SG10201704179YA - Dynamic modulation of cross flow manifold during elecroplating - Google Patents

Dynamic modulation of cross flow manifold during elecroplating

Info

Publication number
SG10201704179YA
SG10201704179YA SG10201704179YA SG10201704179YA SG10201704179YA SG 10201704179Y A SG10201704179Y A SG 10201704179YA SG 10201704179Y A SG10201704179Y A SG 10201704179YA SG 10201704179Y A SG10201704179Y A SG 10201704179YA SG 10201704179Y A SG10201704179Y A SG 10201704179YA
Authority
SG
Singapore
Prior art keywords
elecroplating
cross flow
flow manifold
manifold during
dynamic modulation
Prior art date
Application number
SG10201704179YA
Other languages
English (en)
Inventor
Kari Thorkelsson
Aaron Berke
Bryan L Buckalew
Steven T Mayer
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201704179YA publication Critical patent/SG10201704179YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C25D7/126—Semiconductors first coated with a seed layer or a conductive layer for solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/028—Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
SG10201704179YA 2016-05-24 2017-05-23 Dynamic modulation of cross flow manifold during elecroplating SG10201704179YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662340736P 2016-05-24 2016-05-24
US15/225,716 US10364505B2 (en) 2016-05-24 2016-08-01 Dynamic modulation of cross flow manifold during elecroplating

Publications (1)

Publication Number Publication Date
SG10201704179YA true SG10201704179YA (en) 2017-12-28

Family

ID=60421000

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201704179YA SG10201704179YA (en) 2016-05-24 2017-05-23 Dynamic modulation of cross flow manifold during elecroplating

Country Status (5)

Country Link
US (2) US10364505B2 (zh)
KR (2) KR102383143B1 (zh)
CN (2) CN107419312B (zh)
SG (1) SG10201704179YA (zh)
TW (1) TWI729136B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
US10612151B2 (en) * 2018-02-28 2020-04-07 Lam Research Corporation Flow assisted dynamic seal for high-convection, continuous-rotation plating
US10655240B2 (en) * 2018-05-01 2020-05-19 Lam Research Corporation Removing bubbles from plating cells
US10760178B2 (en) 2018-07-12 2020-09-01 Lam Research Corporation Method and apparatus for synchronized pressure regulation of separated anode chamber
TWI700401B (zh) 2018-08-21 2020-08-01 財團法人工業技術研究院 待電鍍的面板、使用其之電鍍製程、及以其製造之晶片
KR20210081441A (ko) * 2018-11-19 2021-07-01 램 리써치 코포레이션 고대류 (high convection) 도금 셀들에서 거품을 방지하기 위한 교차 플로우 (cross flow) 도관
CN114502778A (zh) * 2019-10-04 2022-05-13 朗姆研究公司 用于防止唇形密封件镀出的晶片屏蔽
EP3910095B1 (en) * 2020-05-11 2022-03-16 Semsysco GmbH Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a rotatable substrate
KR20240021678A (ko) * 2021-06-21 2024-02-19 램 리써치 코포레이션 다이 레벨 전착 두께 분포 제어를 위한 마이크로 불활성 애노드 어레이
JP7098089B1 (ja) * 2022-02-07 2022-07-08 株式会社荏原製作所 めっき装置
TW202346659A (zh) * 2022-03-01 2023-12-01 美商蘭姆研究公司 電沉積工具中的間隙特徵化

Family Cites Families (208)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3477051A (en) 1967-12-26 1969-11-04 Ibm Die casting of core windings
US3706651A (en) 1970-12-30 1972-12-19 Us Navy Apparatus for electroplating a curved surface
US3862891A (en) 1973-09-24 1975-01-28 Gte Automatic Electric Lab Inc Uniform plating current apparatus and method
US4001094A (en) 1974-09-19 1977-01-04 Jumer John F Method for incremental electro-processing of large areas
US4033833A (en) 1975-10-30 1977-07-05 Western Electric Company, Inc. Method of selectively electroplating an area of a surface
US4240886A (en) 1979-02-16 1980-12-23 Amax Inc. Electrowinning using fluidized bed apparatus
US4272335A (en) 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
FR2479273A1 (fr) 1980-03-28 1981-10-02 Kodak Pathe Dispositif d'electrolyse a electrode poreuse et son application a la recuperation des metaux a partir des solutions aqueuses
US4304641A (en) 1980-11-24 1981-12-08 International Business Machines Corporation Rotary electroplating cell with controlled current distribution
DE3108358C2 (de) 1981-03-05 1985-08-29 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum partiellen Galvanisieren von zu elektrisch leitenden Bändern, Streifen oder dgl. zusammengefaßten Teilen im Durchlaufverfahren
US4605482A (en) 1981-04-28 1986-08-12 Asahi Glass Company, Ltd. Filter press type electrolytic cell
US4514269A (en) 1982-08-06 1985-04-30 Alcan International Limited Metal production by electrolysis of a molten electrolyte
US4469564A (en) 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
GB2133806B (en) 1983-01-20 1986-06-04 Electricity Council Regenerating solutions for etching copper
JPS59162298A (ja) 1983-03-07 1984-09-13 Kawasaki Steel Corp 金属ストリツプの高電流密度めつき方法
US4856544A (en) 1984-05-21 1989-08-15 Cfm Technologies, Inc. Vessel and system for treating wafers with fluids
US4633893A (en) 1984-05-21 1987-01-06 Cfm Technologies Limited Partnership Apparatus for treating semiconductor wafers
US4738272A (en) 1984-05-21 1988-04-19 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4604178A (en) 1985-03-01 1986-08-05 The Dow Chemical Company Anode
KR890001502B1 (ko) 1985-06-24 1989-05-06 씨.에프.엠 테크늘러지즈 인코포레이티드 반도체 웨이퍼 흐름 처리공정 및 그 장치
US4696729A (en) 1986-02-28 1987-09-29 International Business Machines Electroplating cell
EP0283681B1 (de) 1987-02-23 1992-05-06 Siemens Aktiengesellschaft Galvanisiereinrichtung zur Erzeugung von Höckern auf Chip-Bauelementen
US4931149A (en) 1987-04-13 1990-06-05 Texas Instruments Incorporated Fixture and a method for plating contact bumps for integrated circuits
US4828654A (en) 1988-03-23 1989-05-09 Protocad, Inc. Variable size segmented anode array for electroplating
US5146136A (en) 1988-12-19 1992-09-08 Hitachi, Ltd. Magnetron having identically shaped strap rings separated by a gap and connecting alternate anode vane groups
US4933061A (en) 1988-12-29 1990-06-12 Trifari, Krussman & Fishel, Inc. Electroplating tank
US5039381A (en) 1989-05-25 1991-08-13 Mullarkey Edward J Method of electroplating a precious metal on a semiconductor device, integrated circuit or the like
US5368711A (en) 1990-08-01 1994-11-29 Poris; Jaime Selective metal electrodeposition process and apparatus
US5078852A (en) 1990-10-12 1992-01-07 Microelectronics And Computer Technology Corporation Plating rack
US5096550A (en) 1990-10-15 1992-03-17 The United States Of America As Represented By The United States Department Of Energy Method and apparatus for spatially uniform electropolishing and electrolytic etching
US5162079A (en) 1991-01-28 1992-11-10 Eco-Tec Limited Process and apparatus for control of electroplating bath composition
US5156730A (en) 1991-06-25 1992-10-20 International Business Machines Electrode array and use thereof
US5217586A (en) 1992-01-09 1993-06-08 International Business Machines Corporation Electrochemical tool for uniform metal removal during electropolishing
JPH0625899A (ja) 1992-07-10 1994-02-01 Nec Corp 電解メッキ装置
JP2943551B2 (ja) 1993-02-10 1999-08-30 ヤマハ株式会社 メッキ方法及びその装置
US5316642A (en) 1993-04-22 1994-05-31 Digital Equipment Corporation Oscillation device for plating system
US5421987A (en) 1993-08-30 1995-06-06 Tzanavaras; George Precision high rate electroplating cell and method
US5476578A (en) 1994-01-10 1995-12-19 Electroplating Technologies, Ltd. Apparatus for electroplating
US5391285A (en) 1994-02-25 1995-02-21 Motorola, Inc. Adjustable plating cell for uniform bump plating of semiconductor wafers
AU7403694A (en) 1994-07-19 1996-02-16 American Plating Systems, Inc. Electrolytic plating apparatus and method
US5567300A (en) 1994-09-02 1996-10-22 Ibm Corporation Electrochemical metal removal technique for planarization of surfaces
US5660699A (en) 1995-02-20 1997-08-26 Kao Corporation Electroplating apparatus
US5516412A (en) 1995-05-16 1996-05-14 International Business Machines Corporation Vertical paddle plating cell
JPH0953197A (ja) 1995-08-11 1997-02-25 Ibiden Co Ltd 電解めっき方法、被めっき物収容具
US5620581A (en) 1995-11-29 1997-04-15 Aiwa Research And Development, Inc. Apparatus for electroplating metal films including a cathode ring, insulator ring and thief ring
US5626736A (en) 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
US20020066464A1 (en) 1997-05-09 2002-06-06 Semitool, Inc. Processing a workpiece using ozone and sonic energy
US6228231B1 (en) 1997-05-29 2001-05-08 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
AT407114B (de) 1997-06-10 2000-12-27 Immuno Ag Alpha 1-antitrypsin-präparation sowie verfahren zu deren herstellung
US5908540A (en) 1997-08-07 1999-06-01 International Business Machines Corporation Copper anode assembly for stabilizing organic additives in electroplating of copper
US6004440A (en) 1997-09-18 1999-12-21 Semitool, Inc. Cathode current control system for a wafer electroplating apparatus
AU5907798A (en) 1997-09-30 1999-04-23 Semitool, Inc. Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
US6921468B2 (en) 1997-09-30 2005-07-26 Semitool, Inc. Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
US6126798A (en) 1997-11-13 2000-10-03 Novellus Systems, Inc. Electroplating anode including membrane partition system and method of preventing passivation of same
US6027631A (en) 1997-11-13 2000-02-22 Novellus Systems, Inc. Electroplating system with shields for varying thickness profile of deposited layer
US6156167A (en) 1997-11-13 2000-12-05 Novellus Systems, Inc. Clamshell apparatus for electrochemically treating semiconductor wafers
US6179983B1 (en) 1997-11-13 2001-01-30 Novellus Systems, Inc. Method and apparatus for treating surface including virtual anode
KR100474746B1 (ko) 1998-02-12 2005-03-08 에이씨엠 리서치, 인코포레이티드 도금 장치 및 방법
KR100616198B1 (ko) 1998-04-21 2006-08-25 어플라이드 머티어리얼스, 인코포레이티드 기판상에 전기도금하는 전기화학적 증착 시스템 및 방법
US6106687A (en) 1998-04-28 2000-08-22 International Business Machines Corporation Process and diffusion baffle to modulate the cross sectional distribution of flow rate and deposition rate
US6022465A (en) * 1998-06-01 2000-02-08 Cutek Research, Inc. Apparatus and method utilizing an electrode adapter for customized contact placement on a wafer
US6395152B1 (en) 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US6080291A (en) 1998-07-10 2000-06-27 Semitool, Inc. Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
JP2000087299A (ja) 1998-09-08 2000-03-28 Ebara Corp 基板メッキ装置
US6132587A (en) 1998-10-19 2000-10-17 Jorne; Jacob Uniform electroplating of wafers
US6132805A (en) 1998-10-20 2000-10-17 Cvc Products, Inc. Shutter for thin-film processing equipment
US6402923B1 (en) 2000-03-27 2002-06-11 Novellus Systems Inc Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element
US6919010B1 (en) 2001-06-28 2005-07-19 Novellus Systems, Inc. Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction
US7070686B2 (en) 2000-03-27 2006-07-04 Novellus Systems, Inc. Dynamically variable field shaping element
US6773571B1 (en) 2001-06-28 2004-08-10 Novellus Systems, Inc. Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources
US6793796B2 (en) 1998-10-26 2004-09-21 Novellus Systems, Inc. Electroplating process for avoiding defects in metal features of integrated circuit devices
US6258220B1 (en) 1998-11-30 2001-07-10 Applied Materials, Inc. Electro-chemical deposition system
US7204924B2 (en) 1998-12-01 2007-04-17 Novellus Systems, Inc. Method and apparatus to deposit layers with uniform properties
US6162728A (en) 1998-12-18 2000-12-19 Texas Instruments Incorporated Method to optimize copper chemical-mechanical polishing in a copper damascene interconnect process for integrated circuit applications
US6251255B1 (en) 1998-12-22 2001-06-26 Precision Process Equipment, Inc. Apparatus and method for electroplating tin with insoluble anodes
US6454918B1 (en) 1999-03-23 2002-09-24 Electroplating Engineers Of Japan Limited Cup type plating apparatus
JP3331332B2 (ja) 1999-08-25 2002-10-07 日本エレクトロプレイテイング・エンジニヤース株式会社 カップ式めっき装置
GB9907848D0 (en) 1999-04-07 1999-06-02 Shipley Co Llc Processes and apparatus for removal of copper from fluids
US7160421B2 (en) 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US20030038035A1 (en) 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US6368475B1 (en) 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
EP1194613A4 (en) 1999-04-13 2006-08-23 Semitool Inc PROCESSOR OF PARTS HAVING IMPROVED TREATMENT FLUID FLOW PROCESSING CHAMBER
US6193860B1 (en) 1999-04-23 2001-02-27 Vlsi Technolgy, Inc. Method and apparatus for improved copper plating uniformity on a semiconductor wafer using optimized electrical currents
US6254742B1 (en) 1999-07-12 2001-07-03 Semitool, Inc. Diffuser with spiral opening pattern for an electroplating reactor vessel
TW499329B (en) 1999-09-17 2002-08-21 Product System Inc Chemically inert megasonic transducer system
JP3635217B2 (ja) 1999-10-05 2005-04-06 東京エレクトロン株式会社 液処理装置及びその方法
US6632335B2 (en) 1999-12-24 2003-10-14 Ebara Corporation Plating apparatus
US6737360B2 (en) 1999-12-30 2004-05-18 Intel Corporation Controlled potential anodic etching process for the selective removal of conductive thin films
US6562204B1 (en) 2000-02-29 2003-05-13 Novellus Systems, Inc. Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers
WO2001068952A1 (fr) 2000-03-17 2001-09-20 Ebara Corporation Procede et appareil de plaquage electrolytique
US6521102B1 (en) 2000-03-24 2003-02-18 Applied Materials, Inc. Perforated anode for uniform deposition of a metal layer
US8308931B2 (en) 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
US8475636B2 (en) 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
JP2001316887A (ja) 2000-05-08 2001-11-16 Tokyo Electron Ltd メッキ処理装置
US6527920B1 (en) 2000-05-10 2003-03-04 Novellus Systems, Inc. Copper electroplating apparatus
US6821407B1 (en) 2000-05-10 2004-11-23 Novellus Systems, Inc. Anode and anode chamber for copper electroplating
US7622024B1 (en) 2000-05-10 2009-11-24 Novellus Systems, Inc. High resistance ionic current source
US6695962B2 (en) 2001-05-01 2004-02-24 Nutool Inc. Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs
US6398926B1 (en) 2000-05-31 2002-06-04 Techpoint Pacific Singapore Pte Ltd. Electroplating apparatus and method of using the same
US7273535B2 (en) 2003-09-17 2007-09-25 Applied Materials, Inc. Insoluble anode with an auxiliary electrode
US20050145499A1 (en) 2000-06-05 2005-07-07 Applied Materials, Inc. Plating of a thin metal seed layer
US6927176B2 (en) 2000-06-26 2005-08-09 Applied Materials, Inc. Cleaning method and solution for cleaning a wafer in a single wafer process
US7456113B2 (en) 2000-06-26 2008-11-25 Applied Materials, Inc. Cleaning method and solution for cleaning a wafer in a single wafer process
US20020062839A1 (en) 2000-06-26 2002-05-30 Steven Verhaverbeke Method and apparatus for frontside and backside wet processing of a wafer
US6964792B1 (en) 2000-11-03 2005-11-15 Novellus Systems, Inc. Methods and apparatus for controlling electrolyte flow for uniform plating
US6802946B2 (en) 2000-12-21 2004-10-12 Nutool Inc. Apparatus for controlling thickness uniformity of electroplated and electroetched layers
US6610189B2 (en) 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
JP4123330B2 (ja) 2001-03-13 2008-07-23 三菱マテリアル株式会社 電気メッキ用含燐銅陽極
JP2002289568A (ja) 2001-03-23 2002-10-04 Dainippon Screen Mfg Co Ltd 基板洗浄装置およびそれに用いる超音波振動エレメント
US6869515B2 (en) 2001-03-30 2005-03-22 Uri Cohen Enhanced electrochemical deposition (ECD) filling of high aspect ratio openings
US6605525B2 (en) 2001-05-01 2003-08-12 Industrial Technologies Research Institute Method for forming a wafer level package incorporating a multiplicity of elastomeric blocks and package formed
US6800187B1 (en) 2001-05-31 2004-10-05 Novellus Systems, Inc. Clamshell apparatus for electrochemically treating wafers
US6551487B1 (en) 2001-05-31 2003-04-22 Novellus Systems, Inc. Methods and apparatus for controlled-angle wafer immersion
JP4043234B2 (ja) 2001-06-18 2008-02-06 株式会社荏原製作所 電解加工装置及び基板処理装置
WO2003007412A1 (en) 2001-07-13 2003-01-23 Brown University Research Foundation Polymer electrolyte membrane for electrochemical and other applications
KR100394808B1 (ko) 2001-07-19 2003-08-14 삼성전자주식회사 웨이퍼 레벨 적층 칩 패키지 및 그 제조 방법
US6881318B2 (en) 2001-07-26 2005-04-19 Applied Materials, Inc. Dynamic pulse plating for high aspect ratio features
WO2003018879A1 (fr) 2001-08-22 2003-03-06 Optical Forming Corporation Appareil et procede d'electroformage
JP3869306B2 (ja) 2001-08-28 2007-01-17 東京エレクトロン株式会社 現像処理方法および現像液塗布装置
TWI224531B (en) 2001-09-11 2004-12-01 Ebara Corp Substrate processing apparatus and method
JP3681670B2 (ja) 2001-09-25 2005-08-10 シャープ株式会社 半導体集積回路の製造装置および製造方法
US6755946B1 (en) * 2001-11-30 2004-06-29 Novellus Systems, Inc. Clamshell apparatus with dynamic uniformity control
TWI261875B (en) 2002-01-30 2006-09-11 Tokyo Electron Ltd Processing apparatus and substrate processing method
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
US6843855B2 (en) 2002-03-12 2005-01-18 Applied Materials, Inc. Methods for drying wafer
JP2003268591A (ja) 2002-03-12 2003-09-25 Ebara Corp 電解処理方法及び電解処理装置
US7854828B2 (en) 2006-08-16 2010-12-21 Novellus Systems, Inc. Method and apparatus for electroplating including remotely positioned second cathode
US6911136B2 (en) 2002-04-29 2005-06-28 Applied Materials, Inc. Method for regulating the electrical power applied to a substrate during an immersion process
DE10229001B4 (de) 2002-06-28 2007-02-15 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Steuern der Ionenverteilung während des galvanischen Auftragens eines Metalls auf eine Werkstückoberfläche
US7077585B2 (en) 2002-07-22 2006-07-18 Yoshitake Ito Developing method and apparatus for performing development processing properly and a solution processing method enabling enhanced uniformity in the processing
US20040118694A1 (en) 2002-12-19 2004-06-24 Applied Materials, Inc. Multi-chemistry electrochemical processing system
US7128823B2 (en) 2002-07-24 2006-10-31 Applied Materials, Inc. Anolyte for copper plating
EP1391540A3 (en) 2002-08-08 2006-10-04 Texas Instruments Incorporated Methods and apparatus for improved current density and feature fill control in ECD reactors
US20040084318A1 (en) 2002-11-05 2004-05-06 Uri Cohen Methods and apparatus for activating openings and for jets plating
US20040149584A1 (en) 2002-12-27 2004-08-05 Mizuki Nagai Plating method
JP2004250785A (ja) 2003-01-31 2004-09-09 Ebara Corp 電解処理装置及び基板処理装置
US7374646B2 (en) 2003-01-31 2008-05-20 Ebara Corporation Electrolytic processing apparatus and substrate processing method
WO2004112093A2 (en) 2003-06-06 2004-12-23 P.C.T. Systems, Inc. Method and apparatus to process substrates with megasonic energy
DE602004018643D1 (de) 2003-06-24 2009-02-05 Sez Ag Einrichtung und verfahren zur nassbehandlung von scheibenartigen substraten
JP2005133160A (ja) 2003-10-30 2005-05-26 Ebara Corp 基板処理装置及び方法
JP2005146398A (ja) 2003-11-19 2005-06-09 Ebara Corp めっき方法及びめっき装置
JP4681221B2 (ja) 2003-12-02 2011-05-11 ミライアル株式会社 薄板支持容器
US7553401B2 (en) 2004-03-19 2009-06-30 Faraday Technology, Inc. Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
USD553104S1 (en) 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
JP4583811B2 (ja) 2004-05-31 2010-11-17 吉田 英夫 めっき処理方法
KR101368748B1 (ko) 2004-06-04 2014-03-05 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 인쇄가능한 반도체소자들의 제조 및 조립방법과 장치
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
US7563348B2 (en) 2004-06-28 2009-07-21 Lam Research Corporation Electroplating head and method for operating the same
WO2006055766A1 (en) 2004-11-19 2006-05-26 Novellus Systems, Inc. Means to eliminate bubble entrapment during electrochemical processing of workpiece surface
TW200641189A (en) 2005-02-25 2006-12-01 Applied Materials Inc Counter electrode encased in cation exchange membrane tube for electroplating cell
US7641776B2 (en) 2005-03-10 2010-01-05 Lsi Corporation System and method for increasing yield from semiconductor wafer electroplating
US7837851B2 (en) 2005-05-25 2010-11-23 Applied Materials, Inc. In-situ profile measurement in an electroplating process
WO2006127320A2 (en) 2005-05-25 2006-11-30 Applied Materials, Inc. Electroplating apparatus based on an array of anodes
US7255970B2 (en) 2005-07-12 2007-08-14 Az Electronic Materials Usa Corp. Photoresist composition for imaging thick films
US20070029193A1 (en) 2005-08-03 2007-02-08 Tokyo Electron Limited Segmented biased peripheral electrode in plasma processing method and apparatus
USD552565S1 (en) 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD544452S1 (en) 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD548705S1 (en) 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
KR100657600B1 (ko) 2005-10-24 2006-12-19 (주)씨-넷 엘씨디모듈의 백라이트 유니트용 커넥터
KR20090029693A (ko) 2006-05-05 2009-03-23 세즈 아게 판상 기판 습식 처리장치 및 처리방법
USD587222S1 (en) 2006-08-01 2009-02-24 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US9822461B2 (en) 2006-08-16 2017-11-21 Novellus Systems, Inc. Dynamic current distribution control apparatus and method for wafer electroplating
US7837841B2 (en) 2007-03-15 2010-11-23 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatuses for electrochemical deposition, conductive layer, and fabrication methods thereof
CN101220500A (zh) 2007-08-29 2008-07-16 中国电子科技集团公司第二研究所 晶圆凸点制造挂具
USD614593S1 (en) 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
USD609652S1 (en) 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
JP2010040849A (ja) 2008-08-06 2010-02-18 Tokyo Ohka Kogyo Co Ltd レジストパターン形成方法
US20100065433A1 (en) 2008-09-12 2010-03-18 Victor Vidaurre Heiremans System and apparatus for enhancing convection in electrolytes to achieve improved electrodeposition of copper and other non ferrous metals in industrial electrolytic cells
USD609655S1 (en) 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
US8858774B2 (en) 2008-11-07 2014-10-14 Novellus Systems, Inc. Electroplating apparatus for tailored uniformity profile
US8262871B1 (en) 2008-12-19 2012-09-11 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
US8581225B2 (en) 2010-04-28 2013-11-12 Panasonic Corporation Variable resistance nonvolatile memory device and method of manufacturing the same
US9385035B2 (en) 2010-05-24 2016-07-05 Novellus Systems, Inc. Current ramping and current pulsing entry of substrates for electroplating
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
KR20120036030A (ko) 2010-10-07 2012-04-17 동우 화인켐 주식회사 네가티브 포토레지스트 잔류물 제거용 조성물 및 이를 이용한 세정방법
USD648289S1 (en) 2010-10-21 2011-11-08 Novellus Systems, Inc. Electroplating flow shaping plate having offset spiral hole pattern
US9404194B2 (en) 2010-12-01 2016-08-02 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
KR101373103B1 (ko) * 2011-03-28 2014-03-11 연세대학교 산학협력단 Ｐａｕｆ 및 그의 결합 파트너의 상호작용을 이용한 암 치료제의 스크리닝 방법
US8575028B2 (en) 2011-04-15 2013-11-05 Novellus Systems, Inc. Method and apparatus for filling interconnect structures
KR101783786B1 (ko) 2011-06-24 2017-10-10 에이씨엠 리서치 (상하이) 인코포레이티드 기판 상의 균일한 금속화를 위한 방법 및 장치
US9228270B2 (en) 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
SG10201509320WA (en) * 2012-05-14 2015-12-30 Novellus Systems Inc Cross flow manifold for electroplating apparatus
CN102719865B (zh) 2012-07-13 2016-02-24 曲悦峰 一种镀膜模具
KR102214898B1 (ko) * 2012-12-12 2021-02-10 노벨러스 시스템즈, 인코포레이티드 전기도금 동안 효율적인 대량 전달을 위한 전해질 유체역학의 향상
TW201439008A (zh) 2013-03-15 2014-10-16 Hydronovation Inc 電化學水軟化系統
US20140299476A1 (en) 2013-04-09 2014-10-09 Ebara Corporation Electroplating method
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
CN103361694A (zh) 2013-08-08 2013-10-23 上海新阳半导体材料股份有限公司 一种用于3d铜互连高深宽比硅通孔技术微孔电镀填铜方法
US9677190B2 (en) 2013-11-01 2017-06-13 Lam Research Corporation Membrane design for reducing defects in electroplating systems
US9303329B2 (en) 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management
CN203890477U (zh) 2014-06-13 2014-10-22 中芯国际集成电路制造(北京)有限公司 导流装置以及电镀装置
US9567685B2 (en) 2015-01-22 2017-02-14 Lam Research Corporation Apparatus and method for dynamic control of plated uniformity with the use of remote electric current
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
US20170073805A1 (en) 2015-04-30 2017-03-16 E-Chromic Technologies, Inc. Fabrication methodology for thin film lithium ion devices
US20160333492A1 (en) 2015-05-13 2016-11-17 Applied Materials, Inc. Methods for increasing the rate of electrochemical deposition
JP6511989B2 (ja) 2015-06-29 2019-05-15 凸版印刷株式会社 電気めっき液分析装置、及び電気めっき液分析方法
WO2017120003A1 (en) 2016-01-06 2017-07-13 Applied Materials, Inc. Systems and methods for shielding features of a workpiece during electrochemical deposition
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US20170342590A1 (en) 2016-05-24 2017-11-30 Lam Research Corporation Modulation of applied current during sealed rotational electroplating
US20180258546A1 (en) 2017-03-09 2018-09-13 Lam Research Corporation Electroplating apparatus and methods utilizing independent control of impinging electrolyte
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
US10094035B1 (en) 2017-10-16 2018-10-09 Lam Research Corporation Convection optimization for mixed feature electroplating

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US10364505B2 (en) 2019-07-30
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CN111748835A (zh) 2020-10-09
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KR102423978B1 (ko) 2022-07-21
CN107419312A (zh) 2017-12-01
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