CN103563074B - 具有Al冷却体的陶瓷印刷电路板 - Google Patents

具有Al冷却体的陶瓷印刷电路板 Download PDF

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CN103563074B
CN103563074B CN201280017161.0A CN201280017161A CN103563074B CN 103563074 B CN103563074 B CN 103563074B CN 201280017161 A CN201280017161 A CN 201280017161A CN 103563074 B CN103563074 B CN 103563074B
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A·多恩
A·蒂姆
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Abstract

本发明涉及一种由陶瓷制成的具有上侧(2a)和下侧(2b)的印刷电路板(2)，其中，在上侧(2a)上布置有烧结的金属化区域和下侧被构造为冷却体(3)。为了改善印刷电路板上侧上的组件的散热，建议，在下侧(2b)上也布置烧结的金属化区域并且在所述金属化区域上焊接金属冷却体(3)。

Description

具有Al冷却体的陶瓷印刷电路板
本发明涉及一种由陶瓷制成的具有上侧和下侧的印刷电路板，其中，在上侧上布置有烧结的金属化区域和下侧被构造为冷却体。
从WO2007/107601A3中已知这种陶瓷印刷电路板。
本发明所基于的任务是，对按照权利要求1的前序部分所述的由陶瓷制成的印刷电路板进行改善，从而改善印刷电路板的上侧上的组件的散热。
按照本发明，该任务是通过下述方式解决的，即在下侧上也布置烧结的金属化区域，并且在所述金属化区域上焊接金属冷却体。通过下侧上的烧结的金属化区域和焊接金属冷却体，实现从印刷电路板的上侧至金属冷却体中的特别良好的散热。优选地，将熔点在450和660℃之间的高熔硬焊料实现为焊料。金属冷却体具有高的导热能力。
在本发明的实施方式中，印刷电路板由氧化铝或氮化铝制成。优选地，印刷电路板由导热能力特别好的氮化铝制成。
在优选的实施方式中，金属冷却体由铝制成。铝具有大的导热能力。
在一个本发明实施方式中，金属冷却体由具有连接侧和作用侧的载体板组成并且冷却体以连接侧被焊接到印刷电路板的下侧的金属化区域上并且在作用侧上具有伸出的冷却元件。冷却体的表面通过伸出的冷却元件得以放大，并且能够更好地辐射导入的热量。
在一个本发明实施方式中，伸出的冷却元件是枕垫类型的多个针。由此在最小的空间上极端地放大表面。
在本发明的一个实施方式中，印刷电路板的上侧被构成为凹形的或凸形的，由此在将印刷电路板作为灯使用时，可以聚焦或散射辐射的光。
按照本发明的用于制造印刷电路板的方法的特征在于，制造在两侧通过烧结的金属化区域预金属化的陶瓷衬底，对金属化区域利用金、银、银合金、具有电镀层的活性焊料、例如Ni+Au或利用铝用厚膜技术或诸如薄膜或等离子体喷镀的替选方法进行金属化和随后将冷却体以其连接侧焊接到印刷电路板的下侧上，其中，优选使用熔点在450和660℃之间的高熔硬焊料作为焊料。通过利用在所述温度范围中的硬焊料焊接，在良好的传热效率情况下实现必要的牢固的连接。不进行夹紧、螺旋接合或粘接，因为这些具有在利用硬焊料焊接时所避免的缺点。
优选地，印刷电路板被用作灯或灯的一部分，其中，必要时具有所属的电路和/或电器件的LED被焊接在印刷电路板的上侧。
可以用不透光的盖板盖上电路用于保护。
可以在LED上施加单透镜或成组透镜用以控制辐射的光。
按照本发明的印刷电路板2(见图1和2)具有上侧2a和下侧2b，其中在下侧2b上布置所焊接的金属冷却体3。本发明的主要特征是，不仅上侧2a而且下侧2b都被构造为陶瓷印刷电路板2。这通过以下方式实现，即在上侧2a和下侧2b上施加烧结的金属化区域。在WO2007107601A2中对烧结的金属化区域进行了描述。在上侧2a或在那里的金属化区域上可以直接焊接构件，例如，LED和/或电路。此外，该优点在于，由于高的导热性，由构件产生的热量直接被导入印刷电路板2的陶瓷中。
在两侧通过烧结的金属化区域预金属化的、优选由AlN制成的陶瓷衬底利用金、银、银合金、具有电镀层的活性焊料、例如Ni+Au或利用铝以厚膜技术或替选方法(薄膜或等离子体喷镀等)被金属化(基础金属化)。也可以对衬底的两侧涂不同的金属化。优选地，印刷电路板由氮化铝制成，因为在此情况下导热性极高。
由于高的导热性，在陶瓷印刷电路板2的下侧2b上或在其基础金属化侧上以适当的几何形状焊接金属冷却体3。优选地，冷却体3由铝制成(压铸件，浇铸件等)。优选地，焊料是熔点在450和660℃之间的高熔硬焊料，所述焊料使印刷电路板2通过其基础金属化和硬焊料与金属冷却体3牢固地连接。不进行夹紧、螺旋接合或粘接。
优选地，在两侧具有烧结的金属化区域并因此在两侧都是电路板或可以为此被使用的陶瓷印刷电路板2，在朝着冷却器侧、即朝向金属冷却体3的一侧是平的。在构件侧、即在优选布置LED6的上侧2a上，表面也可以是凸形或凹形地弯曲的。由此，如果构件是LED6，则散射或集束地辐射光。
优选地，用于焊接金属冷却体3的硬焊料是商业上可获得的铝硬焊料(TMP-铝-焊料膏-39)，例如用于修理铝构件所使用的，所述铝硬焊料在570℃时在加热板上或在适当的焊接炉内牢固地和能良好导热地(超过50W/mK)与价格合适的、在安装侧上、即在下侧2b上通过机械或化学方式良好清洁的(清除氧化物的)铝冷却体3连接。
诸如二极管、LED6、晶体管等的电构件于是与其它可能需要的组件、例如电阻或驱动器一起用软焊料在优选100-400℃下的温度范围中在第二步骤被焊接在预金属化的陶瓷印刷电路板2的上侧2a上。由此，特别为功率构件产生良好的传热。
优选地，通过陶瓷的上侧2a处的插座或经由从陶瓷向外的接合线进行至电网的连接。在LED6被焊接的情况下，可以粘接或焊接单透镜或成组透镜用于保护或用于光散射。不透光的盖板也可以用于封闭电路。
按照本发明的陶瓷印刷电路板可以被用作灯或灯的一部分。
图1示出按照本发明的具有其上侧2a和下侧2b的印刷电路板2。在下侧2a上焊接由铝制成的金属冷却体3。印刷电路板2的陶瓷是氮化铝。在本示例中，印刷电路板2被构造为圆形。在该图中不能看到烧结的金属化区域。金属冷却体3由铝制成并像枕垫那样被构造，即由焊接到陶瓷印刷电路板2上的载体板4组成。在载体板4上，在相对的侧布置大量伸出的圆柱形针5。
图2示出按照图1的印刷电路板2的上侧2a。所焊接的电构件用参考符号6表示。电流线路以厚膜技术施加并且用参考符号7表示。这些电流线路7和构件6被焊接到烧结的金属化区域上。在本图中不能看到金属化区域。

Claims (12)

1.由陶瓷制成的具有上侧(2a)和下侧(2b)的印刷电路板(2)，其中，在上侧(2a)上布置有烧结的金属化区域，其中在下侧(2b)上也布置烧结的金属化区域，在所述烧结的金属化区域上焊接金属冷却体(3)，其中印刷电路板(2)由氧化铝或氮化铝制成，并且金属冷却体(3)包括具有连接侧和作用侧的载体板(4)，该冷却体(3)利用连接侧被焊接到印刷电路板(2)的下侧(2b)的金属化区域上，在该载体板的作用侧上具有伸出的冷却元件，从而印刷电路板的下侧被构造为冷却体(3)，其特征在于，所述金属冷却体(3)由铝制成，印刷电路板(2)被用作灯或灯的一部分，并且具有所属的电路和/或电器件的LED被焊接在印刷电路板的上侧，以及通过陶瓷的上侧(2a)处的插座或经由从陶瓷向外的接合线进行至电网的连接。
2.根据权利要求1所述的印刷电路板，其特征在于，伸出的冷却元件是枕垫类型的多个针(5)。
3.根据权利要求1或2所述的印刷电路板，其特征在于，印刷电路板(2)的上侧(2a)被构造为凹形或凸形的。
4.用于制造根据权利要求1至3中任一项所述的印刷电路板(2)的方法，其特征在于，制造陶瓷衬底，其中在两侧通过烧结的金属化区域对所述陶瓷衬底进行预金属化，对所述陶瓷衬底利用金、银、银合金或利用铝以厚膜技术进行金属化和随后将冷却体(3)以其连接侧焊接到印刷电路板(2)的下侧(2b)上。
5.根据权利要求4所述的方法，其特征在于，具有电镀层的活性焊料包括Ni+Au。
6.根据权利要求4所述的方法，其特征在于，对所述陶瓷衬底利用薄膜方法进行金属化。
7.根据权利要求4所述的方法，其特征在于，对所述陶瓷衬底利用等离子体喷镀方法进行金属化。
8.根据权利要求4所述的方法，其特征在于，作为焊料使用熔点在450和660℃之间的高熔硬焊料用于焊接。
9.权利要求4所述的方法，其特征在于，对所述陶瓷衬底利用具有电镀层的活性焊料进行金属化。
10.根据权利要求1至3中任一项所述的印刷电路板(2)作为灯或灯的一部分的应用，其中，具有所属电路和/或电器件的LED被焊接在印刷电路板的上侧(2a)。
11.根据权利要求10所述的应用，其特征在于，用不透光的盖板盖上电路。
12.根据权利要求10或11所述的应用，其特征在于，在LED上施加单透镜或成组透镜。
CN201280017161.0A 2011-04-04 2012-03-30 具有Al冷却体的陶瓷印刷电路板 Expired - Fee Related CN103563074B (zh)

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TW201302046A (zh) 2013-01-01
DE102012205178A1 (de) 2012-10-04
EP2695189A1 (de) 2014-02-12
WO2012136579A1 (de) 2012-10-11
CN103563074A (zh) 2014-02-05
US20140016330A1 (en) 2014-01-16
BR112013025429A2 (pt) 2016-12-27
RU2013148615A (ru) 2015-05-10

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