JP5649958B2 - メタライズされた表面を備えるセラミックボディを有するコンポーネント - Google Patents
メタライズされた表面を備えるセラミックボディを有するコンポーネント Download PDFInfo
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- JP5649958B2 JP5649958B2 JP2010504631A JP2010504631A JP5649958B2 JP 5649958 B2 JP5649958 B2 JP 5649958B2 JP 2010504631 A JP2010504631 A JP 2010504631A JP 2010504631 A JP2010504631 A JP 2010504631A JP 5649958 B2 JP5649958 B2 JP 5649958B2
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Description
Claims (15)
- その表面(3,4)がメタライズ部(5,6)により覆われているセラミックボディ(2)を有するコンポーネント(1)であって、前記セラミックボディ(2)は、セラミックボディ(2)の上側(3)および下側(4)がそれぞれ、大きさの異なる表面を有するように形成され、その際、セラミックボディ(2)は、冷却リブ(7)を有していることにより立体的に構造化されており(7)、
メタライズ部(5,6)が、ボディの表面上に、向かい合う面および/または隣接する面に施与されており、冷却リブは、少なくとも1つのメタライズ部を有しており、かつ、
セラミック材料が、主成分としてZrO2/HfO250.1質量%〜100質量%またはAl2O350.1質量%〜100質量%またはAlN50.1質量%〜100質量%またはSi3N450.1質量%〜100質量%またはBeO50.1質量%〜100質量%、SiC50.1質量%〜100質量%ならびに副成分として少なくとも1つの酸化状態における元素のCa、Sr、Si、Mg、B、Y、Sc、Ce、Cu、Zn、Pbおよび/または化合物を≦49.9質量%の割合で単独または任意の組み合わせにおいて上記の成分範囲内で含有することを、および前記主成分および前記副成分が、≦3質量%の割合の不純物を差し引いて、任意の組み合わせにおいて100質量%の全組成物になるように組み合わされていることを特徴とする、セラミックボディ(2)を有するコンポーネント(1)。 - セラミックボディ(2)の曲げ破断強度が100MPaより大きく、かつ材料の熱伝導率が1W/mKより大きいことを特徴とする、請求項1記載のコンポーネント。
- メタライズ部を有さない前記セラミックボディ(2)のセラミック材料の熱膨張係数が12×10-6/Kより小さいことを特徴とする、請求項1又は2項記載のコンポーネント。
- メタライズ部(5,6)として、セラミックボディ(2)と、担体ボディと同じまたは異なる熱伝導率を有する金属または金属層が、密接にまたは機械的な形状結合によって表面全体または表面の一部分で接合されていることを特徴とする、請求項1から3までのいずれか1項記載のコンポーネント。
- メタライズ部(5,6)が、純粋な品質または工業的な品質のタングステン、銀、金、銅、白金、パラジウム、ニッケル、アルミニウムまたは鋼または少なくとも2つの異なる金属の混合物および/または、付加的にまたはそれ単独で、反応はんだ、軟質はんだまたは硬質はんだ(9)から成ることを特徴とする、請求項1から4までのいずれか1項記載のコンポーネント。
- セラミックボディ(2)上のメタライズ部(5,6)が少なくとも1つの層から成ること、および前記層がDCB法(Direct Copper Bonding)またはAMB法(Active Metal Brazing)またはスクリーン印刷法または電着法または化学堆積法または蒸着法の使用下で、あるいは付着または接着またはこれらの方法の組み合わせによってボディの表面上に、向かい合う面および/または隣接する面に施与されていることを特徴とする、請求項1から5までのいずれか1項記載のコンポーネント。
- メタライズ部(5,6)が、セラミックボディ(2)の表面(3,4)を金属ボディとして表面の一部分または表面全体でまたは部分的または完全に、平行平面形または任意に幾何学的な形状で、またはこれらの形状を組み合わせた形で覆うことを特徴とする、請求項1から6までのいずれか1項記載のコンポーネント。
- メタライズ部(5,6)が20N/cmより大きい接着強度を有することを特徴とする、請求項1から7までのいずれか1項記載のコンポーネント。
- メタライズ部(5,6)の少なくとも1つの層の厚さが≦2mmであることを特徴とする、請求項1から8までのいずれか1項記載のコンポーネント。
- 少なくとも1つの表面(3,4)に少なくとも1つのメタライズ部(5,6)を有するコンポーネント(1)の曲げ破断強度が550MPaより大きいことを特徴とする、請求項1から9までのいずれか1項記載のコンポーネント。
- セラミックボディ(2)上の少なくとも1つのメタライズ部(5)上に、その表面の一部分または表面全体をマスクする少なくとも1つのさらに別のメタライズ部(6)が適用されていることを特徴とする、請求項1から10までのいずれか1項記載のコンポーネント。
- 少なくとも1つのメタライズ部(5,6)が100W/mKの最小熱伝導率を有することを特徴とする、請求項1から11までのいずれか1項記載のコンポーネント。
- セラミックボディ(2)上の少なくとも1つのメタライズ部(5,6)上に、少なくとも1つの能動電子部品または受動電子部品(8)が取り付けられていることを特徴とする、請求項1から12までのいずれか1項記載のコンポーネント。
- セラミックボディ(2)上の少なくとも1つのメタライズ部(5,6)上に、少なくとも1つの能動電子部品または受動電子部品(8)が取り付けられており、該電子部品(8)は、はんだ付け接合部および/またはボンディング接合部(9)を介して少なくとも1つの箇所で、セラミックボディ(2)上に取り付けられた少なくとも1つのメタライズ部(5)と電気的または/および熱的に接合されていることを特徴とする、請求項1から13までのいずれか1項記載のコンポーネント。
- セラミックボディ(2)が、ヒートシンクとして形成されていることを特徴とする、請求項1から14のいずれか1項記載のコンポーネント。
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DE102007019633.6 | 2007-04-24 | ||
DE102007019633 | 2007-04-24 | ||
PCT/EP2008/054626 WO2008128945A1 (de) | 2007-04-24 | 2008-04-17 | Bauteil mit einem keramischen körper mit metallisierter oberfläche |
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JP2010524830A JP2010524830A (ja) | 2010-07-22 |
JP2010524830A5 JP2010524830A5 (ja) | 2013-01-31 |
JP5649958B2 true JP5649958B2 (ja) | 2015-01-07 |
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US (1) | US8980398B2 (ja) |
EP (1) | EP2142489A1 (ja) |
JP (1) | JP5649958B2 (ja) |
KR (1) | KR101519925B1 (ja) |
CN (1) | CN101687718A (ja) |
DE (1) | DE102008001221A1 (ja) |
WO (1) | WO2008128945A1 (ja) |
Cited By (1)
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US6833413B2 (en) | 2000-05-09 | 2004-12-21 | Asahi Kasei Kabushiki Kaisha | Block copolymer and composition containing the copolymer |
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DE102008063325A1 (de) * | 2008-12-30 | 2010-07-01 | Osram Opto Semiconductors Gmbh | Verfahren zur Fertigung von Leuchtmitteln |
DE102009025033A1 (de) | 2009-06-10 | 2010-12-16 | Behr Gmbh & Co. Kg | Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung |
TWI525287B (zh) | 2009-10-27 | 2016-03-11 | 製陶技術股份有限公司 | 由具有led的可變規模的陶瓷二極體載體構成的陣列 |
KR20140016336A (ko) * | 2011-03-29 | 2014-02-07 | 세람테크 게엠베하 | 세라믹 냉각 장치들 및 led들을 갖는 사출-성형된 램프 바디 |
DE102018221160A1 (de) * | 2018-12-06 | 2020-06-10 | Siemens Aktiengesellschaft | Isolierkeramik für elektrische Schaltungen und zugehörige Anwendungen |
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DE102019124593A1 (de) * | 2019-09-12 | 2021-03-18 | Tdk Electronics Ag | Kühlsystem |
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- 2008-04-17 EP EP08736299A patent/EP2142489A1/de not_active Ceased
- 2008-04-17 DE DE102008001221A patent/DE102008001221A1/de not_active Withdrawn
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US6833413B2 (en) | 2000-05-09 | 2004-12-21 | Asahi Kasei Kabushiki Kaisha | Block copolymer and composition containing the copolymer |
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KR101519925B1 (ko) | 2015-05-14 |
JP2010524830A (ja) | 2010-07-22 |
US8980398B2 (en) | 2015-03-17 |
CN101687718A (zh) | 2010-03-31 |
EP2142489A1 (de) | 2010-01-13 |
WO2008128945A1 (de) | 2008-10-30 |
DE102008001221A1 (de) | 2008-10-30 |
KR20100017331A (ko) | 2010-02-16 |
US20100089625A1 (en) | 2010-04-15 |
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