NO20084351L - Baererlegeme for komponenter og kretser - Google Patents
Baererlegeme for komponenter og kretserInfo
- Publication number
- NO20084351L NO20084351L NO20084351A NO20084351A NO20084351L NO 20084351 L NO20084351 L NO 20084351L NO 20084351 A NO20084351 A NO 20084351A NO 20084351 A NO20084351 A NO 20084351A NO 20084351 L NO20084351 L NO 20084351L
- Authority
- NO
- Norway
- Prior art keywords
- carrier body
- circuits
- components
- support body
- conductive
- Prior art date
Links
- 238000001816 cooling Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
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- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- H01L2924/1304—Transistor
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- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
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- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
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- General Physics & Mathematics (AREA)
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- Manufacturing & Machinery (AREA)
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- Structure Of Printed Boards (AREA)
- Led Device Packages (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
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Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006013873 | 2006-03-23 | ||
DE102006055965 | 2006-11-24 | ||
DE102006058417 | 2006-12-08 | ||
PCT/EP2007/052726 WO2007107601A2 (de) | 2006-03-23 | 2007-03-22 | Trägerkörper für bauelemente oder schaltungen |
Publications (1)
Publication Number | Publication Date |
---|---|
NO20084351L true NO20084351L (no) | 2008-12-18 |
Family
ID=38051792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20084351A NO20084351L (no) | 2006-03-23 | 2008-10-16 | Baererlegeme for komponenter og kretser |
Country Status (19)
Country | Link |
---|---|
US (1) | US8040676B2 (es) |
EP (11) | EP2388811A3 (es) |
JP (1) | JP2009531844A (es) |
KR (1) | KR101363421B1 (es) |
CN (2) | CN105590901A (es) |
AU (1) | AU2007228752B2 (es) |
BR (1) | BRPI0709070A2 (es) |
CA (1) | CA2644433A1 (es) |
DE (1) | DE102007014433A1 (es) |
DK (1) | DK2397754T3 (es) |
ES (1) | ES2536154T3 (es) |
IL (1) | IL194282A (es) |
MX (1) | MX2008012029A (es) |
MY (1) | MY147935A (es) |
NO (1) | NO20084351L (es) |
RU (1) | RU2434313C2 (es) |
SI (1) | SI2397754T1 (es) |
TW (1) | TWI449137B (es) |
WO (1) | WO2007107601A2 (es) |
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JP5649958B2 (ja) * | 2007-04-24 | 2015-01-07 | セラムテック ゲゼルシャフト ミット ベシュレンクテル ハフツングCeramTec GmbH | メタライズされた表面を備えるセラミックボディを有するコンポーネント |
EP2155628A2 (de) * | 2007-04-24 | 2010-02-24 | CeramTec AG | Bauteil mit einem metallisierten keramikkörper |
WO2008128944A1 (de) * | 2007-04-24 | 2008-10-30 | Ceramtec Ag | Bauteil mit einem keramikkörper, dessen oberfläche metallisiert ist |
US20100206536A1 (en) | 2007-04-24 | 2010-08-19 | Claus Peter Kluge | Method for producing a composite including at least one non-flat component |
US20100147795A1 (en) * | 2007-04-24 | 2010-06-17 | Claus Peter Kluge | Method for the selective surface treatment of non-flat workpieces |
DE102007055462A1 (de) | 2007-11-13 | 2009-05-20 | Adamidis, Antonius | Verfahren zur Regelung eines Photovoltaik-Anlage und derartige Anlage |
US7940560B2 (en) | 2008-05-29 | 2011-05-10 | Advanced Micro Devices, Inc. | Memory cells, memory devices and integrated circuits incorporating the same |
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DE102009025033A1 (de) | 2009-06-10 | 2010-12-16 | Behr Gmbh & Co. Kg | Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung |
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- 2007-03-22 EP EP11177187.9A patent/EP2388811A3/de not_active Withdrawn
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