the electrodes 11-1 and 11-2 with a voltage applied to the gate electrode with a simpler configuration than the TFT using the transparent oxide semiconductor film is obtained. It is done. In particular, by reducing the thickness of the oxide film under the electrode 11-2, the magnitude of the current that can be modulated by the gate voltage is increased.

  Further, by making Pt of the electrode 12 thin, a transparent SBT element can be produced.

  The present invention relates to a PN-T element using the transparent oxide semiconductor film as an N-type semiconductor.

  Specifically, as shown in FIG. 12, the transparent oxide N-type semiconductor film 13 is formed on an insulating substrate 10 such as glass or plastic.

  Subsequently, electrodes 11-1 and 11-2 are formed on the oxide film by ITO capable of forming an ohmic contact. Then, a P-type semiconductor material 14 having a Fermi level absolute value larger than the Fermi level absolute value of the semiconductor film is stacked between the electrodes 11-1 and 11-2. Furthermore, a PN-T element can be manufactured by forming the gate electrode 12 with a material capable of forming an ohmic contact with the P-type semiconductor material, for example, Pt, on the P-type semiconductor material. Therefore, an effect of realizing a transistor element that can control the current between the electrodes 11-1 and 11-2 with a voltage applied to the gate electrode with a simpler configuration than the TFT using the transparent oxide semiconductor film is obtained. It is done. In particular, by reducing the thickness of the oxide film under the electrode 12, the current that can be modulated by the gate voltage is increased.

  Further, if the Pt of the electrode 12 is made thin and a transparent oxide P-type semiconductor is used for the P-type semiconductor, a transparent PN-T element can be produced.

  The present invention relates to a BPT element using the transparent oxide semiconductor film as an N-type semiconductor.

  Specifically, on an insulating substrate such as glass or plastic, the transparent oxide N-type semiconductor film 1, the semiconductor film 1 ′ having a different carrier density and conductivity in the transparent oxide N-type semiconductor, and the absolute value of the Fermi level A P-type semiconductor film larger than the absolute value of the Fermi level of the semiconductor film is formed. Subsequently, electrodes 1-1 and 1-2 are formed on the oxide films 1 and 1 'using ITO capable of forming an ohmic contact. Furthermore, the BPT element can be manufactured by forming the base electrode 2 from a material that can form an ohmic contact on the P-type semiconductor film, for example, Pt.

  Further, if the Pt of the electrode 2 is made thin and a transparent oxide P-type semiconductor is used for the P-type semiconductor, a transparent BPT element can be produced.

  The present invention relates to an SBD element using the transparent oxide semiconductor film as an N-type semiconductor.

  Specifically, the transparent oxide N-type semiconductor film 1 is formed on an insulating substrate such as glass or plastic. Subsequently, an electrode 1 is formed on the oxide film with ITO capable of forming an ohmic contact, and an electrode 2 with a material having a work function larger than the absolute value of the Fermi level of the semiconductor film, for example, Pt. Thus, an SBD element can be manufactured.

  Further, by making Pt of the electrode 2 thin, a transparent SBD element can be produced.

  The present invention relates to a PN-D element using the transparent oxide semiconductor film as an N-type semiconductor (FIG. 14).

  Specifically, the transparent oxide N-type semiconductor film 13 is formed on an insulating substrate 10 such as glass or plastic. Subsequently, the electrode 11 and the P-type semiconductor material 14 having an absolute value of the Fermi level larger than the absolute value of the Fermi level of the semiconductor film are made of ITO by which an ohmic contact can be formed on the oxide film. Laminate. Furthermore, a PN-D element can be manufactured by forming the electrode 12 from a material capable of forming an ohmic contact with the P-type semiconductor, for example, Pt.

  Moreover, a transparent PN-D element can be produced by using a transparent oxide film P-type semiconductor as the P-type semiconductor material and reducing the Pt of the electrode 2.

  The present invention relates to a resistance element using the transparent oxide semiconductor film as a resistance material.

  Specifically, the transparent oxide N-type semiconductor film 1 is formed on an insulating substrate such as glass or plastic. Then, a transparent resistive element can be produced by forming the electrodes 11-1 and 11-2 with ITO capable of forming an ohmic contact on the oxide film.

The transparent oxide N-type semiconductor film having carrier density and conductivity different from those of the semiconductor film 1 may be provided between the semiconductor film 1 and the electrodes 11-1 and 11-2. However, both the oxide layers do not have to have a carrier concentration of less than 10 ¹⁸ / cm ³ and a conductivity of 10 S / cm or less.

  As a material for forming an ohmic contact with the transparent oxide N-type semiconductor, for example, the work function such as ITO or calcium (Ca) is approximately the same as or slightly smaller than the absolute value of the Fermi level of the semiconductor film. And metals / alloys characterized by the above.

  Examples of highly conductive materials having a large work function used as the SIT and SBT gate electrodes and the SD Schottky barrier electrodes include metals such as platinum (Pt), Ni, and gold (Au). is there.

  Furthermore, a transparent or translucent metal film can be formed by forming the metal very thin, and transparent SIT, SBT, and SD can be manufactured by combining with the oxide.

Examples of the P-type semiconductor for the gate electrode of SIT and PN-T, and the P-type semiconductor of the PN-D include inorganic semiconductors such as Si doped with acceptor, low molecular organic semiconductors such as pentacene, polythiophene, and polyphenylene. A high molecular organic semiconductor such as vinylene or an oxide semiconductor such as Cu ₂ O can be used. However, in order to form a PN junction barrier, the absolute value of the Fermi level of the P-type semiconductor is larger than the absolute value of the Fermi level of the oxide N-type semiconductor.

  Furthermore, by using the oxide P-type semiconductor and a transparent electrode such as ITO, transparent SIT, PN-T, and PN-D can be manufactured.

In addition, many of the semiconductor materials such as Si described above show an amorphous transparent oxide having an electron carrier concentration of less than 10 ¹⁸ / cm ³ , and tend to increase electron mobility as the electron carrier concentration increases. The band gap is different from that of amorphous transparent oxide. Therefore, a heterojunction is formed with the region made of this amorphous transparent oxide semiconductor. Thus, a semiconductor device having a heterojunction is configured.
(Second Embodiment: Integrated Circuit)
The present invention also relates to a logic circuit using a TFT having the transparent film as a semiconductor film as an N-TFT.

  Specifically, a resistor using the transparent film as an electron conductor and an N-TFT using the transparent film are connected in series between a power source and a ground potential (GND), and the gate of the N-TFT is input as a signal. And the source of the TFT is the output.

  Thereby, an inverter circuit using only the transparent film as a semiconductor layer can be configured.

  Further, in place of the resistor, a P-type TFT (hereinafter referred to as P-TFT) using a P-type semiconductor as an active layer is used, and the gate of the P-TFT is used as a common input with the gate of the N-TFT. A type TFT circuit can be constructed.

  Thereby, the effect that the through current during the operation of the inverter is suppressed and a circuit with low power consumption can be configured is obtained.

As the P-type semiconductor material, for example, an inorganic semiconductor such as doped Si, a low molecular organic semiconductor such as pentacene, a high molecular organic semiconductor such as polythiophene or polyphenylene vinylene, or an oxide semiconductor such as Cu ₂ O is preferably used. . In particular, when the oxide semiconductor is used as a P-type semiconductor, a circuit in which the semiconductor layer is transparent can be configured.

  Similarly to the inverter circuit, logic circuits such as a clocked inverter circuit, a NAND circuit, a NOR circuit, a flip-flop, and a shift register can be formed.

  The present invention also relates to an SRAM circuit using a TFT having the transparent film as a semiconductor film as an N-TFT.

  Specifically, for an inverter circuit including two N-TFTs using the transparent film, an input and an output are connected, and between each input of the inverter and two bit lines (BL, BL bar). Each includes an N-TFT. The gates of the N-TFT are both connected to the word line (WL). Thereby, a 1-bit SRAM cell circuit using the transparent film as the N-type semiconductor layer can be configured.

  Furthermore, in the case of using an inverter in which the N-TFT and the transparent film are composed of a resistor, an SRAM having at least a TFT and a transparent resistor can be manufactured.

  The present invention also relates to a ROM circuit using a TFT having the transparent film as a semiconductor film as an N-TFT.

  Specifically, a plurality of word lines (WL1 to WLn) and a plurality of bit lines (BL1 to BLn) are provided. Each of the bit lines includes a plurality of N-TFTs that use the transparent film having a word line connected to the gate, a source connected to GND, and a drain connected in parallel to each other as a semiconductor film. However, N-TFTs corresponding to all the word lines are not provided for one bit line, and N-TFTs corresponding to several word lines are omitted. As a result, a NOR-type ROM circuit using the transparent film as the N-type semiconductor layer can be configured.

  Furthermore, the TFT part of the ROM circuit can be made transparent by using the transparent film.

  The present invention also relates to a differential amplifier circuit using a TFT having the transparent film as a semiconductor film as an N-TFT.

  Specifically, an N-TFT in which a source is grounded to GND and a constant voltage is applied to a gate as a bias voltage, and two N-TFTs having a gate as an input and a source connected to the drain of the N-TFT. TFT. A differential amplifier circuit can be configured by providing a resistor between each of the drains of the two N-TFTs and the power supply, and using an output between the drain and the resistor of the N-TFT.

  Furthermore, at least the N-TFT and the resistance portion can be made transparent by using the transparent film for the resistance.

  The present invention also relates to an IC tag or an ID tag constituted by a circuit using a TFT using the transparent film as a semiconductor as an N-TFT.

  Specifically, the IC tag or ID tag has a diode characteristic by short-circuiting the gate and drain of the N-TFT, the logic circuit, the memory circuit, the analog circuit using the differential amplifier circuit, and the N-TFT. The rectifier circuit using the element to be realized is configured to include all or at least one of the rectifier circuits.

  The ID tag can make at least the N-TFT and the resistance portion transparent by using the transparent film.

  The present invention also relates to an active matrix substrate in which a TFT using the transparent film as a semiconductor is used as an N-TFT.

  Specifically, an active matrix substrate such as an LCD (Liquid Crystal Display), an organic EL (Electro-Luminescence) display, or an optical sensor can be manufactured using the N-TFT as a switching element of each cell circuit. .

  The active matrix substrate can increase the aperture ratio by using an N-TFT having the transparent film as a semiconductor.

Note that the above-described circuit does not necessarily require that all elements be composed of TFTs. A circuit can also be configured using PN transistors, SIT, SB-T, and BP-T as appropriate.
(About amorphous oxide)
The electron carrier concentration of the amorphous oxide according to the present invention is a value when measured at room temperature. The room temperature is, for example, 25 ° C., specifically, a certain temperature appropriately selected from the range of about 0 ° C. to 40 ° C. Note that the electron carrier concentration of the amorphous oxide according to the present invention does not need to satisfy less than 10 ¹⁸ / cm ³ in the entire range of 0 ° C. to 40 ° C. For example, a carrier electron density of less than 10 ¹⁸ / cm ³ may be realized at 25 ° C. Further, when the electron carrier concentration is further reduced to 10 ¹⁷ / cm ³ or less, more preferably 10 ¹⁶ / cm ³ or less, a normally-off TFT can be obtained with a high yield.

The term “less than 10 ¹⁸ / cm ^3” is preferably less than 1 × 10 ¹⁸ / cm ³ , and more preferably less than 1.0 × 10 ¹⁸ / cm ³ .

  The electron carrier concentration can be measured by Hall effect measurement.

  In the present invention, an amorphous oxide refers to an oxide that exhibits a halo pattern in an X-ray diffraction spectrum and does not exhibit a specific diffraction line.

The lower limit of the electron carrier concentration in the amorphous oxide of the present invention is not particularly limited as long as it can be applied as a TFT channel layer. The lower limit is, for example, 10 ¹² / cm ³ .

Therefore, in the present invention, the material, composition ratio, production conditions, etc. of the amorphous oxide are controlled as in the examples described later, for example, the electron carrier concentration is 10 ¹² / cm ³ or more and 10 ¹⁸ / cm ^3. Less than. More preferably, it is in the range of 10 ¹³ / cm ³ or more and 10 ¹⁷ / cm ³ or less, and more preferably 10 ¹⁵ / cm ³ or more and 10 ¹⁶ / cm ³ or less.
As the amorphous oxide, in addition to InZnGa oxide, In oxide, In _x Zn _1-x oxide (0.2 ≦ x ≦ 1), In _x Sn _1-x oxide (0.8 ≦ x ≦ 1) or In _x (Zn, Sn) _1-x oxide (0.15 ≦ x ≦ 1).

Note that an In _x (Zn, Sn) _1-x oxide can be described as an In _x (Zn _y Sn _1-y ) _1-x oxide, and the range of y is 1 to 0.

Note that in the case of an In oxide containing no Zn and Sn, part of In can be substituted with Ga. That is, it is the case of In _x Ga _1-x oxide (0 ≦ x ≦ 1).

Hereinafter, an amorphous oxide having an electron carrier concentration of less than 10 ¹⁸ / cm ³ successfully produced by the present inventors will be described in detail.

The oxide includes In—Ga—Zn—O, the composition in the crystalline state is represented by InGaO ₃ (ZnO) _m (m is a natural number less than 6), and the electron carrier concentration is 10 ¹⁸ / cm ^3. It is characterized by being less than.

The oxide includes In—Ga—Zn—Mg—O, and the composition of the crystalline state is InGaO ₃ (Zn _1−x Mg _× O) _m (m is a natural number less than 6, 0 <x ≦ 1 The electron carrier concentration is less than 10 ¹⁸ / cm ³ .

Note that it is also preferable to design a film formed using these oxides so that the electron mobility exceeds 1 cm ² / (V · sec).

When the above film is used for a channel layer, transistor characteristics with a normally-off gate current of less than 0.1 microampere and an on / off ratio of more than 10 ³ can be realized. In addition, a flexible TFT having transparency or translucency with respect to visible light is realized.

  The film is characterized in that the electron mobility increases as the number of conduction electrons increases. As the substrate on which the transparent film is formed, a glass substrate, a resin plastic substrate, a plastic film, or the like can be used.

When the amorphous oxide film is used as a channel layer, a gate insulating layer is formed of Al ₂ O ₃ , Y ₂ O ₃ , HfO ₂ , or a mixed crystal compound containing at least two of these compounds. Available for membranes.

  In addition, it is also preferable to form a film in an atmosphere containing oxygen gas without intentionally adding impurity ions for increasing electric resistance to the amorphous oxide.

  The present inventors have found that the semi-insulating oxide amorphous thin film has a unique characteristic that the electron mobility increases as the number of conduction electrons increases. Then, a TFT was formed using the film, and it was found that transistor characteristics such as an on / off ratio, a saturation current in a pinch-off state, and a switch speed were further improved. That is, it has been found that a normally-off type TFT can be realized by using an amorphous oxide.

When an amorphous oxide thin film is used as the channel layer of the film transistor, the electron mobility can exceed 1 cm ² / (V · sec), preferably 5 cm ² / (V · sec).

When the electron carrier concentration is less than 10 ¹⁸ / cm ³ , preferably less than 10 ¹⁶ / cm ³ , the current between the drain and source terminals when off (when no gate voltage is applied) is less than 10 microamperes, Preferably it can be less than 0.1 microamperes.

When the film is used, when the electron mobility is more than 1 cm ² / (V · sec), preferably more than 5 cm ² / (V · sec), the saturation current after pinch-off can be more than 10 microamperes, The on / off ratio can be greater than 10 ³ .

  In the TFT, in a pinch-off state, a high voltage is applied to the gate terminal, and high-density electrons exist in the channel.

  Therefore, according to the present invention, the saturation current value can be further increased by the amount of increase in electron mobility. As a result, improvements in transistor characteristics such as an increase in on / off ratio, an increase in saturation current, and an increase in switching speed can be expected.

  In a normal compound, when the number of electrons increases, electron mobility decreases due to collisions between electrons.

The TFT structure includes a stagger (top gate) structure in which a gate insulating film and a gate terminal are sequentially formed on a semiconductor channel layer, or a reverse structure in which a gate insulating film and a semiconductor channel layer are sequentially formed on a gate terminal. A staggered (bottom gate) structure can be used.
(First film formation method: PLD method)
An amorphous oxide thin film whose composition in the crystalline state is represented by InGaO ₃ (ZnO) _m (m is a natural number less than 6) is amorphous up to a high temperature of 800 ° C. or higher when the value of m is less than 6. Although the quality state is kept stable, it becomes easier to crystallize as the value of m increases. That is, as the ratio of ZnO to InGaO ₃ increases and approaches the ZnO composition, it becomes easier to crystallize.

  Therefore, the value of m is preferably less than 6 for the channel layer of the amorphous TFT.

As a film forming method, a vapor phase film forming method is preferably used with a polycrystalline sintered body having an InGaO ₃ (ZnO) _m composition as a target. Among the vapor deposition methods, the sputtering method and the pulse laser deposition method are suitable. Furthermore, the sputtering method is most suitable from the viewpoint of mass productivity.

However, when the amorphous film is formed under normal conditions, oxygen vacancies mainly occur, and until now, the electron carrier concentration has been less than 10 ¹⁸ / cm ³ and the electric conductivity has not been reduced to 10 S / cm or less. It was. When such a film is used, a normally-off transistor cannot be formed.

  The present inventors produced In—Ga—Zn—O produced by a pulse laser deposition method using the apparatus shown in FIG.

  Film formation was performed using a PLD film formation apparatus as shown in FIG.

  In the figure, 701 is RP (rotary pump), 702 is TMP (turbo molecular pump), 703 is a preparation chamber, 704 is an electron gun for RHEED, 705 is a substrate holding means for rotating and moving the substrate up and down, and 706 is This is a laser incident window. 707 is a substrate, 708 is a target, 709 is a radical source, 710 is a gas inlet, 711 is a target holding means for rotating and moving the target up and down, 712 is a bypass line, 713 is a main line, 714 is TMP ( Turbo molecular pump). Reference numeral 715 denotes an RP (rotary pump), 716 denotes a titanium getter pump, and 717 denotes a shutter. In the figure, 718 is an IG (ion vacuum gauge), 719 is a PG (Pirani vacuum gauge), 720 is a BG (Baratron vacuum gauge), and 721 is a growth chamber (chamber).

An In-Ga-Zn-O amorphous oxide semiconductor thin film was deposited on a SiO ₂ glass substrate (Corning 1737) by pulsed laser deposition using a KrF excimer laser. As a pre-deposition treatment, the substrate was degreased and cleaned with ultrasonic waves for 5 minutes each using acetone, ethanol, and ultrapure water, and then dried at 100 ° C. in air.

As the polycrystalline target, an InGaO ₃ (ZnO) ₄ sintered body target (size 20 mmΦ5 mmt) was used. This is because, as a starting material, In ₂ O ₃ : Ga ₂ O ₃ : ZnO (each 4N reagent) is wet-mixed (solvent: ethanol), calcined (1000 ° C .: 2 h), dry pulverized, main sintered ( 1550 ° C: 2 hours). The electric conductivity of the target thus prepared was 90 (S / cm).
The film was formed while the ultimate vacuum in the growth chamber was 2 × 10 ⁻⁶ (Pa) and the oxygen partial pressure during growth was controlled to 6.5 (Pa).

  The partial pressure of oxygen in the chamber 721 is 6.5 Pa, and the substrate temperature is 25 ° C.

The distance between the target 708 and the film formation substrate 707 is 30 (mm), and the power of the KrF excimer laser incident from the incident window 716 is 1.5-3 (mJ / cm ² / pulse). It is a range. The pulse width was 20 (nsec), the repetition frequency was 10 (Hz), and the irradiation spot diameter was 1 × 1 (mm square).

  Thus, film formation was performed at a film formation rate of 7 (nm / min).

  The thin film obtained was subjected to grazing incidence X-ray diffraction (thin film method, incident angle 0.5 degree) of the thin film, and no clear diffraction peak was observed. Thus, the produced In-Ga-Zn-O thin film Can be said to be amorphous.

  Furthermore, as a result of measuring the X-ray reflectivity and analyzing the pattern, it was found that the mean square roughness (Rrms) of the thin film was about 0.5 nm and the film thickness was about 120 nm. As a result of X-ray fluorescence (XRF) analysis, the metal composition ratio of the thin film was In: Ga: Zn = 0.98: 1.02: 4.

The electrical conductivity was less than about ^10-2 S / cm. The electron carrier concentration is estimated to be about 10 ¹⁶ / cm ³ or less, and the electron mobility is estimated to be about 5 cm ² / (V · sec).

From the analysis of the light absorption spectrum, the energy band gap of the fabricated amorphous thin film was found to be about 3 eV. From the above, the fabricated In-Ga-Zn-O-based thin film exhibits an amorphous phase close to the composition of crystalline InGaO ₃ (ZnO) ₄ , has a small oxygen deficiency, and has a low electrical conductivity and is a transparent flat surface. It turned out to be a thin film.

This will be specifically described with reference to FIG. This figure shows a transparent amorphous oxide thin film composed of In-Ga-Zn-O and having a composition expressed by InGaO ₃ (ZnO) _m (m is a number less than 6) assuming a crystalline state. It is the characteristic view which showed the case where it produces on the same conditions as an example. This characteristic diagram shows the change in the electron carrier concentration of the deposited oxide when the oxygen partial pressure is changed.

By forming a film in an atmosphere where the oxygen partial pressure is higher than 4.5 Pa under the same conditions as in this example, the electron carrier concentration can be reduced to less than 10 ¹⁸ / cm ³ as shown in FIG. did it. In this case, the temperature of the substrate is maintained at substantially room temperature without intentionally heating. In order to use a flexible plastic film as a substrate, the substrate temperature is preferably kept below 100 ° C.

If the oxygen partial pressure is further increased, the electron carrier concentration can be further reduced. For example, as shown in FIG. 1, in the InGaO ₃ (ZnO) ₄ thin film formed at a substrate temperature of 25 ° C. and an oxygen partial pressure of 5 Pa, the number of electron carriers could be further reduced to 10 ¹⁶ / cm ³ .

The obtained thin film had an electron mobility of more than 1 cm ² / (V · sec) as shown in FIG. However, in the pulse laser vapor deposition method of the present embodiment, when the oxygen partial pressure is set to 6.5 Pa or more, the surface of the deposited film becomes uneven, making it difficult to use it as a TFT channel layer.

Therefore, it is expressed by the composition InGaO ₃ (ZnO) _m (m is a number of less than 6) in a crystalline state by pulse laser deposition in an atmosphere having an oxygen partial pressure of more than 4.5 Pa, desirably more than 5 Pa and less than 6.5 Pa. A transparent amorphous oxide thin film is prepared. If this transparent amorphous oxide thin film is used, a normally-off transistor can be formed.

Further, the electron mobility of the thin film was obtained to exceed 1 cm ² / V · second, and the on / off ratio could be increased to more than 10 ³ .

  As described above, when an InGaZn oxide film is formed by the PLD method under the conditions shown in this embodiment, the oxygen partial pressure can be controlled to be 4.5 Pa or more and less than 6.5 Pa. desirable.

Note that, in order to realize the electron carrier concentration of less than 10 ¹⁸ / cm ³ , the electron carrier concentration depends on the oxygen partial pressure conditions, the configuration of the film formation apparatus, the material and composition of the film formation, and the like.

Next, an amorphous oxide was produced under the condition of an oxygen partial pressure of 6.5 Pa in the above apparatus, and a top gate type MISFET element shown in FIG. 5 was produced. Specifically, first, a semi-insulating amorphous InGaO ₃ (ZnO) having a thickness of 120 nm used as a channel layer (2) is formed on the glass substrate (1) by the above-described method for producing an amorphous In—Ga—Zn—O thin film. _Four films were formed.

Further, an InGaO ₃ (ZnO) ₄ film and a gold film having a large electric conductivity were stacked in a thickness of 30 nm by a pulse laser deposition method with an oxygen partial pressure in the chamber of less than 1 Pa. And the drain terminal (5) and the source terminal (6) were formed by the photolithographic method and the lift-off method. Finally, a Y ₂ O ₃ film used as the gate insulating film (3) is formed by electron beam evaporation (thickness: 90 nm, relative dielectric constant: about 15, leakage current density: 10 ^-3 A when 0.5 MV / cm is applied) / cm ² ), and a gold film was formed thereon. And the gate terminal (4) was formed by the photolithographic method and the lift-off method.
FIG. 6 shows the current-voltage characteristics of the MISFET element measured at room temperature. As the drain voltage VDS increases, the drain current IDS increases, indicating that the channel is an n-type semiconductor. This is consistent with the fact that amorphous In-Ga-Zn-O based semiconductors are n-type. IDS showed the behavior of a typical semiconductor transistor that saturates (pinch-off) at about VDS = 6 V. When the gain characteristic was examined, the threshold value of the gate voltage VGS when VDS = 4 V was applied was about −0.5 V. When VG = 10 V, a current of IDS = 1.0 × 10 ⁻⁵ A flowed. This corresponds to the fact that carriers can be induced in the In-Ga-Zn-O amorphous semiconductor thin film of the insulator by the gate bias.

The on / off ratio of the transistor was more than 10 ³ . When the field effect mobility was calculated from the output characteristics, a field effect mobility of about 7 cm ² (Vs) ⁻¹ was obtained in the saturation region. A similar measurement was performed by irradiating the fabricated device with visible light, but no change in transistor characteristics was observed.

  According to this embodiment, it is possible to realize a thin film transistor having a channel layer having a low electron carrier concentration, a high electrical resistance, and a high electron mobility.

  The above-described amorphous oxide had excellent characteristics that the electron mobility increased with an increase in the electron carrier concentration and further exhibited degenerate conduction.

  In this embodiment, a thin film transistor is formed on a glass substrate. However, since the film formation itself can be performed at room temperature, a substrate such as a plastic plate or a film can be used.

Further, the amorphous oxide obtained in this example hardly absorbs visible light and can realize a transparent flexible TFT.
(Second film formation method: sputtering method (SP method))
A case where a film is formed by a high-frequency SP method using argon gas as an atmosphere gas will be described.

  The SP method was performed using the apparatus shown in FIG. In the figure, reference numeral 807 denotes a film formation substrate, 808 denotes a target, 805 denotes a substrate holding means with a cooling mechanism, 814 denotes a turbo molecular pump, 815 denotes a rotary pump, and 817 denotes a shutter. Reference numeral 818 denotes an ion vacuum gauge, 819 denotes a Pirani vacuum gauge, 821 denotes a growth chamber (chamber), and 830 denotes a gate valve.

As the film formation substrate 807, a SiO ₂ glass substrate (1737 manufactured by Corning) was prepared. As pre-deposition treatment, the substrate was subjected to ultrasonic degreasing and cleaning with acetone, ethanol, and ultrapure water for 5 minutes each and then dried at 100 ° C. in air.

As a target material, a polycrystalline sintered body (size 20 mmΦ5 mmt) having an InGaO ₃ (ZnO) ₄ composition was used.

In this sintered body, as a starting material, In ₂ O ₃ : Ga ₂ O ₃ : ZnO (each 4N reagent) is wet-mixed (solvent: ethanol), calcined (1000 ° C: 2h), dry pulverized, main-fired It was produced after crystallization (1550 ° C: 2h). The electric conductivity of the target 808 was 90 (S / cm) and was in a semi-insulating state.

The ultimate vacuum in the growth chamber 821 is 1 × 10 ⁻⁴ (Pa), and the total pressure of oxygen gas and argon gas during growth is constant in the range of 4 to 0.1 × 10 ⁻¹ (Pa). The value of And the partial pressure ratio of argon gas and oxygen was changed, and the oxygen partial pressure was changed in the range of 10 < ^-3 > -2 * 10 <^-1> (Pa).

  The substrate temperature was room temperature, and the distance between the target 808 and the deposition target substrate 807 was 30 (mm).

The input power was RF 180 W, and the film formation rate was 10 (nm / min).
With respect to the obtained film, grazing incidence X-ray diffraction (thin film method, incident angle 0.5 degree) was performed on the film surface, but no clear diffraction peak was detected, and the produced In—Zn—Ga—O-based film was amorphous. It was shown to be a membrane.

  Furthermore, as a result of measuring the X-ray reflectivity and analyzing the pattern, it was found that the mean square roughness (Rrms) of the thin film was about 0.5 nm and the film thickness was about 120 nm. As a result of X-ray fluorescence (XRF) analysis, the metal composition ratio of the thin film was In: Ga: Zn = 0.98: 1.02: 4.

  The oxygen partial pressure of the atmosphere during film formation was changed, and the electrical conductivity of the obtained amorphous oxide film was measured. The result is shown in FIG.

As shown in FIG. 3, the electrical conductivity could be reduced to less than 10 S / cm by forming a film in an atmosphere having a high oxygen partial pressure exceeding 3 × 10 ⁻² Pa.

By further increasing the oxygen partial pressure, the number of electron carriers could be reduced.
For example, as shown in FIG. 3, in an InGaO ₃ (ZnO) ₄ thin film formed at a substrate temperature of 25 ° C. and an oxygen partial pressure of 10 ⁻¹ Pa, the electrical conductivity is further reduced to about 10 ⁻¹⁰ S / cm. I was able to. In addition, the InGaO ₃ (ZnO) ₄ thin film formed at an oxygen partial pressure exceeding 10 ⁻¹ Pa had an electrical resistance that was too high to measure the electrical conductivity. In this case, although the electron mobility could not be measured, the electron mobility was estimated to be about 1 cm ² / V · second by extrapolating from the value in the film having a high electron carrier concentration.

That is, the film was formed by sputter deposition in an argon gas atmosphere having an oxygen partial pressure of over 3 × 10 ⁻² Pa, preferably over 5 × 10 ⁻¹ Pa. By this film formation, a transparent amorphous oxide thin film composed of In—Ga—Zn—O and represented by a composition InGaO ₃ (ZnO) _m (m is a natural number of less than 6) in a crystalline state was produced. Using this transparent amorphous oxide thin film, a transistor having a normally-off and an on / off ratio exceeding 10 ³ could be constructed.

In the case of using the apparatus and materials shown in this embodiment, the oxygen partial pressure during film formation by sputtering is, for example, in the range of 3 × 10 ⁻² Pa to 5 × 10 ⁻¹ Pa. In the thin film formed by the pulse laser deposition method and the sputtering method, as shown in FIG. 2, the electron mobility increases as the number of conduction electrons increases.

  As described above, by controlling the oxygen partial pressure, oxygen defects can be reduced, and as a result, the electron carrier concentration can be reduced. In the amorphous state, unlike the polycrystalline state, there is essentially no particle interface, so that an amorphous thin film with high electron mobility can be obtained.

Even when a polyethylene terephthalate (PET) film having a thickness of 200 μm was used instead of the glass substrate, the obtained InGaO ₃ (ZnO) ₄ amorphous oxide film showed similar characteristics.

If polycrystalline InGaO ₃ (Zn _1-x Mg _x O) _m (m is a natural number less than 6 and 0 <x ≦ 1) is used as a target, a high-resistance amorphous material even under an oxygen partial pressure of less than 1 Pa. An InGaO ₃ (Zn _1-x Mg _x O) _m film can be obtained.

For example, when a target in which Zn is replaced with 80 at% Mg is used, the electron carrier concentration of the film obtained by the pulse laser deposition method in an atmosphere with an oxygen partial pressure of 0.8 Pa may be less than 10 ¹⁶ / cm 3. (The electric resistance value is about 10 ⁻² S / cm.)

The electron mobility of such a film is lower than that of the Mg-free film, but the degree is small, and the electron mobility at room temperature is about 5 cm ² / (V · sec), which is one digit that of amorphous silicon. A large value is shown. When the film is formed under the same conditions, both the electrical conductivity and the electron mobility decrease as the Mg content increases, so the Mg content is preferably more than 20% and less than 85% (x). 0.2 <x <0.85).

In the thin film transistor using the above-described amorphous oxide film, a gate insulating film is preferably formed using a mixed crystal compound containing at least two of Al ₂ O ₃ , Y ₂ O ₃ , HfO ₂ , or a compound thereof.

If there is a defect at the interface between the gate insulating thin film and the channel layer thin film, the electron mobility is lowered and the transistor characteristics are hysteresis. Further, the leakage current varies greatly depending on the type of the gate insulating film. For this purpose, it is necessary to select a gate insulating film suitable for the channel layer. If an Al ₂ O ₃ film is used, leakage current can be reduced. Further, the hysteresis can be reduced by using a Y ₂ O ₃ film. Further, if a high dielectric constant HfO ₂ film is used, the electron mobility can be increased. Further, by using mixed crystals of these films, a TFT with small leakage current and hysteresis and high electron mobility can be formed. In addition, since the gate insulating film formation process and the channel layer formation process can be performed at room temperature, both a staggered structure and an inverted staggered structure can be formed as the TFT structure.

  The TFT thus formed is a three-terminal element having a gate terminal, a source terminal, and a drain terminal. This TFT uses a semiconductor thin film formed on an insulating substrate such as ceramics, glass, or plastic as a channel layer through which electrons or holes move. The TFT is an active element having a function of switching a current between the source terminal and the drain terminal by applying a voltage to the gate terminal to control a current flowing in the channel layer.

  It is important in the present invention that the desired electron carrier concentration can be achieved by controlling the oxygen deficiency.

  In the above description, the amount of oxygen (oxygen deficiency) in the amorphous oxide film is controlled by performing it in an atmosphere containing oxygen at a predetermined concentration during film formation. However, it is also preferable to control (reduce or increase) the amount of oxygen vacancies after film formation by post-processing the oxide film in an atmosphere containing oxygen.

  In order to effectively control the oxygen deficiency, the temperature in the atmosphere containing oxygen is 0 ° C. or higher and 300 ° C. or lower, preferably 25 ° C. or higher and 250 ° C. or lower, more preferably 100 ° C. or higher and 200 ° C. or lower. Is good.

Needless to say, the film formation may be performed in an atmosphere containing oxygen, and the post-treatment after the film formation may be performed in the atmosphere containing oxygen. If a predetermined electron carrier concentration (less than 10 ¹⁸ / cm ³ ) can be obtained, oxygen partial pressure control is not performed during film formation, and post-treatment after film formation is performed in an atmosphere containing oxygen. Also good.

Note that the lower limit of the electron carrier concentration in the present invention is, for example, 10 ¹⁴ / cm ³ or more, although it depends on what kind of element, circuit or device the oxide film obtained is used for.
(Expansion of materials)
Furthermore, as a result of expanding the composition system and researching it, an amorphous oxide composed of an oxide of at least one of Zn, In and Sn, an amorphous material with a low electron carrier concentration and a high electron mobility. It has been found that an oxide film can be produced.

  Further, the present inventors have found that this amorphous oxide film has a unique characteristic that the electron mobility increases as the number of conduction electrons increases.

  A TFT is formed using the film, and a normally-off type TFT excellent in transistor characteristics such as an on / off ratio, a saturation current in a pinch-off state, and a switch speed can be formed.

In the present invention, an oxide having the following characteristics (a) to (h) can be used.
(A) An amorphous oxide having an electron carrier concentration at room temperature of less than 10 ¹⁸ / cm ³ .
(B) An amorphous oxide characterized by an increase in electron carrier concentration and an increase in electron mobility.

Here, room temperature refers to a temperature of about 0 ° C. to 40 ° C. Amorphous refers to a compound in which only a halo pattern is observed in an X-ray diffraction spectrum and does not show a specific diffraction line. Moreover, the electron mobility here means the electron mobility obtained by Hall effect measurement.
(C) The amorphous oxide described in the above (a) or (b), wherein the electron mobility at room temperature is more than 0.1 cm ² / V · sec.
(D) The amorphous oxide described in any one of (b) to (c) above showing degenerate conduction. Here, degenerate conduction refers to a state in which the thermal activation energy in the temperature dependence of electrical resistance is 30 meV or less.
(E) The amorphous oxide described in any one of (a) to (d) above, which contains at least one element of Zn, In, and Sn as a constituent component.
(F) To the amorphous oxide described in (e) above, the Group 2 element M2 having an atomic number smaller than Zn (M2 is Mg, Ca), the Group 3 element M3 having an atomic number smaller than In (M3 is B, Among Al, Ga, Y), Sn group 4 element M4 (M4 is Si, Ge, Zr), group 5 element M5 (M5 is V, Nb, Ta) and Lu, W An amorphous oxide film containing at least one element.
(G) the crystal composition in a state that _{In 1-x M3 x O 3} (Zn 1-y M2 y O) m (0 ≦ x, y ≦ 1, m is 0 or less than 6 natural number) is a compound alone or m The amorphous oxide film according to any one of (a) to (f), which is a mixture of different compounds. M3 is, for example, Ga, and M2 is, for example, Mg.

 (h) The amorphous oxide film according to the above (a) to (g) provided on a glass substrate, metal substrate, plastic substrate or plastic film.

  The present invention is (10) a field effect transistor using the amorphous oxide or the amorphous oxide film described above as a channel layer.

Note that a field effect type in which an amorphous oxide film having an electron carrier concentration of less than 10 ¹⁸ / cm ^{3 and more} than 10 ¹⁵ / cm ³ is used for a channel layer, and a gate terminal is arranged via a source terminal, a drain terminal, and a gate insulating film. A transistor is formed. When a voltage of about 5 V is applied between the source and drain terminals, the current between the source and drain terminals when no gate voltage is applied can be about 10 ⁻⁷ ampere.

The electron mobility of the oxide crystal increases as the s orbital overlap of the metal ions increases, and the oxide crystal of Zn, In, Sn having a large atomic number has a value of 0.1 to 200 cm ² / (V · sec). It has a large electron mobility.

  Further, in the oxide, oxygen and metal ions are ionically bonded.

  Therefore, even in the amorphous state where there is no chemical bond directionality, the structure is random, and the bond direction is non-uniform, the electron mobility should be comparable to the electron mobility in the crystalline state. Is possible.

On the other hand, by substituting Zn, In, and Sn with an element having a small atomic number, the electron mobility is reduced. As a result, the electron mobility of the amorphous oxide according to the present invention is about 0.01 cm ² / (V · second) to 20 cm ² / (V · second).

In the case where a channel layer of a transistor is formed using the oxide, in the transistor, a mixed crystal compound containing at least two of Al ₂ O ₃ , Y ₂ O ₃ , HfO ₂ , or a compound thereof is used as a gate insulating film. It is preferable.

If there is a defect at the interface between the gate insulating thin film and the channel layer thin film, the electron mobility is lowered and the transistor characteristics are hysteresis. Further, the leakage current varies greatly depending on the type of the gate insulating film. For this purpose, it is necessary to select a gate insulating film suitable for the channel layer. If an Al ₂ O ₃ film is used, leakage current can be reduced. Further, the hysteresis can be reduced by using a Y ₂ O ₃ film. Furthermore, if a high dielectric constant HfO ₂ film is used, the field effect mobility can be increased. In addition, by using a film made of a mixed crystal of these compounds, a TFT with small leakage current and hysteresis and high field effect mobility can be formed. In addition, since the gate insulating film formation process and the channel layer formation process can be performed at room temperature, both a staggered structure and an inverted staggered structure can be formed as the TFT structure.

The In ₂ O ₃ oxide film can be formed by a vapor phase method, and an amorphous film can be obtained by adding about 0.1 Pa of moisture to the atmosphere during film formation.

In addition, although it is difficult to obtain an amorphous film of ZnO and SnO ₂ , an amorphous film can be obtained by adding In ₂ O ₃ to about 20 atomic% in the case of ZnO and about 90 atomic% in the case of SnO _2. Can be obtained. In particular, in order to obtain a Sn—In—O-based amorphous film, nitrogen gas may be introduced into the atmosphere at about 0.1 Pa.

  From the group II element M2 (M2 is Mg, Ca) having an atomic number smaller than Zn and the group 3 element M3 (M3 is B, Al, Ga, Y), Sn having an atomic number smaller than In Consists of at least one complex oxide of group 4 element M4 having a small atomic number (M4 is Si, Ge, Zr), group 5 element M5 (M5 is V, Nb, Ta) and Lu, W Can be added.

  Thereby, the amorphous film at room temperature can be further stabilized. Moreover, the composition range in which an amorphous film is obtained can be expanded.

  In particular, the addition of B, Si, and Ge, which has strong covalent bonding, is effective for stabilizing the amorphous phase, and the complex phase composed of ions having a large difference in ionic radius stabilizes the amorphous phase.

  For example, in the case of the In—Zn—O system, it is difficult to obtain an amorphous film that is stable at room temperature unless In is in a composition range of more than about 20 atomic%. With this composition range, a stable amorphous film can be obtained.

In film formation by a vapor phase method, an amorphous oxide film having an electron carrier concentration of less than 10 ¹⁸ / cm ^{3 and more} than 10 ¹⁵ / cm ³ can be obtained by controlling the atmosphere.

As a film formation method of the amorphous oxide, it is preferable to use a vapor phase method such as a pulse laser deposition method (PLD method), a sputtering method (SP method), or an electron beam evaporation method. Among the gas phase methods, the PLD method is suitable from the viewpoint of easily controlling the composition of the material system, and the SP method is suitable from the viewpoint of mass productivity. However, the film forming method is not limited to these methods.
(Formation of In-Zn-Ga-O-based amorphous oxide film by PLD method)
An In—Zn—Ga—O amorphous oxide film was deposited on a glass substrate (1737 manufactured by Corning) by a PLD method using a KrF excimer laser. At this time, polycrystalline sintered bodies having InGaO ₃ (ZnO) and InGaO ₃ (ZnO) ₄ compositions were used as targets, respectively.

  As the film formation apparatus, the apparatus described in FIG. 48 described above was used, and the film formation conditions were the same as in the case of using the apparatus.

  The substrate temperature is 25 ° C. With respect to the obtained film, grazing incidence X-ray diffraction (thin film method, incident angle 0.5 degree) was performed on the film surface, and no clear diffraction peak was detected. In—Zn—Ga— produced from two types of targets All of the O-based films were shown to be amorphous films.

  Furthermore, the X-ray reflectivity measurement of the In—Zn—Ga—O-based amorphous oxide film on the glass substrate was performed and the pattern was analyzed. As a result, the mean square roughness (Rrms) of the thin film was about 0.5 nm. The film thickness was found to be about 120 nm.

As a result of X-ray fluorescence (XRF) analysis, the metal composition ratio of a film obtained using a polycrystalline sintered body having an InGaO ₃ (ZnO) composition as a target was In: Ga: Zn = 1.1: 1.1: 0. .9. The metal composition ratio of the film obtained using the polycrystalline sintered body having the InGaO (ZnO) ₄ composition as a target was In: Ga: Zn = 0.98: 1.02: 4.

The oxygen partial pressure of the atmosphere during film formation was changed, and the electron carrier concentration of the amorphous oxide film obtained using a polycrystalline sintered body having an InGaO ₃ (ZnO) ₄ composition as a target was measured. The result is shown in FIG. By forming a film in an atmosphere having an oxygen partial pressure of over 4.2 Pa, the electron carrier concentration could be lowered to less than 10 ¹⁸ / cm ³ . In this case, the temperature of the substrate is maintained at substantially room temperature without intentionally heating. When the oxygen partial pressure was less than 6.5 Pa, the surface of the obtained amorphous oxide film was flat.

When the oxygen partial pressure is 5 Pa, the electron carrier concentration of an amorphous oxide film obtained using a polycrystalline sintered body having an InGaO ₃ (ZnO) ₄ composition as a target is 10 ¹⁶ / cm ³ , and the electric conductivity is 10 ^−2. S / cm. The electron mobility was estimated to be about 5 cm ² / V · sec. From the analysis of the light absorption spectrum, the band gap energy width of the fabricated amorphous oxide film was found to be about 3 eV.

Increasing the oxygen partial pressure further reduced the electron carrier concentration. As shown in FIG. 1, an In—Zn—Ga—O-based amorphous oxide film formed at a substrate temperature of 25 ° C. and an oxygen partial pressure of 6 Pa has an electron carrier concentration of 8 × 10 ¹⁵ / cm ³ (electric conduction: about 8 × 10 ⁻³ S / cm). The obtained film was estimated to have an electron mobility exceeding 1 cm ² / (V · sec). However, in the PLD method, when the oxygen partial pressure is set to 6.5 Pa or more, the surface of the deposited film becomes uneven, making it difficult to use as a TFT channel layer.

Regarding the In—Zn—Ga—O amorphous oxide film formed with different oxygen partial pressures, targeting a polycrystalline sintered body having an InGaO ₃ (ZnO) ₄ composition, the relationship between the electron carrier concentration and the electron mobility is as follows. Examined. The result is shown in FIG. It is shown that as the electron carrier concentration increases from 10 ¹⁶ / cm ³ to 10 ²⁰ / cm ³ , the electron mobility increases from about 3 cm ² / (V · sec) to about 11 cm ² / (V · sec). It was done. Further, with regard InGaO 3 _(ZnO) amorphous oxide film obtained as a target, a polycrystalline sintered body having a composition similar trend was observed.

Even when a polyethylene terephthalate (PET) film having a thickness of 200 μm was used instead of the glass substrate, the obtained In—Zn—Ga—O-based amorphous oxide film exhibited similar characteristics.
(Formation of In-Zn-Ga-Mg-O-based amorphous oxide film by PLD method)
Polycrystalline InGaO ₃ (Zn _1-x Mg _x O) ₄ (0 <x ≦ 1) was used as a target, and InGaO ₃ (Zn _1-x Mg _x O) ₄ (0 <x ≦ 1) A film was formed.

  As the film forming apparatus, the apparatus shown in FIG. 48 was used.

As a film formation substrate, a SiO ₂ glass substrate (1737 manufactured by Corning) was prepared. As a pretreatment, the substrate was subjected to ultrasonic degreasing and washing with acetone, ethanol, and ultrapure water for 5 minutes each and then dried at 100 ° C. in air. As a target, an InGa (Zn _1-x Mg _x O) ₄ (x = 1-0) sintered body (size 20 mmΦ5 mmt) was used.

The target is starting material In ₂ O ₃ : Ga ₂ O ₃ : ZnO: MgO (each 4N reagent), wet mixing (solvent: ethanol), calcining (1000 ° C: 2h), dry grinding, main sintering (1550 (C: 2h).

The growth chamber reaching vacuum was 2 × 10 ⁻⁶ (Pa), and the oxygen partial pressure during growth was 0.8 (Pa). The substrate temperature was room temperature (25 ° C.), and the distance between the target and the deposition target substrate was 30 (mm).

The power of the KrF excimer laser is 1.5 (mJ / cm ² / pulse), the pulse width is 20 (nsec), the repetition frequency is 10 (Hz), and the irradiation spot diameter is 1 × 1 (mm square) ).
The film formation rate was 7 (nm / min).

  The atmosphere is an oxygen partial pressure of 0.8 Pa, and the substrate temperature is 25 ° C. With respect to the obtained film, grazing incidence X-ray diffraction (thin film method, incident angle 0.5 degree) was performed on the film surface, but no clear diffraction peak was detected, and the produced In—Zn—Ga—Mg—O-based film Was shown to be an amorphous film. The surface of the obtained film was flat.

  The electric conductivity, electron carrier concentration, and electron mobility x of an In—Zn—Ga—Mg—O-based amorphous oxide film formed in an atmosphere having an oxygen partial pressure of 0.8 Pa using targets with different x values. The value dependency was examined.

The result is shown in FIG. It was shown that when the x value exceeds 0.4, the electron carrier concentration can be made less than 10 ¹⁸ / cm ³ in the amorphous oxide film formed by the PLD method in an atmosphere having an oxygen partial pressure of 0.8 Pa. Further, in the amorphous oxide film having an x value exceeding 0.4, the electron mobility was more than 1 cm ² / V · second.

As shown in FIG. 4, when a target in which Zn is replaced with 80 atomic% Mg is used, the electron carrier concentration of the film obtained by the pulse laser deposition method is 10 ¹⁶ / in an atmosphere with an oxygen partial pressure of 0.8 Pa. It can be less than cm ³ (the electrical resistance is about 10 ⁻² S / cm). The electron mobility of such a film is lower than that of the Mg-free film, but the degree is small, and the electron mobility at room temperature is about 5 cm ² / (V · sec), which is one digit that of amorphous silicon. A large value is shown. When the film is formed under the same conditions, both the electrical conductivity and the electron mobility decrease with an increase in the Mg content. Therefore, the Mg content is preferably more than 20 atomic% and less than 85 atomic% ( x is 0.2 <x <0.85), and more preferably 0.5 <x <0.85.

Even when a polyethylene terephthalate (PET) film having a thickness of 200 μm is used instead of the glass substrate, the obtained InGaO ₃ (Zn _1-x Mg _x O) ₄ (0 <x ≦ 1) amorphous oxide film is Showed similar characteristics.
(In ₂ O ₃ amorphous oxide film deposition by PLD method)
An In ₂ O ₃ film was formed on a 200 μm thick PET film by using a PLD method using a KrF excimer laser and targeting an In ₂ O ₃ polycrystalline sintered body.

The apparatus shown in FIG. 48 was used. A SiO ₂ glass substrate (1737 manufactured by Corning) was prepared as a film formation substrate.

  As a pretreatment of this substrate, ultrasonic degreasing was performed for 5 minutes each with acetone, ethanol, and ultrapure water, and then dried at 100 ° C. in air.

As a target, an In ₂ O ₃ sintered body (size 20 mmΦ5 mmt) was used. This was prepared by calcining the starting material In ₂ O ₃ (4N reagent) through calcining (1000 ° C .: 2 h), dry grinding, and main sintering (1550 ° C .: 2 h).

The growth chamber reaching vacuum was 2 × 10 ⁻⁶ (Pa), the oxygen partial pressure during growth was 5 (Pa), and the substrate temperature was room temperature.

  The oxygen partial pressure was 5 Pa, the water vapor partial pressure was 0.1 Pa, and 200 W was applied to the oxygen radical generator to generate oxygen radicals.

The distance between the target and the deposition substrate is 40 (mm), the power of the KrF excimer laser is 0.5 (mJ / cm ² / pulse), the pulse width is 20 (nsec), the repetition frequency is 10 (Hz), The irradiation spot diameter was 1 × 1 (mm square). The film formation rate was 3 (nm / min).

  Regarding the obtained film, grazing incidence X-ray diffraction (thin film method, incident angle 0.5 degree) was performed on the film surface, and no clear diffraction peak was detected, and the produced In-O film was an amorphous film. It has been shown. The film thickness was 80 nm.

The obtained In—O amorphous oxide film had an electron carrier concentration of 5 × 10 ¹⁷ / cm ³ and an electron mobility of about 7 cm ² / V · sec.
(Formation of In-Sn-O amorphous oxide film by PLD method)
By using a PLD method using a KrF excimer laser, an (In _0.9 Sn _0.1 ) O _3.1 polycrystalline sintered body is used as a target and an In—Sn—O-based oxide film is formed on a 200 μm-thick PET film. Was deposited.

In particular,
A SiO ₂ glass substrate (1737 manufactured by Corning) was prepared as a film formation substrate.

  As the substrate pretreatment, ultrasonic degreasing was performed for 5 minutes each using acetone, ethanol, and ultrapure water. Then, it was dried in air at 100 ° C.

As a target, an In ₂ O ₃ —SnO ₂ sintered body (size 20 mmΦ5 mmt) was prepared. As a starting material, In ₂ O ₃ -SnO ₂ (4N reagent) is wet mixed (solvent: ethanol), calcined (1000 ° C: 2h), dry pulverized, and finally sintered (1550 ° C: 2h). can get.

  The substrate temperature is room temperature. The oxygen partial pressure was 5 (Pa), the nitrogen partial pressure was 0.1 (Pa), and 200 W was applied to the oxygen radical generator to generate oxygen radicals.

The distance between the target and the deposition substrate was 30 (mm), the power of the KrF excimer laser was 1.5 (mJ / cm ² / pulse), the pulse width was 20 (nsec), and the repetition frequency Was 10 (Hz), and the irradiation spot diameter was 1 × 1 (mm square). The film formation rate was 6 (nm / min).

  With respect to the obtained film, grazing incidence X-ray diffraction (thin film method, incident angle 0.5 degree) was performed on the film surface, but no clear diffraction peak was detected, and the produced In—Sn—O film was an amorphous film. It was shown that there is.

The obtained In—Sn—O amorphous oxide film had an electron carrier concentration of 8 × 10 ¹⁷ / cm ³ and an electron mobility of about 5 cm ² / V · sec. The film thickness was 100 nm.
(Formation of In-Ga-O amorphous oxide film by PLD method)
A SiO ₂ glass substrate (1737 manufactured by Corning) was prepared as a film formation substrate.

  As pretreatment of the substrate, ultrasonic degreasing was performed for 5 minutes each using acetone, ethanol, and ultrapure water, and then dried at 100 ° C. in air.

As a target, an (In ₂ O ₃ ) _1-x- (Ga ₂ O ₃ ) _x (X = 0-1) sintered body (size 20 mmΦ5 mmt) was prepared. For example, when x = 0.1, the target is an (In _0.9 Ga _0.1 ) ₂ O ₃ polycrystalline sintered body.

This consists of starting material: In ₂ O ₃ -Ga ₂ O ₂ (4N reagent), wet mixing (solvent: ethanol), calcining (1000 ° C: 2h), dry grinding, main sintering (1550 ° C: 2h) It is obtained through

The growth chamber reaching vacuum was 2 × 10 ⁻⁶ (Pa), and the oxygen partial pressure during growth was 1 (Pa).

The substrate temperature was room temperature, the distance between the target and the deposition target substrate was 30 (mm), and the power of the KrF excimer laser was 1.5 (mJ / cm ² / pulse). The pulse width was 20 (nsec), the repetition frequency was 10 (Hz), and the irradiation spot diameter was 1 × 1 (mm square). The film formation rate was 6 (nm / min).

  The substrate temperature is 25 ° C. The oxygen partial pressure was 1 Pa. Regarding the obtained film, grazing incidence X-ray diffraction (thin film method, incident angle 0.5 degree) was performed on the film surface, but no clear diffraction peak was detected, and the produced In—Ga—O film was an amorphous film. It was shown that there is. The film thickness was 120 nm.

The obtained In—Ga—O amorphous oxide film had an electron carrier concentration of 8 × 10 ¹⁶ / cm ³ and an electron mobility of about 1 cm ² / V · sec.
(Production of TFT element using In—Zn—Ga—O amorphous oxide film (glass substrate))
Fabrication of TFT Element A top gate TFT element shown in FIG. 5 was fabricated.

First, on a glass substrate (1), a polycrystalline sintered body having an InGaO ₃ (ZnO) ₄ composition is used as a target, and the above-described PLD apparatus is used under the condition of an oxygen partial pressure of 5 Pa. An O-based amorphous oxide film was prepared. An In-Ga-Zn-O-based amorphous film having a thickness of 120 nm used as the channel layer (2) was formed.

  Further, an In—Ga—Zn—O-based amorphous film and a gold film having a high electric conductivity were stacked by 30 nm by the PLD method with an oxygen partial pressure in the chamber of less than 1 Pa. And the drain terminal (5) and the source terminal (6) were formed by the photolithographic method and the lift-off method.

Finally, a Y ₂ O ₃ film used as the gate insulating film (3) was formed by electron beam evaporation (thickness: 90 nm, relative dielectric constant: about 15, leakage current density: 10 ^-3 A when 0.5 MV / cm applied) / cm ² ). A gold film was formed thereon, and a gate terminal (4) was formed by a photolithography method and a lift-off method. The channel length was 50 μm and the channel width was 200 μm.

FIG. 6 shows the current-voltage characteristics of the TFT element measured at room temperature. As the drain voltage VDS increases, the drain current IDS increases, indicating that the channel has n-type conduction.

  This is consistent with the fact that the amorphous In—Ga—Zn—O amorphous oxide film is an n-type conductor. IDS showed the behavior of a typical semiconductor transistor that saturates (pinch-off) at about VDS = 6 V. When the gain characteristic was examined, the threshold value of the gate voltage VGS when VDS = 4 V was applied was about −0.5 V.

When VG = 10 V, a current of IDS = 1.0 × 10 ⁻⁵ A flowed. This corresponds to the fact that carriers can be induced in the insulator In-Ga-Zn-O amorphous oxide film by the gate bias.

The on / off ratio of the transistor was more than 10 ³ . When the field effect mobility was calculated from the output characteristics, a field effect mobility of about 7 cm ² (Vs) ⁻¹ was obtained in the saturation region. A similar measurement was performed by irradiating the fabricated device with visible light, but no change in transistor characteristics was observed.

In addition, it can apply as a channel layer of TFT by making the electron carrier density | concentration of an amorphous oxide less than 10 < ¹⁸ > / cm < ³ >. The electron carrier concentration is more preferably 10 ¹⁷ / cm ³ or less, and even more preferably 10 ¹⁶ / cm ³ or less.
(Production of TFT element using In-Zn-Ga-O-based amorphous oxide film (amorphous substrate))
The top gate type TFT element shown in FIG. 5 was produced. First, an In—Zn—Ga—O-based amorphous oxide film having a thickness of 120 nm used as a channel layer (2) was formed on a polyethylene terephthalate (PET) film (1) by a PLD method. At this time, a polycrystalline sintered body having an InGaO ₃ (ZnO) composition was used as a target, and film formation was performed in an atmosphere with an oxygen partial pressure of 5 Pa.

Further, an In—Zn—Ga—O-based amorphous oxide film and a gold film having a high electric conductivity were stacked by 30 nm by a PLD method with an oxygen partial pressure in the chamber of less than 1 Pa. And the drain terminal (5) and the source terminal (6) were formed by the photolithographic method and the lift-off method. Finally, a gate insulating film (3) was formed by electron beam evaporation, and gold was formed thereon. And the gate terminal (4) was formed by the photolithographic method and the lift-off method. The channel length was 50 μm and the channel width was 200 μm. Three types of TFTs having the above-described structures using Y ₂ O ₃ (thickness: 140 nm), Al ₂ O ₃ (thickness: 130 μm) and HfO ₂ (thickness: 140 μm) as gate insulating films were prepared. .

Characteristic Evaluation of TFT Element The current-voltage characteristic measured at room temperature of the TFT formed on the PET film was the same as that shown in FIG. That is, as the drain voltage VDS increases, the drain current IDS increases, indicating that the channel has n-type conduction. This is consistent with the fact that the amorphous In—Ga—Zn—O-based amorphous oxide film is an n-type conductor. IDS showed typical transistor behavior that saturates (pinch-off) at around VDS = 6V. When Vg = 0, a current of IDS = 2.0 × 10 ⁻⁵ A flows when Ids = 10 ⁻⁸ A and Vg = 10 V. This corresponds to the fact that electron carriers can be induced in the In-Ga-Zn-O amorphous oxide film of the insulator by the gate bias.

The on / off ratio of the transistor was more than 10 ³ . When the field effect mobility was calculated from the output characteristics, a field effect mobility of about 7 cm ² (Vs) ⁻¹ was obtained in the saturation region.

  The device prepared on the PET film was bent with a curvature radius of 30 mm, and the same transistor characteristics were measured, but no change was observed in the transistor characteristics. Further, the same measurement was performed by irradiating visible light, but no change in transistor characteristics was observed.

The TFT using the Al ₂ O ₃ film as the gate insulating film also showed similar transistor characteristics to those shown in FIG. 6, but when Vg = 0, Ids = 10 ⁻⁸ A, and Vg = 10 V, A current of IDS = 5.0 × 10 ⁻⁶ A flowed. On-off ratio of the transistor was 10 greater than ^2. When the field effect mobility was calculated from the output characteristics, a field effect mobility of about 2 cm ² (Vs) ⁻¹ was obtained in the saturation region.

The TFT using the HfO ₂ film as the gate insulating film also showed a transistor characteristic similar to that shown in FIG. 6. However, when Vg = 0, Ids = 10 ⁻⁸ A, and when Vg = 10 V, IDS = A current of 1.0 × 10 −6 A flowed. On-off ratio of the transistor was 10 greater than ^2. Further, when the field effect mobility was calculated from the output characteristics, a field effect mobility of about 10 cm ² (Vs) ⁻¹ was obtained in the saturation region.
(Creation of TFT element using In ₂ O ₃ amorphous oxide film by PLD method)
The top gate type TFT element shown in FIG. 5 was produced. First, an 80 nm thick In ₂ O ₃ amorphous oxide film used as a channel layer (2) was formed on a polyethylene terephthalate (PET) film (1) by a PLD method.

Further, an In ₂ O ₃ amorphous oxide film and a gold film having a high electric conductivity are formed by PLD method by setting the oxygen partial pressure in the chamber to less than 1 Pa and further applying zero voltage to the oxygen radical generator. Each was laminated with 30 nm. And the drain terminal (5) and the source terminal (6) were formed by the photolithographic method and the lift-off method. Finally, a Y ₂ O ₃ film used as the gate insulating film (3) was formed by electron beam evaporation, and gold was formed thereon. And the gate terminal (4) was formed by the photolithographic method and the lift-off method.

Characteristic Evaluation of TFT Element A current-voltage characteristic measured at room temperature of a TFT formed on a PET film was measured. As the drain voltage VDS increases, the drain current IDS increases, indicating that the channel is an n-type semiconductor. This is consistent with the fact that the In—O amorphous oxide film is an n-type conductor. IDS showed the behavior of a typical transistor that saturates (pinch-off) at about VDS = 5 V. Further, when Vg = 0 V, a current of 2 × 10 ⁻⁸ A and IDS = 2.0 × 10 ⁻⁶ A flowed when VG = 10 V. This corresponds to the fact that electron carriers can be induced in the In-O amorphous oxide film of the insulator by the gate bias.

On-off ratio of the transistor was about 10 ^2. Further, when the field effect mobility was calculated from the output characteristics, a field effect mobility of about 10 cm ² (Vs) ⁻¹ was obtained in the saturation region. The TFT element formed on the glass substrate also showed similar characteristics.

The device prepared on the PET film was bent with a radius of curvature of 30 mm and the same transistor characteristics were measured, but no change was observed in the transistor characteristics.
(Preparation of TFT element using In-Sn-O amorphous oxide film by PLD method)
The top gate type TFT element shown in FIG. 5 was produced. First, an In—Sn—O amorphous oxide film having a thickness of 100 nm used as a channel layer (2) was formed on a polyethylene terephthalate (PET) film (1) by a PLD method. Further, an In-Sn-O amorphous oxide film having a high electrical conductivity and a PLD method are used by setting the partial pressure of oxygen in the chamber to less than 1 Pa, further reducing the voltage applied to the oxygen radical generator to zero. Each gold film was laminated to 30 nm. And the drain terminal (5) and the source terminal (6) were formed by the photolithographic method and the lift-off method. Finally, a Y ₂ O ₃ film used as a gate insulating film (3) is formed by an electron beam evaporation method, gold is formed thereon, and a gate terminal (4) is formed by a photolithography method and a lift-off method. did.

Characteristic Evaluation of TFT Element A current-voltage characteristic measured at room temperature of a TFT formed on a PET film was measured. As the drain voltage VDS increases, the drain current IDS increases, indicating that the channel is an n-type semiconductor. This is consistent with the fact that the In—Sn—O-based amorphous oxide film is an n-type conductor. IDS showed the behavior of a typical transistor that saturates (pinch off) at about VDS = 6 V. Further, when Vg = 0V, a current of 5 × 10 ⁻⁸ A flowed, and when VG = 10 V, a current of IDS = 5.0 × 10 ⁻⁵ A flowed. This corresponds to the fact that electron carriers could be induced in the insulator In—Sn—O amorphous oxide film by the gate bias.

The on / off ratio of the transistor was about 10 ³ . Further, when the field effect mobility was calculated from the output characteristics, a field effect mobility of about 5 cm ² (Vs) ⁻¹ was obtained in the saturation region. The TFT element formed on the glass substrate also showed similar characteristics.

The device prepared on the PET film was bent with a radius of curvature of 30 mm and the same transistor characteristics were measured, but no change was observed in the transistor characteristics.
(Preparation of TFT element using In-Ga-O amorphous oxide film by PLD method)
The top gate type TFT element shown in FIG. 5 was produced. First, an In—Ga—O-based amorphous oxide film having a thickness of 120 nm used as the channel layer (2) was formed on the polyethylene terephthalate (PET) film (1) by the film forming method shown in Example 6. . Further, an In—Ga—O amorphous oxide film having a high electrical conductivity is formed by the PLD method by setting the oxygen partial pressure in the chamber to less than 1 Pa and further applying zero voltage to the oxygen radical generator. And 30 nm thick gold films. And the drain terminal (5) and the source terminal (6) were formed by the photolithographic method and the lift-off method. Finally, a Y ₂ O ₃ film used as a gate insulating film (3) is formed by an electron beam evaporation method, gold is formed thereon, and a gate terminal (4) is formed by a photolithography method and a lift-off method. did.

Characteristic Evaluation of TFT Element A current-voltage characteristic measured at room temperature of a TFT formed on a PET film was measured. As the drain voltage VDS increases, the drain current IDS increases, indicating that the channel is an n-type semiconductor. This is consistent with the fact that the In—Ga—O amorphous oxide film is an n-type conductor. IDS showed the behavior of a typical transistor that saturates (pinch off) at about VDS = 6 V. When Vg = 0V, a current of 1 × 10 ⁻⁸ A flows, and when VG = 10 V, a current of IDS = 1.0 × 10 ⁻⁶ A flows. This corresponds to the fact that electron carriers could be induced in the insulator In-Ga-O amorphous oxide film by the gate bias.

On-off ratio of the transistor was about 10 ^2. Further, when the field effect mobility was calculated from the output characteristics, a field effect mobility of about 0.8 cm ² (Vs) ⁻¹ was obtained in the saturation region. The TFT element formed on the glass substrate also showed similar characteristics.

  The device prepared on the PET film was bent with a radius of curvature of 30 mm and the same transistor characteristics were measured, but no change was observed in the transistor characteristics.

In addition, it can apply as a channel layer of TFT by making the electron carrier density | concentration of an amorphous oxide less than 10 < ¹⁸ > / cm < ³ >. The electron carrier concentration is more preferably 10 ¹⁷ / cm ³ or less, and even more preferably 10 ¹⁶ / cm ³ or less.
(Example 1: SIT device using the transparent film)
As shown in FIG. 7, an ITO thin film having a thickness of 30 nm is formed on an insulating substrate 10 such as glass or plastic by a pulse laser deposition method, and the drain electrode 11-1 is patterned by a photolithography method and a lift-off method. Subsequently, an In-Ga-Zn-O-based amorphous N-type semiconductor 13 was formed to a thickness of 30 nm by a pulse laser deposition method by the above method. Then, the In-Ga-Zn-O-based amorphous N-type semiconductor film is formed on the electrode 11-1 by a photolithography method and a lift-off method. Thereafter, a 30 nm thick Pt thin film is formed as the electrode 12 by a pulse laser deposition method, and is patterned on the semiconductor film by a photolithography method and a lift-off method so as to form a comb-tooth shape. Further, the In-Ga-Zn-O amorphous N-type semiconductor 13 was formed to 30 nm by a pulse laser deposition method. Then, the In-Ga-Zn-O-based amorphous N-type semiconductor film is patterned by photolithography and lift-off so as to cover the gate electrode 12. However, the semiconductor film preferably has higher carrier density and conductivity than the semiconductor film formed on the drain electrode, and may have a carrier density of 10 ¹⁸ / cm ³ or more. Finally, an ITO film is formed to a thickness of 30 nm on the In-Ga-Zn-O-based amorphous N-type semiconductor and patterned by a photolithography method and a lift-off method to form the source electrode 11-2. By the above means, an SIT element can be manufactured (FIG. 7).

  How much the current flowing between the drain electrode and the source electrode of the SIT element can lower the potential barrier formed according to the voltage applied to the gate electrode 12 by the voltage applied between the drain electrode and the source electrode. It depends on. Further, the SIT element is a majority carrier device having electrons as carriers, and since the gap between the drain and the source is narrow, a larger current can be passed as compared with the TFT.

  In the SIT element, instead of Pt forming the gate electrode 12, the P-type semiconductor 14 has an absolute value of the Fermi level larger than the absolute value of the Fermi level of the In-Ga-Zn-O-based amorphous N-type semiconductor. A similar SIT element can be fabricated using (FIG. 8).

Also, the SIT elements having the same function can be configured as shown in FIGS.
(Example 2: SBT element using the transparent film)
As shown in FIG. 11, the In-Ga-Zn-O amorphous N-type semiconductor 13 was formed to 30 nm on the insulating substrate 10 such as glass or plastic by the pulse laser deposition method by the pulse laser deposition method. Then, the patterned In-Ga-Zn-O-based amorphous N-type semiconductor film is formed by a photolithography method and a lift-off method. Subsequently, the In-Ga-Zn-O-based amorphous N-type semiconductor 13 was further formed to 30 nm on the semiconductor film. Then, patterning is performed so that a portion corresponding to the gate electrode has a concave shape by a photolithography method and a lift-off method. Thereafter, a Pt thin film of 30 nm is formed as the gate electrode 12 by a pulse laser deposition method, and patterning is performed on the concave portion of the semiconductor film by a photolithography method and a lift-off method. Further, an ITO film having a thickness of 30 nm is formed on the convex portion of the In-Ga-Zn-O-based amorphous N-type semiconductor, and patterned by a photolithography method and a lift-off method, whereby the drain electrode 11-1 and the source electrode 11-2 are formed. Form. By the above means, an SBT element can be manufactured (FIG. 11).

  Here, the manufacturing order of the gate, drain and source electrodes may be changed.

The current flowing between the drain electrode and the source electrode of the SBT element changes the size of the depletion region formed in accordance with the voltage applied to the gate electrode 2, so that the size of the current path between the drain electrode and the source electrode is Determined by increasing or decreasing. Unlike the TFT, the SBT element does not require an insulating layer, and thus has an advantage that it can be formed with a simple element structure.
(Example 3: Production of PN-T element using the transparent film)
As shown in FIG. 12, the In-Ga-Zn-O amorphous N-type semiconductor 13 was formed to 30 nm on the insulating substrate 10 such as glass or plastic by the pulse laser deposition method by the pulse laser deposition method. Then, the patterned In-Ga-Zn-O-based amorphous N-type semiconductor film is formed by a photolithography method and a lift-off method. Subsequently, the In-Ga-Zn-O-based amorphous N-type semiconductor 13 is further formed to a thickness of 30 nm on the semiconductor film, and a portion corresponding to the gate electrode is formed into a concave shape by a photolithography method and a lift-off method. Pattern. Thereafter, a P-type semiconductor film 14 having an absolute value of the Fermi level larger than the absolute value of the Fermi level of the In-Ga-Zn-O-based amorphous N-type semiconductor is deposited in a recess of the semiconductor film by a pulse laser deposition method. It is formed to 30 nm by photolithography and lift-off methods. Further, a 30 nm thick Pt thin film is formed as the gate electrode 12 by a pulse laser deposition method, and is patterned on the P-type semiconductor film by a photolithography method and a lift-off method. Finally, a 30 nm ITO film is formed on the convex portion of the In-Ga-Zn-O-based amorphous N-type semiconductor and patterned by a photolithography method and a lift-off method, so that the drain electrode 11-1 and the source electrode 11- 2 is formed. By the above means, a PN-T element can be manufactured (FIG. 12).

  Here, the manufacturing order of the gate, drain and source electrodes may be changed.

Since the current flowing between the drain electrode and the source electrode of the PN-T element changes the size of the depletion region formed in the N-type semiconductor according to the voltage applied to the gate electrode 2, the drain electrode- It is determined by increasing or decreasing the size of the current path between the source electrodes. Unlike the TFT, the PN-T element has an advantage that an insulating layer is not necessary.
(Example 4: SD element using the transparent film)
As shown in FIG. 13, the In-Ga-Zn-O amorphous N-type semiconductor 13 is formed to 30 nm on the insulating substrate 10 such as glass or plastic by the pulse laser deposition method by the pulse laser deposition method. Then, the patterned In-Ga-Zn-O-based amorphous N-type semiconductor film is formed by a photolithography method and a lift-off method. Subsequently, a 30 nm thick Pt thin film is formed as an electrode 12 on the semiconductor by pulse laser deposition, and patterned by photolithography and lift-off. Further, an ITO film having a thickness of 30 nm is formed as an electrode 11 on the semiconductor by a pulse laser method, and is patterned by a photolithography method and a lift-off method. By the above means, an SD element can be manufactured (FIG. 13).

  Here, the production order of the electrode 11 and the electrode 12 may be switched.

The SD element has a rectifying property by forming a Schottky barrier between the electrode 12 and the semiconductor film 13.
(Example 5: PN-D element using the transparent film)
As shown in FIG. 14, the In-Ga-Zn-O amorphous N-type semiconductor 13 is formed to 30 nm on the insulating substrate 10 such as glass or plastic by the pulse laser deposition method by the pulse laser deposition method. Then, the patterned In-Ga-Zn-O-based amorphous N-type semiconductor film is formed by a photolithography method and a lift-off method. Subsequently, a P-type semiconductor film 14 having a Fermi level absolute value larger than the Fermi level absolute value of the In-Ga-Zn-O amorphous N-type semiconductor is formed on the semiconductor by a pulse laser deposition method. To 30 nm. Then, patterning is performed by a photolithography method and a lift-off method. Furthermore, 30 nm of Pt is formed as an electrode 12 on the P-type semiconductor by a pulse laser method and patterned by a photolithography method and a lift-off method. Finally, an ITO film having a thickness of 30 nm is formed as an electrode 11 on the N-type semiconductor by a pulse laser method and patterned by a photolithography method and a lift-off method. By the above means, a PN-D element can be produced (FIG. 14).

  Here, the production order of the electrode 11 and the electrode 12 may be switched.

The PN-D element has a rectifying property by forming a PN junction between the semiconductor film 13 and the semiconductor film 14.
(Example 6: Resistance element using the transparent film)
As shown in FIG. 15, the In-Ga-Zn-O amorphous N-type semiconductor 13 was formed to 30 nm on the insulating substrate 10 such as glass or plastic by the pulse laser deposition method by the pulse laser deposition method. The patterned In—Ga—Zn—O amorphous N-type semiconductor film is formed by photolithography and lift-off. Subsequently, an ITO film having a thickness of 30 nm is formed on the N-type semiconductor as the electrodes 11-1 and 11-2 by a pulse laser method, and patterned by a photolithography method and a lift-off method. By the above means, a transparent resistance element can be produced (FIG. 15).

  In addition, the resistive element is an In-Ga-Zn-O amorphous N-type semiconductor 13 'having a carrier density and conductivity different from those of the semiconductor film between the electrodes 11-1, 11-2 and the semiconductor film 13. May be provided (FIG. 16).

In the following, a normally-off (enhancement-type) MISFET using the above-described transparent film is used as an N-TFT unless otherwise specified.
(Example 7: Inverter circuit using TFT having the transparent film as an active layer)
N-TFTs 1 and 2 having the transparent film, which is an N-type semiconductor, as an active layer are connected in series between a power source and GND. Then, the inverter circuit is realized by connecting the gate of the N-TFT 2 whose drain is connected to the power source to the power source, inputting the gate of the N-TFT 1 whose source is grounded to GND, and using the drain as the output ( FIG. 17).

  Further, an inverter circuit can be configured by using the transparent film as a resistor instead of the N-TFT 2 (FIG. 18).

  Further, as a method of increasing the output rising capability as compared with the inverter, an N-type depletion type transistor (hereinafter referred to as N-DTFT) N-DTFT 1 in which the gate and the source are short-circuited can be used instead of the N-TFT 2. (FIG. 19).

  In the above inverter circuit, the output when the input is at the high level is at the low level, but the voltage is determined by the divided voltage between the N-TFT 1 and the N-TFT 2 (or resistor, N-DTFT 1). Therefore, in order to output a low level, the current capability of the N-TFT 2 is lowered as compared with the N-TFT 1. As a result, the output charging capability is lowered. In order to increase the output charging capability, inverter circuits shown in FIGS. This circuit includes an N-TFT 4 whose gate is the output of the inverter and whose drain is a power source, and an N-TFT 3 which is between the source and GND of the N-TFT 4 and whose gate is the input of the inverter. This circuit is a two-stage inverter circuit (FIGS. 20 and 21) having the drain of the N-TFT 3 as an output. In the case of this two-stage inverter circuit, the N-TFT 4 has a source follower configuration and can increase the output charging capability.

  As an example of a two-stage inverter circuit, the configuration shown in FIG. 47 is also possible.

  Further, in the inverter circuit, a P-type TFT (P-TFT1) having a P-type semiconductor as an active layer is used in place of the N-TFT2, the resistor, and the N-DTFT1, thereby driving without a static through current. A complementary inverter circuit with high capability can be constructed (FIG. 22).

As the P-type semiconductor, an inorganic semiconductor such as Si, an organic semiconductor such as pentacene / polythiophene, and an oxide semiconductor can be considered. However, if a bottom gate structure is possible as the TFT, the complementary inverter can be simply configured by using an organic semiconductor that can be formed by mask vapor deposition or ink jet, from the viewpoint of simplicity of the process. On the other hand, when the complementary inverter is manufactured using a P-type oxide semiconductor, there is an advantage that a circuit having a transparent semiconductor portion can be manufactured.
(Embodiment 8: NAND, NOR circuit using TFT having the transparent film as an active layer)
An N-TFT 3 is inserted between the source and the GND of the N-TFT 1 of the inverter using the N-TFT 1 and 2 using the transparent film as an active layer as an N-type semiconductor. The gate of the N-TFT 1 is used as a first input (IN 1), and the gate of the N-TFT 3 is used as a second input (IN 2). Thus, a NAND circuit can be configured (FIG. 23).

  Similarly to the inverter, a NAND circuit can be configured by using an N-DTFT 1 (FIG. 24) in which the gate and the source are short-circuited instead of the N-TFT 2 or a resistor.

  Further, when a P-type TFT having a P-type semiconductor as an active layer is used, two P-type TFTs, P-TFT 1 and P-TFT 2 are connected in parallel between the power source and the output instead of the N-TFT 2. By setting the gates to IN1 and IN2, a NAND circuit can be configured (FIG. 25).

  On the other hand, the N-TFT 3 is inserted in parallel with the N-TFT 1 of the inverter using the N-TFT 1 and 2 using the transparent film as an active layer, which is an N-type semiconductor, and the gate of the N-TFT 1 is connected to the first input ( IN1), the gate of the N-TFT 3 is used as the second input (IN2), so that a NOR circuit can be configured (FIG. 26).

  Similarly to the inverter, the NOR circuit can be configured by using an N-DTFT 1 (FIG. 27) in which the gate and the source are short-circuited instead of the N-TFT 2 or a resistor.

Further, when a P-type TFT having a P-type semiconductor as an active layer is used, instead of the N-TFT 2, two P-type TFTs, P-TFT 1 and P-TFT 2, are connected in series between the power source and the output, By setting the respective gates to IN1 and IN2, a NOR circuit can be configured (FIG. 28).
(Example 9: Clocked inverter, flip-flop, shift register circuit using TFT having the transparent film as an active layer)
An N-TFT 3 is inserted into the output of an inverter using N-TFTs 1 and 2 using the transparent film, which is an N-type semiconductor, as an active layer. Then, by controlling the gate with the clock signal (CP), a clocked inverter circuit can be configured to control whether the inverter signal is output or the resistance is increased according to the clock signal (FIG. 29).

  The N-TFT 2 of the clocked inverter can be configured as a circuit even by using an N-DTFT 1 in which the gate and the source are short-circuited or a resistor.

  Further, when a P-type TFT having a P-type semiconductor as an active layer is used, a P-TFT 1 having a gate connected to an input can be used instead of the N-TFT 2. Further, the amplitude of the output voltage can be increased by inserting the P-TFT 2 in parallel with the N-TFT 3 and controlling the gate with the inverted signal (CP bar) of the clock (FIG. 30).

  In addition, when a P-type TFT is used, in addition to the above configuration, a P-TFT 2 is connected in series between PTFT-1 and the output, and an N-TFT 4 is connected to an inverter using the P-type TFT (FIG. 22). The N-TFT 1 and the output are connected in series. A clocked inverter can be configured by controlling the gate of the P-TFT 2 with the CP bar and the gate of the N-TFT 4 with the CP (FIG. 31).

  By using the inverter and the clocked inverter, a flip-flop can be configured.

  For example, in the D flip-flop, the input IN is a clocked inverter (C-INV1) controlled by a CP bar, and the output of the C-INV1 is connected to the input of the inverter (INV1). The output of the INV1 is controlled by the CP. The input of the clocked inverter (C-INV2) connected to the input and output of the INV1 and the input of the clocked inverter (C-INV3) also controlled by the CP. Connected. The output of the C-INV3 is connected to the input of the inverter (INV2). The output of the INV2 is controlled by the CP bar, and is connected to the input of the clocked inverter (C-INV2) to which the input and output of the INV1 are connected, and becomes the output Q of the D-flip flop (FIG. 32). ).

By using the flip-flop, a shift register can be configured (FIG. 33).
(Example 10: 1-bit SRAM cell circuit using TFT having the transparent film as an active layer)
A 1-bit SRAM cell circuit can be configured using an N-TFT having the transparent film as an active layer, which is an N-type semiconductor, and the inverter circuit.

  The SRAM cell circuit includes two inverters INV1 and INV2. In the two inverters, the output of INV1 and the input of INV2 and the output of INV2 and the input of INV1 are connected, and the gate is connected to the word line WL. The N-TFT 1 provided between the output of the INV 2 and the bit line BL, and the N-TFT 2 having a gate connected to the WL and provided between the output of the INV 1 and the inverted bit line BL bar are provided. (FIG. 34).

As the inverter in the SRAM cell circuit, the inverter shown in the first embodiment can be used. FIG. 35 shows a configuration when an inverter using the N-TFT and a resistor is employed, and FIG. 36 shows a configuration when an inverter using the N-TFT and a P-TFT is employed.
(Example 11: NOR type ROM circuit using TFT having the transparent film as an active layer)
The NOR type ROM circuit of this embodiment includes a plurality of word lines (WL1 to WL3) and a plurality of bit lines (BL1 to BL2). Each of the bit lines includes a plurality of N-TFTs using the transparent film in which the word line is connected to the gate, the source is connected to GND, and the drain is connected in parallel. However, the N-TFT corresponding to the word line WL1 is not provided for the bit line BL1, and the N-TFT corresponding to the word line WL2 is not provided for the bit line BL2 (FIG. 37). .

  The ROM circuit is precharged to a high level first, and then a high level or a low level voltage is applied to each word line so that only a specific bit line has a low level (GND level) voltage. can do. For example, if WL1 is high and WL2 and WL3 are low, BL1 remains high but BL2 is low. Thus, a memory operation is realized in which the signal level of the bit line is determined depending on the presence or absence of the N-TFT corresponding to the word line.

  The ROM circuit can perform a multi-bit memory operation by increasing the number of word lines, bit lines, and N-TFTs.

Further, the ROM circuit is a NOR type in which each bit line is discharged by one N-TFT, so that it can operate at a high speed, but has a large area because it requires many contacts.
The NOR-type ROM circuit stores data depending on whether or not an N-TFT is formed, but a NOR-type ROM circuit capable of writing data with light (UV light) after the substrate is manufactured can also be realized.

  The N-TFT forms carriers due to oxygen vacancies in the transparent film. Thermal annealing in an atmosphere containing oxygen, for example, thermal annealing at 150 ° C. for about 2 hours, fills the oxygen deficiency in the transparent film, lowers the conductivity of the transparent film, and the N-TFT is turned on. In other words, TFT operation stops. Thereafter, when light (UV light) is applied from the back surface, oxygen vacancies are regenerated in the transparent film, and the N-TFT can be turned on, that is, can perform TFT operation.

  Therefore, first, N-TFTs corresponding to all the word lines are formed (FIG. 38), and then all the N-TFTs cannot be turned on by performing thermal annealing (FIG. 39). Subsequently, a mask that allows light to pass through only the portion of the N-TFT that is desired to be operable is prepared, and light (UV light) is irradiated from the back surface via the mask. Thereby, only the N-TFT irradiated with light among the N-TFT operates (FIG. 40). Thereby, a NOR-type ROM circuit can be configured.

The ROM circuit that can write data by the above light can write different data by changing the mask on the same substrate, and erase and rewrite the data once it has been thermally annealed again. It becomes.
(Example 12: NAND ROM circuit using a TFT having the transparent film as an active layer)
The NAND ROM circuit of this embodiment includes a plurality of word lines (WL1 to WL3) and a plurality of bit lines (BL1 to BL2). The NAND-type ROM circuit has an N-TFT using the transparent film in which WL2 is connected to the gate and BL1 is connected to the drain, and in series, WL3 is connected to the gate, and a source is connected to GND. And an N-TFT using a transparent film. In addition, an N-TFT using the above transparent film in which WL1 is connected to the gate and BL2 is connected to the drain, and the transparent film in which WL3 is connected to the gate and the source is connected to GND are used in series. The N-TFT is used (FIG. 41).

  The ROM circuit is precharged to a high level first, and then a high level or a low level voltage is applied to each word line so that only a specific bit line has a low level (GND level) voltage. can do. For example, if WL1 is low and WL2 and WL3 are high, BL1 is low and BL2 remains high. Thus, a memory operation is realized in which the signal level of the bit line is determined depending on the presence or absence of the N-TFT corresponding to the word line.

  The ROM circuit can perform a multi-bit memory operation by increasing the number of word lines, bit lines, and N-TFTs.

  Further, the ROM circuit is a NAND type in which each bit line is discharged by a plurality of N-TFTs connected in series, so that the operation is slow, but the area can be reduced because there are few contacts.

The ROM circuit can also be configured with the same function using the N-TFT and the depletion type TFT (FIG. 42).
(Example 13: differential amplifier circuit using TFT having the transparent film as an active layer)
A differential amplifier circuit can be configured using an N-TFT having the transparent film, which is an N-type semiconductor, as an active layer, and a resistor.

  The differential amplifier circuit includes an N-TFT 3 using the transparent film in which the source is grounded to GND and the constant voltage VB is applied to the gate, the source is connected to the N-TFT 3, and the gate is connected to the input IN +, It has N-TFT1 and N-TFT2 which are set to IN-. The differential amplifier circuit has one end connected to the power supply, the other end connected to the drain of the N-TFT 1, one end connected to the power supply, and the other end connected to the drain of the N-TFT 2. And the drain of the N-TFT 2 is used as an output (FIG. 43).

  The differential amplifier circuit can be used as an SRAM sense amplifier and is a basic component of an analog circuit.

Furthermore, a new differential amplifier circuit can be configured by adding an output stage having the following configuration. The output stage has an N-TFT 4 from which the source is grounded and a constant voltage VB is applied to the gate from the differential amplifier circuit. The output stage has a level shift stage composed of an N-TFT 5 whose source is connected to the drain of the N-TFT 4, whose drain is connected to the power supply, and whose gate is connected to the output of the differential amplifier circuit. . Furthermore, it has an N-TFT 6 whose source is grounded and whose gate is connected to the drain of the N-TFT 4 in the level shift stage. The N-TFT 7 has a source connected to the drain of the N-TFT 6, a drain connected to a power source, and a gate connected to the output of the differential amplifier circuit. In this way, by adding an output stage and configuring a new differential amplifier circuit using the entire output as the drain of the N-TFT 6 (FIG. 44), the ability to drive the load can be increased.
(Example 14: ID tag using TFT having the transparent film as an active layer)
Using the N-TFT whose active layer is the transparent film, which is an N-type semiconductor, and the logic circuit, memory circuit, and differential amplifier circuit, it operates at a low speed of several MHz or less required for IC cards and ID tags. It is possible to construct a circuit that

  FIG. 45 shows a block diagram of an RF-ID tag as an example. The ID tag includes an antenna unit, a power supply unit, a memory unit, a control circuit, and a clock circuit. The power supply unit includes a rectifier circuit that rectifies the AC signal only to the positive side, and a voltage supply circuit that supplies an appropriate voltage to the circuit. The memory unit includes a decoder circuit, a ROM circuit, and a register circuit. .

  The rectifier circuit requires a diode, but there is a possibility that an element connected between the gate and drain of the N-TFT using the transparent film can be substituted. The voltage supply circuit can be configured by a regulator using the differential amplifier shown in the seventh embodiment.

On the other hand, the decoder circuit can be configured by a logic circuit such as an inverter, NAND, NOR, etc. shown in the above embodiment, and the register circuit can be formed by a flip-flop shown in the above embodiment.
(Example 15: Backplane of a display using a TFT having the transparent film as an active layer)
By using an N-TFT having the transparent film, which is an N-type semiconductor, as an active layer, as an active matrix, a display backplane having a transparent TFT can be formed (FIG. 46). When a transparent material is used for the substrate, the TFT portion of the backplane becomes transparent, so that the aperture ratio of the LCD or organic EL display can be increased and light can be emitted from the substrate side.

  The transparent oxide film according to the present invention, and semiconductor elements and circuits using the film can be used as switching elements for LCDs and organic EL displays. Moreover, it can be widely applied as a component such as a flexible display using a flexible material such as a plastic film as a substrate, an IC card and an ID tag.

It is a graph which shows the relationship between the electron carrier density | concentration of the In-Ga-Zn-O type | system | group amorphous film formed into a film by the pulse laser vapor deposition method, and the oxygen partial pressure during film-forming. It is a graph which shows the relationship between the number of electron carriers and the electron mobility of the In-Ga-Zn-O type amorphous film formed by the pulse laser deposition method. It is a graph which shows the relationship between the electrical conductivity of an In-Ga-Zn-O type | system | group amorphous film | membrane, and the oxygen partial pressure during film-forming. Electrical conductivity in an atmosphere of an oxygen partial pressure of 0.8Pa for the values of x of InGaO3 was deposited by pulsed laser deposition _{(Zn 1-x Mg x O} ), is a graph showing a carrier concentration, a change in the electron mobility. 3 is a schematic diagram showing a top gate type MISFET element structure manufactured in Example 1. FIG. 2 is a graph showing current-voltage characteristics of a top gate type MISFET device fabricated in Example 1. FIG. It is a figure which shows Example 1 of a SIT element. It is a figure which shows Example 2 of a SIT element. It is a figure which shows Example 3 of a SIT element. It is a figure which shows Example 4 of a SIT element. It is a figure which shows the Example of a SBT element. It is a figure which shows the Example of a PN-T element. It is a figure which shows the Example of a SBD element. It is a figure which shows the Example of a PN-D element. It is a figure which shows Example 1 of a resistive element. It is a figure which shows Example 2 of a resistance element. 1 is a diagram illustrating an inverter circuit 1 of Example 1. FIG. 1 is a diagram illustrating an inverter circuit 2 according to a first embodiment. FIG. 3 is a diagram illustrating an inverter circuit 3 according to the first embodiment. FIG. 3 is a diagram illustrating an inverter circuit 4 according to the first embodiment. FIG. 3 is a diagram illustrating an inverter circuit 5 according to the first embodiment. FIG. 3 is a diagram illustrating an inverter circuit 6 according to the first embodiment. FIG. 6 is a diagram illustrating a NAND circuit 1 according to a second embodiment. FIG. 6 is a diagram illustrating a NAND circuit 2 according to a second embodiment. FIG. 6 is a diagram illustrating a NAND circuit 3 according to a second embodiment. FIG. 6 is a diagram illustrating a NOR circuit 1 according to a second embodiment. FIG. 6 is a diagram illustrating a NOR circuit 2 according to a second embodiment. FIG. 6 is a diagram illustrating a NOR circuit 3 according to a second embodiment. FIG. 6 is a diagram illustrating a clocked inverter circuit 1 according to a third embodiment. FIG. 6 is a diagram illustrating a clocked inverter circuit 2 according to a third embodiment. FIG. 6 is a diagram illustrating a clocked inverter circuit 3 according to a third embodiment. FIG. 6 is a diagram illustrating a D-flip flop according to a third embodiment. FIG. 9 illustrates a shift register according to a third embodiment. FIG. 10 is a diagram illustrating a 1-bit SRAM cell circuit 1 according to a fourth embodiment. FIG. 10 is a diagram illustrating a 1-bit SRAM cell circuit 2 according to a fourth embodiment. FIG. 9 is a diagram illustrating a 1-bit SRAM cell circuit 3 according to a fourth embodiment. FIG. 10 is a diagram illustrating a NOR ROM circuit 1 according to a fifth embodiment. FIG. 11 is a diagram showing a first stage in the manufacture of a NOR type ROM circuit 2 of Example 5. FIG. 10 is a diagram illustrating a second stage of manufacturing the NOR-type ROM circuit 2 according to the fifth embodiment. FIG. 10 is a diagram illustrating a NOR type ROM circuit 2 according to a fifth embodiment. FIG. 10 is a diagram illustrating a NAND ROM circuit 1 according to a sixth embodiment. FIG. 10 is a diagram illustrating a NAND ROM circuit 2 according to a sixth embodiment. FIG. 10 is a diagram illustrating a differential amplifier circuit 1 according to a seventh embodiment. FIG. 10 is a diagram illustrating a differential amplifier circuit 2 according to a seventh embodiment. 10 is a diagram showing an N-TFT in Example 8. FIG. FIG. 10 is a diagram illustrating an active matrix backplane according to a ninth embodiment. FIG. 3 is a diagram illustrating an inverter circuit 7 according to the first embodiment. It is a schematic diagram of the apparatus used when performing PLD method. It is a schematic diagram of the apparatus used when performing PLD method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Channel layer 3 Gate insulating film 4 Gate terminal 5 Drain terminal 6 Source terminal 10 Insulating substrate 11-1, 11-2 electrode 12 Gate electrode 13 Transparent oxide N-type semiconductor film 14 P-type semiconductor material

Claims (4)

In —Zn—Ga oxide, In—Zn—Ga—Mg oxide, In—Zn oxide, In—Sn oxide, Sn—In—Zn oxide, In oxide, Zn—Ga oxide, and In -A circuit including an N-type TFT using an amorphous oxide, which is one of Ga oxides, as an N-type semiconductor is a constituent element, and the N-type semiconductor is formed in an atmosphere containing oxygen at a predetermined concentration. As a result of the film formation, the electron carrier concentration is less than 10 ¹⁸ / cm ³ , so that the N-type TFT has a current between the source and drain terminals of less than 10 microamperes when no gate voltage is applied. An integrated circuit, wherein the effective mobility is more than 1 cm ² / (V · sec). In—Zn—Ga oxide, In—Zn—Ga—Mg oxide, In—Zn oxide, In—Sn oxide, Sn—In—Zn oxide, In oxide, Zn—Ga oxide, and In -A circuit including an N-type TFT using an amorphous oxide which is one of Ga oxides as an N-type semiconductor is a constituent element, and the N-type semiconductor is in an atmosphere containing oxygen after film formation. The post-treatment results in an electron carrier concentration of less than 10 ¹⁸ / cm ³ , whereby the N-type TFT has a source-drain terminal current of less than 10 microamperes when no gate voltage is applied, An integrated circuit characterized by having a field-effect mobility exceeding 1 cm ² / (V · sec) . In—Zn—Ga oxide, In—Zn—Ga—Mg oxide, In—Zn oxide, In—Sn oxide, Sn—In—Zn oxide, In oxide, Zn—Ga oxide, and In -A circuit including an N-type TFT using an amorphous oxide, which is one of Ga oxides, as an N-type semiconductor is a constituent element, and the N-type semiconductor is formed in an atmosphere containing oxygen at a predetermined concentration. After the film is formed and post-treated in an atmosphere containing oxygen, the electron carrier concentration is less than 10 ¹⁸ / cm ³ , so that the N-type TFT can be connected between the source and drain terminals when no gate voltage is applied. An integrated circuit characterized in that the current is less than 10 microamperes and the field effect mobility is greater than 1 cm ² / (V · sec) . Said logic circuit N TFT, and a memory circuit, an integrated circuit according to claim 1 to 3, characterized in that it uses at least either one of the differential amplifier circuit.